STMicroelectronics L6201, L6201PS, L6202, L6203 Schematics

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L6201

®

L6202 - L6203

 

 

DMOS FULL BRIDGE DRIVER

SUPPLY VOLTAGE UP TO 48V

5A MAX PEAK CURRENT (2A max. for L6201) TOTAL RMS CURRENT UP TO

L6201: 1A; L6202: 1.5A; L6203/L6201PS: 4A RDS (ON) 0.3 Ω (typical value at 25 °C) CROSS CONDUCTION PROTECTION

TTL COMPATIBLE DRIVE

OPERATING FREQUENCY UP TO 100 KHz THERMAL SHUTDOWN

INTERNAL LOGIC SUPPLY HIGH EFFICIENCY

DESCRIPTION

The I.C. is a full bridge driver for motor control applications realized in Multipower-BCD technology which combines isolated DMOS power transistors with CMOS and Bipolar circuits on the same chip. By using mixed technology it has been possible to optimize the logic circuitry and the power stage to achieve the best possible performance. The DMOS output transistors can operate at supply voltages up to 42V and efficiently at high switch-

MULTIPOWER BCD TECHNOLOGY

Powerdip 12+3+3

SO20 (12+4+4)

Multiwatt11

PowerSO20

ORDERING NUMBERS:

L6201 (SO20)

L6201PS (PowerSO20)

L6202 (Powerdip18)

L6203 (Multiwatt)

ing speeds. All the logic inputs are TTL, CMOS and μC compatible. Each channel (half-bridge) of the device is controlled by a separate logic input, while a common enable controls both channels. The I.C. is mounted in three different packages.

BLOCK DIAGRAM

July 2003

1/20

L6201 - L6202 - L6203

PIN CONNECTIONS (Top view)

SO20

 

 

POWERDIP

GND

1

20

GND

N.C.

2

19

N.C.

N.C.

3

18

N.C.

OUT2

4

17

ENABLE

VS

5

16

SENSE

OUT1

6

15

Vref

BOOT1

7

14

BOOT2

IN1

8

13

IN2

N.C.

9

12

N.C.

GND

10

11

GND

 

 

D95IN216

 

 

 

PowerSO20

 

 

 

MULTIWATT11

 

2/20

 

 

 

 

 

 

 

 

 

L6201 - L6202 - L6203

PINS FUNCTIONS

 

 

 

 

 

 

 

 

 

 

 

Device

 

Name

Function

 

 

 

 

 

L6201

L6201PS

 

L6202

L6203

 

 

 

1

16

 

1

10

SENSE

A resistor Rsense connected to this pin provides feedback for

 

 

 

 

 

 

motor current control.

 

 

 

 

 

 

 

2

17

 

2

11

ENAB

When a logic high is present on this pin the DMOS POWER

 

 

 

 

 

LE

transistors are enabled to be selectively driven by IN1 and IN2.

3

2,3,9,12,

 

3

 

N.C.

Not Connected

 

18,19

 

 

 

 

 

4,5

 

4

 

GND

Common Ground Terminal

 

 

 

 

 

 

 

1, 10

 

5

6

GND

Common Ground Terminal

 

 

 

 

 

 

6,7

 

6

 

GND

Common Ground Terminal

 

 

 

 

 

 

 

8

 

7

 

N.C.

Not Connected

 

 

 

 

 

 

 

9

4

 

8

1

OUT2

Ouput of 2nd Half Bridge

 

 

 

 

 

 

 

10

5

 

9

2

Vs

Supply Voltage

11

6

 

10

3

OUT1

Output of first Half Bridge

 

 

 

 

 

 

 

12

7

 

11

4

BOOT1

A boostrap capacitor connected to this pin ensures efficient

 

 

 

 

 

 

driving of the upper POWER DMOS transistor.

 

 

 

 

 

 

 

13

8

 

12

5

IN1

Digital Input from the Motor Controller

 

 

 

 

 

 

 

14,15

 

13

 

GND

Common Ground Terminal

 

 

 

 

 

 

 

11, 20

 

14

6

GND

Common Ground Terminal

 

 

 

 

 

 

16,17

 

15

 

GND

Common Ground Terminal

 

 

 

 

 

 

 

18

13

 

16

7

IN2

Digital Input from the Motor Controller

 

 

 

 

 

 

 

19

14

 

17

8

BOOT2

A boostrap capacitor connected to this pin ensures efficient

 

 

 

 

 

 

driving of the upper POWER DMOS transistor.

 

 

 

 

 

 

 

20

15

 

18

9

Vref

Internal voltage reference. A capacitor from this pin to GND is

 

 

 

 

 

 

recommended. The internal Ref. Voltage can source out a

 

 

 

 

 

 

current of 2mA max.

 

 

 

 

 

 

 

ABSOLUTE MAXIMUM RATINGS

Symbol

 

Parameter

Value

Unit

 

 

 

 

 

Vs

Power Supply

 

52

V

VOD

Differential Output Voltage (between Out1 and Out2)

60

V

 

 

 

 

 

VIN, VEN

Input or Enable Voltage

 

– 0.3 to + 7

V

 

 

 

 

 

Io

Pulsed Output Current

for L6201PS/L6202/L6203 (Note 1)

5

A

 

– Non Repetitive (< 1 ms) for L6201

5

A

 

 

for L6201PS/L6202/L6203

10

A

 

DC Output Current

for L6201 (Note 1)

1

A

 

 

 

 

 

Vsense

Sensing Voltage

 

– 1 to + 4

V

 

 

 

 

 

Vb

Boostrap Peak Voltage

 

60

V

Ptot

Total Power Dissipation:

 

 

 

 

Tpins = 90°C for L6201

 

4

W

 

for L6202

 

5

W

 

Tcase = 90°C for L6201PS/L6203

20

W

 

Tamb = 70°C for L6201 (Note 2)

0.9

W

 

for L6202 (Note 2)

1.3

W

 

for L6201PS/L6203 (Note 2)

2.3

W

 

 

 

 

Tstg, Tj

Storage and Junction Temperature

– 40 to + 150

°C

 

 

 

 

 

Note 1: Pulse width limited only by junction temperature and transient thermal impedance (see thermal characteristics) Note 2: Mounted on board with minimized dissipating copper area.

3/20

L6201 - L6202 - L6203

THERMAL DATA

Symbol

Parameter

 

 

Value

 

Unit

 

L6201

L6201PS

L6202

L6203

 

 

 

 

Rth j-pins

Thermal Resistance Junction-pins

max

15

12

°C/W

Rth j-case

Thermal Resistance Junction Case

max.

3

Rth j-amb

Thermal Resistance Junction-ambient

max.

85

13 (*)

60

35

 

(*) Mounted on aluminium substrate.

ELECTRICAL CHARACTERISTICS (Refer to the Test Circuits; Tj = 25°C, VS = 42V, Vsens = 0, unless otherwise specified).

Symbol

Parameter

 

Test Conditions

 

Min.

Typ.

Max.

Unit

 

 

 

 

 

 

 

 

 

 

 

Vs

Supply Voltage

 

 

 

 

 

12

36

48

V

Vref

Reference Voltage

IREF = 2mA

 

 

 

 

13.5

 

V

IREF

Output Current

 

 

 

 

 

 

 

2

mA

 

 

 

 

 

 

 

 

 

Is

Quiescent Supply Current

EN = H VIN = L

 

 

 

10

15

mA

 

 

 

EN = H VIN = H

IL = 0

 

10

15

mA

 

 

 

EN = L ( Fig. 1,2,3)

 

 

 

8

15

mA

 

 

 

 

 

 

 

 

 

 

 

fc

Commutation Frequency (*)

 

 

 

 

 

 

30

100

KHz

Tj

Thermal Shutdown

 

 

 

 

 

 

150

 

°C

Td

Dead Time Protection

 

 

 

 

 

 

100

 

ns

TRANSISTORS

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

OFF

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

IDSS

Leakage Current

Fig. 11 Vs = 52 V

 

 

 

 

1

mA

 

 

 

 

 

 

 

 

 

 

 

 

ON

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

RDS

On Resistance

Fig. 4,5

 

 

 

 

0.3

0.55

Ω

 

 

 

 

 

 

 

 

 

 

VDS(ON)

Drain Source Voltage

Fig. 9

 

 

L6201

 

 

 

 

 

 

 

IDS = 1A

 

 

 

0.3

 

V

 

 

 

IDS = 1.2A

 

 

L6202

 

0.36

 

V

 

 

 

IDS = 3A

 

L6201PS/0

 

0.9

 

V

 

 

 

 

 

 

 

3

 

 

 

 

Vsens

Sensing Voltage

 

 

 

 

 

– 1

 

4

V

 

 

 

 

 

 

 

 

 

 

 

SOURCE DRAIN DIODE

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Vsd

Forward ON Voltage

Fig. 6a and b

 

 

 

 

 

 

 

 

 

ISD = 1A

L6201

EN = L

 

0.9 (**)

 

V

 

 

 

ISD = 1.2A

L6202

EN = L

 

0.9 (**)

 

V

 

 

 

ISD = 3A

L6201PS/03

EN =

 

1.35(**)

 

V

 

 

 

L

 

 

 

 

 

 

 

 

trr

Reverse Recovery Time

dif = 25 A/μs

 

 

 

300

 

ns

 

 

 

 

 

 

 

 

 

 

 

 

dt

 

 

 

 

 

 

 

 

 

 

 

IF = 1A

 

L6201

 

 

 

 

 

 

 

IF = 1.2A

 

L6202

 

 

 

 

 

 

 

IF = 3A

 

L6203

 

 

 

 

tfr

Forward Recovery Time

 

 

 

 

 

 

200

 

ns

 

 

 

 

 

 

 

 

 

 

 

LOGIC LEVELS

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

VIN L,

VEN L

Input Low Voltage

 

 

 

 

 

– 0.3

 

0.8

V

 

 

 

 

 

 

 

 

 

 

 

 

VIN H,

VEN H

Input High Voltage

 

 

 

 

 

2

 

7

V

 

 

 

 

 

 

 

 

 

 

 

IIN L,

IEN L

Input Low Current

VIN,

VEN = L

 

 

 

 

–10

μA

IIN H,

IEN H

Input High Current

VIN,

VEN = H

 

 

 

30

 

μA

4/20

L6201 - L6202 - L6203

ELECTRICAL CHARACTERISTICS (Continued)

LOGIC CONTROL TO POWER DRIVE TIMING

Symbol

Parameter

 

Test Conditions

Min.

Typ.

Max.

Unit

 

 

 

 

 

 

 

 

t1 (Vi)

Source Current Turn-off Delay

Fig. 12

 

 

300

 

ns

t2 (Vi)

Source Current Fall Time

Fig. 12

 

 

200

 

ns

t3 (Vi)

Source Current Turn-on Delay

Fig. 12

 

 

400

 

ns

t4 (Vi)

Source Current Rise Time

Fig. 12

 

 

200

 

ns

 

 

 

 

 

 

 

 

 

t5

(Vi)

Sink Current Turn-off Delay

Fig. 13

 

 

300

 

ns

 

 

 

 

 

 

 

 

 

t6

(Vi)

Sink Current Fall Time

Fig. 13

 

 

200

 

ns

 

 

 

 

 

 

 

 

 

t7

(Vi)

Sink Current Turn-on Delay

Fig. 13

 

 

400

 

ns

t8

(Vi)

Sink Current Rise Time

Fig. 13

 

 

200

 

ns

(*) Limited by power dissipation

(**) In synchronous rectification the drain-source voltage drop VDS is shown in fig. 4 (L6202/03); typical value for the L6201 is of 0.3V.

Figure 1: Typical Normalized IS vs. Tj

Figure 3: Typical Normalized IS vs. VS

Figure 2: Typical Normalized Quiescent Current

vs. Frequency

Figure 4: Typical RDS (ON) vs. VS ~ Vref

5/20

STMicroelectronics L6201, L6201PS, L6202, L6203 Schematics

L6201 - L6202 - L6203

Figure 5: Normalized RDS (ON)at 25°C vs. Temperature Typical Values

Figure 6a: Typical Diode Behaviour in Synchronous Rectification (L6201)

Figure 6b: Typical Diode Behaviour in Synchronous Rectification (L6201PS/02/03)

Figure 7a: Typical Power Dissipation vs IL (L6201)

Figure 7b: Typical Power Dissipation vs IL

(L6201PS, L6202, L6203))

6/20

L6201 - L6202 - L6203

Figure 8a: Two Phase Chopping

Figure 8b: One Phase Chopping

IN1 = H

IN 2 = H

EN = H

Figure 8c: Enable Chopping

7/20

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