Features
■ I
■ V
■ I
= 0.8 A
T(RMS)
, V
DRM
= 30 to 200 µA
GT
RRM
X00619
0.8 A sensitive gate SCR
Datasheet − production data
A
= 600 V
G
K
Applications
■ Limited gate current topologies
■ Ground fault circuit interrupters
■ Overvoltage crowbar protection in power
supplies
■ Protection in electronic ballasts
■ Capacitive discharge ignitions
■ Ignitors (lighting, oven...)
Description
The X006 SCR can be used as on/off function in
applications where topology does not offer high
current for gate triggering.
This device is optimized in forward voltage drop
and inrush current capabilities for reduced power
losses and high reliability in harsh environments.
A
K
G
A
TO-92
X00619-MA
Table 1. Device summary
I
T(RMS)
V
/ V
DRM
RRM
I
GT
A
K
SOT-223
X00619MN
0.8 A
600 V
30 to 200 µA
G
May 2012 Doc ID 15755 Rev 2 1/10
This is information on a product in full production.
www.st.com
10
Characteristics X00619
1 Characteristics
Table 2. Absolute ratings (limiting values, Tj = 25 °C unless otherwise specified)
Symbol Parameter Value Unit
I
T(RMS)
On-state rms current (180 °Conduction angle)
SOT-223 T
TO-92 T
TO-92 T
IT
Average on-state current (180 °Conduction angle)
(AV)
SOT-223 T
tp = 8.3 ms
I
TSM
di/dt
I
P
G(AV)
T
Table 3. Electrical characteristics (Tj = 25 °C unless otherwise specified)
Non repetitive surge peak on-state current
= 10 ms 9
t
p
²
tI²t Value for fusing tp = 10 ms Tj = 25 °C 0.4 A2s
I
Critical rate of rise of on-state current
I
= 2 x IGT, tr ≤ 100 ns
G
Peak gate current tp = 20 µs Tj = 125 °C 1 A
GM
F = 60 Hz T
Average gate power dissipation Tj = 125 °C 0.1 W
Storage junction temperature range
stg
T
Operating junction temperature range
j
= 83 °C
L
= 107 °C
c
= 83 °C
L
= 107 °C
c
0.8 A
0.5 A
10
Tj = 25 °C
= 125 °C 50 A/µs
j
- 40 to + 150
- 40 to + 125
Symbol Test conditions Value Unit
A
°C
I
GT
VD = 12 V, RL = 140 Ω
200
MAX.
MIN. 30
V
GT
V
V
dV/dt V
Table 4. Static electrical characteristics
VD = V
GD
RGIRG
I
H
I
L
DRM, RL
= 10 µA MIN. 5 V
IT = 50 mA, RGK = 1 kΩ MAX. 5 mA
IG = 1 mA, RGK = 1 kΩ MAX. 6 mA
= 67% V
D
= 3.3 kΩ, RGK = 1 kΩ Tj = 125 °C MIN. 0.2 V
DRM, RGK
= 1 kΩ Tj = 125 °C MIN. 40 V/µs
0.8 V
Symbol Test conditions Value Unit
V
TM
V
TO
R
ITM = 1 A, tp = 380 µs Tj = 25 °C
Threshold voltage
= 125 °C
T
Dynamic resistance 245 mΩ
d
j
MAX
1.35 V
0.85 V
Tj = 25 °C 1 µA
I
DRM IRRMVDRM
= V
RRM, RGK
= 1 kΩ
= 125 °C 100
T
j
µA
µA
2/10 Doc ID 15755 Rev 2
X00619 Characteristics
Table 5. Thermal resistances
Symbol Parameter Value Unit
R
R
th(j-l)
th(j-c)
Junction to leads (DC) TO-92
70
Junction to case (DC) SOT-223 30
Max.
TO-92 150
R
th(j-a)
Figure 1. Maximum average power
Junction to ambient (DC)
dissipation versus average
S = 5 cm
2
SOT-223 60
Figure 2. Average and DC on-state current
versus case temperature (SOT-223)
on-state current
P(W)
0.6
α = 30°, 60°, 90°, 120°,180°, DC
0.4
0.2
0.0
0.0 0.1 0.2 0.3 0.4 0.5 0.6
°°° °
°DC
I (A)
T(AV)
360°
α
Figure 3. Average and DC on-state current
versus lead temperature (TO-92)
I (A)
T(AV)
1.0
SOT-223
0.8
0.6
0.4
0.2
0.0
0 25 50 75 100 125
α = 30°, 60°, 90°, 120°,180°, DC
T (°C)
l
Figure 4. Average and DC on-state current
versus ambient temperature (free
air convection)
1.0
0.8
I (A)
T(AV)
TO- 92
α = 30°, 60°, 90°, 120°,180°, DC
1.0
0.8
I (A)
T(AV)
DC
SOT-223
= 5 cm²
S
CU
°C/W
0.6
0.4
0.2
T (°C)
0.0
0 25 50 75 100 125
l
Doc ID 15755 Rev 2 3/10
0.6
0.4
0.2
0.0
0 25 50 75 100 125
α = 180°
T (°C)
amb
TO- 92
S
CU
= 0.5 cm²
Characteristics X00619
Figure 5. Relative variation of thermal
impedance junction to ambient
versus pulse duration
Z/R
th(j-a) th(j-a)
1.00
TO- 92
S
= 0.5 cm²
CU
0.10
0.01
1.0E-02 1.0E-01 1.0E+00 1.0E+01 1.0E+02 1.0E+03
SOT-223
S
= 5 cm²
CU
t (s)
p
Figure 7. Relative variation of holding
current versus gate-cathode
resistance (typical values)
I [R ] / I [ =1k ]
HGK HΩRGK
3.5
3.0
2.5
2.0
1.5
1.0
0.5
R(k)GKΩ
0.0
1.E-02 1.E-01 1.E+00 1.E+01 1.E+02
Figure 9. Relative variation of dV/dt immunity
versus gate-cathode capacitance
(typical values)
dV/dt[C ] / dV/dt[ =1k ]GKΩR
100
10
1
1 10
GK
C (nF)
GK
VD= 0.67xV
Rgk= 1 kΩ
DRM
Figure 6. Relative variation of gate trigger,
holding and latching current versus
junction temperature
I,I,I[T] /
GTHL j
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
-40 -20 0 20 40 60 80 100 120
I ,I ,I [T =25°C]
GTHL j
T (°C)
j
Typical values
IHand I
I
GT
L
Figure 8. Relative variation of dV/dt immunity
versus gate-cathode resistance
(typical values)
dV/dt[R ] / dV/dt[ =1k ]GKΩR
100.0
10.0
1.0
0.1
1.0E-01 1.0E+00 1.0E+01
GK
R(k)GKΩ
VD= 0.67xV
DRM
Figure 10. Surge peak on-state current versus
number of cycles
I (A)
TSM
10
9
8
7
6
5
4
3
2
1
0
1 10 100 1000
Non repetitive
T
initial=25 °C
j
Repetitive
T
= 25 °C
l
Number of cycles
tp=10ms
One cycle
4/10 Doc ID 15755 Rev 2
X00619 Characteristics
Figure 11. Non repetitive surge peak on state
I (A), I t (A s)
TSM
100
10
1
0
0.01 0.10 1.00 10.00
current for a sinusoidal pulse and
corresponding value of I
22
I
TSM
t(ms)
p
2
T
Tjinitial=25 °C
I²t
Figure 12. On-state characteristics (maximum
values)
I (A)
TM
10.0
1.0
TJ=125 C
TJ=25 C
V (V)
0.1
0.5 1.0 1.5 2.0 2.5 3.0
TM
Tjmax
Vto=0.85 V
=245 mΩ
R
d
Figure 13. Thermal resistance junction to ambient versus copper surface under tab (SOT-223)
R (°C/W)
th(j-a)
130
120
110
100
90
80
70
60
50
40
30
20
10
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
Epoxy printed circuit board FR4
copper thickness = 35 µm
S(cm²)
Doc ID 15755 Rev 2 5/10
Ordering information scheme X00619
2 Ordering information scheme
Figure 14. Ordering information scheme
X 006 19 M A 1AA2
Sensitive SCR series
Current
006 = 0.8 A
Sensitivity
19 = 30 µA to 200 µA
Voltage
M = 600 V
Package
A = TO-92
N = SOT-223
Package
1AA2 = Bulk (TO-92)
2AL2 = Ammopack (TO-92)
5AL2 = Tape and reel (TO-92 and SOT-223)
6/10 Doc ID 15755 Rev 2
X00619 Package information
3 Package information
● Epoxy meets UL94, V0
● Lead-free packages
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
specifications, grade definitions and product status are available at: www.st.com
ECOPACK
Table 6. TO-92 (plastic) dimensions
®
packages, depending on their level of environmental compliance. ECOPACK®
®
is an ST trademark.
.
Dimensions
Ref.
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
A
B
C
A - 1.35 - - 0.053 -
a
B - - 4.70 - - 0.185
C - 2.54 - - 0.100 -
F
DE
D 4.40 - - 0.173 - -
E 12.70 - - 0.500 - -
F - - 3.70 - - 0.146
a - - 0.50 - - 0.019
Doc ID 15755 Rev 2 7/10
Package information X00619
Table 7. SOT-223 dimensions
Dimensions
Ref.
A
A1
e1
D
B1
V
B
c
A1.800.071
A1 0.02 0.10 0.001 0.004
B 0.60 0.70 0.85 0.024 0.027 0.033
B1 2.90 3.00 3.15 0.114 0.118 0.124
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
c 0.24 0.26 0.35 0.009 0.010 0.014
(1)
6.30 6.50 6.70 0.248 0.256 0.264
E
H
1243
D
e 2.3 0.090
e1 4.6 0.181
(1)
3.30 3.50 3.70 0.130 0.138 0.146
e
E
H 6.70 7.00 7.30 0.264 0.276 0.287
V 10° max
1. Do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15mm (0.006inches)
Figure 15. SOT-223 footprint
3.25
1.32
5.16
2.30 0.95
8/10 Doc ID 15755 Rev 2
7.80
1.32
X00619 Ordering information
4 Ordering information
Table 8. Ordering information
Order code Marking Package Weight Base qty Delivery mode
X00619MA1AA2
X00619MA2AL2 2000 Ammopack
X00619MA5AL2 2000
X00619MN5AL2 X0 619 MN SOT-223 0.12 g 1000
X0619 MA TO-92 0.2 g
5 Revision history
Table 9. Document revision history
Date Revision Changes
26-May-2009 1 First issue
03-May-2012 2 Added SOT-223 package.
2500 Bulk
Tape and reel
Doc ID 15755 Rev 2 9/10
X00619
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