STM32F103xF
STM32F103xG
XL-density performance line ARM-based 32-bit MCU with 768 KB to 1 MB Flash, USB, CAN, 17 timers, 3 ADCs, 13 communication interfaces
Features
■Core: ARM 32-bit Cortex™-M3 CPU with MPU
–72 MHz maximum frequency,
1.25 DMIPS/MHz (Dhrystone 2.1) performance at 0 wait state memory access
–Single-cycle multiplication and hardware division
■Memories
–768 Kbytes to 1 Mbyte of Flash memory
–96 Kbytes of SRAM
–Flexible static memory controller with 4 Chip Select. Supports Compact Flash, SRAM, PSRAM, NOR and NAND memories
–LCD parallel interface, 8080/6800 modes
■Clock, reset and supply management
–2.0 to 3.6 V application supply and I/Os
–POR, PDR, and programmable voltage detector (PVD)
–4-to-16 MHz crystal oscillator
–Internal 8 MHz factory-trimmed RC
–Internal 40 kHz RC with calibration
–32 kHz oscillator for RTC with calibration
■Low power
–Sleep, Stop and Standby modes
–VBAT supply for RTC and backup registers
■3 × 12-bit, 1 µs A/D converters (up to 21 channels)
–Conversion range: 0 to 3.6 V
–Triple-sample and hold capability
–Temperature sensor
■2 × 12-bit D/A converters
■DMA: 12-channel DMA controller
–Supported peripherals: timers, ADCs, DAC, SDIO, I2Ss, SPIs, I2Cs and USARTs
■Debug mode
–Serial wire debug (SWD) & JTAG interfaces
–Cortex-M3 Embedded Trace Macrocell™
Target specification
FBGA
LQFP64 10 × 10 mm,
LQFP100 14 × 14 mm, LFBGA144 10 × 10 mm LQFP144 20 × 20 mm
■Up to 112 fast I/O ports
–51/80/112 I/Os, all mappable on 16 external interrupt vectors and almost all 5 V-tolerant
■Up to 17 timers
–Up to ten 16-bit timers, each with up to 4 IC/OC/PWM or pulse counter and quadrature (incremental) encoder input
–2 × 16-bit motor control PWM timers with dead-time generation and emergency stop
–2 × watchdog timers (Independent and Window)
–SysTick timer: a 24-bit downcounter
–2 × 16-bit basic timers to drive the DAC
■Up to 13 communication interfaces
–Up to 2 × I2C interfaces (SMBus/PMBus)
–Up to 5 USARTs (ISO 7816 interface, LIN, IrDA capability, modem control)
–Up to 3 SPIs (18 Mbit/s), 2 with I2S interface multiplexed
–CAN interface (2.0B Active)
–USB 2.0 full speed interface
–SDIO interface
■CRC calculation unit, 96-bit unique ID
■ECOPACK® packages
Reference |
Part number |
STM32F103xF
STM32F103RF STM32F103VF
STM32F103ZF
STM32F103xG
STM32F103RG STM32F103VG
STM32F103ZG
January 2012 |
Doc ID 16554 Rev 3 |
1/120 |
This is preliminary information on a new product foreseen to be developed. Details are subject to change without notice. |
www.st.com |
Contents |
STM32F103xF, STM32F103xG |
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Contents
1 |
Introduction |
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
. 9 |
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2 |
Description . . |
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10 |
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2.1 |
Device overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
11 |
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2.2 |
Full compatibility throughout the family . . . . . . . . . . . . . . . . . . . . . . . . . . |
14 |
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2.3 |
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
15 |
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2.3.1 |
ARM® Cortex™-M3 core with embedded Flash and SRAM . . . . . . . . . |
15 |
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2.3.2 |
Memory protection unit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
15 |
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2.3.3 |
Embedded Flash memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
15 |
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2.3.4 |
CRC (cyclic redundancy check) calculation unit . . . . . . . . . . . . . . . . . . |
15 |
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2.3.5 |
Embedded SRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
16 |
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2.3.6 |
FSMC (flexible static memory controller) . . . . . . . . . . . . . . . . . . . . . . . . |
16 |
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2.3.7 |
LCD parallel interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
16 |
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2.3.8 |
Nested vectored interrupt controller (NVIC) . . . . . . . . . . . . . . . . . . . . . . |
16 |
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2.3.9 |
External interrupt/event controller (EXTI) . . . . . . . . . . . . . . . . . . . . . . . |
16 |
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2.3.10 |
Clocks and startup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
17 |
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2.3.11 |
Boot modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
17 |
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2.3.12 |
Power supply schemes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
17 |
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2.3.13 |
Power supply supervisor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
17 |
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2.3.14 |
Voltage regulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
18 |
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2.3.15 |
Low-power modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
18 |
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2.3.16 |
DMA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
18 |
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2.3.17 |
RTC (real-time clock) and backup registers . . . . . . . . . . . . . . . . . . . . . . |
19 |
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2.3.18 |
Timers and watchdogs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
19 |
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2.3.19 |
I²C bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
21 |
2.3.20Universal synchronous/asynchronous receiver transmitters (USARTs) 21
2.3.21 Serial peripheral interface (SPI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 2.3.22 Inter-integrated sound (I2S) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 2.3.23 SDIO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 2.3.24 Controller area network (CAN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 2.3.25 Universal serial bus (USB) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 2.3.26 GPIOs (general-purpose inputs/outputs) . . . . . . . . . . . . . . . . . . . . . . . . 22 2.3.27 ADC (analog to digital converter) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 2.3.28 DAC (digital-to-analog converter) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
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STM32F103xF, STM32F103xG |
Contents |
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2.3.29 Temperature sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 2.3.30 Serial wire JTAG debug port (SWJ-DP) . . . . . . . . . . . . . . . . . . . . . . . . . 24 2.3.31 Embedded Trace Macrocell™ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
3 |
Pinouts and pin descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
25 |
4 |
Memory mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
37 |
5 |
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
38 |
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5.1 Parameter conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
38 |
5.1.1 Minimum and maximum values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 5.1.2 Typical values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 5.1.3 Typical curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 5.1.4 Loading capacitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 5.1.5 Pin input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 5.1.6 Power supply scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 5.1.7 Current consumption measurement . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
5.2 |
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
40 |
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5.3 |
Operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
41 |
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5.3.1 |
General operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
. 41 |
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5.3.2 |
Operating conditions at power-up / power-down . . . . . . . . . . . . . . . . . |
. 42 |
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5.3.3 |
Embedded reset and power control block characteristics . . . . . . . . . . |
. 42 |
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5.3.4 |
Embedded reference voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
43 |
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5.3.5 |
Supply current characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
43 |
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5.3.6 |
External clock source characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . |
53 |
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5.3.7 |
Internal clock source characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . |
58 |
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5.3.8 |
PLL characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
60 |
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5.3.9 |
Memory characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
60 |
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5.3.10 |
FSMC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
61 |
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5.3.11 |
EMC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
81 |
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5.3.12 |
Absolute maximum ratings (electrical sensitivity) . . . . . . . . . . . . . . . . . |
82 |
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5.3.13 |
I/O current injection characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
83 |
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5.3.14 |
I/O port characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
84 |
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5.3.15 |
NRST pin characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
89 |
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5.3.16 |
TIM timer characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
90 |
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5.3.17 |
Communications interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
91 |
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5.3.18 |
CAN (controller area network) interface . . . . . . . . . . . . . . . . . . . . . . . . |
100 |
Doc ID 16554 Rev 3 |
3/120 |
Contents |
STM32F103xF, STM32F103xG |
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5.3.19 12-bit ADC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101 5.3.20 DAC electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106 5.3.21 Temperature sensor characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 108
6 |
Package characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
109 |
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6.1 |
Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
109 |
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6.2 |
Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
114 |
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6.2.1 |
Reference document . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
. 114 |
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6.2.2 |
Selecting the product temperature range . . . . . . . . . . . . . . . . . . . . . . |
. 115 |
7 |
Part numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
117 |
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8 |
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
118 |
4/120 |
Doc ID 16554 Rev 3 |
STM32F103xF, STM32F103xG |
List of tables |
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List of tables
Table 1. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Table 2. STM32F103xF and STM32F103xG features and peripheral counts . . . . . . . . . . . . . . . . . 11 Table 3. STM32F103xx family . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Table 4. STM32F103xF and STM32F103xG timer feature comparison . . . . . . . . . . . . . . . . . . . . . . 19 Table 5. STM32F103xF and STM32F103xG pin definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 Table 6. FSMC pin definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 Table 7. Voltage characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 Table 8. Current characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 Table 9. Thermal characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 Table 10. General operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 Table 11. Operating conditions at power-up / power-down . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 Table 12. Embedded reset and power control block characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 42 Table 13. Embedded internal reference voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 Table 14. Maximum current consumption in Run mode, code with data processing
running from Flash . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 Table 15. Maximum current consumption in Run mode, code with data processing
running from RAM. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 Table 16. Maximum current consumption in Sleep mode, code running from Flash or RAM. . . . . . . 46 Table 17. Typical and maximum current consumptions in Stop and Standby modes . . . . . . . . . . . . 47 Table 18. Typical current consumption in Run mode, code with data processing
running from Flash . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 Table 19. Typical current consumption in Sleep mode, code running from Flash or
RAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51 Table 20. Peripheral current consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52 Table 21. High-speed external user clock characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54 Table 22. Low-speed external user clock characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54 Table 23. HSE 4-16 MHz oscillator characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
Table 24. LSE oscillator characteristics (fLSE = 32.768 kHz) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57 Table 25. HSI oscillator characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
Table 26. LSI oscillator characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59 Table 27. Low-power mode wakeup timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59 Table 28. PLL characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60 Table 29. Flash memory characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60 Table 30. Flash memory endurance and data retention . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61 Table 31. Asynchronous non-multiplexed SRAM/PSRAM/NOR read timings . . . . . . . . . . . . . . . . . . 63 Table 32. Asynchronous non-multiplexed SRAM/PSRAM/NOR write timings . . . . . . . . . . . . . . . . . . 64 Table 33. Asynchronous read muxed . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64 Table 34. Asynchronous multiplexed PSRAM/NOR read timings. . . . . . . . . . . . . . . . . . . . . . . . . . . . 65 Table 35. Asynchronous multiplexed PSRAM/NOR write timings . . . . . . . . . . . . . . . . . . . . . . . . . . . 66 Table 36. Synchronous multiplexed NOR/PSRAM read timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68 Table 37. Synchronous multiplexed PSRAM write timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70 Table 38. Synchronous non-multiplexed NOR/PSRAM read timings . . . . . . . . . . . . . . . . . . . . . . . . . 71 Table 39. Synchronous non-multiplexed PSRAM write timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72 Table 40. Switching characteristics for PC Card/CF read and write cycles in
attribute/common space . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77 Table 41. Switching characteristics for PC Card/CF read and write cycles in I/O space . . . . . . . . . . 78 Table 42. Switching characteristics for NAND Flash read cycles . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80 Table 43. Switching characteristics for NAND Flash write cycles. . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
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List of tables |
STM32F103xF, STM32F103xG |
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Table 44. EMS characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81 Table 45. EMI characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82 Table 46. ESD absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82 Table 47. Electrical sensitivities . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83 Table 48. I/O current injection susceptibility . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83 Table 49. I/O static characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84 Table 50. Output voltage characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87 Table 51. I/O AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88 Table 52. NRST pin characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89
Table 53. TIMx characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90 Table 54. I2C characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91
Table 55. SCL frequency (fPCLK1= 36 MHz.,VDD = 3.3 V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92 Table 56. SPI characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93 Table 57. I2S characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96
Table 58. SD / MMC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99 Table 59. USB startup time. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99 Table 60. USB DC electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100 Table 61. USB: full-speed electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100 Table 62. ADC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101
Table 63. RAIN max for fADC = 14 MHz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102 Table 64. ADC accuracy - limited test conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102
Table 65. ADC accuracy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103 Table 66. DAC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106 Table 67. TS characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108 Table 68. LFBGA144 – 144-ball low profile fine pitch ball grid array, 10 x 10 mm,
0.8 mm pitch, package data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110 Table 69. LQFP144, 20 x 20 mm, 144-pin low-profile quad flat package mechanical data . . . . . . . 111 Table 70. LQPF100 – 14 x 14 mm 100-pin low-profile quad flat package mechanical data. . . . . . . 112 Table 71. LQFP64 – 10 x 10 mm 64 pin low-profile quad flat package mechanical data . . . . . . . . . 113 Table 72. Package thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 114 Table 73. STM32F103xF and STM32F103xG ordering information scheme . . . . . . . . . . . . . . . . . . 117
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STM32F103xF, STM32F103xG |
List of figures |
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List of figures
Figure 1. |
STM32F103xF and STM32F103xG performance line block diagram. . . . . . . . . . . . . . . . . |
12 |
Figure 2. |
Clock tree . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
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Figure 3. |
STM32F103xF and STM32F103xG XL-density performance line BGA144 ballout . . . . . . |
25 |
Figure 4. |
STM32F103xF and STM32F103xG XL-density performance line LQFP144 pinout. . . . . . |
26 |
Figure 5. |
STM32F103xF and STM32F103xG XL-density performance line LQFP100 pinout. . . . . . |
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Figure 6. |
STM32F103xF and STM32F103xG XL-density performance line |
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LQFP64 pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
28 |
Figure 7. |
Memory map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
37 |
Figure 8. |
Pin loading conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
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Figure 9. |
Pin input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
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Figure 10. |
Power supply scheme. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
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Figure 11. |
Current consumption measurement scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
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Figure 12. |
Typical current consumption in Run mode versus frequency (at 3.6 V) - |
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code with data processing running from RAM, peripherals enabled . . . . . . . . . . . . . . . . . |
45 |
Figure 13. |
Typical current consumption in Run mode versus frequency (at 3.6 V)- |
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code with data processing running from RAM, peripherals disabled . . . . . . . . . . . . . . . . |
45 |
Figure 14. |
Typical current consumption on VBAT with RTC on vs. temperature at different VBAT |
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values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
47 |
Figure 15. |
Typical current consumption in Stop mode with regulator in run mode |
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versus temperature at different VDD values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
48 |
Figure 16. |
Typical current consumption in Stop mode with regulator in low-power |
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mode versus temperature at different VDD values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
49 |
Figure 17. |
Typical current consumption in Standby mode versus temperature at |
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different VDD values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
49 |
Figure 18. |
High-speed external clock source AC timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
55 |
Figure 19. |
Low-speed external clock source AC timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
55 |
Figure 20. |
Typical application with an 8 MHz crystal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
56 |
Figure 21. |
Typical application with a 32.768 kHz crystal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
58 |
Figure 22. |
Asynchronous non-multiplexed SRAM/PSRAM/NOR read waveforms . . . . . . . . . . . . . . . |
62 |
Figure 23. |
Asynchronous non-multiplexed SRAM/PSRAM/NOR write waveforms . . . . . . . . . . . . . . . |
63 |
Figure 24. |
Asynchronous multiplexed PSRAM/NOR read waveforms. . . . . . . . . . . . . . . . . . . . . . . . . |
65 |
Figure 25. |
Asynchronous multiplexed PSRAM/NOR write waveforms . . . . . . . . . . . . . . . . . . . . . . . . |
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Figure 26. |
Synchronous multiplexed NOR/PSRAM read timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
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Figure 27. |
Synchronous multiplexed PSRAM write timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
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Figure 28. |
Synchronous non-multiplexed NOR/PSRAM read timings . . . . . . . . . . . . . . . . . . . . . . . . . |
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Figure 29. |
Synchronous non-multiplexed PSRAM write timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
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Figure 30. |
PC Card/CompactFlash controller waveforms for common memory read access . . . . . . . |
73 |
Figure 31. |
PC Card/CompactFlash controller waveforms for common memory write access . . . . . . . |
74 |
Figure 32. |
PC Card/CompactFlash controller waveforms for attribute memory read |
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access. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
75 |
Figure 33. |
PC Card/CompactFlash controller waveforms for attribute memory write |
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access. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
76 |
Figure 34. |
PC Card/CompactFlash controller waveforms for I/O space read access . . . . . . . . . . . . . |
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Figure 35. |
PC Card/CompactFlash controller waveforms for I/O space write access . . . . . . . . . . . . . |
77 |
Figure 36. |
NAND controller waveforms for read access . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
79 |
Figure 37. |
NAND controller waveforms for write access . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
79 |
Figure 38. |
NAND controller waveforms for common memory read access . . . . . . . . . . . . . . . . . . . . . |
79 |
Figure 39. |
NAND controller waveforms for common memory write access. . . . . . . . . . . . . . . . . . . . . |
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STM32F103xF, STM32F103xG |
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Figure 40. Standard I/O input characteristics - CMOS port . . . . . . . . . . |
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Figure 41. Standard I/O input characteristics - TTL port . . . . . . . . . . . . |
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Figure 42. 5 V tolerant I/O input characteristics - CMOS port . . . . . . . . |
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Figure 43. 5 V tolerant I/O input characteristics - TTL port . . . . . . . . . . |
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Figure 44. I/O AC characteristics definition . . . . . . . . . . . . . . . . . . . . . . |
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Figure 45. Recommended NRST pin protection . . . . . . . . . . . . . . . . . . |
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Figure 46. I2C bus AC waveforms and measurement circuit . . . . . . . . . |
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Figure 47. SPI timing diagram - slave mode and CPHA = 0 . . . . . . . . . |
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Figure 48. SPI timing diagram - slave mode and CPHA = 1(1) . . . . . . . |
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Figure 49. SPI timing diagram - master mode(1) . . . . . . . . . . . . . . . . . . |
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Figure 50. I2S slave timing diagram (Philips protocol)(1) . . . . . . . . . . . . |
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Figure 51. I2S master timing diagram (Philips protocol)(1) . . . . . . . . . . . |
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Figure 52. SDIO high-speed mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
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Figure 53. SD default mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
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Figure 54. USB timings: definition of data signal rise and fall time . . . . |
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Figure 55. ADC accuracy characteristics . . . . . . . . . . . . . . . . . . . . . . . . |
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Figure 56. Typical connection diagram using the ADC . . . . . . . . . . . . . |
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104 |
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Figure 57. Power supply and reference decoupling (VREF+ not connected to VDDA). . . . . . . . . . . . . |
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Figure 58. Power supply and reference decoupling (VREF+ connected to VDDA). . . . . . . . . . . . . . . . |
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Figure 59. 12-bit buffered /non-buffered DAC . . . . . . . . . . . . . . . . . . . . |
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Figure 60. Recommended PCB design rules (0.80/0.75 mm pitch BGA |
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Figure 61. LFBGA144 – 144-ball low profile fine pitch ball grid array, 10 x 10 mm, |
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0.8 mm pitch, package outline . . . . . . . . . . . . . . . . . . . . . . . |
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110 |
Figure 62. LQFP144, 20 x 20 mm, 144-pin low-profile quad |
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flat package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
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111 |
Figure 63. |
Recommended footprint(1) . . . . . . . . . . . . . . . . . . . . . . . . . . |
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111 |
Figure 64. LQFP100, 14 x 14 mm 100-pin low-profile quad flat package outline . . . . . . . . . . . . . . . |
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Figure 65. |
Recommended footprint(1) . . . . . . . . . . . . . . . . . . . . . . . . . . |
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112 |
Figure 66. LQFP64 – 10 x 10 mm 64 pin low-profile quad flat package outline . . . . . . . . . . . . . . . . |
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Figure 67. |
Recommended footprint(1) . . . . . . . . . . . . . . . . . . . . . . . . . . |
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113 |
Figure 68. |
LQFP100 PD max vs. TA . . . . . . . . . . . . . . . . . . . . . . . . . . . |
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STM32F103xF, STM32F103xG |
Introduction |
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This datasheet provides the ordering information and mechanical device characteristics of the STM32F103xF and STM32F103xG XL-density performance line microcontrollers. For more details on the whole STMicroelectronics STM32F103xx family, please refer to
Section 2.2: Full compatibility throughout the family.
The XL-density STM32F103xx datasheet should be read in conjunction with the STM32F10xxx reference manual.
For information on programming, erasing and protection of the internal Flash memory please refer to the STM32F10xxx Flash programming manual.
The reference and Flash programming manuals are both available from the STMicroelectronics website www.st.com.
For information on the Cortex™-M3 core please refer to the Cortex™-M3 Technical Reference Manual, available from the www.arm.com website at the following address: http://infocenter.arm.com/help/index.jsp?topic=/com.arm.doc.ddi0337e/.
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Description |
STM32F103xF, STM32F103xG |
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The STM32F103xF and STM32F103xG performance line family incorporates the highperformance ARM® Cortex™-M3 32-bit RISC core operating at a 72 MHz frequency, highspeed embedded memories (Flash memory up to 1 Mbyte and SRAM up to 96 Kbytes), and an extensive range of enhanced I/Os and peripherals connected to two APB buses. All devices offer three 12-bit ADCs, ten general-purpose 16-bit timers plus two PWM timers, as well as standard and advanced communication interfaces: up to two I2Cs, three SPIs, two I2Ss, one SDIO, five USARTs, an USB and a CAN.
The STM32F103xx XL-density performance line family operates in the –40 to +105 °C temperature range, from a 2.0 to 3.6 V power supply. A comprehensive set of power-saving mode allows the design of low-power applications.
These features make the STM32F103xx high-density performance line microcontroller family suitable for a wide range of applications such as motor drives, application control, medical and handheld equipment, PC and gaming peripherals, GPS platforms, industrial applications, PLCs, inverters, printers, scanners, alarm systems and video intercom.
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STM32F103xF, STM32F103xG |
Description |
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The STM32F103xx XL-density performance line family offers devices in four different package types: from 64 pins to 144 pins. Depending on the device chosen, different sets of peripherals are included, the description below gives an overview of the complete range of peripherals proposed in this family.
Figure 1 shows the general block diagram of the device family.
Table 2. |
STM32F103xF and STM32F103xG features and peripheral counts |
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Peripherals |
STM32F103Rx |
STM32F103Vx |
STM32F103Zx |
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Flash memory |
768 KB |
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1 MB |
768 KB |
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1 MB |
768 KB |
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1 MB |
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SRAM in Kbytes |
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96 |
96 |
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96 |
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FSMC |
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No |
Yes(1) |
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Yes |
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General-purpose |
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10 |
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Timers |
Advanced-control |
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2 |
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Basic |
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2 |
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SPI(I2S)(2) |
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3(2) |
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I2C |
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2 |
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Comm |
USART |
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5 |
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USB |
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1 |
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CAN |
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1 |
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SDIO |
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1 |
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GPIOs |
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51 |
80 |
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112 |
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12-bit ADC |
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Number of channels |
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21 |
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12-bit DAC |
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2 |
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Number of channels |
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2 |
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CPU frequency |
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72 MHz |
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Operating voltage |
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2.0 to 3.6 V |
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Operating temperatures |
Ambient temperatures: –40 to +85 °C /–40 to +105 °C (see Table 10) |
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Junction temperature: –40 to + 125 °C (see Table 10) |
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Package |
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LQFP64 |
LQFP100 |
LQFP144, BGA144 |
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1.For the LQFP100 package, only FSMC Bank1 and Bank2 are available. Bank1 can only support a multiplexed NOR/PSRAM memory using the NE1 Chip Select. Bank2 can only support a 16or 8-bit NAND Flash memory using the NCE2 Chip Select. The interrupt line cannot be used since Port G is not available in this package.
2.The SPI2 and SPI3 interfaces give the flexibility to work in an exclusive way in either the SPI mode or the I2S audio mode.
Doc ID 16554 Rev 3 |
11/120 |
Description |
STM32F103xF, STM32F103xG |
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TRACECLK |
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TRACED[0:3] |
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TPIU |
ETM |
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as AF |
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SWJTAG |
Trace/Trig |
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NJTRST |
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Ib u s |
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JTDI |
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MPU |
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JTCK/SWCLK |
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JTMS/SWDAT |
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JTDO |
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Cortex-M3 CPU |
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Dbus |
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as AF |
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Fmax: 48/72 MHz |
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NVIC |
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S |
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ystem |
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obl |
ce |
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Flash |
interfa |
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bl |
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o |
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ce |
Flash |
interfa |
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Flash1 512 KB |
VDD |
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POWER |
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VDD =2 t o 3 .6V |
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64 bit |
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VOLT. REG. |
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VSS |
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3.3V TO 1.8V |
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Flash2 512 KB |
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@VDD |
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64 bit |
POR |
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SUPPLY |
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Reset |
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SUPERVISION |
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NRST |
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Int |
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POR / PDR |
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VDDA |
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VSSA |
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NVIC |
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@VDDA |
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PVD |
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SRAM |
RC HS |
@VDDA |
@V |
DD |
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96 Kbyte |
RC LS |
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OSC_IN |
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PLL |
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XTAL OSC |
OSC_OUT |
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GP DMA1 |
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4-16 MHz |
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7 channels |
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IWDG |
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GP DMA2 |
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Standby |
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A[25:0] |
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PCLK1 |
interface |
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VBAT=1.8 V to 3 .6V |
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5 channels |
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Reset & |
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D[15:0] |
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PCLK2 |
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@VSW |
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CLK |
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clock |
PCLK3 |
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OSC32_IN |
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NOE |
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controller |
HCLK |
XTAL 32 kHz |
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OSC32_OUT |
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NWE |
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FCLK |
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Backup |
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NE[3:0] |
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RTC |
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TAMPER-RTC |
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NBL[1:0] |
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reg |
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FSMC |
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AWU |
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(ALARM OUT) |
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NWAIT |
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Backup interface |
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NL |
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as AF |
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AHB2 |
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TIM2 |
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4 Ch, ETR as AF |
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D[7:0], CMD |
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SDIO |
APB3 |
APB2 |
APB1 |
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TIM3 |
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4 Ch, ETR as AF |
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CK as AF |
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112 AF |
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EXT.IT |
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WKUP |
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PA[15:0] |
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GPIO port A |
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PB[15:0] |
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GPIO port B |
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PC[15:0] |
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GPIO port C |
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PD[15:0] |
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GPIO port D |
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PE[15:0] |
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GPIO port E |
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PF[15:0] |
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GPIO port F |
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PG[15:0] |
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GPIO port G |
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4 channels |
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4 compl. channels |
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TIM1 |
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BKIN, ETR input as AF |
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4 channels |
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4 compl. channels |
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TIM8 |
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BKIN, ETR input as AF |
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2 channels as AF |
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TIM9 |
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1 channel as AF |
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TIM10 |
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1 channel as AF |
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TIM11 |
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MOSI,MISO, |
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SPI1 |
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SCK,NSS as AF |
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RX,TX, CTS, RTS, |
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USART1 |
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CK as AF |
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8 ADINs common |
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Temp sensor |
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to the 3 ADCs |
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12b it ADC1 |
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IF |
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8 ADINs common |
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to the ADC1 & 2 |
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12bit ADC2 |
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IF |
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5 ADINs on ADC3 |
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12b it ADC3 |
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IF |
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VREF– |
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VREF+ |
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@VDDA |
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APB2 : Fmax=48 / 72 MHz
WWDG
SRAM 512B
TIM6
TIM7
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TIM4 |
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4 Ch, ETR as AF |
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TIM5 |
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4 Ch, ETR as AF |
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2 channels as AF |
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TIM12 |
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TIM13 |
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1 channel as AF |
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1 channel as AF |
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TIM14 |
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RX,TX, CTS, RTS, |
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USART2 |
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CK as AF |
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RX,TX, CTS, RTS, |
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USART3 |
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CK as AF |
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UART4 |
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RX,TX as AF |
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RX,TX as AF |
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UART5 |
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MOSI/SD,MISO, |
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SPI2/I2S2 |
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SCK/CK,NSS/WS, |
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MCLK as AF |
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MOSI/SD,MISO, |
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SPI3/I2S3 |
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SCK/CK,NSS/WS, |
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MCLK as AF |
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I2C1 |
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SCL,SDA,SMBA |
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as AF |
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I2C2 |
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SCL,SDA,SMBA |
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as AF |
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b xCAN device |
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USBDP/CAN_TX |
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USB 2.0 FS device |
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USBDM/CAN_RX |
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IF |
12bit DAC1 |
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DAC1_OUT as AF |
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IF |
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12bit DAC2 |
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DAC2_OUT as AF |
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@VDDA |
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ai17352
1.TA = –40 °C to +85 °C (suffix 6, see Table 73) or –40 °C to +105 °C (suffix 7, see Table 73), junction temperature up to 105 °C or 125 °C, respectively.
2.AF = alternate function on I/O port pin.
12/120 |
Doc ID 16554 Rev 3 |
STM32F103xF, STM32F103xG |
Description |
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Figure 2. |
Clock tree |
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FLITFCLK |
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to Flash programming interface |
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USB |
48 MHz |
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USBCLK |
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Prescaler |
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to USB interface |
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/1, 1.5 |
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I2S3CLK |
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to I2S3 |
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Peripheral clock |
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enable |
I2S2CLK |
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to I2S2 |
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Peripheral clock |
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SDIOCLK |
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8 MHz |
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enable |
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to SDIO |
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Peripheral clock |
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HSI |
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HSI RC |
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enable |
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FSMCCLK |
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to FSMC |
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Peripheral clock |
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/2 |
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enable |
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HCLK |
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72 MHz max |
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to AHB bus, core, |
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Clock |
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memory and DMA |
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Enable |
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to Cortex System timer |
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PLLSRC |
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SW |
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/8 |
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PLLMUL |
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FCLK Cortex |
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..., x16 |
HSI |
SYSCLK |
AHB |
APB1 |
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free running clock |
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36 MHz max |
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PCLK1 |
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x2, x3, x4 |
PLLCLK |
72 MHz |
Prescaler |
Prescaler |
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to APB1 |
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PLL |
/1, 2..512 |
/1, 2, 4, 8, 16 |
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max |
Peripheral Clock |
peripherals |
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HSE |
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Enable |
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TIM2,3,4,5,12,13,14,6,7 |
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to TIM2/3/4/5/12/13/14 |
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and TIM6/7 |
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TIMxCLK |
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CSS |
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else |
x2 |
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Peripheral Clock |
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Enable |
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PLLXTPRE |
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APB2 |
72 MHz max |
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PCLK2 |
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Prescaler |
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OSC_OUT |
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peripherals to APB2 |
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4-16 MHz |
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/1, 2, 4, 8, 16 |
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Peripheral Clock |
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OSC_IN |
HSE OSC |
/2 |
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Enable |
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TIM1, 8, 9, 10, 11 |
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to TIM1/8 |
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and TIM9/10/11 |
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If (APB2 prescaler =1) x1 |
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TIMxCLK |
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else x2 |
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/128 |
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Peripheral Clock |
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ADC |
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Enable |
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OSC32_IN |
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to RTC |
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to ADC1, 2 or 3 |
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LSE OSC |
LSE |
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Prescaler |
ADCCLK |
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32.768 kHz |
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RTCCLK |
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/2, 4, 6, 8 |
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OSC32_OUT |
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RTCSEL[1:0] |
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/2 |
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HCLK/2 |
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To SDIO AHB interface |
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to Independent Watchdog (IWDG) |
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Peripheral clock |
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LSI RC |
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LSI |
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enable |
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40 kHz |
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IWDGCLK |
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Main |
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Legend: |
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/2 |
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PLLCLK |
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Clock Output |
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HSE = High-speed external clock signal |
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MCO |
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HSI |
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HSI = High-speed internal clock signal |
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HSE |
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LSI = Low-speed internal clock signal |
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SYSCLK |
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LSE = Low-speed external clock signal |
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MCO |
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ai17354 |
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1.When the HSI is used as a PLL clock input, the maximum system clock frequency that can be achieved is 64 MHz.
2.For the USB function to be available, both HSE and PLL must be enabled, with the USBCLK at 48 MHz.
3.To have an ADC conversion time of 1 µs, APB2 must be at 14 MHz, 28 MHz or 56 MHz.
Doc ID 16554 Rev 3 |
13/120 |
Description |
STM32F103xF, STM32F103xG |
|
|
The STM32F103xx is a complete family whose members are fully pin-to-pin, software and feature compatible. In the reference manual, the STM32F103x4 and STM32F103x6 are identified as low-density devices, the STM32F103x8 and STM32F103xB are referred to as medium-density devices, the STM32F103xC, STM32F103xD and STM32F103xE are referred to as high-density devices and the STM32F103xF and STM32F103xG are called XL-density devices.
Low-density, high-density and XL-density devices are an extension of the STM32F103x8/B medium-density devices, they are specified in the STM32F103x4/6, STM32F103xC/D/E and STM32F103xF/G datasheets, respectively. Low-density devices feature lower Flash memory and RAM capacities, less timers and peripherals. High-density devices have higher Flash memory and RAM capacities, and additional peripherals like SDIO, FSMC, I2S and DAC. XL-density devices bring even more Flash and RAM memory, and extra features, namely an MPU, a greater number of timers and a dual bank Flash structure while remaining fully compatible with the other members of the family.
The STM32F103x4, STM32F103x6, STM32F103xC, STM32F103xD, STM32F103xE, STM32F103xF and STM32F103xG are a drop-in replacement for the STM32F103x8/B devices, allowing the user to try different memory densities and providing a greater degree of freedom during the development cycle.
Moreover, the STM32F103xx performance line family is fully compatible with all existing STM32F101xx access line and STM32F102xx USB access line devices.
Table 3. |
STM32F103xx family |
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Low-density |
Medium-density |
High-density devices |
XL-density devices |
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devices |
devices |
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16 KB |
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32 KB |
64 KB |
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128 KB |
256 KB |
384 KB |
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512 KB |
768 KB Flash |
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1 MB Flash |
Pinout |
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Flash |
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Flash(1) |
Flash |
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Flash |
Flash |
Flash |
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Flash |
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6 KB |
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10 KB |
20 KB |
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20 KB |
48 or |
64 KB |
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64 KB |
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64 KB(2) |
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96 KB RAM |
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96 KB RAM |
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RAM |
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RAM |
RAM |
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RAM |
RAM |
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RAM |
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RAM |
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144 |
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5 × USARTs |
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5 × USARTs |
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10 × 16-bit timers, |
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||||
100 |
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4 × 16-bit timers, |
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2 × basic timers |
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2 × basic timers |
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3 × SPIs, 2 × I2Ss, 2 × I2Cs |
|||||
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3 × USARTs |
|
3 × SPIs, 2 × I2Ss, 2 × I2Cs |
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USB, CAN, 2 × PWM timers |
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3 × 16-bit timers |
USB, CAN, 2 × PWM timers |
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2 × USARTs |
3 × ADCs, 2 × DACs, 1 × SDIO, |
||||||||||||
|
2 × SPIs, 2 × I2Cs, |
3 × ADCs, 2 × DACs, |
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|||||||||||
64 |
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Cortex-M3 with MPU |
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2 × 16-bit timers |
USB, CAN, |
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1 × SDIO |
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||||||||
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1 × SPI, 1 × I2C, |
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FSMC (100and 144-pin |
||||||||
|
1 × PWM timer |
FSMC (100and 144-pin |
||||||||||||
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USB, CAN, |
packages(4)), dual bank Flash |
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packages(3)) |
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||||||||||||
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2 × ADCs |
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memory |
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1 × PWM timer |
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2 × ADCs |
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48 |
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36 |
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1.For orderable part numbers that do not show the A internal code after the temperature range code (6 or 7), the reference datasheet for electrical characteristics is that of the STM32F103x8/B medium-density devices.
2.64 KB RAM for 256 KB Flash are available on devices delivered in CSP packages only.
3.Ports F and G are not available in devices delivered in 100-pin packages.
4.Ports F and G are not available in devices delivered in 100-pin packages.
14/120 |
Doc ID 16554 Rev 3 |
STM32F103xF, STM32F103xG |
Description |
|
|
2.3.1ARM® Cortex™-M3 core with embedded Flash and SRAM
The ARM Cortex™-M3 processor is the latest generation of ARM processors for embedded systems. It has been developed to provide a low-cost platform that meets the needs of MCU implementation, with a reduced pin count and low-power consumption, while delivering outstanding computational performance and an advanced system response to interrupts.
The ARM Cortex™-M3 32-bit RISC processor features exceptional code-efficiency, delivering the high-performance expected from an ARM core in the memory size usually associated with 8- and 16-bit devices.
With its embedded ARM core, STM32F103xF and STM32F103xG performance line family is compatible with all ARM tools and software.
Figure 1 shows the general block diagram of the device family.
The memory protection unit (MPU) is used to separate the processing of tasks from the data protection. The MPU can manage up to 8 protection areas that can all be further divided up into 8 subareas. The protection area sizes are between 32 bytes and the whole 4 gigabytes of addressable memory.
The memory protection unit is especially helpful for applications where some critical or certified code has to be protected against the misbehavior of other tasks. It is usually managed by an RTOS (real-time operating system). If a program accesses a memory location that is prohibited by the MPU, the RTOS can detect it and take action. In an RTOS environment, the kernel can dynamically update the MPU area setting, based on the process to be executed.
The MPU is optional and can be bypassed for applications that do not need it.
768 Kbytes to 1 Mbyte of embedded Flash are available for storing programs and data. The Flash memory is organized as two banks. The first bank has a size of 512 Kbytes. The second bank is either 256 or 512 Kbytes depending on the device. This gives the device the capability of writing to one bank while executing code from the other bank (read-while-write capability).
The CRC (cyclic redundancy check) calculation unit is used to get a CRC code from a 32-bit data word and a fixed generator polynomial.
Among other applications, CRC-based techniques are used to verify data transmission or storage integrity. In the scope of the EN/IEC 60335-1 standard, they offer a means of verifying the Flash memory integrity. The CRC calculation unit helps compute a signature of the software during runtime, to be compared with a reference signature generated at linktime and stored at a given memory location.
Doc ID 16554 Rev 3 |
15/120 |
Description |
STM32F103xF, STM32F103xG |
|
|
96 Kbytes of embedded SRAM accessed (read/write) at CPU clock speed with 0 wait states.
The FSMC is embedded in the STM32F103xF and STM32F103xG performance line family. It has four Chip Select outputs supporting the following modes: PC Card/Compact Flash, SRAM, PSRAM, NOR and NAND.
Functionality overview:
●The three FSMC interrupt lines are ORed in order to be connected to the NVIC
●Write FIFO
●Code execution from external memory except for NAND Flash and PC Card
●The targeted frequency, fCLK, is HCLK/2, so external access is at 36 MHz when HCLK is at 72 MHz and external access is at 24 MHz when HCLK is at 48 MHz
The FSMC can be configured to interface seamlessly with most graphic LCD controllers. It supports the Intel 8080 and Motorola 6800 modes, and is flexible enough to adapt to specific LCD interfaces. This LCD parallel interface capability makes it easy to build costeffective graphic applications using LCD modules with embedded controllers or highperformance solutions using external controllers with dedicated acceleration.
The STM32F103xF and STM32F103xG performance line embeds a nested vectored interrupt controller able to handle up to 60 maskable interrupt channels (not including the 16 interrupt lines of Cortex™-M3) and 16 priority levels.
●Closely coupled NVIC gives low latency interrupt processing
●Interrupt entry vector table address passed directly to the core
●Closely coupled NVIC core interface
●Allows early processing of interrupts
●Processing of late arriving higher priority interrupts
●Support for tail-chaining
●Processor state automatically saved
●Interrupt entry restored on interrupt exit with no instruction overhead
This hardware block provides flexible interrupt management features with minimal interrupt latency.
The external interrupt/event controller consists of 19 edge detector lines used to generate interrupt/event requests. Each line can be independently configured to select the trigger event (rising edge, falling edge, both) and can be masked independently. A pending register maintains the status of the interrupt requests. The EXTI can detect an external line with a pulse width shorter than the Internal APB2 clock period. Up to 112 GPIOs can be connected to the 16 external interrupt lines.
16/120 |
Doc ID 16554 Rev 3 |
STM32F103xF, STM32F103xG |
Description |
|
|
System clock selection is performed on startup, however the internal RC 8 MHz oscillator is selected as default CPU clock on reset. An external 4-16 MHz clock can be selected, in which case it is monitored for failure. If failure is detected, the system automatically switches back to the internal RC oscillator. A software interrupt is generated if enabled. Similarly, full interrupt management of the PLL clock entry is available when necessary (for example with failure of an indirectly used external oscillator).
Several prescalers allow the configuration of the AHB frequency, the high speed APB (APB2) and the low speed APB (APB1) domains. The maximum frequency of the AHB and the high speed APB domains is 72 MHz. The maximum allowed frequency of the low speed APB domain is 36 MHz. See Figure 2 for details on the clock tree.
At startup, boot pins are used to select one of three boot options:
●Boot from user Flash: you have an option to boot from any of two memory banks. By default, boot from Flash memory bank 1 is selected. You can choose to boot from Flash memory bank 2 by setting a bit in the option bytes.
●Boot from system memory
●Boot from embedded SRAM
The boot loader is located in system memory. It is used to reprogram the Flash memory by using USART1.
●VDD = 2.0 to 3.6 V: external power supply for I/Os and the internal regulator. Provided externally through VDD pins.
●VSSA, VDDA = 2.0 to 3.6 V: external analog power supplies for ADC, DAC, Reset blocks, RCs and PLL (minimum voltage to be applied to VDDA is 2.4 V when the ADC or DAC is used). VDDA and VSSA must be connected to VDD and VSS, respectively.
●VBAT = 1.8 to 3.6 V: power supply for RTC, external clock 32 kHz oscillator and backup registers (through power switch) when VDD is not present.
For more details on how to connect power pins, refer to Figure 10: Power supply scheme.
The device has an integrated power-on reset (POR)/power-down reset (PDR) circuitry. It is always active, and ensures proper operation starting from/down to 2 V. The device remains
in reset mode when VDD is below a specified threshold, VPOR/PDR, without the need for an external reset circuit.
The device features an embedded programmable voltage detector (PVD) that monitors the
VDD/VDDA power supply and compares it to the VPVD threshold. An interrupt can be generated when VDD/VDDA drops below the VPVD threshold and/or when VDD/VDDA is higher
than the VPVD threshold. The interrupt service routine can then generate a warning message and/or put the MCU into a safe state. The PVD is enabled by software. Refer to
Table 12: Embedded reset and power control block characteristics for the values of VPOR/PDR and VPVD.
Doc ID 16554 Rev 3 |
17/120 |
Description |
STM32F103xF, STM32F103xG |
|
|
The regulator has three operation modes: main (MR), low power (LPR) and power down.
●MR is used in the nominal regulation mode (Run)
●LPR is used in the Stop modes.
●Power down is used in Standby mode: the regulator output is in high impedance: the kernel circuitry is powered down, inducing zero consumption (but the contents of the registers and SRAM are lost)
This regulator is always enabled after reset. It is disabled in Standby mode.
2.3.15Low-power modes
The STM32F103xF and STM32F103xG performance line supports three low-power modes to achieve the best compromise between low power consumption, short startup time and available wakeup sources:
●Sleep mode
In Sleep mode, only the CPU is stopped. All peripherals continue to operate and can wake up the CPU when an interrupt/event occurs.
●Stop mode
Stop mode achieves the lowest power consumption while retaining the content of SRAM and registers. All clocks in the 1.8 V domain are stopped, the PLL, the HSI RC and the HSE crystal oscillators are disabled. The voltage regulator can also be put either in normal or in low-power mode.
The device can be woken up from Stop mode by any of the EXTI line. The EXTI line source can be one of the 16 external lines, the PVD output, the RTC alarm or the USB wakeup.
●Standby mode
The Standby mode is used to achieve the lowest power consumption. The internal voltage regulator is switched off so that the entire 1.8 V domain is powered off. The PLL, the HSI RC and the HSE crystal oscillators are also switched off. After entering Standby mode, SRAM and register contents are lost except for registers in the Backup domain and Standby circuitry.
The device exits Standby mode when an external reset (NRST pin), an IWDG reset, a rising edge on the WKUP pin, or an RTC alarm occurs.
Note: |
The RTC, the IWDG, and the corresponding clock sources are not stopped by entering Stop |
|
or Standby mode. |
2.3.16 DMA
The flexible 12-channel general-purpose DMAs (7 channels for DMA1 and 5 channels for DMA2) are able to manage memory-to-memory, peripheral-to-memory and memory-to- peripheral transfers. The two DMA controllers support circular buffer management, removing the need for user code intervention when the controller reaches the end of the buffer.
Each channel is connected to dedicated hardware DMA requests, with support for software trigger on each channel. Configuration is made by software and transfer sizes between source and destination are independent.
18/120 |
Doc ID 16554 Rev 3 |
STM32F103xF, STM32F103xG |
Description |
|
|
The DMA can be used with the main peripherals: SPI, I2C, USART, general-purpose, basic and advanced-control timers TIMx, DAC, I2S, SDIO and ADC.
2.3.17RTC (real-time clock) and backup registers
The RTC and the backup registers are supplied through a switch that takes power either on VDD supply when present or through the VBAT pin. The backup registers are forty-two 16-bit registers used to store 84 bytes of user application data when VDD power is not present.
They are not reset by a system or power reset, and they are not reset when the device wakes up from the Standby mode.
The real-time clock provides a set of continuously running counters which can be used with suitable software to provide a clock calendar function, and provides an alarm interrupt and a periodic interrupt. It is clocked by a 32.768 kHz external crystal, resonator or oscillator, the internal low power RC oscillator or the high-speed external clock divided by 128. The internal low-speed RC has a typical frequency of 40 kHz. The RTC can be calibrated using an external 512 Hz output to compensate for any natural quartz deviation. The RTC features a 32-bit programmable counter for long term measurement using the Compare register to generate an alarm. A 20-bit prescaler is used for the time base clock and is by default configured to generate a time base of 1 second from a clock at 32.768 kHz.
The XL-density STM32F103xx performance line devices include up to two advanced-control timers, up to ten general-purpose timers, two basic timers, two watchdog timers and a SysTick timer.
Table 4 compares the features of the advanced-control, general-purpose and basic timers.
Table 4. |
STM32F103xF and STM32F103xG timer feature comparison |
|
||||||
Timer |
|
Counter |
Counter |
Prescaler factor |
DMA request |
Capture/compare |
Complementary |
|
|
resolution |
type |
generation |
channels |
outputs |
|||
|
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|
||||||
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Up, |
Any integer between |
|
|
|
|
TIM1, TIM8 |
|
16-bit |
down, |
Yes |
4 |
Yes |
||
|
1 and 65536 |
|||||||
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up/down |
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||
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||
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TIM2, TIM3, |
|
Up, |
Any integer between |
|
|
|
||
16-bit |
down, |
Yes |
4 |
No |
||||
TIM4, TIM5 |
|
1 and 65536 |
||||||
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up/down |
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TIM9, TIM12 |
|
16-bit |
Up |
Any integer between |
No |
2 |
No |
|
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1 and 65536 |
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||
TIM10, TIM11 |
16-bit |
Up |
Any integer between |
No |
1 |
No |
||
TIM13, TIM14 |
1 and 65536 |
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TIM6, TIM7 |
|
16-bit |
Up |
Any integer between |
Yes |
0 |
No |
|
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1 and 65536 |
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Doc ID 16554 Rev 3 |
19/120 |
Description |
STM32F103xF, STM32F103xG |
|
|
Advanced-control timers (TIM1 and TIM8)
The two advanced-control timers (TIM1 and TIM8) can each be seen as a three-phase PWM multiplexed on 6 channels. They have complementary PWM outputs with programmable inserted dead-times. They can also be seen as a complete general-purpose timer. The 4 independent channels can be used for:
●Input capture
●Output compare
●PWM generation (edge or center-aligned modes)
●One-pulse mode output
If configured as a standard 16-bit timer, it has the same features as the TIMx timer. If configured as the 16-bit PWM generator, it has full modulation capability (0-100%).
In debug mode, the advanced-control timer counter can be frozen and the PWM outputs disabled to turn off any power switch driven by these outputs.
Many features are shared with those of the general-purpose TIM timers which have the same architecture. The advanced-control timer can therefore work together with the TIM timers via the Timer Link feature for synchronization or event chaining.
General-purpose timers (TIMx)
There are10 synchronizable general-purpose timers embedded in the STM32F103xF and STM32F103xG performance line devices (see Table 4 for differences).
●TIM2, TIM3, TIM4, TIM5
There are up to 4 synchronizable general-purpose timers (TIM2, TIM3, TIM4 and TIM5) embedded in the STM32F103xF and STM32F103xG access line devices.
These timers are based on a 16-bit auto-reload up/down counter, a 16-bit prescaler and feature 4 independent channels each for input capture/output compare, PWM or one-pulse mode output. This gives up to 16 input captures / output compares / PWMs on the largest packages.
Their counter can be frozen in debug mode. Any of the general-purpose timers can be used to generate PWM outputs. They all have independent DMA request generation.
These timers are capable of handling quadrature (incremental) encoder signals and the digital outputs from 1 to 3 hall-effect sensors.
●TIM10, TIM11 and TIM9
These timers are based on a 16-bit auto-reload upcounter and a 16-bit prescaler. TIM10 and TIM11 feature one independent channel, whereas TIM9 has two independent channels for input capture/output compare, PWM or one-pulse mode output. They can be synchronized with the TIM2, TIM3, TIM4, TIM5 full-featured general-purpose timers. They can also be used as simple time bases.
●TIM13, TIM14 and TIM12
These timers are based on a 16-bit auto-reload upcounter and a 16-bit prescaler. TIM13 and TIM14 feature one independent channel, whereas TIM12 has two independent channels for input capture/output compare, PWM or one-pulse mode output. They can be synchronized with the TIM2, TIM3, TIM4, TIM5 full-featured general-purpose timers. They can also be used as simple time bases.
20/120 |
Doc ID 16554 Rev 3 |
STM32F103xF, STM32F103xG |
Description |
|
|
Basic timers TIM6 and TIM7
These timers are mainly used for DAC trigger generation. They can also be used as a generic 16-bit time base.
Independent watchdog
The independent watchdog is based on a 12-bit downcounter and 8-bit prescaler. It is clocked from an independent 40 kHz internal RC and as it operates independently from the main clock, it can operate in Stop and Standby modes. It can be used either as a watchdog to reset the device when a problem occurs, or as a free running timer for application timeout management. It is hardware or software configurable through the option bytes. The counter can be frozen in debug mode.
Window watchdog
The window watchdog is based on a 7-bit downcounter that can be set as free running. It can be used as a watchdog to reset the device when a problem occurs. It is clocked from the main clock. It has an early warning interrupt capability and the counter can be frozen in debug mode.
SysTick timer
This timer is dedicated to real-time operating systems, but could also be used as a standard down counter. It features:
●A 24-bit down counter
●Autoreload capability
●Maskable system interrupt generation when the counter reaches 0.
●Programmable clock source
2.3.19I²C bus
Up to two I²C bus interfaces can operate in multimaster and slave modes. They can support standard and fast modes.
They support 7/10-bit addressing mode and 7-bit dual addressing mode (as slave). A hardware CRC generation/verification is embedded.
They can be served by DMA and they support SMBus 2.0/PMBus.
The STM32F103xF and STM32F103xG performance line embeds three universal synchronous/asynchronous receiver transmitters (USART1, USART2 and USART3) and two universal asynchronous receiver transmitters (UART4 and UART5).
These five interfaces provide asynchronous communication, IrDA SIR ENDEC support, multiprocessor communication mode, single-wire half-duplex communication mode and have LIN Master/Slave capability.
The USART1 interface is able to communicate at speeds of up to 4.5 Mbit/s. The other available interfaces communicate at up to 2.25 Mbit/s.
USART1, USART2 and USART3 also provide hardware management of the CTS and RTS signals, Smart Card mode (ISO 7816 compliant) and SPI-like communication capability. All interfaces can be served by the DMA controller except for UART5.
Doc ID 16554 Rev 3 |
21/120 |
Description |
STM32F103xF, STM32F103xG |
|
|
Up to three SPIs are able to communicate up to 18 Mbits/s in slave and master modes in full-duplex and simplex communication modes. The 3-bit prescaler gives 8 master mode frequencies and the frame is configurable to 8 bits or 16 bits. The hardware CRC generation/verification supports basic SD Card/MMC modes.
All SPIs can be served by the DMA controller.
2.3.22Inter-integrated sound (I2S)
Two standard I2S interfaces (multiplexed with SPI2 and SPI3) are available, that can be operated in master or slave mode. These interfaces can be configured to operate with 16/32 bit resolution, as input or output channels. Audio sampling frequencies from 8 kHz up to 48 kHz are supported. When either or both of the I2S interfaces is/are configured in master mode, the master clock can be output to the external DAC/CODEC at 256 times the sampling frequency.
An SD/SDIO/MMC host interface is available, that supports MultiMediaCard System Specification Version 4.2 in three different databus modes: 1-bit (default), 4-bit and 8-bit. The interface allows data transfer at up to 48 MHz in 8-bit mode, and is compliant with SD Memory Card Specifications Version 2.0.
The SDIO Card Specification Version 2.0 is also supported with two different databus modes: 1-bit (default) and 4-bit.
The current version supports only one SD/SDIO/MMC4.2 card at any one time and a stack of MMC4.1 or previous.
In addition to SD/SDIO/MMC, this interface is also fully compliant with the CE-ATA digital protocol Rev1.1.
The CAN is compliant with specifications 2.0A and B (active) with a bit rate up to 1 Mbit/s. It can receive and transmit standard frames with 11-bit identifiers as well as extended frames with 29-bit identifiers. It has three transmit mailboxes, two receive FIFOs with 3 stages and 14 scalable filter banks.
The STM32F103xF and STM32F103xG performance line embed a USB device peripheral compatible with the USB full-speed 12 Mbs. The USB interface implements a full-speed (12 Mbit/s) function interface. It has software-configurable endpoint setting and suspend/resume support. The dedicated 48 MHz clock is generated from the internal main PLL (the clock source must use a HSE crystal oscillator).
2.3.26GPIOs (general-purpose inputs/outputs)
Each of the GPIO pins can be configured by software as output (push-pull or open-drain), as input (with or without pull-up or pull-down) or as peripheral alternate function. Most of the GPIO pins are shared with digital or analog alternate functions. All GPIOs are high currentcapable.
22/120 |
Doc ID 16554 Rev 3 |
STM32F103xF, STM32F103xG |
Description |
|
|
The I/Os alternate function configuration can be locked if needed following a specific sequence in order to avoid spurious writing to the I/Os registers.
Three 12-bit analog-to-digital converters are embedded into STM32F103xF and STM32F103xG performance line devices and each ADC shares up to 21 external channels, performing conversions in single-shot or scan modes. In scan mode, automatic conversion is performed on a selected group of analog inputs.
Additional logic functions embedded in the ADC interface allow:
●Simultaneous sample and hold
●Interleaved sample and hold
●Single shunt
The ADC can be served by the DMA controller.
An analog watchdog feature allows very precise monitoring of the converted voltage of one, some or all selected channels. An interrupt is generated when the converted voltage is outside the programmed thresholds.
The events generated by the general-purpose timers (TIMx) and the advanced-control timers (TIM1 and TIM8) can be internally connected to the ADC start trigger and injection trigger, respectively, to allow the application to synchronize A/D conversion and timers.
2.3.28DAC (digital-to-analog converter)
The two 12-bit buffered DAC channels can be used to convert two digital signals into two analog voltage signal outputs. The chosen design structure is composed of integrated resistor strings and an amplifier in inverting configuration.
This dual digital Interface supports the following features:
●two DAC converters: one for each output channel
●8-bit or 12-bit monotonic output
●left or right data alignment in 12-bit mode
●synchronized update capability
●noise-wave generation
●triangular-wave generation
●dual DAC channel independent or simultaneous conversions
●DMA capability for each channel
●external triggers for conversion
●input voltage reference VREF+
Eight DAC trigger inputs are used in the STM32F103xF and STM32F103xG performance line family. The DAC channels are triggered through the timer update outputs that are also connected to different DMA channels.
Doc ID 16554 Rev 3 |
23/120 |
Description |
STM32F103xF, STM32F103xG |
|
|
The temperature sensor has to generate a voltage that varies linearly with temperature. The conversion range is between 2 V < VDDA < 3.6 V. The temperature sensor is internally connected to the ADC1_IN16 input channel which is used to convert the sensor output voltage into a digital value.
2.3.30Serial wire JTAG debug port (SWJ-DP)
The ARM SWJ-DP Interface is embedded, and is a combined JTAG and serial wire debug port that enables either a serial wire debug or a JTAG probe to be connected to the target. The JTAG TMS and TCK pins are shared respectively with SWDIO and SWCLK and a specific sequence on the TMS pin is used to switch between JTAG-DP and SW-DP.
The ARM® Embedded Trace Macrocell provides a greater visibility of the instruction and data flow inside the CPU core by streaming compressed data at a very high rate from the STM32F10xxx through a small number of ETM pins to an external hardware trace port analyzer (TPA) device. The TPA is connected to a host computer using USB, Ethernet, or any other high-speed channel. Real-time instruction and data flow activity can be recorded and then formatted for display on the host computer running debugger software. TPA hardware is commercially available from common development tool vendors. It operates with third party debugger software tools.
24/120 |
Doc ID 16554 Rev 3 |
STM32F103xF, STM32F103xG |
Pinouts and pin descriptions |
|
|
|
1 |
2 |
3 |
4 |
5 |
6 |
7 |
8 |
9 |
10 |
11 |
12 |
|
A |
PC13- |
PE3 |
PE2 |
PE1 |
PE0 |
PB4 |
PB3 |
PD6 |
PD7 |
PA15 |
PA14 |
PA13 |
|
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JTRST |
JTDO |
JTDI |
JTCK |
JTMS |
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TAMPER-RTC |
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B |
PC14- |
PE4 |
PE5 |
PE6 |
PB9 |
PB5 |
PG15 |
PG12 |
PD5 |
PC11 |
PC10 |
PA12 |
|
OSC32_IN |
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C |
PC15- |
VBAT |
PF0 |
PF1 |
PB8 |
PB6 |
PG14 |
PG11 |
PD4 |
PC12 |
NC |
PA11 |
|
OSC32_OUT |
|||||||||||||
D |
OSC_IN |
VSS_5 |
VDD_5 |
PF2 |
BOOT0 |
PB7 |
PG13 |
PG10 |
PD3 |
PD1 |
PA10 |
PA9 |
|
E |
OSC_OUT |
PF3 |
PF4 |
PF5 |
VSS_3 |
VSS_11 |
VSS_10 |
PG9 |
PD2 |
PD0 |
PC9 |
PA8 |
|
F |
NRST |
PF7 |
PF6 |
VDD_4 |
VDD_3 |
VDD_11 |
VDD_10 |
VDD_8 |
VDD_2 |
VDD_9 |
PC8 |
PC7 |
|
G |
PF10 |
PF9 |
PF8 |
VSS_4 |
VDD_6 |
VDD_7 |
VDD_1 |
VSS_8 |
VSS_2 |
VSS_9 |
PG8 |
PC6 |
|
H |
PC0 |
PC1 |
PC2 |
PC3 |
VSS_6 |
VSS_7 |
VSS_1 |
PE11 |
PD11 |
PG7 |
PG6 |
PG5 |
|
J |
VSSA |
PA0-WKUP |
PA4 |
PC4 |
PB2/ |
PG1 |
PE10 |
PE12 |
PD10 |
PG4 |
PG3 |
PG2 |
|
BOOT1 |
|||||||||||||
K |
VREF– |
PA1 |
PA5 |
PC5 |
PF13 |
PG0 |
PE9 |
PE13 |
PD9 |
PD13 |
PD14 |
PD15 |
|
L |
VREF+ |
PA2 |
PA6 |
PB0 |
PF12 |
PF15 |
PE8 |
PE14 |
PD8 |
PD12 |
PB14 |
PB15 |
|
M |
VDDA |
PA3 |
PA7 |
PB1 |
PF11 |
PF14 |
PE7 |
PE15 |
PB10 |
PB11 |
PB12 |
PB13 |
AI14798b
Doc ID 16554 Rev 3 |
25/120 |
Pinouts and pin descriptions |
STM32F103xF, STM32F103xG |
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PE2 |
1 |
PE3 |
2 |
PE4 |
3 |
PE5 |
4 |
PE6 |
5 |
VBAT |
6 |
PC13-TAMPER-RTC |
7 |
PC14-OSC32_IN |
8 |
PC15-OSC32_OUT |
9 |
PF0 |
10 |
PF1 |
11 |
PF2 |
12 |
PF3 |
13 |
PF4 |
14 |
PF5 |
15 |
VSS_5 |
16 |
VDD_5 |
17 |
PF6 |
18 |
PF7 |
19 |
PF8 |
20 |
PF9 |
21 |
PF10 |
22 |
OSC_IN |
23 |
OSC_OUT |
24 |
NRST |
25 |
PC0 |
26 |
PC1 |
27 |
PC2 |
28 |
PC3 |
29 |
VSSA |
30 |
VREF- |
31 |
VREF+ |
32 |
VDDA |
33 |
PA0-WKUP |
34 |
PA1 |
35 |
PA2 |
36 |
DD 3 |
SS 3 |
PE1 |
PE0 |
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V |
V |
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144 |
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143 |
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142 |
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141 |
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37 |
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38 |
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39 |
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40 |
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PA3 |
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SS 4 |
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DD 4 PA4 |
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V |
V |
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PB9 |
PB8 |
BOOT0 |
PB7 |
PB6 |
PB5 |
PB4 |
PB3 |
PG15 |
V |
V |
PG14 |
PG13 |
PG12 |
PG11 |
PG10 |
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DD11 |
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SS11 |
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140 |
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139 |
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138 |
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137 |
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136 |
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135 |
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134 |
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133 |
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132 |
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131 |
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130 |
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129 |
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128 |
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127 |
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126 |
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125 |
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LQFP144
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41 |
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42 |
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43 |
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44 |
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45 |
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46 |
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47 |
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48 |
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49 |
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51 |
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52 |
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53 |
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54 |
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55 |
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56 |
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PA5 |
PA6 |
PA7 |
PC4 |
PC5 |
PB0 |
PB1 |
PB2 |
PF11 |
PF12 |
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VSS6 |
V |
PF13 |
PF14 |
PF15 |
PG0 |
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DD6 |
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PG9 |
PD7 |
PD6 |
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DD 10 |
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SS 10 |
PD5 |
PD4 |
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V |
V |
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124 |
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123 |
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122 |
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121 |
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120 |
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119 |
118 |
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57 |
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58 |
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59 |
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60 |
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61 |
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62 |
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63 |
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PG1 |
PE7 |
PE8 |
PE9 |
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SS 7 |
DD 7 PE10 |
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V |
V |
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PD3 |
PD2 |
PD1 |
PD0 |
PC12 |
PC11 |
PC10 |
PA15 PA14 |
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109 |
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117 |
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116 |
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115 |
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114 |
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113 |
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112 |
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111 |
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110 |
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108 |
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VDD_2 |
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|
|
|
|
|
|
|
|
|
|
|
|
|
107 |
|
|
|
|||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
VSS_2 |
|||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
106 |
|
|
|
|||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
NC |
|||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
105 |
|
|
|
|||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
PA13 |
|||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
104 |
|
|
|
|||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
PA12 |
|||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
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|
|
|
|
|
|
|
|
|
|
103 |
|
|
|
|||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
PA11 |
|||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
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|
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|
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|
|
|
|
|
|
|
|
||||
|
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|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
102 |
|
|
|
|||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
PA10 |
|||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
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|
|
|
|
|
|
|
|
|
||||
|
|
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|
|
|
|
|
|
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|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
101 |
|
|
|
|||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
PA9 |
|||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
||||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
100 |
|
|
|
|||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
PA8 |
|||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
||||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
99 |
|
|
||||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
PC9 |
||||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|||||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
98 |
|
|
||||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
PC8 |
||||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|||||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
97 |
|
|
||||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
PC7 |
||||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|||||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
96 |
|
|
||||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
PC6 |
||||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|||||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
95 |
|
|
||||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
VDD_9 |
||||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|||||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
94 |
|
|
||||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
VSS_9 |
||||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
93 |
|
|
||||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
PG8 |
||||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
92 |
|
|
||||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
PG7 |
||||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
91 |
|
|
||||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
PG6 |
||||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
90 |
|
|
||||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
PG5 |
||||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|||||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
89 |
|
|
||||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
PG4 |
||||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|||||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
88 |
|
|
||||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
PG3 |
||||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|||||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
87 |
|
|
||||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
PG2 |
||||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|||||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
86 |
|
|
||||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
PD15 |
||||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|||||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|||
|
|
|
|
|
|
|
|
|
|
|
|
|
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85 |
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|
||||
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PD14 |
||||
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84 |
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||||
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VDD_8 |
||||
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|||||
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|||
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83 |
|
|
VSS_8 |
|||
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PD13 |
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82 |
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||||
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PD12 |
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81 |
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||||
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PD11 |
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80 |
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|
||||
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PD10 |
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79 |
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|
||||
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78 |
|
|
PD9 |
|||
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|||||
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77 |
|
|
PD8 |
|||
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|||||
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76 |
|
|
PB15 |
|||
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|||||
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75 |
|
|
PB14 |
|||
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74 |
|
|
PB13 |
|||
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PB12 |
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73 |
|
|
||||
|
|
64 |
|
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|
65 |
|
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|
66 |
|
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67 |
|
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|
68 |
|
|
69 |
|
|
70 |
|
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71 |
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72 |
|
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|||
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PE11 |
|
PE12 |
|
PE13 |
|
PE14 |
|
PE15 |
|
|
PB10 |
|
|
PB11 |
|
|
SS_1 |
|
DD_1 |
|
||||||||||||||||||
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V |
V |
|
ai14667
26/120 |
Doc ID 16554 Rev 3 |
STM32F103xF, STM32F103xG |
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|
Pinouts and pin descriptions |
|||||||||
|
|
||||||||||||||||||||||||||
|
Figure 5. STM32F103xF and STM32F103xG XL-density performance line LQFP100 |
||||||||||||||||||||||||||
|
pinout |
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|
VDD 3 |
VSS 3 |
PE1 |
PE0 |
PB9 |
PB8 |
BOOT0 |
PB7 |
PB6 |
PB5 |
PB4 |
PB3 |
PD7 |
PD6 |
PD5 |
PD4 |
PD3 |
PD2 |
PD1 |
PD0 |
PC12 |
PC11 |
PC10 |
PA15 |
PA14 |
|
|
PE2 |
100 |
99 |
98 |
97 |
96 |
95 |
94 |
93 |
92 |
91 |
90 |
89 |
88 |
87 |
86 |
85 |
84 |
83 |
82 |
81 |
80 |
79 |
78 |
77 |
76 |
|
|
1 |
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75 |
VDD_2 |
|
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PE3 |
2 |
|
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74 |
VSS_2 |
|
PE4 |
3 |
|
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73 |
NC |
|
PE5 |
4 |
|
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72 |
PA 13 |
|
PE6 |
5 |
|
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71 |
PA 12 |
|
VBAT |
6 |
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70 |
PA 11 |
|
PC13-TAMPER-RTC 7 |
|
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|
69 |
PA 10 |
|
|
PC14-OSC32_IN |
8 |
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68 |
PA 9 |
|
PC15-OSC32_OUT |
9 |
|
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67 |
PA 8 |
|
VSS_5 |
10 |
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|
66 |
PC9 |
|
VDD_5 |
11 |
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|
65 |
PC8 |
|
OSC_IN |
12 |
|
|
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|
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|
|
|
LQFP100 |
|
|
|
|
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|
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|
|
64 |
PC7 |
|||
|
OSC_OUT |
13 |
|
|
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63 |
PC6 |
||||
|
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|
||||
|
NRST |
14 |
|
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62 |
PD15 |
|
PC0 |
15 |
|
|
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|
|
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|
61 |
PD14 |
|
PC1 |
16 |
|
|
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|
60 |
PD13 |
|
PC2 |
17 |
|
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|
|
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|
59 |
PD12 |
|
PC3 |
18 |
|
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|
58 |
PD11 |
|
VSSA |
19 |
|
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|
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|
57 |
PD10 |
|
VREF- |
20 |
|
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|
56 |
PD9 |
|
VREF+ |
21 |
|
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|
55 |
PD8 |
|
VDDA |
22 |
|
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|
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|
54 |
PB15 |
|
PA0-WKUP |
23 |
|
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|
53 |
PB14 |
|
PA1 |
24 |
|
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|
|
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|
52 |
PB13 |
|
PA2 |
25 |
|
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|
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|
51 |
PB12 |
|
|
26 |
27 |
28 |
29 |
30 |
31 |
32 |
33 |
34 |
35 |
36 |
37 |
38 |
39 |
40 |
41 |
42 |
43 |
44 |
45 |
46 |
47 |
48 |
49 |
50 |
|
|
|
PA3 |
VSS 4 |
VDD 4 |
PA4 |
PA5 |
PA6 |
PA7 |
PC4 |
PC5 |
PB0 |
PB1 |
PB2 |
PE7 |
PE8 |
PE9 |
PE10 |
PE11 |
PE12 |
PE13 |
PE14 |
PE15 |
PB10 |
PB11 |
VSS 1 |
VDD 1 |
|
|
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|
ai14391 |
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|
Doc ID 16554 Rev 3 |
27/120 |
Pinouts and pin descriptions |
|
|
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|
|
|
|
|
STM32F103xF, STM32F103xG |
|||||
|
|
|
|
|||||||||||
|
Figure 6. STM32F103xF and STM32F103xG XL-density performance line |
|||||||||||||
|
LQFP64 pinout |
|
|
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||
|
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|
VDD 3 |
VSS 3 |
PB9 |
PB8 |
BOOT0 |
PB7 |
PB6 PB5 PB4 PB3 |
PD2 |
PC12 |
PC11 PC10 |
PA15 |
PA14 |
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VBAT |
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VDD_2 |
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PC13-TAMPER-RTC |
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VSS_2 |
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PC14-OSC32_IN |
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PA13 |
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PC15-OSC32_OUT |
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PA12 |
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PD0 OSC_IN |
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PA11 |
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PD1 OSC_OUT |
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PA10 |
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NRST |
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PA9 |
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PC0 |
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LQFP64 |
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PA8 |
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PC1 |
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PC9 |
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PC2 |
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PC8 |
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PC3 |
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PC7 |
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VSSA |
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PC6 |
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VDDA |
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PB15 |
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PA0-WKUP |
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PB14 |
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PA1 |
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PB13 |
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PA2 |
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PB12 |
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PA3 |
VSS 4 |
VDD 4 |
PA4 |
PA5 |
PA6 |
PA7 PC4 PC5 PB0 |
PB1 |
PB2 |
PB10 PB11 |
VSS 1 |
VDD 1 |
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ai14392 |
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28/120 |
Doc ID 16554 Rev 3 |
STM32F103xF, STM32F103xG |
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Pinouts and pin descriptions |
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Table 5. |
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STM32F103xF and STM32F103xG pin definitions |
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Pins |
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(2) |
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Alternate functions(4) |
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(1) |
levelO/I |
Main |
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LFBGA144 |
LQFP64 |
LQFP100 |
LQFP144 |
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Pin name |
Type |
function(3) |
Default |
Remap |
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(after reset) |
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A3 |
- |
1 |
1 |
PE2 |
I/O |
FT |
PE2 |
TRACECK / FSMC_A23 |
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A2 |
- |
2 |
2 |
PE3 |
I/O |
FT |
PE3 |
TRACED0 / FSMC_A19 |
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B2 |
- |
3 |
3 |
PE4 |
I/O |
FT |
PE4 |
TRACED1/ FSMC_A20 |
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B3 |
- |
4 |
4 |
PE5 |
I/O |
FT |
PE5 |
TRACED2/ FSMC_A21 |
TIM9_CH1 |
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B4 |
- |
5 |
5 |
PE6 |
I/O |
FT |
PE6 |
TRACED3 / FSMC_A22 |
TIM9_CH2 |
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C2 |
1 |
6 |
6 |
VBAT |
S |
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VBAT |
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A1 |
2 |
7 |
7 |
PC13-TAMPER- |
I/O |
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PC13(6) |
TAMPER-RTC |
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RTC(5) |
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B1 |
3 |
8 |
8 |
PC14-OSC32_IN(5) |
I/O |
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PC14(6) |
OSC32_IN |
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C1 |
4 |
9 |
9 |
PC15- |
I/O |
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PC15(6) |
OSC32_OUT |
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OSC32_OUT(5) |
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C3 |
- |
- |
10 |
PF0 |
I/O |
FT |
PF0 |
FSMC_A0 |
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C4 |
- |
- |
11 |
PF1 |
I/O |
FT |
PF1 |
FSMC_A1 |
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D4 |
- |
- |
12 |
PF2 |
I/O |
FT |
PF2 |
FSMC_A2 |
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E2 |
- |
- |
13 |
PF3 |
I/O |
FT |
PF3 |
FSMC_A3 |
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E3 |
- |
- |
14 |
PF4 |
I/O |
FT |
PF4 |
FSMC_A4 |
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E4 |
- |
- |
15 |
PF5 |
I/O |
FT |
PF5 |
FSMC_A5 |
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D2 |
- |
10 |
16 |
VSS_5 |
S |
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VSS_5 |
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D3 |
- |
11 |
17 |
VDD_5 |
S |
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VDD_5 |
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F3 |
- |
- |
18 |
PF6 |
I/O |
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PF6 |
ADC3_IN4 / FSMC_NIORD |
TIM10_CH1 |
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F2 |
- |
- |
19 |
PF7 |
I/O |
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PF7 |
ADC3_IN5 / FSMC_NREG |
TIM11_CH1 |
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G3 |
- |
- |
20 |
PF8 |
I/O |
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PF8 |
ADC3_IN6 / FSMC_NIOWR |
TIM13_CH1 |
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G2 |
- |
- |
21 |
PF9 |
I/O |
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PF9 |
ADC3_IN7 / FSMC_CD |
TIM14_CH1 |
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G1 |
- |
- |
22 |
PF10 |
I/O |
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PF10 |
ADC3_IN8 / FSMC_INTR |
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D1 |
5 |
12 |
23 |
OSC_IN |
I |
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OSC_IN |
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PD0(7) |
E1 |
6 |
13 |
24 |
OSC_OUT |
O |
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OSC_OUT |
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PD1(7) |
F1 |
7 |
14 |
25 |
NRST |
I/O |
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NRST |
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H1 |
8 |
15 |
26 |
PC0 |
I/O |
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PC0 |
ADC123_IN10 |
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H2 |
9 |
16 |
27 |
PC1 |
I/O |
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PC1 |
ADC123_IN11 |
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H3 |
10 |
17 |
28 |
PC2 |
I/O |
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PC2 |
ADC123_IN12 |
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H4 |
11 |
18 |
29 |
PC3 |
I/O |
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PC3 |
ADC123_IN13 |
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J1 |
12 |
19 |
30 |
VSSA |
S |
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VSSA |
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K1 |
- |
20 |
31 |
VREF- |
S |
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VREF- |
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Doc ID 16554 Rev 3 |
29/120 |
Pinouts and pin descriptions |
|
|
|
STM32F103xF, STM32F103xG |
|||||
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|
|
|
|
|
|
|
|
|
Table 5. |
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STM32F103xF and STM32F103xG pin definitions (continued) |
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||||||
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Pins |
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(2) |
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Alternate functions(4) |
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|
(1) |
levelO/I |
Main |
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LFBGA144 |
LQFP64 |
LQFP100 |
LQFP144 |
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Pin name |
Type |
function(3) |
Default |
Remap |
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(after reset) |
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L1 |
- |
21 |
32 |
VREF+ |
S |
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VREF+ |
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M1 |
13 |
22 |
33 |
VDDA |
S |
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VDDA |
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WKUP/USART2_CTS(8) / |
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J2 |
14 |
23 |
34 |
PA0-WKUP |
I/O |
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PA0 |
ADC123_IN0 / TIM2_CH1_ETR / |
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TIM5_CH1 / TIM8_ETR |
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K2 |
15 |
24 |
35 |
PA1 |
I/O |
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PA1 |
USART2_RTS(7) / ADC123_IN1 / |
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TIM5_CH2 / TIM2_CH2(7) |
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USART2_TX(7) / TIM5_CH3 / |
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L2 |
16 |
25 |
36 |
PA2 |
I/O |
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PA2 |
ADC123_IN2 / TIM9_CH1 / |
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TIM2_CH3 (7) |
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USART2_RX(7) / TIM5_CH4 / |
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M2 |
17 |
26 |
37 |
PA3 |
I/O |
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PA3 |
ADC123_IN3 / TIM2_CH4(7)/ |
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TIM9_CH2 |
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G4 |
18 |
27 |
38 |
VSS_4 |
S |
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VSS_4 |
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F4 |
19 |
28 |
39 |
VDD_4 |
S |
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VDD_4 |
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J3 |
20 |
29 |
40 |
PA4 |
I/O |
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PA4 |
SPI1_NSS(7) / USART2_CK(7) / |
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DAC_OUT1 / ADC12_IN4 |
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K3 |
21 |
30 |
41 |
PA5 |
I/O |
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PA5 |
SPI1_SCK(7) / DAC_OUT2 / |
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ADC12_IN5 |
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SPI1_MISO(7) / TIM8_BKIN / |
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L3 |
22 |
31 |
42 |
PA6 |
I/O |
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PA6 |
ADC12_IN6 / TIM3_CH1(7)/ |
TIM1_BKIN |
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TIM13_CH1 |
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SPI1_MOSI(7)/ TIM8_CH1N / |
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M3 |
23 |
32 |
43 |
PA7 |
I/O |
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PA7 |
ADC12_IN7 / TIM3_CH2(7) / |
TIM1_CH1N |
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TIM14_CH1 |
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J4 |
24 |
33 |
44 |
PC4 |
I/O |
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PC4 |
ADC12_IN14 |
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K4 |
25 |
34 |
45 |
PC5 |
I/O |
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PC5 |
ADC12_IN15 |
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L4 |
26 |
35 |
46 |
PB0 |
I/O |
|
PB0 |
ADC12_IN8 / TIM3_CH3 / |
TIM1_CH2N |
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TIM8_CH2N |
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M4 |
27 |
36 |
47 |
PB1 |
I/O |
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PB1 |
ADC12_IN9 / TIM3_CH4(7) / |
TIM1_CH3N |
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TIM8_CH3N |
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J5 |
28 |
37 |
48 |
PB2 |
I/O |
FT |
PB2/BOOT1 |
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M5 |
- |
- |
49 |
PF11 |
I/O |
FT |
PF11 |
FSMC_NIOS16 |
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L5 |
- |
- |
50 |
PF12 |
I/O |
FT |
PF12 |
FSMC_A6 |
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H5 |
- |
- |
51 |
VSS_6 |
S |
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VSS_6 |
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G5 |
- |
- |
52 |
VDD_6 |
S |
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VDD_6 |
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K5 |
- |
- |
53 |
PF13 |
I/O |
FT |
PF13 |
FSMC_A7 |
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30/120 |
Doc ID 16554 Rev 3 |