Datasheet ST1S32 Datasheet (ST)

4 A DC step-down switching regulator
VFDFPN 8 4x4x1.0
VINSW
SW
VFB
PG
GND
EN
ST1S32
Cin_sw
Cout
L
R1
R2
VINA
Cin_a R3
VOUT
VIN
AM12608V1
Features
4 A DC output current
Output voltage adjustable from 0.8 V
1.5 MHz switching frequency
Internal soft-start and enable
Integrated 60 mΩ and 45 mΩ Power MOSFETs
All ceramic capacitor
Power Good (POR)
Cycle-by-cycle current limiting
Current foldback short-circuit protection
VFDFPN 8 4x4x1.0 package
Applications
µP/ASIC/DSP/FPGA core and I/O supplies
Point of Load for: STB, TV, DVD
Optical storage, hard disk drives, printers,
audio/graphic cards
ST1S32
Datasheet — production data
Description
The ST1S32 is an internally compensated 1.5 MHz fixed-frequency PWM synchronous step­down regulator. The ST1S32 operates from 2.8 V to 5.5 V input, while it regulates an output voltage as low as 0.8 V and up to V
The ST1S32 integrates a 60 mΩ high-side switch and a 45 mΩ synchronous rectifier, allowing very high efficiency with very low output voltages.
The peak current mode control with internal compensation delivers a very compact solution with a minimum component count.
IN
.
Figure 1. Application circuit
May 2012 Doc ID 023246 Rev 1 1/29
This is information on a product in full production.
The ST1S32 is available in 4 mm x 4 mm, 8-lead VFDFPN package.
www.st.com
29
Contents ST1S32
Contents
1 Pin settings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.1 Pin connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2 Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
4 Functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
4.1 Soft-start . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
4.2 Error amplifier and control loop stability . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
4.3 Overcurrent protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
4.4 Enable function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
4.5 Light load operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
4.6 Hysteretic thermal shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
5 Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
5.1 Input capacitor selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
5.2 Inductor selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
5.3 Output capacitor selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
5.4 Thermal dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
5.5 Layout considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
6 Demonstration board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
7 Typical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
8 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
9 Order codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
10 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
2/29 Doc ID 023246 Rev 1
ST1S32 Pin settings
1 Pin settings
1.1 Pin connection
Figure 2. Pin connection (top view)
1.2 Pin description
Table 1. Pin description
No. Type Description
1 VINA Unregulated DC input voltage.
2EN
3FB
4 AGND Ground.
5PG
6 VINSW Power input voltage.
7 SW Regulator output switching pin.
8 PGND Power Ground.
Enable input. With EN higher than 1.5 V the device in ON and with EN lower than 0.5 V the device is OFF.
Feedback input. Connecting the output voltage directly to this pin the output voltage is regulated at 0.8 V. To have higher regulated voltages an external resistor divider is required from V
Open drain Power Good (POR) pin. It is released (open drain) when the output voltage is higher than 0.92 * V output voltage is below 0.92 * V immediately.
If not used, it can be left floating or to GND.
OUT
to the FB pin.
OUT
with a delay of 170 us. If the
OUT
, the POR pin goes to low impedance
Doc ID 023246 Rev 1 3/29
Maximum ratings ST1S32
2 Maximum ratings
Table 2. Absolute maximum ratings
Symbol Parameter Value Unit
V
IN
V
EN
V
SW
V
PG
V
FB
P
TOT
T
OP
T
stg
2.1 Thermal data
Table 3. Thermal data
Symbol Parameter Value Unit
R
thJA
1. Package mounted on demonstration board.
Input voltage -0.3 to 7
Enable voltage -0.3 to V
Output switching voltage -1 to V
Power-on reset voltage (Power Good) -0.3 to V
IN
IN
IN
Feedback voltage -0.3 to 1.5
Power dissipation at TA < 60 °C 2.25 W
Operating junction temperature range -40 to 150 °C
Storage temperature range -55 to 150 °C
Maximum thermal resistance junction­ambient
(1)
40 °C/W
V
4/29 Doc ID 023246 Rev 1
ST1S32 Electrical characteristics
3 Electrical characteristics
TJ=25 °C, V
=5 V, unless otherwise specified.
IN
Table 4. Electrical characteristics
Symbol Parameter Test condition
Operating input voltage
IN
range
Turn-on VCC threshold
Turn-off VCC threshold
High-side switch on-
-P resistance
Low-side switch on-
-N resistance
Maximum limiting current
V
R
R
V
V
INON
INOFF
DSON
DSON
I
LIM
Oscillator
Switching frequency 1.2 1.5 1.9 MHz
Maximum duty cycle
D
F
MAX
SW
Dynamic characteristics
(1)
(1)
(1)
=300 mA 60 mΩ
I
SW
=300 mA 45 mΩ
I
SW
(2)
(2)
Val ues
Min. Typ. Max.
2.8 5.5
2.4
2.0
5.0 A
95 100 %
Unit
V
Feedback voltage
/
Reference load regulation Io=10 mA to 4 A
/
Reference line regulation VIN= 2.8 V to 5.5 V
IN
%V
ΔI
%V
V
ΔV
FB
OUT
OUT
OUT
DC characteristics
I
Q
I
QST-BY
Quiescent current
Total standby quiescent current
Enable
V
EN
I
EN
EN threshold voltage
EN current 0.1 μA
0.792 0.8 0.808
Io=10 mA to 4 A
(1)
(2)
(2)
Duty cycle=0, no load
=1.2 V
V
FB
0.776 0.8 0.824
0.2 0.6 %
0.2 0.3 %
630 1200 μA
V
OFF 10 μA
Device ON level 1.5
V
Device OFF level 0.5
Doc ID 023246 Rev 1 5/29
Electrical characteristics ST1S32
Table 4. Electrical characteristics (continued)
Val ues
Symbol Parameter Test condition
Min. Typ. Max.
Power Good
Unit
PG threshold 92 %V
PG hystereris 30 50
PG
PG output voltage low Isink= 6 mA open drain 400
PG rise delay 170 μs
Soft-start
T
SS
Soft-start duration 400 μs
Protection
Thermal shutdown 150
T
SHDN
1. Specifications referred to TJ from -40 to +125 °C. Specifications in the -40 to +125 °C temperature range are assured by design, characterization and statistical correlation.
2. Guaranteed by design.
Hystereris 20
FB
mV
°C
6/29 Doc ID 023246 Rev 1
ST1S32 Functional description
4 Functional description
The ST1S32 is based on a “peak current mode”, constant frequency control. The output voltage V providing an error signal that, compared to the output of the current sense amplifier, controls the ON and OFF time of the power switch.
The main internal blocks are shown in the block diagram in Figure 3. They are:
A fully integrated oscillator that provides the internal clock and the ramp for the slope
compensation avoiding sub-harmonic instability
The soft-start circuitry to limit inrush current during the startup phase
The transconductance error amplifier
The pulse width modulator and the relative logic circuitry necessary to drive the internal
power switches
The drivers for embedded P-channel and N-channel Power MOSFET switches
The high-side current sensing block
The low-side current sense to implement diode emulation
A voltage monitor circuitry (UVLO) that checks the input and internal voltages
A thermal shutdown block, to prevent thermal run-away.
is sensed by the Feedback pin (FB) compared to an internal reference (0.8 V)
OUT
Figure 3. Block diagram
Doc ID 023246 Rev 1 7/29
Functional description ST1S32
4.1 Soft-start
The soft-start is essential to assure the correct and safe startup of the step-down converter. It avoids inrush current surge and makes the output voltage rise monothonically.
The soft-start is managed by ramping the reference of the error amplifier from 0 V to 0.8 V. The internal soft-start capacitor is charged with a resistor to 0.8 V, then the FB pin follows the reference so that the output voltage is regulated to rise to the set value monothonically.
4.2 Error amplifier and control loop stability
The error amplifier provides the error signal to be compared with the high-side switch current through the current sense circuitry. The non-inverting input is connected with the internal 0.8 V reference, whilst the inverting input is the FB pin. The compensation network is internal and connected between the E/A output and GND.
The error amplifier of the ST1S32 is a transconductance operational amplifier, with high bandwidth and high output impedance.
The characteristics of the uncompensated error amplifier are:
Table 5. Characteristics of the uncompensated error amplifier
Description Value
DC gain 94 dB
gm 238 μA/V
Ro 96 MΩ
The ST1S32 embeds the compensation network that assures the stability of the loop in the whole operating range. Here below are all the tools needed to check the loop stability.
In Figure 4. the simple small signal model for the peak current mode control loop is shown.
8/29 Doc ID 023246 Rev 1
ST1S32 Functional description
L
Cout
Current sense
Logic
And
Driver
Slope
Com pensati on
PW M comparator
Err or Amp
Rc
Cc
R1
R2
0.8 V
High side
Swi tch
Low si de
Swi tch
GCO(s)
G
DIV
(s)
G
EA
(s)
VIN
V
C
V
OUT
V
FB
AM12609V1
GCOs()
R
LOAD
R
i
------------ ------
1
1
R
outTSW
L
------------- ------------- ----
m
C
1D()0.5[]+
------------ ------------- ------------- ------------- ------------ --------------- ------------- ----------
1
s
ω
z
-----+
⎝⎠
⎛⎞
1
s
ω
p
-----+
⎝⎠
⎛⎞
------------ ---------
F
H
s()⋅⋅=
ω
Z
1
ESR C
OUT
------------ ------------- ---------=
Figure 4. Block diagram of the loop for the small signal analysis
Three main terms can be identified to obtain the loop transfer function:
1. from control (output of E/A) to output, G
2. from output (V
) to the FB pin, G
OUT
DIV
3. from the FB pin to control (output of E/A), G
The transfer function from control to output G
CO
(s);
(s);
CO
(s).
EA
(s) results:
Equation 1
where R current sense circuitry (0.369 Ω), ω zero given by the ESR of the output capacitor.
F
(s) accounts for the sampling effect performed by the PWM comparator on the output of
H
the error amplifier that introduces a double pole at one half of the switching frequency.
Equation 2
represents the load resistance, Ri the equivalent sensing resistor of the
LOAD
the single pole introduced by the LC filter and ωz the
p
Doc ID 023246 Rev 1 9/29
Functional description ST1S32
ω
p
1
R
LOADCOUT
------------- ------------- --------------
m
C
1D()0.5
LC
OUTfSW
⋅⋅
------------ ------------- ------------- ----------+=
mC1
S
e
S
n
------
+=
SeVppf
SW
=
S
n
VINV
OUT
L
------------- ------------- --- -
Ri⋅=
FHs()
1
1
s
ω
nQP
------------ -------- -
s
2
ω
n
2
-----++
----------- ------------- ------------- ------=
Q
P
1
π m
C
1D()0.5[]
------------ ------------- ------------- ------------- -------------=
ωnπ fSW⋅=
G
DIV
s()
R
2
R1R2+
------------ --------=
Equation 3
where:
Equation 4
S
represents the ON-time slope of the sensed inductor current, Se the slope of the external
n
ramp (V
peak-to-peak amplitude - 0.535 V) that implements the slope compensation to
PP
avoid sub-harmonic oscillations at duty cycle over 50%.
The sampling effect contribution F
Equation 5
where:
Equation 6
and
Equation 7
The transfer function G
(s) from V
DIV
(s) is:
H
to FB results:
OUT
The transfer function from FB to Vc (output of E/A) introduces the singularities (poles and zeroes) to stabilize the loop. In Figure 5, the small signal model of the error amplifier with the internal compensation network is shown.
10/29 Doc ID 023246 Rev 1
ST1S32 Functional description
CoRo
Cc
Cc
Cp
Gm*Vd
V
FB
V
REF
Vd
Rc
AM11419v1
GEAs()
G
EA0
1s+ RcC
c
⋅⋅()
s
2
R0C0Cp+()RcCcsR0Cc⋅ R0C0Cp+()RcCc⋅++()1++⋅⋅ ⋅⋅
------------ ------------ ------------- ------------- ------------- -------------- ------------- ------------- ------------- --------------- ------------ ------------- ------------- ------------- ------------ -------------=
f
P LF
1
2 π R
0Cc
⋅⋅ ⋅
----------- ------------- ------------- -----=
f
P HF
1
2 π R
c
C0Cp+()⋅⋅ ⋅
----------- ------------- ------------- ------------- ----------=
f
Z
1
2 π R
cCc
⋅⋅ ⋅
------------ ------------ ------------- ---- -=
Figure 5. Small signal model for the error amplifier
R
and CC introduce a pole and a zero in the open loop gain. CP does not significantly affect
C
system stability and can be neglected.
So, G
(s) results:
EA
Equation 8
where G
= Gm · R
EA
o
The poles of this transfer function are (if Cc >> C0+CP):
Equation 9
Equation 10
whereas the zero is defined as:
Equation 11
The embedded compensation network is R considered as negligible. The error amplifier output resistance is 212 M singularities are:
=80 kΩ, CC=55 pF while CP and CO can be
C
Ω, so the relevant
Doc ID 023246 Rev 1 11/29
Functional description ST1S32
fZ36 2 kHz,= f
P LF
30 Hz=
G
LOOP
s() GCOs() G
DIV
s() GEAs()⋅⋅=
0.1 1 10 100 1.10
3
1.10
4
1.10
5
1.10
6
1.10
7
60
42
24
6
12
30
48
66
84
102
120
Frequency [ Hz ]
Module [dB]
AM11420v1
Equation 12
So, closing the loop, the loop gain G
LOOP
(s) is:
Equation 13
Example:
VIN=5 V, VOUT=1.2 V, Iomax=4 A, L=1.0 uH, Cout=47 uF (MLCC), R1=10 k k
Ω
(see Section 5.2 and Section 5.3 for inductor and output capacitor selection
guidelines).
The module and phase Bode plot are reported in Figure 6.
The bandwidth is 117 kHz and the phase margin is 63 degrees.
Figure 6. Module Bode plot
Ω
, R2=20
12/29 Doc ID 023246 Rev 1
ST1S32 Functional description
AM11421v1
0.1 1 10 100 1.10
3
1.10
4
1.10
5
1.10
6
1.10
7
210
182.5
155
127.5
100
72.5
45
17.5
10
Frequency [ H z ]
Phase
Figure 7. Phase Bode plot
4.3 Overcurrent protection
The ST1S32 implements overcurrent protection sensing the current flowing through the high-side current switch.
If the current exceeds the overcurrent threshold, the high-side is turned off, implementing a cycle-by-cycle current limitation. Since the regulation loop is no longer fixing the duty cycle, the output voltage is unregulated and the FB pin falls accordingly to the new duty cycle.
If the FB pin falls below 0.2 V, the peak current limit is reduced to around 2.3 A and the switching frequency is reduced to assure that the inductor current is properly limited below the above mentioned value and above 1.2 A. This strategy is called “current foldback”.
The mechanism to adjust the switching undercurrent foldback condition exploits the low-side current sense circuitry. If FB is lower than 0.2 V, the high-side Power MOSFET is turned off when the current reaches the current foldback threshold (2.3 A), then, after a proper dead time that avoids the cross conduction, the low-side is turned on until the low-side current is lower than a valley threshold (1.2 A). Once the low-side is turned off, the high-side is immediately turned on. In this way the frequency is adjusted to keep the inductor current ripple between the current foldback value (2.3 A) and valley threshold (1.2 A), therefore properly limiting the output current in case of overcurrent or short-circuit.
It should be noted that in some cases, mainly with very low output voltages, the hard overcurrent can make the FB find the new equilibrium just over the current foldback threshold (0.2 V). In this case no frequency reduction is enabled, then the inductor current may diverge. That is, the ripple current during the minimum ON-time is higher than the ripple current during the OFF-time (the switching period minus the minimum ON-time), so pulse­by-pulse the average current is rising, exceeding the current limit.
In order to avoid too high current, a further protection is activated when the high-side current exceeds a further current threshold (OCP2) slightly over the current limit (OCP1). If the current triggers the second threshold, the converter stops switching, the reference of the error amplifier is pulled down and then it restarts with a soft-start procedure. If the overcurrent condition is still active, the current foldback with frequency reduction properly limits the output current to 2.3 A.
Doc ID 023246 Rev 1 13/29
Functional description ST1S32
4.4 Enable function
The enable feature allows the device to be put into standby mode. With the EN pin lower than 0.4 V, the device is disabled and the power consumption is reduced to less than 10 uA. With the EN pin higher than 1.2 V, the device is enabled. If the EN pin is left floating, an internal pull-down ensures that the voltage at the pin reaches the inhibit threshold and the device is disabled. The pin is also V
compatible.
IN
4.5 Light load operation
With peak current mode control loop the output of the error amplifier is proportional to the load current. In the ST1S32, to increase light load efficiency, when the output of the error amplifier falls below a certain threshold, the high-side turn-on is prevented.
This mechanism reduces the switching frequency at light load in order to save the switching losses.
4.6 Hysteretic thermal shutdown
The thermal shutdown block generates a signal that turns off the power stage if the junction temperature goes above 150 the device restarts in normal operation.
o
C. Once the junction temperature goes back to about 130 oC,
14/29 Doc ID 023246 Rev 1
ST1S32 Application information
I
RMSIO
D
2D
2
η
------------ -----
D
2
η
2
------ -+=
V
PP
I
O
CINFSW⋅
------------- ------------- --
1
D
η
----
⎝⎠
⎛⎞
D
D
η
--- -
1D()+ ESR IO⋅+=
C
IN
I
O
V
PPFSW
------------- ------------- ---
1
D
η
----
⎝⎠
⎛⎞
D
D
η
----
1D()+=
C
IN_MIN
I
O
2V
PP_MAXFSW
⋅⋅
------------- ------------ ------------- ------------- --=
5 Application information
5.1 Input capacitor selection
The capacitor connected to the input must be capable of supporting the maximum input operating voltage and the maximum RMS input current required by the device. The input capacitor is subject to a pulsed current, the RMS value of which is dissipated over its ESR, affecting the overall system efficiency.
So the input capacitor must have an RMS current rating higher than the maximum RMS input current and an ESR value compliant with the expected efficiency.
The maximum RMS input current flowing through the capacitor can be calculated as:
Equation 14
where Io is the maximum DC output current, D is the duty cycle, and η is the efficiency. Considering η=1, this function has a maximum at D=0.5 and is equal to Io/2.
The peak-to-peak voltage across the input capacitor can be calculated as:
Equation 15
where ESR is the equivalent series resistance of the capacitor.
Given the physical dimension, ceramic capacitors can well meet the requirements of the input filter sustaining a higher input RMS current than electrolytic / tantalum types. In this case, the equation of C
as a function of the target peak-to-peak voltage ripple (VPP) can
IN
be written as follows:
Equation 16
neglecting the small ESR of ceramic capacitors. Considering η=1, this function has its maximum in D=0.5, therefore, given the maximum
peak-to-peak input voltage (V
PP_MAX
), the minimum input capacitor (C
IN_MIN
) value is:
Equation 17
Doc ID 023246 Rev 1 15/29
Application information ST1S32
ΔI
L
VINV
OUT
L
------------ ------------ ----- -
T
ON
V
OUT
L
------------ --
T
OFF
==
L
MIN
V
OUT
ΔI
MAX
----------------
1D
MIN
F
SWMIN
------------ -----------
=
Ty p i c a l l y, CIN is dimensioned to keep the maximum peak-to-peak voltage ripple in the order of 1% of V
INMAX
.
The placement of the input capacitor is very important in order to avoid noise injection and voltage spikes on the input voltage pin. So the C
must be placed as close as possible to
IN
the VIN_SW pin.
In Ta bl e 6 some multi-layer ceramic capacitors suitable for this device are reported.
Table 6. Input MLCC capacitors
Manufacturer Series Cap value (µF) Rated voltage (V)
Murata GRM21 10 10
TDK
Taiyo Yuden LMK212 22 10
A ceramic bypass capacitor, as close as possible to the VINA pin, so that additional parasitic ESR and ESL are minimized, is suggested in order to prevent instability on the output voltage due to noise. The value of the bypass capacitor can go from 330 nF to 1µF.
5.2 Inductor selection
The inductance value fixes the current ripple flowing through the output capacitor. So the minimum inductance value in order to have the expected current ripple must be selected. The rule to fix the current ripple value is to have a ripple at 20%-40% of the output current.
In continuous current mode (CCM), the inductance value can be calculated by the following equation:
Equation 18
C3225 10 25
C3216 10 16
where T the low-side switch (in CCM, F V
OUT
calculate minimum duty). So by fixing ΔI
is the conduction time of the high-side switch and T
ON
, is obtained at maximum T
=1/(TON + T
SW
, that is at minimum duty cycle (see previous section to
OFF
OFF
=20% to 30% of the maximum output current, the
L
minimum inductance value can be calculated as:
Equation 19
where F
16/29 Doc ID 023246 Rev 1
is the minimum switching frequency, according to Ta bl e 4 .
SWMIN
is the conduction time of
OFF
)). The maximum current ripple, given the
ST1S32 Application information
LV
out
2V
pp
fsw•()>
I
LPK,
I
O
ΔI
L
2
--------+=
The slope compensation, to prevent the sub-harmonic instability in peak current control loop, is internally managed and so fixed. This implies a further lower limit for the inductor value. To assure the sub-harmonic stability:
Equation 20
where V
is the peak-to-peak value of the slope compensation ramp.
pp
The inductor value selected, based on Equation 19, must satisfy Equation 20.
The peak current through the inductor is given by:
Equation 21
So if the inductor value decreases, the peak current (that must be lower than the current limit of the device) increases. The higher the inductor value, the higher the average output current that can be delivered, without reaching the current limit.
In Ta bl e 7 some inductor part numbers are listed.
Table 7. Inductors
Manufacturer Series Inductor value (µH) Saturation current (A)
XAL50xx 1.2 to 3.3 6.3 to 9
Coilcraft
Wurth
XAL60xx 2.2 to 5.6 7.4 to 11
MSS1048 1.0 to 3.8 6.5 to 11
WE-HCI 7030 1.5 to 4.7 7 to 14
WE-PD type L 1.5 to 3.5 6.4 to 10
Coiltronics
DR73 1.0 to 2.2 5.5 to 7.9
DR74 1.5 to 3.3 5.4 to 8.35
5.3 Output capacitor selection
The current in the output capacitor has a triangular waveform which generates a voltage ripple across it. This ripple is due to the capacitive component (charge or discharge of the output capacitor) and the resistive component (due to the voltage drop across its ESR). So the output capacitor must be selected in order to have a voltage ripple compliant with the application requirements.
The amount of the voltage ripple can be calculated starting from the current ripple obtained by the inductor selection.
Doc ID 023246 Rev 1 17/29
Application information ST1S32
ΔV
OUT
ESR ΔI
MAX
ΔI
MAX
8C
OUTfSW
⋅⋅
------------ ------------- ------------- ----+=
P
COND
R
HSIOUT
2
DRLSI
OUT
2
1D()⋅⋅+⋅⋅=
Equation 22
For the ceramic (MLCC) capacitor the capacitive component of the ripple dominates the resistive one. While for the electrolythic capacitor the opposite is true.
As the compensation network is internal, the output capacitor should be selected in order to have a proper phase margin and then a stable control loop.
The equations of Section 4.2 help to check loop stability, given the application conditions, the value of the inductor and the output capacitor.
In Ta bl e 8 some capacitor series are listed.
Table 8. Output capacitors
Manufacturer Series Cap value (μF) Rated voltage (V) ESR (mΩ)
Murata
Panasonic
Sanyo TPA/B/C 100 to 470 4 to 16 40 to 80
TDK C3225 22 to 100 6.3 < 5
GRM32 22 to 100 6.3 to 25 < 5
GRM31 10 to 47 6.3 to 25 < 5
ECJ 10 to 22 6.3 < 5
EEFCD 10 to 68 6.3 15 to 55
5.4 Thermal dissipation
The thermal design is important to prevent the thermal shutdown of the device if junction temperature goes above 150 °C. The three different sources of loss within the device are:
a) conduction losses due to the on-resistance of the high-side switch (R
side switch (R
Equation 23
where D is the duty cycle of the application. Note that the duty cycle is theoretically given by the ratio between V the regulator.
b) switching losses due to high-side Power MOSFET turn-on and off; these can be
calculated as:
); these are equal to:
LS
and VIN, but actually it is slightly higher to compensate the losses of
OUT
) and low-
HS
18/29 Doc ID 023246 Rev 1
ST1S32 Application information
P
SW
VINI
OUT
T
RISETFALL
+()
2
------------- ------------- ------------ ---- -
Fsw⋅⋅ V
INIOUTTSWFSW
⋅⋅⋅==
PQVINIQ⋅=
TJTARthJAP
TOT
+=
Equation 24
where T switch (V
Figure 8. T
and T
RISE
) and the current flowing into it during turn-on and turn-off phases, as shown in
DS
is the equivalent switching time. For this device the typical value for the
SW
are the overlap times of the voltage across the high-side power
FALL
equivalent switching time is 20 ns.
c) Quiescent current losses, calculated as:
Equation 25
where I
The junction temperature T
is the quiescent current (IQ=1.2 mA maximum).
Q
can be calculated as:
J
Equation 26
where T
Rth
is the ambient temperature and P
A
is the equivalent thermal resistance junction-to-ambient of the device; it can be
JA
is the sum of the power losses just seen.
TOT
calculated as the parallel of many paths of heat conduction from the junction to the ambient. For this device the path through the exposed pad is the one conducting the largest amount of heat. The Rth
measured on the demonstration board described in Section 5.5 is about
JA
40 °C/W for the VFDFPN package.
Doc ID 023246 Rev 1 19/29
Application information ST1S32
V
SW
I
SW,HS
V
IN
V
DS,HS
P
COND,HS
P
COND,LS
P
SW
T
FALL
T
RISE
AM11422v1
Figure 8. Switching losses
5.5 Layout considerations
The PC board layout of the switching DC/DC regulator is very important to minimize the noise injected in high impedance nodes, to reduce interference generated by the high switching current loops and to optimize the reliability of the device.
In order to avoid EMC problems, the high switching current loops must be as short as possible. In the buck converter there are two high switching current loops: during the ON­time, the pulsed current flows through the input capacitor, the high-side power switch, the inductor and the output capacitor; during the OFF-time, through the low-side power switch, the inductor and the output capacitor.
The input capacitor connected to VINSW must be placed as close as possible to the device, to avoid spikes on VINSW due to the stray inductance and the pulsed input current.
In order to prevent dynamic unbalance between VINSW and VINA, the trace connecting the VINA pin to the input must be derived from VINSW.
The feedback pin (FB) connection to the external resistor divider is a high impedance node, so interference can be minimized by routing the feedback node with a very short trace and as far as possible from the high current paths.
A single point connection from signal ground to power ground is suggested.
Thanks to the exposed pad of the device, the ground plane helps to reduce the thermal resistance junction-to-ambient; so a large ground plane, soldered to the exposed pad, enhances the thermal performance of the converter allowing high power conversion.
20/29 Doc ID 023246 Rev 1
ST1S32 Application information
AM11423v1
Input cap as close as possible to VINSW pin
Star center for common ground
Short FB trace VINA derived from Cin
to avoid dynamic voltage drop between VINA and VINSW
Short high switching current loop
Via to connect the thermal pad to bottom or inner ground plane
Figure 9. PCB layout example
Doc ID 023246 Rev 1 21/29
Demonstration board ST1S32
3.3V
5V
VIN
Vout
0
0
L1
2.2uHL12.2uH
R2 20kR220k
R3
10kR310k
C2 22uC222u
C1
10uC110u
C31uC3 1u
U1
ST1S31U1ST1S32
VIN_A
1
EN
2
FB
3
AGND
4
PGND
8
SW
7
VIN_SW
6
PGOOD
5
ePAD
C4NCC4
NC
R1
62.5kR162.5k
AM12610V1
6 Demonstration board
Figure 10. Demonstration board schematic
Table 9. Component list
Reference Part number Description Manufacturer
U1 ST1S32PUR ST
L1 DR74 2R2 2.2 µH, Isat=7 A Coiltronics
C1 C3225X7RE106K 10 µF 25 V X7R TDK
C2 C3225X7R1C226M 22
C3 1
C4 NC
R1 62.5 kΩ
R2 20 kΩ
R3 10 kΩ
µF 16 V X7R TDK
µF 25 V X7R
22/29 Doc ID 023246 Rev 1
ST1S32 Demonstration board
Figure 11. Demonstration board PCB top and bottom
Doc ID 023246 Rev 1 23/29
Typical characteristics ST1S32
VIN=5V
Green: IL (100mA/div)
Yellow: SW (1V/div)
Red: V
OUT
(20mV/div)
Timescale 2us/div
VIN=5V, V
OUT
=1.2V, IO=0A
Green: IL (100mA/div)
Yellow: SW (1V/div)
Red: V
OUT
(20mV/div)
Timescale 2us/div
VIN=5V, V
OUT
=1.2V, IO=100mA
VIN=3.3V
7 Typical characteristics
Figure 12. Efficiency vs. I
@ VIN = 5 V Figure 13. Zero load operation
OUT
Figure 14. 100 mA operation Figure 15. Efficiency vs. I
@ VIN = 3.3 V
OUT
24/29 Doc ID 023246 Rev 1
ST1S32 Typical characteristics
Green: IL (1A/div)
Yellow: SW (1V/div)
Red: V
OUT
(200mV/div)
Timescale 200us/div
VIN=5V, V
OUT
=1.2V, I
LOAD
=0.5A -> 5.8A
Green: IL (1A/div)
Yellow: SW (1V/div)
Red: V
OUT
(200mV/div)
Timescale 100us/div
VIN=5.5V, V
OUT
=1.2V
Figure 16. Overcurrent protection Figure 17. Short-circuit protection
Doc ID 023246 Rev 1 25/29
Package mechanical data ST1S32
8 Package mechanical data
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark.
®
packages, depending on their level of environmental compliance. ECOPACK
26/29 Doc ID 023246 Rev 1
ST1S32 Package mechanical data
"
Table 10. VFQFPN8 (4x4x1.0 mm) mechanical data
mm inch
Dim.
Min. Typ. Max. Min. Typ. Max.
A 0.80 0.90 1.00 0.0315 0.0354 0.0394
A1 0.02 0.05 0.0008 0.0020
A3 0.20 0.0079
b 0.23 0.30 0.38 0.009 0.0117 0.0149
D 3.90 4.00 4.10 0.153 0.157 0.161
D2 2.82 3.00 3.23 0.111 0.118 0.127
E 3.90 4.00 4.10 0.153 0.157 0.161
E2 2.05 2.20 2.30 0.081 0.087 0.091
e 0.80 0.031
L 0.40 0.50 0.60 0.016 0.020 0.024
Figure 18. Package dimensions
Doc ID 023246 Rev 1 27/29
Order codes ST1S32
AM12611V1
Figure 19. Recommended footprint
(a)
9 Order codes
Table 11. Ordering information
Order codes Package
ST1S32PUR VFDFPN 4x4 8L
10 Revision history
Table 12. Document revision history
Date Revision Changes
31-May-2012 1 First release.
a. Dimensions are in mm.
28/29 Doc ID 023246 Rev 1
ST1S32
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice.
All ST products are sold pursuant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein.
UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
UNLESS EXPRESSLY APPROVED IN WRITING BY TWO AUTHORIZED ST REPRESENTATIVES, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST.
ST and the ST logo are trademarks or registered trademarks of ST in various countries.
Information in this document supersedes and replaces all information previously supplied.
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.
© 2012 STMicroelectronics - All rights reserved
STMicroelectronics group of companies
Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan -
Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America
www.st.com
Doc ID 023246 Rev 1 29/29
Loading...