380Mbps (1.8V to 3.3V translation)
260Mbps (<1.8V to 3.3V translation)
260Mbps (translate to 2.5V)
210Mbps (translate to 1.5V)
■ Latch-up performance exceeds 500mA
(JESD 17)
■ ESD performance:
HBM > 2000V (MIL STD 883 method 3015);
MM > 200V
■ R
HS compliant for Flip-Chip package
O
Flip-Chip 5
Description
The ST1G3234 is a dual supply low voltage
CMOS 1-Bit bus buffer level translator fabricated
with sub-micron silicon gate and five-layer metal
wiring C
interface between a 3.3V bus and a 2.5V or 1.8V
bus in a mixed 3.3V/1.8V, 3.3V/2.5V, 1.8V/1.4V
and 2.5V/1.8V supply systems, it achieves high
speed operation while maintaining the CMOS low
power dissipation.
This IC is intended for one-way asynchronous
communication between data buses. The input
and output power down protections disable the
device when both power supply are down, so that
the buses are effectively isolated.
The input tolerant buffers allow to translate V
compatible signals and greater signals than V
up/down to V
All inputs are equipped with protection circuits
against static discharge, giving them ESD
immunity and transient excess voltage.
Stressing the device above the rating listed in the “Absolute Maximum Ratings” table may
cause permanent damage to the device. These are stress ratings only and operation of the
device at these or any other conditions above those indicated in the Operating sections of
this specification is not implied. Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability. Refer also to the STMicroelectronics SURE
Program and other relevant quality documents.
Table 3. Absolute maximum ratings
SymbolParameterValueUnit
V
V
V
V
I
I
T
V
V
I
I
CCA
CCB
Output supply voltage-0.5 to +4.6V
CCA
Input supply voltage-0.5 to + 4.6V
CCB
DC output voltage
OA
(power down mode: V
DC input voltage
IB
(power down mode: V
DC output voltage
OA
DC input voltage -0.5 to + 4.6V
IB
I
DC input diode current− 20mA
IK
DC output diode current− 50mA
OK
DC output current± 50mA
OA
DC V
DC V
P
Power dissipation200mW
d
Storage temperature-65 to +150°C
stg
T
Lead temperature (10 sec)260°C
L
or ground current
CCA
or ground current
CCB
CCA=VCCB
CCA=VCCB
=Gnd)
=Gnd)
-0.5 to +4.6V
-0.5 to +4.6V
-0.5 to V
CCA
± 100mA
± 100mA
+ 0.5
V
5/15
Maximum ratingST1G3234
3.1 Recommended operating conditions
Table 4. Recommended operating conditions
SymbolParameterValueUnit
V
CCA
V
CCB
V
V
T
dt/dv
1. VI from 0.8V to 2.0V at VCC = 3.0V
Supply voltage 1.4 to 3.6V
Supply voltage
Input voltage (B1)
IB
Output voltage (A1)
OA
Operating temperature-40 to 85°C
op
Input Rise and Fall Time
(1)
V
= 3.0 to 3.6V
CCB
V
= 2.3 to 2.7V
CCB
V
= 1.4 to 1.95V
CCB
1.4 to 3.6
0 to V
CCB
0 to V
CCA
0 to 10ns/V
0 to 20ns/V
0 to 100ns/V
V
V
V
6/15
ST1G3234Electrical characteristics
4 Electrical characteristics
Table 5. DC specification
Test conditionValue
SymbolParameter
V
(V)
CCB
(1)
V
(V)
CCA
(1)
TA = 25 °C
MinMaxMinMax
-40 to 85 °C
Unit
V
V
V
OHA
V
OLA
I
I
OFF
I
CCtB
High level input
IHB
voltage
Low level input
ILB
voltage
High level
output voltage
Low level output
voltage
Input leakage
IB
current
Power OFF
leakage current
Quiescent
supply current
1.4
1.8
1.4 to
3.6V
2.51.61.6
0.65V
0.65V
CCB
CCB
0.65V
0.65V
CCB
CCB
3.32.02.0
1.4
1.8
1.4 to
3.6V
2.50.70.7
0.35V
0.35V
CCB
CCB
0.35V
0.35V
3.30.80.8
=-100µA
1.4
2.75
1.4 to
3.6V
2.3
1.65
1.4
1.4
2.75
3.6V
2.75
2.3
1.4 to
1.65
1.4
2.73.6
1.42.7
00
1.4 to
1.4 to
3.6V
3.6V
I
O
=-10mA
I
O
I
=-6mA
O
I
=-2mA
O
I
=-1mA
O
I
=100µA
O
=1mA
I
O
I
=10mA
O
I
=6mA
O
I
=2mA
O
I
=1mA
O
=V
V
IB
CCB
V
=3.6V or GND
IB
V
=GND to 3.6V
IB
=GND to 3.6V
V
OA
VIB =V
CCB
or GND
or GND
1.21.2
2.22.2
1.81.8
1.41.4
1.11.1
0.200.20
0.400.40
0.550.55
0.400.40
0.250.25
0.200.20
± 0.5± 5µA
± 0.5± 5µA
± 1.0± 10µA
0.55µA
CCB
CCB
V
V
V
V
I
CCtA
1. VCC range = 3.3 ± 0.3; 2.5 ± 0.2V; 1.8 ± 0.15V
Quiescent
supply current
1.4 to
3.6V
1.4 to
3.6V
VIB =V
CCB
or GND
0.55µA
7/15
Electrical characteristicsST1G3234
Table 6. AC electrical characteristics
Test conditionValue
SymbolParameter
t
PLH tPHL
t
PLH tPHL
Propagation delay time B1 to A1
Propagation delay time B1 to A1
Table 7. Capacitance characteristics
V
CCB
(V)
V
CCA
(V)
2.3 to 3.61.4
-40 to 85 °C
MinMax
2.05.0
1.4 to 1.951.42.05.0
2.3 to 3.61.65 to 1.952.04.5
C
1.4 to 1.951.65 to 1.952.04.8
= 10 pF
L
1.4 to 1.952.3 to 2.72.03.5
1.4 to 1.953.0 to 3.62.03.5
2.3 to 2.73.0 to 3.61.03.0
2.3 to 3.61.4
2.05.5
1.4 to 1.951.42.05.5
2.3 to 3.61.65 to 1.952.05.0
C
= 30 pF
1.4 to 1.951.65 to 1.952.05.2
L
= 500 Ω
R
L
1.4 to 1.952.3 to 2.72.04.0
1.4 to 1.953.0 to 3.62.04.0
2.3 to 2.73.0 to 3.61.03.5
Test conditionValue
Unit
ns
ns
SymbolParameter
C
C
Input capacitanceopen open5pF
INB
Output capacitance2.53.36pF
O
V
CCB
(V)
V
CCA
(V)
2.53.3
1.83.327
C
Power dissipation
PD
capacitance
1.42.523
f = 10MHz
1.41.820
3.31.827
Note:1C
is defined as the value of the IC’s internal equivalent capacitance which is calculated
PD
from the operating current consumption without load. (Refer to Test Circuit). Average current
can be obtained by the following equation. I
8/15
= 25 °C
T
A
MinTypMaxMinMax
27
= CPD x VCC x fIN + ICC/4 (per circuit)
CC(opr)
-40 to 85 °C
Unit
pF
ST1G3234Test circuit
5 Test circuit
Figure 4.Test circuit
Table 8. Test circuit
Tes tSw itch
, t
t
PLH
PHL
= 10/30pF or equivalent (includes jig and probe capacitance)
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect . The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com
Figure 6.Marking
Note:X = Marking Area; Marking Code 9537
11/15
Package mechanical dataST1G3234
Flip-Chip 5 MECHANICAL DATA
DIM.
MIN.TYPMAX.MIN.TYP.MAX.
A0.5850.650.71523.025.628.1
A10.210.250.298.39.811.4
a20.4015.7
b0.2650.31 50.36510.412.414.4
D1.311.361.4151.653.555.5
D10.86634.1
E0.971.021.0738.240.242. 1
E10.519.7
eD0 .3830.4330.48315. 117.019.0
eE0.200.250.307.99.811.8
fD0.2479.7
fE0.26010.2
ccc0.0803.1
mm.mils
12/15
7224716F
ST1G3234Package mechanical data
Tape & Reel Flip-Chip 5 MECHANICAL DATA
DIM.
MIN.TYPMAX.MIN.TYP.MAX.
A1786.926
C12.813.20. 5040.519
D20.20.795
N4950511.9291.9692.008
T12.40.488
Ao1.601.651.700.0630.0650.067
Bo1.271.321.370.0500.0520.054
Ko0.760.810.860.0300.0320.034
Po3.944.10. 1530.1570.161
P3.944.10.1530.1570.161
mm.inch
13/15
Revision historyST1G3234
8 Revision history
Table 10. Revision history
DateRevisionChanges
14-Oct-20041First release.
20-Dec-20042Revision on Table 3.
11-Feb-20053Add Tape & Reel, Figures 2, 3, 5, 6, Ta b le 3 , 5, 7 and Mechanical
Data has been modified.
30-Mar-20054Add features ==> Max data rates.
09-May-20055Ta b le 7 and Ta b le 8 have been updated.
16-Aug-20066New template, updated test condition V
OHA
Ta bl e 5
14/15
ST1G3234
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