Dual-core Cortex A9 embedded MPU for communications
Features
■ CPU subsystem:
– 2x ARM Cortex A9 cores, up to 600 MHz
– Supporting both symmetric (SMP) and
asymmetric (AMP) multiprocessing
– 32+32 KB L1 Instructions/Data cache per
core with parity check
– Shared 512 KB L2 cache (ECC protected)
with parity check
– Accelerator coherence port (ACP)
■ Bus: 64-bit multilayer network-on-chip
■ Memories:
– 32 KB BootROM
– 32 KB internal SRAM
– Multi-port controller (MPMC) for external
DDR2-800/DDR3-1066 with 16/32 bits
datapath, up to 1GB addressable with ECC
option for SEC/DED
– Controller (FSMC) for external NAND
Flash, parallel NOR Flash and
asynchronous SRAM
– Controller (SMI) for external serial NOR
flash
■ Connectivity:
– 2x Giga/Fast Ethernet ports (for external
GMII/RGMII/MII PHY)
– 3x Fast Ethernet (for external SMII/RMII
PHY)
– 3x PCIe 2.0 links (embedded PHY)
– 3x SATA gen-2 host port
– 1x 32-bit PCI expansion bus (up to 66 MHz)
– 2x USB 2.0 host ports with integrated
PHYs
– 1x USB2.0 OTG port with integrated PHY
– 2x CAN 2.0 a/b interfaces
– 2x TDM/E1 HDLC controllers with 256/32
time slots per frame respectively
– 2x HDLC controllers for external RS485
PHYs
SPEAr1310
Data brief
PBGA (23 x 23 mm)
– 2x I2S ports for external audio/modem
– 6x UARTs (up to 5 Mbaud)
– 1x SSP port (SPI and other protocols),
master/slave, up to 41 Mbps
– 2x I2C ports master/slave
■ Integrated support for external peripherals:
– TFT LCD controller, up to 1920 x 1200 (60
Hz), 24 bpp
– Touchscreen I/F (4-wire resistive)
– 9 x 9 keyboard controller
– Memory card interface (MCIF) supporting
SD/SDIO 2.0, SDHC, MMC 4.2/4.3,
CF/CF+ Rev 4.1, XD
■ Expansion interface (EXPI)
■ Security: C3 cryptographic accelerator
■ 13x timers and 1x real time clock
■ Miscellaneous functions:
– 2x high-performance 8-channels DMA
controllers
– JPEG HW codec
– 10 bit ADC, up to 1 Msps, 8 inputs with
autoscan capability
– Programmable bidirectional GPIO signals
with interrupt capability
– 510 + 209 one time programmable (OTP)
bits
– Embedded sensor for junction temperature
monitoring
– JTAG-PTM (debugging and test interface)
■ Power saving features:
– Power islands for leakage reduction
– IP clock gating for dynamic power reduction
– Dynamic frequency scaling
September 2010 Doc ID 17528 Rev 4 1/57
For further information contact your local STMicroelectronics sales office.
www.st.com
1
Contents SPEAr1310
Contents
1 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2 Multilayer interconnect matrix (BUSMATRIX) . . . . . . . . . . . . . . . . . . . . 11
2.1 Main features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
3 CortexA9 subsystem (A9SM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
3.1 Main features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
4 Clock and reset system . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
5 Reset and clock generator (RCG) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
5.1 Main features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
6 Power control module (PCM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
6.1 Main features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
7 BootROM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
8 Static RAM (SRAM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
8.1 Main features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
9 Multiport memory controller (MPMC) . . . . . . . . . . . . . . . . . . . . . . . . . . 18
9.1 Main features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
10 Flexible static memory controller (FSMC) . . . . . . . . . . . . . . . . . . . . . . 19
10.1 Main features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
11 Serial memory interface (SMI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
11.1 Main features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
12 Giga/Fast Ethernet media access controller (GMAC) . . . . . . . . . . . . . 21
12.1 Main features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
13 PCI Express (PCIe) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
2/57 Doc ID 17528 Rev 4
SPEAr1310 Contents
13.1 Main features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
14 SATA gen-2 controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
14.1 Main features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
15 PCIe/SATA physical interface (MiPHY) . . . . . . . . . . . . . . . . . . . . . . . . . 28
16 32-bit PCI expansion bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
16.1 Main features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
17 USB Host controller (UHC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
17.1 Main features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
18 USB On-The-Go controller (OTG) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
18.1 Main features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
19 Controller area network interfaces (CAN) . . . . . . . . . . . . . . . . . . . . . . . 32
19.1 Main features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
20 TDM/E1 HDLC controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
20.1 Main features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
21 RS485 HDLC controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
21.1 Main features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
22 Inter-IC sound controller (I2S) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
22.1 Main features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
23 Universal asynchronous receiver/transmitter (UART) . . . . . . . . . . . . . 37
23.1 Main features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
24 Synchronous serial port (SSP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
24.1 Main features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
25 I2C controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
25.1 Main features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Doc ID 17528 Rev 4 3/57
Contents SPEAr1310
26 TFT LCD controller (CLCD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
26.1 Main features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
27 Keyboard controller (KBD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
27.1 Main features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
28 Memory card interface (MCIF) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
28.1 Main features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
29 Expansion interface (EXPI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
29.1 Main features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
30 Security co-processor (C3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
30.1 Main features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
31 One-time programmable antifuse (OTP) . . . . . . . . . . . . . . . . . . . . . . . . 47
31.1 Main features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
32 General purpose timer (GPT) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
32.1 Main features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
33 Real-time clock (RTC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
33.1 Main features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
34 Direct memory access controller (DMAC) . . . . . . . . . . . . . . . . . . . . . . . 50
34.1 Main features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
35 JPEG Codec (JPGC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
35.1 Main features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
36 Analog-to-digital converter (ADC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
36.1 Main features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
37 General purpose input/output (GPIO) . . . . . . . . . . . . . . . . . . . . . . . . . . 54
37.1 Main features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
38 Temperature sensor (THSENS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
4/57 Doc ID 17528 Rev 4
SPEAr1310 Contents
38.1 Main features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
39 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
Doc ID 17528 Rev 4 5/57
Description SPEAr1310
1 Description
The SPEAr1310 is a member of the SPEAr family of embedded MPUs for network devices.
It offers an unprecedented combination of processing performance and aggressive power
reduction control for next-generation communication appliances.
The SPEAr1310 is based on ARM's new multi-core technology (Cortex-A9 SMP/AMP) and it
is manufactured with ST's 55nm HCMOS low power silicon process.
SPEAr1310 targets cost and power sensitive networking applications for the home and
small business as well as telecom infrastructure equipment, with lowest overall leakage
under real operating conditions. The device integrates ARM's latest generation ARMv7 CPU
cores, ST's proven C3 security coprocessor, and advanced connectivity interfaces and
controllers.
Figure 1. SPEAr1310 system connectivity
Serial
NOR
Flash
NAND/NOR
DDR2/3 RAM
Mass
Storage
Parallel
Flash
Memory
Card
FE/GE
PHYs
TFT Display
SMI
FSMC
MPMC
3x SATA
MCIF
3x FE MAC
2x GE MAC
LCD
Keypad
KBD 2x I2S
SPEAr1310
4x HDLC
(TDM/E1/RS485)
Audio I/O
Frontend
6x UART
Audi o
2x I2C
2x CAN
SPI Peripherals
SSP
USB OTG
2x USBH
3x PCIe
PCI
ADC
EXPI
GPIO
JTAG
USB Host or
Peripheral
USB Peripherals
PCIe
Cards /
Modules
PCI Cards
Analog
Sources
FPGA
Any device
Power
Supply
Add title on master page
LAN/WAN
Telecom
Equipment
Add subtitle on master page
The SPEAr1310 internal architecture is based on several shared subsystem logic blocks
that are interconnected through a multilayer interconnection matrix (the BUSMATRIX). The
switch matrix structure allows different subsystem data flows to be executed in parallel
improving the core platform efficiency.
High performance master agents are directly interconnected with the memory controller to
reduce memory access latency. The overall memory bandwidth assigned to each master
6/57 Doc ID 17528 Rev 4
Terminals
CAN Network
Test &
Debug
SPEAr1310 Description
port can be programmed and optimized through an internal, weighted round-robin (WRR)
arbitration scheme.
Figure 2 is the internal connectivity block diagram.
Figure 2. SPEAr1310 block diagram of the internal connectivity
A9 Subsystem Module
PTM
FPU
I/F
A9 CPU
Instr
Data
Cache
Cache
cache2cache
transfers
SCU
L2 cache
CoreSight Subsystem
G
I
C
Temp. sensor (THSENS)
OTP memory
Power management
32 KB BootROM
32 KB RAM
Reset and clock
control
FSMC
Flash/SRAM controller
Snoop
filtering
FPU
A9 CPU
Instr
Cache
Timers
PTM
Data
Cache
LCD display
controller
FI/
2x Giga/Fast Ethernet
3x Fast Ethernet
A
C
P
3x PCIe
3x SATA
PCI 32-bit @ 66 MHz
Network-on-chip
1x USB OTG
2x UHC
USB Host controller
2x HDLC (TDM/E1)
2x HDLC (RS485)
EXPI
MCIF
Expansion interface
Memory card interface
2x DMAC
SMI
Serial memory interface
C3
Crypto accelerator
MPMC
DDR2/3 controller
KBD
2x I2S
RTC
2x CAN
6x UART
SSP
2x I2C
ADC
keyboard
JPEG
Codec
GPIO
MISC
Doc ID 17528 Rev 4 7/57
Description SPEAr1310
Ta bl e 1 provides an overview of SPEAr1310 features and capabilities.
Table 1. SPEAr1310 features and capabilities overview
Category Feature Instances / Details Notes
Processor
cores
CPU subsystem
L2 Cache
Debug & test
Interconnect Internal bus
Reset and clock
RCG
generator
2x
Cortex A9@600 MHz
32+32 KB L1 per core
1x
512 KB ECC
2x
JTAG-PTM
1x
64 bit @ 166 MHz
1x
Configuration MISC 1x
Includes:
– 1x 64-bit global timer
– 2x 32-bit timers
– 2x watchdog/timers
Network-on-chip
Reset and clock
generation module
Miscellaneous SoC
configuration registers
Power management PCM 1x Power control module
BootROM
SRAM
1x
32 KB
2x
32 KB + 4 KB
On-chip ROM for boot
firmware
Static RAM
1x
MPMC
Memories
up to 1 GB
DDR2: 400 MHz + ECC
DDR3: 533 MHz + ECC
DDR 2/3 controller
1x
FSMC
16-/32-bit
Parallel NAND/NOR Flash
1x
SMI
4x 16 MB C.S.@50Mbps
Serial NOR Flash
8/57 Doc ID 17528 Rev 4
Parallel Flash controller
SPI Flash controller
SPEAr1310 Description
Table 1. SPEAr1310 features and capabilities overview (continued)
Category Feature Instances / Details Notes
Connectivity
Ethernet
MIPHY
PCIe
SATA
2x Giga
3x Fast (see Tab l e 2 )
3x PHYs
(single + dual macro)
3x
root complex/endpoint
3x
gen.2
MAC controllers
PHYs for PCIe and SATA
PCIe controllers
SATA controllers
1x
PCI
32 bit @ 66 MHz
Legacy PCI bus controller
host/device
USB
CAN bus
HDLC
2x USB2.0 Host
1x USB2.0 OTG
2x
CAN2.0 a/b
2x TDM/E1
2x RS485
USB controllers with
PHYs
CAN controllers
HDLC controllers
I2S 2x Digital audio
UART 6x Async. serial ports
SSP/SPI 1x
Sync. serial port
(master/slave)
I2C 2x I2C bus (master/slave)
TFT LCD
controller
Integrated support
for external
peripherals
Keyboard
controller
Memory card
interfaces
Expansion EXPI
1x
24bpp, 1920x1200 @ 60 fps +
PWM
1x
9x9 matrix
1x SD/SDIO 2.0/SDHC/MMC 4.x
1x CF/CF+ Rev 4.1, XD
1x
32 bit AHB like @83 MHz
1x
DES, 3DES, AES
C3
Security
OTP
univ. hashing
SHA1/2, MD5, HMAC
PKA, True_RNG
1x
510+209
Cryptography accelerator
One-time programmable
antifuse
Doc ID 17528 Rev 4 9/57
Description SPEAr1310
Table 1. SPEAr1310 features and capabilities overview (continued)
Category Feature Instances / Details Notes
GPT
4x
(total 8 timers)
RTC 1x Real-time clock
2x
(total 16 channels)
1x
8 channels x 10bit, 1Msps
2x
(total 16 I/O)
Other
DMAC
JPEG Codec 1x JPEG encoder/decoder
ADC
GPIO
THSENS 1x Temperature sensor
Table 2. MAC Phy interfaces available
MAC controller Rate Interfaces
GE (1 Gbps) GMII / RGMII
MAC1
FE (10/100 Mbps) MII / RMII
MAC2 GE (1 Gbps) RGMII
MAC3 FE (10/100 Mbps) SMII / RMII
MAC4 FE (10/100 Mbps) SMII / RMII
General purpose timers
DMA controller
A/D converter
Also used for touchscreen
I/F
General-purpose I/O
MAC5 FE (10/100 Mbps) SMII / RMII
10/57 Doc ID 17528 Rev 4
SPEAr1310 Multilayer interconnect matrix (BUSMATRIX)
2 Multilayer interconnect matrix (BUSMATRIX)
The multilayer interconnect matrix is the connectivity infrastructure that enables data
exchange between the various blocks of the device. This structure supports parallel
communications between master and slave components, and ensures the maximum level of
system throughput.
Note: In this document, the words initiator agent (IA) and master are synonyms ; target agent (TA)
and slave are synonyms.
2.1 Main features
● Hierarchical structure to meet the requirements of different system blocks and
peripherals:
– High performance low latency
– High performance medium latency
– Medium performance medium/long latency
– Slow peripherals and configurations
● Power awareness through the power down request/acknowledgement of the power
management module
● Single interrupt for outbound signaling
Doc ID 17528 Rev 4 11/57
CortexA9 subsystem (A9SM) SPEAr1310
3 CortexA9 subsystem (A9SM)
The CPU subsystem is based on the ARM Cortex A9 processor, and has a dual core
configuration.
3.1 Main features
Each core has the following features:
● ARM v7 CPU at 600 MHz
● 32 KB of L1 instruction CACHE with parity check
● 32 KB of L1 data CACHE with parity check
● Embedded FPU for single and double data precision scalar floating-point operations
● Memory management unit (MMU)
● ARM, Thumb2 and Thumb2-EE instruction set support
● TrustZone© security extension
● Program Trace Macrocell and CoreSight© component for software debug
● JTAG interface
● AMBA© 3 AXI 64-bit interface
● 32-bit timer with 8-bit prescaler
● Internal watchdog (working also as timer)
The dual core configuration is completed by a common set of components:
● Snoop control unit (SCU) to manage inter-process communication, cache-2-cache and
system memory transfer, cache coherency
● Generic interrupt control (GIC) unit configured to support 128 independent interrupt
sources with software configurable priority and routing between the two cores
● 64-bit global timer with 8-bit prescaler
● Asynchronous accelerator coherency port (ACP)
● Parity support to detect internal memory failures during runtime
● 512 KB of unified 8-way set associative L2 cache with support for parity check and
ECC
● L2 Cache controller based on PL310 IP released by ARM
● Dual 64-bit AMBA 3 AXI interface with possible filtering on the second one to use a
single port for DDR memory access
12/57 Doc ID 17528 Rev 4
SPEAr1310 Clock and reset system
4 Clock and reset system
This centralized structure provides system synchronization and includes the following
features:
● Six PLLs. Four of them are fully programmable and offer an EMI reduction mode
(spread spectrum clock generation through dithering) that can replace all traditional
EMI reduction techniques.
– PLL1 programmable dithered pll, dedicated for Core1 & 2 & AXI/AHB bus &
peripherals. Both core need to run at the same speed
– PLL2 programmable dithered PLL, dedicated for the 125 MHz clock of the Gigabit
Ethernet MACs
– PLL3 programmable dithered PLL, for specific embedded IP functions
– PLL4 programmable dithered PLL, dedicated for the DDR memory controller
(Asynchronous access memory mode)
– PLL5 low jitter, dedicated for the USB
– PLL6 for the PCIe controllers
● Several synthesizers provide different frequencies for different IPs
● Fully programmable control of clock and reset signals for all slave blocks allowing
sophisticated power management.
Doc ID 17528 Rev 4 13/57
Reset and clock generator (RCG) SPEAr1310
5 Reset and clock generator (RCG)
The reset and clock generator (RCG) provides the system clocks and resets. It is highly
configurable through the miscellaneous registers.
5.1 Main features
● Three main clock sources:
– osci1: 24 MHz clock coming from internal oscillator connected to external quartz.
– osci2: 32 kHz clock coming from internal oscillator used for RTC block (optional)
– osci3: 25/100 MHz clock coming from MIPHY macro (optional).
● Three programmable dithered PLLs (to reduce EMI):
– PLL1: primarily used to generate the 1 GHz clock for the AMBA subsystem
– PLL2, PLL3: primarily used to generate clocks for RAS logic and generic IPs
● Seven configurable clock generators:
– SSCG1-4: dedicated to RAS logic
– SSCG5: for CLCD clock
– SSCG6: for EXPI clock
– SSCG7: for AMBA system clocks
● Three operating modes for AMBA clocks:
– DOZE: the clock source is osci2 (osci1 after power on)
– SLOW: the clock source is the osci1 or a divided version
– NORMAL: the clock source is PLL1 (by default), PLL2, PLL3 or SSCG7
● Configurable clock gating and software reset for most peripherals
● Global software reset and watchdog reset
14/57 Doc ID 17528 Rev 4
SPEAr1310 Power control module (PCM)
6 Power control module (PCM)
PCM is the core of the SPEAr1310 leakage power management system. Its role is to
properly manage the power supply shutoff of the switchable sections of the embedded MPU.
6.1 Main features
● Generation of supply switch control signals for SPEAr1310 power islands
● Generation of isolation control signals for SPEAr1310 power islands
● Generation of shutoff commands for external DDR 1V2 and 1V5/1V8 supply lines
● Acknowledge generation for user requested power island configuration
● Monitoring of voltage detector outputs for each power island
● Wake-up source management
Doc ID 17528 Rev 4 15/57
BootROM SPEAr1310
7 BootROM
The term BootROM refers to the on-chip 32 KB ROM as well as the booting firmware prestored in such memory. Supported booting devices are:
● Serial NOR Flash
● Parallel NOR Flash
● NAND Flash
● I2C EEPROM
● PCIe
● USB Device
● UART
The BootROM firmware selects the booting device after reset by reading the status of the
STRAP[3:0] pins.
16/57 Doc ID 17528 Rev 4
SPEAr1310 Static RAM (SRAM)
8 Static RAM (SRAM)
SPEAr1310 has internal static RAM (SRAM) areas. A part of these memory areas is used
during the bootstrap phase by BootROM firmware. After booting, all SRAM areas are fully
available for general purpose applications.
8.1 Main features
● 4 KB of Always-on RAM (SYSRAM1, single port)
When all of the power islands are switched off, SYSRAM1 maintains its data content.
● 32 KB of system RAM (SYSRAM0, single port)
When all of the power islands are switched off, SYSRAM0 loses its data content.
Doc ID 17528 Rev 4 17/57
Multiport memory controller (MPMC) SPEAr1310
9 Multiport memory controller (MPMC)
MPMC is a high performance multichannel memory controller able to support DDR2 and
DDR3 double data rate memory devices. The multiport architecture ensures that memory is
shared efficiently among different high-bandwidth client modules.
9.1 Main features
● Supports both DDR3 and DDR2 devices. Wide range of memory device cuts
supported: from 128 Mb to 4 Gb for each chip select. Two chip selects supported.
● Programmable memory datapath size of full memory 32-bit data width or half memory
16 bits data width
● Clock frequencies from 100 MHz to 533 MHz supported
● 6 AXI interfaces with a data interface width of 64 bits. Each port is configured with a
thread ID of 4 bits
● Exclusive and locked accesses support Weighted Round-Robin arbitration scheme
support to ensure high memory bandwidth utilization
● DRAM command processing
● Register port with an AHB Interface with a data interface width of 32 bits
● A programmable register interface to control memory device parameters and protocols
including auto pre-charge
● Full initialization of memory on memory controller reset
● Automatically maps user addresses to the DRAM memory in a contiguous block
addressing starts at user address 0 and ends at the highest available address
according to the size and number of DRAM devices present
● Fully pipelined command, read and write data interfaces to the memory controller
● Advanced bank look-ahead features for high memory throughput
● 7-bit ECC functionality with single-bit and double-bit error reporting and automatic
correction of single-bit error events. Programmable reporting and correction.
Programmable removal of ECC storage
18/57 Doc ID 17528 Rev 4
SPEAr1310 Flexible static memory controller (FSMC)
10 Flexible static memory controller (FSMC)
The flexible static memory controller (FSMC) is an AHB peripheral that interfaces AHB
masters to a wide variety of memories. A wrapper is designed to contain this IP and a MUX
which selects the appropriate signals to connect to the pads depending on the type of
memory.
10.1 Main features
● Support for NAND Flash (8 bit parallel data bus that can be extended up to 32 bits in
specific configurations)
● ECC hardware: the NAND Flash controller contains a hardware acceleration block for
error correction code computation, for pages ranging from 256 to 8192
● Independent chip select control for each memory bank
● Write FIFO: 16 words deep, each word is 32 bits wide
● Support for asynchronous NOR Flash (additional signals multiplexed on PL_GPIOs,
address and data on dedicated IOs); 26 bit address bus supported
● Support for asynchronous static RAM (signals multiplexed on PL_GPIOs, address and
data on dedicated IOs); 26 bit address bus supported
● Support for muxed NOR and SRAM
● Independent read/write timings and protocol, allowing matching the widest variety of
memories and timings
Doc ID 17528 Rev 4 19/57
Serial memory interface (SMI) SPEAr1310
11 Serial memory interface (SMI)
The serial memory interface integrated in SPEAr1310 acts as an AHB slave interface (32,
16- or 8-bit) to SPI-compatible off-chip memories. SMI allows the CPU to use these serial
memories either as data storage or for code execution.
11.1 Main features
● Supports a group of SPI-compatible Flash and EEPROM devices
● Acts always as a SPI master and up to 4 SPI slave memory devices are supported
(through as many chip select signals), with up to 16 MB address space each; 2 out of
the 4 chip select are available on PL_GPIOs.
● The SMI clock signal (smi_clk_o) is generated by SMI (and input to all slaves) using
clock provided by the AHB bus
● smi_clk_o can be up to 50 MHz in fast read mode (or 20 MHz in normal mode), and it
can be controlled by a programmable 7-bit prescaler allowing 127 different clock
frequencies.
20/57 Doc ID 17528 Rev 4
SPEAr1310 Giga/Fast Ethernet media access controller (GMAC)
12 Giga/Fast Ethernet media access controller (GMAC)
The GMAC IP provides the capability to transmit and receive data over Ethernet.
12.1 Main features
● Supports 10/100/1000 Mbps data transfer rates with the following PHY interfaces:
– IEEE 802.3-compliant GMII/MII (default) interface to communicate with an external
Gigabit/Fast Ethernet PHY
– RGMII (specification version 2.0) interface to communicate with an external gigabit
PHY
– SGMII (specification version 1.8) interface to communicate with an external gigabit
PHY
Note that the SGMII block inside GMAC comprises the rate adapter layer (RAL)
and the physical coding scheme (PCS) modules: these modules implement a TBI
"like" interface. Outside the chip the SerDes and high-speed I/O modules are
needed to implement the actual SGMII interface.
– RMII (specification version 1.2 from RMII consortium) interface to communicate
with an external Fast Ethernet PHY (for 10/100 Mbps operations only)
● Full-duplex operation
– IEEE 802.3x flow control automatic transmission of zero-quanta pause frame on
flow control input de-assertion
– Optional forwarding of received pause control frames to the user application
● Half-duplex operation
– CSMA/CD Protocol support
– Flow control using back-pressure support
– Frame bursting and frame extension in 1000 Mbps half-duplex operation
● Automatic CRC and pad generation controllable on a per-frame basis
● Provides options for automatic pad/CRC stripping on receive frames
● Supports a variety of flexible address filtering modes, such as:
– Up to 31 48-bit SA address comparison check with masks for each byte
– 64-bit hash filter for multicast and unicast (DA) addresses
– Option to pass all multicast addressed frames
– Promiscuous mode support to pass all frames without any filtering for network
monitoring
– Passes all incoming packets (per filter) with a status report
● Programmable frame length to support standard or jumbo Ethernet frames with up to
16 KB of size
● Programmable interframe gap (IFG) (40-96 bit times in steps of 8)
● Separate 32-bit status for transmit and receive packets
● IEEE 802.1Q VLAN tag detection for reception frames
● Self-managed DMA transfers with an internal DMA block
Doc ID 17528 Rev 4 21/57
Giga/Fast Ethernet media access controller (GMAC) SPEAr1310
● Separate transmission, reception, and control interfaces to the application
– The host CPU uses a 32-bit AHB (AMBA 2.0) slave interface to access the GMAC
subsystem control and status registers (CSRs)
– The GMAC transfers data to system memory through a 32-bit AXI (AMBA 3.0)
master interface
● Support for network statistics with RMON/MIB counters (RFC2819/RFC2665)
● A module for detection of LAN remote wake-up frames and AMD magic packet frames:
power management module (PMT)
● A receive module for checksum off-load for received IPv4 and TCP packets
encapsulated by the Ethernet frame (Type 1)
● An enhanced receive module for checking IPv4 header checksum and TCP, UDP, or
ICMP checksum encapsulated in IPv4 or IPv6 datagrams (Type 2)
● A module to support Ethernet frame time stamping as described in IEEE 1588- 2002
and IEEE 1588-2008 (standard for precision networked clock synchronization). Sixtyfour-bit time stamps are given in the transmit or receive status of each frame
● MDIO master interface for PHY device configuration and management: station
management agent (SMA), MDIO module
● Supports the standard IEEE P802.3az, version D2.0 for energy efficient Ethernet;
allows physical layers to operate in the low-power idle (LPI) mode
The MAC transaction level (MTL) block consists of two sets of FIFOs: a transmit FIFO with
programmable threshold capability, and a receive FIFO with a programmable threshold
(default of 64 bytes). The MTL block has the following features:
● 32-bit transaction layer block that provides a bridge between the application and the
GMAC
● Single-channel transmit and receive engines
● Synchronization for all clocks in the design (transmit, receive, and system clocks)
● Optimization for packet-oriented transfers with frame delimiters
● Four separate ports for system-side and GMAC side transmission and reception
● FIFO instantiation outside the top-level module to facilitate memory testing/instantiation
● 4-KB receive FIFO size on reception
● Supports receive status vectors insertion into the receive FIFO after the EOF transfer.
This enables multiple-frame storage in the receive FIFO without requiring another FIFO
to store those frames
● Configurable receive FIFO threshold (default fixed at 64 bytes) in cut-through or
threshold mode
● Provides an option to filter all error frames on reception and not forward them to the
application in store-and-forward mode.
● Provides an option to forward under-sized good frames
● Supports statistics by generating pulses for frames dropped or corrupted (due to
overflow) in the receive FIFO
● 2-KB FIFO size on transmission
● Store and forward mechanism for transmission to the GMAC
● Threshold control for transmit buffer management
● Automatic retransmission of collision frames for transmission
22/57 Doc ID 17528 Rev 4
SPEAr1310 Giga/Fast Ethernet media access controller (GMAC)
● Discards frames on late collision, excessive collisions, excessive deferral, and under-
run conditions
● Software control to flush TX FIFO
The DMA block exchanges data between the MTL block and host memory. The host can use
a set of registers (DMA CSR) to control the DMA operations. The DMA block supports the
following features:
● 32-bit data transfers
● Single-channel transmit and receive engines
● Fully synchronous design operating on a single system clock (except for CSR module,
when a separate CSR clock is configured)
● Optimization for packet-oriented DMA transfers with frame delimiters
● Byte-aligned addressing for data buffer support
● Dual-buffer (ring) or linked-list (chained) descriptor chaining
● Descriptor architecture that allows large blocks of data transfer with minimum CPU
intervention
● Comprehensive status reporting for normal operation and transfers with errors
● Individual programmable burst size for transmit and receive DMA engines for optimal
host bus utilization
● Programmable interrupt options for different operational conditions
● Complete per-frame transmit/receive interrupt control
● Round-robin or fixed-priority arbitration between receive and transmit engines
● Start/stop modes
● Separate ports for host CSR access and host data interface
The GMAC audio video (AV) feature enables transmission of time-sensitive traffic over
bridged local area networks (LANs). The GMAC AV has the following features:
● Compliant to IEEE 802.1-AS standard, version D6.0: specifies the protocol and
procedures used to ensure that the synchronization requirements are met for timesensitive applications
● Compliant to IEEE 802.1-Qav standard, version D6.0: allows the bridges to provide
time-sensitive and loss-sensitive real-time audio video data transmission (AV traffic). It
specifies the priority regeneration and controlled bandwidth queue draining algorithms
that are used in bridges and AV traffic sources
● Supports one additional channel (channel 1) on the transmit and receive paths for AV
traffic in 100 Mbps and 1000 Mbps modes. The channel 0 is available by default and
carries the legacy best-effort Ethernet traffic on the transmit side
● Supports IEEE 802.1-Qav specified credit-based shaper (CBS) algorithm for the
additional transmit channels
● Provides separate DMA, TxFIFO, and RxFIFO MTL for the additional channel (to avoid
"head of line blocking" issues); the system-side interface remains the same
Doc ID 17528 Rev 4 23/57
Giga/Fast Ethernet media access controller (GMAC) SPEAr1310
The GMAC has the following additional features for monitoring, testing, and debugging:
● Supports internal loopback on the GMII/MII for debugging
● Provides DMA states (Tx and Rx) as status bits
● Provides debug status register that gives status of FSMs in transmit and receive data-
paths and FIFO fill-levels
● Application abort status bits
● MMC (RMON) module in the GMAC core
● Current Tx/Rx buffer pointer as status registers
● Current Tx/Rx descriptor pointer as status registers
● Statistical counters that help in calculating the bandwidth served by each transmit
channel when AV support is enabled
24/57 Doc ID 17528 Rev 4
SPEAr1310 PCI Express (PCIe)
13 PCI Express (PCIe)
The PCI Express (PCIe) core incorporates a dual mode (DM) core which can implement a
PCIe interface for a PCIe Root Complex (RC) or Endpoint (EP). The dual mode core can
operate in EP or RC port modes, depending on the value sampled on the core input at
power-on reset. The DM core can be switched between modes at runtime by applying a
power-on reset.
PCI Express is compliant with the PCI Express Base 2.0 specification and supports PHYs
with the PIPE 1.87 or PxPIPE interface specification. As a consequence, it is also compliant
with the PCIe 1.1 specification.
The core features a proprietary user-configurable and high-performance application
interface for generating and receiving PCIe traffic. It is available with standard AMBA 3 AXI
interfaces.
13.1 Main features
Typical applications for a PCI Express device built with the DM core include:
● Motherboard components for desktop and mobile computers
● Graphics devices
● Add-in cards for desktop and mobile computers
● Components and add-in cards in server applications
● Embedded applications
● Data communications equipment
● Telecommunications equipment
● Storage devices
● Wireless devices
● Other applications
The DM core in EP mode supports PCI Express Legacy Endpoint devices. However, the
application must ensure that the device obeys the Legacy Endpoint device rules defined in
the PCI Express Base 2.0 specification.
Note: The core is not intended for use in a root complex integrated endpoint.
Doc ID 17528 Rev 4 25/57
PCI Express (PCIe) SPEAr1310
The features common to both EP and RC mode of the DM cores are:
● Support for all non-optional features and some optional features defined in the PCI
Express Base 2.0 specification.
● Ultra-low transmit and receive latency
● Support a max payload size of 256 bytes
● 4-KB maximum request size
● Very high accessible bandwidth
● Support for both Gen1 (at 125 MHz) and Gen2 (at 250 MHz) operation
● 2.5 Gbps (Gen1) or 5.0 Gbps (gen2) Lane (x1)
● Automatic Lane reversal as specified in the PCI Express 2.0 specification (transmit and
receive)
● Polarity inversion on receive
● Multiple virtual channels (VCs) (maximum of 2)
● Multiple traffic classes (TCs)
● Supports ECRC generation and checking
● Supports PCI Express beacon and wake-up mechanism
● Supports PCI power management
● Supports PCI Express active state power management (ASPM)
● Supports PCI Express advanced error reporting
● Supports Vital product data (VPD)
● Supports PCIe messages for both transmit and receive.
● Supports external priority arbitration (in addition to the internally-implemented transmit
arbitration)
● Supports expansion ROM
Additional features specific to RC mode
The features specific to the RC mode are:
● Type 1 configuration space
● Application-initiated Lane reversal for situations where the core does not detect Lane 0
(for example, an x4 core connected to an x8 device that has its Lanes reversed)
Additional features specific to EP mode
The features specific to the EP mode are:
● Alternate routing-ID (ARI)
● Address translation services (ATS)
● Completion timeout ranges
● Function level reset (FLR)
● Type 0 configuration space
● MSI interrupt capability
26/57 Doc ID 17528 Rev 4
SPEAr1310 SATA gen-2 controller
14 SATA gen-2 controller
The SATA AHCI Core implements the serial advanced technology attachment (SATA)
storage interface for physical storage devices.
14.1 Main features
This functional block supports the following features:
● SATA 3.0 Gb/s Gen II
● eSATA (external analog logic also needs to support eSATA)
● Compliant with the following specifications:
– Serial ATA 3.0 (except FIS-based switching)
– AHCI Revision 1.3 (except FIS-based switching)
– AMBA 3 AXI interfaces
● User-defined PHY status and control ports
● RX data buffer for recovered clock systems
● Data alignment circuitry when RX data buffer is also included
● OOB signaling detection and generation
● 8b/10b encoding/decoding
● Asynchronous signal recovery, including retry polling
● Digital support of device hot-plugging
● Power management features including automatic partial-to-slumber transition
● BIST loopback modes
● Single SATA deviceInternal DMA engine per port
● Hardware-assisted native command queuing for up to 32 entries
● Port Multiplier with command-based switching
● Disabling RX and TX Data clocks during power down modes
● Integrated SATA link layer and transport layer logic
● Supports PIO, first party and legacy DMA modes
● Supports legacy command queuing
● Supports ATA and ATAPI master-only emulation mode (for instance, register and
command compatible with these standards)
● Power-down mode
● Data scrambling
● CRC computation
● Automatic data flow control
● Far end loop-back re-timed
Doc ID 17528 Rev 4 27/57
PCIe/SATA physical interface (MiPHY) SPEAr1310
15 PCIe/SATA physical interface (MiPHY)
To be completed.
28/57 Doc ID 17528 Rev 4
SPEAr1310 32-bit PCI expansion bus
16 32-bit PCI expansion bus
SPEAr1310 supports legacy PCI, providing both the host and device interfaces. The device
interface is used for intelligent expansions in PCI machines (like PCs). The "host interface"
is used to provide additional peripherals to SPEAr1310 cores - for instance, dedicated
signals (clock, bus request and grant) for up to four external devices.
16.1 Main features
● PCI specification 2.3 compliant
● 32-bit address/data paths
● Up to 66 MHz interface clock
● Programmable for acting as Host or Device
● Four dedicated interrupts
Doc ID 17528 Rev 4 29/57
USB Host controller (UHC) SPEAr1310
17 USB Host controller (UHC)
17.1 Main features
The USB 2.0 Host controller has 2 physical ports that are fully compliant with the Universal
Serial Bus specification (version 2.0), and provides an interface to the industry-standard
AHB bus.
The main features of the UHC are:
● A PHY interface implementing a USB 2.0 transceiver macro-cell interface plus (UTMI+)
fully compliant with UTMI+ specification (revision 1.0), to execute serialization and deserialization of transmissions over the USB line
● Either 30 MHz clock for 16-bit interface or 60 MHz for 8-bit interface supported by the
UTMI + PHY interface
● A USB 2.0 Host controller (UHC) connected to the AHB bus that generates the
commands for the UTMI+PHY
● Complies with both the enhanced host controller interface (EHCI) specification (version
1.0) and the open host controller interface (OHCI) specification (version 1.0a)
● The UHC supports the 480 Mbps high-speed (HS) for USB 2.0 through an embedded
EHCI Host Controller, as well as the 12 Mbps full-speed (FS) and the 1.5 Mbps lowspeed (LS) for USB 1.1 through one integrated OHCI Host controller
● All clock synchronization is handled within the UHC
● An AHB slave for each controller (1 EHCI and 1 OHCI), acting as programming
interface to access to control and status registers
● An AHB master for each controller (1 EHCI and 1 OHCI) for data transfer to system
memory, supporting 8-, 16-, and 32-bit wide data transactions on the AHB bus
● 32-bit AHB bus addressing
30/57 Doc ID 17528 Rev 4
SPEAr1310 USB On-The-Go controller (OTG)
18 USB On-The-Go controller (OTG)
18.1 Main features
● Complies with the On-The-Go supplement to the USB 2.0 specification (revision 1.3)
● Supports the session request protocol (SRP)
● Supports the Host negotiation protocol (HNP)
● A PHY interface implementing the USB 2.0 transceiver macrocell interface (UTMI+
specification, revision 1.0 (Level 3)) to execute serialization and de-serialization of
transmissions over the USB line
● Unidirectional and bidirectional 16-bit UTMI data bus interfaces
● Support for the following speeds:
– High-speed (HS): 480-Mbps
– Full-speed (FS): 12-Mbps
– Low-speed (LS): 1.5-Mbps (only in Host mode)
● Both of the DMA and slave-only modes are supported
Doc ID 17528 Rev 4 31/57
Controller area network interfaces (CAN) SPEAr1310
19 Controller area network interfaces (CAN)
19.1 Main features
● CAN protocol version 2.0 part A and B
● Bit rates up to 1 Mbps
● 32 message objects (136 x 32-bit message RAM)
● Each message object has its own identifier mask
● Maskable interrupt
● Programmable loop-back mode for self-test operation
● Disabled automatic retransmission mode for time triggered CAN applications
32/57 Doc ID 17528 Rev 4
SPEAr1310 TDM/E1 HDLC controller
20 TDM/E1 HDLC controller
20.1 Main features
The main features of the TDM/E1 HDLC design are:
● AMBA 2.0 compliant
● AMBA slave interface, used to program TDM/E1
● AMBA master interface, used to transfer data between DDR and IP
● DMA engine included to alleviate CPU from transferring data
● Data buffer queue making bulk data transfer more efficient
● Interrupt Queue supplying more interrupt information
● Miscellaneous Interrupt generation
– Frame transmitted/received
– End of data buffer queue
– Buffer empty/ buffer filled
– Tx/Rx DMA FIFO underflow/overflow
– Interrupt queue overflow
– Interrupt FIFO overflow
– Abort generation and detection
– Oversize and non-octet-aligned frame detection
– CRC and alignment error generation
TDM interface features:
● Six signals
● Duplex Tx/Rx communication
● Up to 16 Mbps pre Tx/Rx channel
● 256 time slots / frame(125 us)
● Supports any time-slot banding to any Tx/Rx channel
● Data sending/sampling time configurable
● Delay between bit 0 of TS0 and the SYNC signal configurable
E1 interface main features:
● Six signals
● Duplex Tx/Rx communication
● Up to 2 Mbps pre Tx/Rx channel
● 32 time slot / frame(125 us)
● Supports any time-slot banding to any Tx/Rx channel
● Data sending/sampling time configurable
● Delay between the bit 0 of TS0 and the SYNC signal is configurable
Doc ID 17528 Rev 4 33/57
TDM/E1 HDLC controller SPEAr1310
HDLC controller main features:
● Compliant with ISO/IEC13239
● Standard HDLC frame code/decode
34/57 Doc ID 17528 Rev 4
SPEAr1310 RS485 HDLC controller
21 RS485 HDLC controller
21.1 Main features
The main features of the RS485 HDLC controllers are:
● AMBA 2.0 compliant
● AMBA slave interface, used to program RS485/HDLC
● AMBA master interface, used to transfer data between DDR and IP
● DMA engine included to alleviate CPU from transferring data
● Data buffer queue making bulk data transfer more efficient
● Interrupt Queue supplying more interrupt information
● Miscellaneous Interrupt generation
– Frame transmitted/received
– End of data buffer queue
– Buffer empty/ buffer filled
– Tx/Rx DMA FIFO underflow/overflow
– Interrupt queue overflow
– Interrupt FIFO overflow
– Abort generation and detection
– Oversize and non-octet-aligned frame detection
– CRC and alignment error generation
RS485 interface main features:
● Five signals for each RS485 interface
● Duplex Tx/Rx communication
● Maximum Tx/Rx data rate 3.88 Mbps
● Collision detection and automatic frame re-transmition
● Data sending/sampling timing configurable
● Tx data can be sent out after the rising/falling edge of Tx clock
● Rx data are sampling at the rising/falling edge of Rx clock
● No constraints on clock duty cycle, data sending/receiving only depends on the
rising/falling edge of Tx/Rx clock
HDLC controller main features:
● Compliant with ISO/IEC13239
● Standard HDLC frame code/decode
Doc ID 17528 Rev 4 35/57
Inter-IC sound controller (I2S) SPEAr1310
22 Inter-IC sound controller (I2S)
The I2S controller is a highly configurable IP for use in audio applications. It provides a
simple interface to standard audio components.
22.1 Main features
● Compliant to Philips I2S serial bus specifications
● Concurrent I2S master and slave operations
● Supports 12/16/20/24/32 bit data interface
● Fully synchronous design with serial clock and system clock
● Interrupt support for reporting FIFO and other conditions
● Programmable FIFO thresholds
● Supports data exchange to the system memory through DMA interface
● Software controlled block resets and enables
● Software controlled FIFO flush
36/57 Doc ID 17528 Rev 4
SPEAr1310 Universal asynchronous receiver/transmitter (UART)
23 Universal asynchronous receiver/transmitter (UART)
A UART is responsible for performing the main task in serial communications with
computers. The device changes incoming parallel information to serial data that can be sent
on a communication line. The UART performs all the tasks, timing, parity checking, etc.
needed for the communication
The UART is an APB module in the power bus subsystem; it supports standard
asynchronous communication bits (start, stop and parity), which are added prior to
transmission and removed on reception.
The UART can support serial data baud rate, dc up to UARTCLK_max_freq/16. It supports
modem control functions CTS, DCD, DSR, RTS, DTR and RI.
23.1 Main features
● Separate 16x8 transmit and 16x12 receive first-in, first-out memory buffers (FIFOs)
● Programmable FIFO disabling for 1-byte depth
● Programmable baud rate generator
● Independent masking of transmit FIFO, receive FIFO, receive timeout, modem status,
and error condition interrupts
● Support for direct memory access (DMA)
● False start bit detection
● Line break generation and detection
● Programmable hardware flow control
● Fully-programmable serial interface characteristics:
– data can be 5, 6, 7, or 8 bits
– even, odd, stick, or no-parity bit generation and detection
– 1 or 2 stop bit generation
.
The following key parameters are programmable:
● Communication baud rate, integer, and fractional parts
● Number of data bits
● Number of stop bits
● Parity mode
● FIFO enable (16 deep) or disable (1 deep)
● FIFO trigger levels selectable between 1/8, 1/4, 1/2, 3/4, and 7/8
● Hardware flow control
● The UART clock can be fixed at 48 MHz or can be programmed using the
miscellaneous register UART_CLK_SYNT.
Doc ID 17528 Rev 4 37/57
Synchronous serial port (SSP) SPEAr1310
24 Synchronous serial port (SSP)
The synchronous serial port (SSP) block includes a master or slave interface to enable
synchronous serial communication with slave or master peripherals.
24.1 Main features
● Master or slave operation
● Programmable clock bit rate and prescaler
● Separate transmit and receive first-in, first-out memory buffers, 16-bit wide, 8 locations
deep
● Programmable choice of interface operation, SPI, Microwire, or TI synchronous serial
● Programmable data frame size from 4 to 16 bits
● Independent masking of transmit FIFO, receive FIFO, and receive overrun interrupts
● Internal loopback test mode available
● Support for direct memory access (DMA)
38/57 Doc ID 17528 Rev 4
SPEAr1310 I2C controller
25 I2C controller
The I2C controller acts as an APB slave interface to the two-wire serial I2C bus.
25.1 Main features
● Compliance to the I2C-bus specification from Philips
● Operates in three different modes:
– Standard-speed mode (data rates up to 100 Kb/s)
– Fast-speed mode (data rates up to 400 Kb/s)
– High-speed mode (data rates up to 3.4 Mb/s)
● Provides clock synchronization
● Supports either master or slave I2C operation mode.
● Supports multimaster operation mode (bus arbitration)
● Provides 7-bit or 10-bit addressing
● Supports 7-bit or 10-bit combined format transfers
● Provides slave bulk transfer mode
● Ignores CBUS addresses (an older ancestor of I2C that used to share the I2C bus)
● Transmits and receives buffers
● Provides interrupt or polled-mode operation
● Handles bit and byte waiting at all bus speeds
● Provides digital filter for the received SDA and SCL lines
● Handles component parameters for a configurable software driver support
● Provides a DMA handshaking interface compatible with the DW_ahb_dmac
handshaking interface
● Supports for APB data bus widths of 8, 16 and 32 bits
Doc ID 17528 Rev 4 39/57
TFT LCD controller (CLCD) SPEAr1310
26 TFT LCD controller (CLCD)
The TFT LCD controller provides all the necessary control signals to interface directly to a
variety of TFT LCD panels.
26.1 Main features
● Wide range of programmable LCD panel resolutions
● Support for 1 port TFT LCD panel interfaces:
– 18-bit digital (6-bits/color)
– 24-bit digital (8-bits/color) CMOS
● Support for 2 Port TFT LCD panel interfaces (2
● Programmable frame buffer bits-per-pixel (bpp) color depths:
– 1, 2, 4, 8 bpp mapped through the color palette to 18-bit LCD pixel
– up to 18 bpp directly drive 18-bit LCD pixel
– 24 bpp directly drive 24-bit LCD pixel
● Color Palette RAM to reduce Frame Buffer memory storage requirements bandwidth
● Programmable output format support:
– RGB 6:6:6 or 5:6:5 or 5:5:5 on 18-bit digital interface
– RGB 8:8:8 on 24-bit digital interface
● Programmable horizontal timing parameters:
– horizontal front porch, back porch, sync width, pixels-per-line
– horizontal sync polarity
● Programmable vertical timing parameters:
– vertical front porch, back porch, sync width, lines-per-panel
– vertical sync polarity
● Programmable pixel clock frequency up to bus clock frequency
● Programmable data enable timing signal:
– derived from horizontal and vertical timing parameters
– display enable polarity
● Power up and down sequencing support
● Programmable endianness
● Pulse width modulation for LCD panel LED backlight brightness control
nd
port available on PL_GPIOs)
40/57 Doc ID 17528 Rev 4
SPEAr1310 Keyboard controller (KBD)
27 Keyboard controller (KBD)
The GPIO keyboard controller integrated in SPEAr1310 offers a 4-mode input and output
port. It provides an 18-bit GPIO, 6x6/9x9/2x2 keyboard functionality, and offers an interface
to the industry standard APB bus.
27.1 Main features
● 18-bit general-purpose parallel port (GPIO) with input or output single pin
programmability
● 36 (6x6)/81 (9x9)/4 (2x2) key keyboard
● GPIO or keyboard functionality
● Selection of any one of the three keyboard matrices
● AMBA APB interface
Doc ID 17528 Rev 4 41/57
Memory card interface (MCIF) SPEAr1310
28 Memory card interface (MCIF)
MCIF is a hardware IP that interfaces with the most common memory card on the market:
● SD/SDIO 2.0
● SDHC
The device interface multiplexes different memory cards on the same IOs; only one memory
card is accessible at a given time. At the board level, discrete elements are required to
handle host-swap management.
28.1 Main features
SD/SDIO/MMC controller
● Compliant with:
– SD Host controller standard specification version 2.0
– SDIO card specification version 2.0
– SD memory card specification draft version 2.0
– SD memory card security specification version 1.01
– MMC specification version 3.31, 4.2 and 4.3
– AMBA specification AHB (version 2.0)
● Data transfer with the system core through:
– PIO mode on the Host AHB slave interface
– DMA mode on the Host AHB master interface
● Host clock rate variable from 0 to 50 MHz
● Maximum data rate achievable:
– 200 Mbps (sd4 bit mode)
– 400 Mbps (mmc8 bit mode)
● Data transfer:
– SD mode: 1 bit, 4 bit, and SPI mode
– MMC mode: 1 bit, 4 bit, 8 bit, and SPI mode
● Cyclic redundancy check for commands (CRC7) and for data integrity (CRC16)
● Variable length data transfer
● Read wait control and suspend/resume operations supported
● Works with I/O cards, read-only cards and read/write cards
● Supports MMC Plus and MMC Mobile
● Error correction code support for MMC 4.3 cards
● Card detection (Insertion/Removal)
● Card password protection
● Two 4K FIFO to aid data transfer between the CPU and the controller
● FIFO overrun and underrun handled by stopping the SD clock
● CF/CF+ Rev 4.1
● MMC 4.2/4.3
● xD
42/57 Doc ID 17528 Rev 4
SPEAr1310 Memory card interface (MCIF)
CF/CF+ Host controller
● CF Specification Revision 4.1 compliance (True IDE Mode only)
● Multiword DMA to transfer data between the host and the CF/+ device
● Ultra DMA mode for accessing the CF/+ card using the 16-bit data path
● PIO timing mode0 through mode6
● Multiword DMA timing mode0 through mode4
● Ultra DMA timing mode0 through mode6
● Data transfers up to 256 (512-byte) blocks
● Variable-length data transfer in multiword DMA and Ultra DMA modes
● Interrupt-driven data transfers in PIO mode
xD Host controller (Xtreme Digital)
● Comfortable erase mechanism
● Programmable access timing
● Supports Read, Write, Erase, Read device ID, Status and Reset Commands.
● Supports ECC Generation and Checking
● Supports multiblock programming and multiblock erase.
● Supports 1 Gbit, 2 Gbit
Doc ID 17528 Rev 4 43/57
Expansion interface (EXPI) SPEAr1310
29 Expansion interface (EXPI)
The auxiliary bidirectional interface (EXPI) is multiplexed with the programmable PL_GPIOs
signals to connect an external component (for instance, emulation FPGA).
SPEAr1310 provides an AHB master (81) and an AHB slave (I) interface that are used by
the EXPI block in order to give access from the external world to the internal resources and
vice versa.
The EXPI is in charge of decoupling outside speed from the internal speed on the bus using
asynchronous bridges taking also care of multiplexing the first 100 PL_GPIO and the 4
PL_CLK between RAS and its functionality.
29.1 Main features
● Master and slave mode supported
● Full connectivity between SPEAr1310 IAs and EXPI TA port
● Configurable internal/external sources for clock and reset
● Configurable internal source clock operating frequency
● 16 dedicated PL_GPIOs for DMA handshaking.
– Up to 5 handshaking interfaces with programmable flow control (3 signals):
– Up to 8 handshaking interface with DMA flow control without TC (2 signals)
● Handshaking interface programmability
● Reduced 24 bit addressing mode with translation table
● 8 more signals can be used
– Other 3 handshaking interfaces with programmable flow control
– Other 4 handshaking interface with DMA flow control without TC
● 4 interrupt signal from external to SoC
● 1 interrupt signal from SoC to external
44/57 Doc ID 17528 Rev 4
SPEAr1310 Security co-processor (C3)
30 Security co-processor (C3)
C3 is a multipurpose, instruction driven, programmable DMA-based co-processor. It is
configured to accelerate cryptographic and network security functions.
30.1 Main features
● AMBA AHB 2.0 master and slave interfaces
● Scatter and gather DMA engine (implemented only by MPCM channel)
● Instruction dispatchers
– ID0 and ID1 available
– ID2 and ID3 empty
● Internal RAM: 4Kx32
● Coupling/Chaining: 2 paths
The hardware accelerator crypto algorithms available in SPEAr1310 have the following
channels supported by mentioned operations:
● Channel 0: Move channel
– ID: 0x00001020
– Supported operations: copy, AND, OR, XOR
– Chained mode: either master or slave
– Cascaded mode: both master and slave
– Input FIFO: 8x32 bits
– Output FIFO: 8x32 bits
● Channel 1: Data encryption standard (DES and TripleDES)
– ID: 0x00002001
– Supported algorithms: DES (56-bit keys, ECB and CBC encryption/decryption, no
parity check) and TripleDES (168-bit keys, ECB and CBC encryption/decryption,
EncDecEnc)
– Input FIFO: 16x32 bits
– Output FIFO: 16x32 bits
● Channel 2: MPCM for the advanced encryption standard (AES)
– ID: 0x0000E000
– Supported algorithms: AES (128-, 192-, 256-bit keys, ECB and CBC
encryption/decryption, with programmable operation modes to support almost all
possible modes, including Counter and XTS mode)
– Memory for modes of operation: 512 words of 62 bits each
– Input FIFO: 16x32 bits
– Output FIFO: 16x32 bits
– Read scatter/gather list: 4x32 bits
– Write scatter/gather list: 4x32 bits
Doc ID 17528 Rev 4 45/57
Security co-processor (C3) SPEAr1310
● Channel 3: Unified hash with HMAC
– ID: 0x00004014
– Supported algorithms: HMAC MD5 (hash with 128-bit digest), HMAC SHA1 (hash
with 160-bit digest) and HMAC SHA2 (SHA256 and SHA224 with 256- and 224-bit
digest respectively)
– Input FIFO: 16x32 bits
– Output FIFO: 8x32 bits
● Channel 4: Unified hash 2 with HMAC
– ID: 0x00011001
– Supported algorithms: HMAC SHA384 (hash with 384-bit digest) and HMAC
SHA512 (hash with 512-bit digest)
– Input FIFO: 16x32 bits
– Output FIFO: 8x32 bits
● Channel 5: Public key accelerator (PKA) v6
– ID: 0x00006001
– Supported algorithms: modular exponentiation for RSA and Diffie-Hellman (up to
2048 bits), scalar multiplication of elliptic curve points over prime fields for ECC
(up to 384 bits) and Montgomery’s parameter for finite field operations
– Input FIFO: 8x32 bits
– Output FIFO: 8x32 bits
● Channel 6: Random number generator (RNG)
– ID: 0x0000F000
– Generates a sequence of true random numbers, based on a contiguous analog
oscillator; the sequence has a success ratio of more than 85 % for 20.000 bits,
according to FIPS 140-1 tests
– Monitors the entropy of the generated sequence
– Input FIFO: 2x32 bits
– Output FIFO: 4x32 bits
● Channel 7: empty
46/57 Doc ID 17528 Rev 4
SPEAr1310 One-time programmable antifuse (OTP)
31 One-time programmable antifuse (OTP)
The OTP block is an array of one-time programmable antifuse memory cells.
All OTP banks feature an embedded charge pump which provides internally the high voltage
necessary for antifuse programming sessions. Therefore, it is not necessary to use an
additional high voltage pad at the chip interface. OTP is software programmable, so no
dedicated programming interface is needed at chip level.
31.1 Main features
OTP embeds three 255-bit banks, with these features:
● BANK 1: 255-bit data bank with write-protect mechanism
● BANK 2: 255-bit data bank with write-protect mechanism
● BANK M: 255-bit bank, logically partitioned as follows:
– 32 bits (16 + redundancy) used for BANK1/BANK2 write protection
– 4 bits ( 2 + redundancy) reserved for selecting usage of 2 following sections (ID
and key)
– 72 bits free or reserved for USB/PCI ID data (64 + ECC)
– 137 bits free or reserved for key storage (128 + ECC)
– 2 bits ( 1 + redundancy) reserved for disabling ARM debug feature
– 8 bits reserved
Doc ID 17528 Rev 4 47/57
General purpose timer (GPT) SPEAr1310
32 General purpose timer (GPT)
General purpose timers can be used for precise timing measurement and for measurement
of frequency of any input signal. They are essentially counters that increment based on the
clock cycle and the timer prescaler. An application can monitor these counters to determine
how much time has elapsed. GPT can have timer and capture mode capabilities.
32.1 Main features
● It is constituted by 2 channels; each one consists of a programmable 16-bit counter and
a dedicated 8-bit timer clock prescaler
● The programmable 8-bit prescaler unit performs a clock division by 1, 2, 4, 8, 16, 32,
64, 128, and 256
● Three interrupt sources (MATCH, REDG, and FEDG) are available for each timer
channel. They are mapped to a single interrupt line for each channel but may be
individually masked and acknowledged
● Each timer has a separate register set to control, enable and run each channel
separately
● Three modes of operations are available for each timer channel:
– Auto-reload mode
– Single-shot mode
– Capture function
Auto-reload mode
When the timer is enabled, the counter is cleared and starts incrementing. When it reaches
the compare register value, an interrupt source is activated, the counter is automatically
cleared and restarts incrementing. The process is repeated until the timer is disabled.
Single-shot mode
When the timer is enabled, the counter is cleared and starts incrementing. When it reaches
the compare register value, an interrupt source is activated, the counter stopped and the
timer disabled.
Capture function
This function is provided for the measurement of input timing signals. After being initialized,
when a rising transition occurs at the GPTx_TMR_CAPX (x =1,2 depending upon the timer
used)(X =1,2 depending upon the channel used for the timer) input, the actual counter
value is stored into the rising edge capture register In the same way, when a falling edge
transition occurs at the CAPT input, the actual counter value is stored into the falling edge
capture register. You can read the value stored in the two capture registers and compute the
duration of the rising to falling edge (or vice versa) time interval.
48/57 Doc ID 17528 Rev 4
SPEAr1310 Real-time clock (RTC)
33 Real-time clock (RTC)
The RTC is a block that keeps track of the real time of day. It also functions as an alarm and
a calendar. The time is displayed in 24-hour format, and time/calendar values are stored in
binary-coded decimal format.
The time of day, alarm and calendar, status and control registers can all be accessed via a
standard 32 APB bus. All read/write operations last 2 cycles.
RTC provides a self isolation mode that is activated during power down. This feature allows
RTC to continue working if power is not supplied to the rest of the circuit. This feature is
realized by supplying separate power and clock connections.
A set of 16 general purpose registers (GP-Reg) are provided which can be used to save
data during the power down state.GP-Reg-set runs on 32 K oscillator clock and powered by
RTC battery. Each register is 32-bit and addressed mapped on the 32-bit APB bus. A bit in
status register reflects the status of any pending write to GP-Reg-set. This means that write
operation to the GP-Reg-set should be sequential, so you should wait for this pending
status bit to be cleared before writing again to GP-Reg-set.
33.1 Main features
● Works on dedicated 32768 Hz external clock and power supply
● 9999- year calendar
● Leap years support
● Programmable alarm interrupt
● Power management and self-isolation
● Prescaler and timer registers bypass for TEST
● Time and date update monitors
● 16 general purpose registers which can be used to save data during power down state.
Doc ID 17528 Rev 4 49/57
Direct memory access controller (DMAC) SPEAr1310
34 Direct memory access controller (DMAC)
The DMAC is an AHB-central DMA controller core that transfers data from a source
peripheral to a destination peripheral over two AHB buses. A wrapper is designed to
instantiate 2 DMAC cores (each with 2 AHB master interfaces), 2 ICMs (which arbitrate the
same master interface of each DMAC) and a MUX (which manages multiple peripheral
handshaking interfaces).
34.1 Main features
● AMBA 2.0-compliant
● AHB slave interface – used to program the DMAC
● 8 channels, one per source and destination pair
● Unidirectional channels – data transfers in one direction only
● Programmable channel priority
● 2 independent AHB master interfaces
● Data bus width configured to 64 bits for each AHB master interface
● Configurable endianness for master interfaces
● Support for memory-to-memory, memory-to-peripheral, peripheral-to-memory, and
peripheral-to-peripheral DMA transfers
● Component ID parameters for configurable software driver support
● Programmable source and destination addresses (on AHB bus)
● Address increment, decrement or no change
● Multiblock transfers achieved through linked lists (block chaining)
● Independent source and destination selection of multiblock transfer type
● Scatter/Gather
● Single FIFO per channel for source and destination
● FIFO depth configured to 16 bytes for the first 4 channels and to 128 bytes for the last 4
channels
● D flip-flop-based FIFO
● Automatic data packing or unpacking to fit FIFO width
● Programmable source and destination for each channel
● Programmable transfer type for each channel (memory-to-memory, memory-to-
peripheral, peripheral-to-memory, and peripheral-to-peripheral)
● Programmable burst transaction size for each channel
● Programmable enable and disable of DMA channel
● Support for disabling channel without data loss
● Support for suspension of DMA operation
● Support for RETRY, SPLIT, and ERROR responses
50/57 Doc ID 17528 Rev 4
SPEAr1310 Direct memory access controller (DMAC)
● Programmable maximum burst transfer size per channel
● Maximum transaction size configured to 256 for all the channels
● Maximum block size configured to 4095 for all the channels
● Bus locking – can be programmed to be over the transaction, block, or DMA transfer
level
● Channel locking – can be programmed to be over the transaction, block, or DMA
transfer level
● 16 Handshaking interfaces for source and destination peripherals
● Hardware and Software handshaking interfaces
● Peripheral interrupt handshaking interface
● Handshaking interface supports single or burst DMA transactions
● Polarity control for hardware handshaking interface
● Enabling and disabling of individual DMA handshaking interface
● Programmable flow control at block transfer level (source, destination or DMAC core)
● Software control of source data pre-fetch when destination is flow controller
● Combined and separate interrupt requests
● Interrupt generation on DMA transfer (multiblock) completion, block transfer
completion, single and burst transaction completion and error condition
● Support of interrupt enabling and masking.
Doc ID 17528 Rev 4 51/57
JPEG Codec (JPGC) SPEAr1310
35 JPEG Codec (JPGC)
The design ware (DW) JPEG Codec with header processing is part of a SoC-based
multimedia solution that enables fast and simple image compression and decompression.
35.1 Main features
The main features of DW JPEG Codec are:
● 8-bit/channel pixel depths
● Single clock per pixel encoding and decoding
● Support for JPEG header generation and parsing
● Up to four programmable quantization tables
● Fully programmable Huffman tables (two AC and two DC)
● Fully programmable minimum coded unit (MCU)
● Encode/decode support (non simultaneous)
● Single clock Huffman coding and decoding
● Four-channel interface: Pixel In, Compressed Out, Compressed In, Pixel Out
● Stallable design
● Hardware support for restart marker insertion
● Support for single, greyscale component
● Functionality to enable/disable header processing
● Internal registers interface
● Fully synchronous design
● Configured for high-speed decode mode.
52/57 Doc ID 17528 Rev 4
SPEAr1310 Analog-to-digital converter (ADC)
36 Analog-to-digital converter (ADC)
The ADC integrated in the device has the following features.
36.1 Main features
● Successive approximation A/D conversion
● 10-bit resolution
● 1 MSPS
● 8 analog input channels (0 – 2.5 V)
● INL ± 1 LSB
● DNL ± 1 LSB
● Programmable conversion speed – minimum conversion time 1 µs
Doc ID 17528 Rev 4 53/57
General purpose input/output (GPIO) SPEAr1310
37 General purpose input/output (GPIO)
The general purpose input/output (GPIO) block provides 8 programmable inputs or outputs.
Each input/output can be controlled in software mode through an APB interface.
37.1 Main features
● Eight individually programmable input/output pins (default to input at reset)
● An APB slave acting as control interface in software mode
● Programmable interrupt generation capability on any number of pins
● Bit masking in both read and writes operation through address lines
54/57 Doc ID 17528 Rev 4
SPEAr1310 Temperature sensor (THSENS)
38 Temperature sensor (THSENS)
The THSENS block is an embedded sensor for junction temperature monitoring.
38.1 Main features
● Embeds a thermal sensor providing digital measurement of junction temperature
● Allows offset correction of digital measurement (calibrated at testing)
● Generates a “high temperature” interrupt when junction temperature exceeds a
software programmable higher bound threshold
● Generates a “low temperature” interrupt when junction temperature is lower than a
software programmable lower bound threshold
● Supports operating conditions ranging from –40 to 125°C
● Allows measurement of junction temperature starting at 0°C
● Software programmable power-down functionality for lower power consumption
● Continuous (periodic) sensing of temperature when not powered down.
Doc ID 17528 Rev 4 55/57
Revision history SPEAr1310
39 Revision history
Table 3. Document revision history
Date Revision Changes
4-Jun-2010 1 Initial release.
Modified confidentiality level
20-Aug-2010 2
26-Aug-2010 3
2-Sep-2010 4
from public to confidential.
Minor text changes.
Modified confidentiality level from confidential to public for the announce of the
product.
Updated information about PCIe and SATA:
– Modified the feature list in the first page.
– Modified Figure 1: SPEAr1310 system connectivity
– Modified Figure 2: SPEAr1310 block diagram of the internal connectivity
Reviewed the structure of the document.
Reviewed Chapter 8: Static RAM (SRAM)
Added Chapter 7: Reset and clock generator (RCG)
Updated Chapter 9: Multiport memory controller (MPMC)
Updated Chapter 10: Flexible static memory controller (FSMC)
Updated Chapter 12: Giga/Fast Ethernet media access controller (GMAC)
Updated Chapter 16: 32-bit PCI expansion bus
Updated Chapter 23: Universal asynchronous receiver/transmitter (UART)
Updated Chapter 30: Security co-processor (C3)
Updated Chapter 32: General purpose timer (GPT)
Updated Chapter 33: Real-time clock (RTC)
Updated Chapter 35: JPEG Codec (JPGC)
56/57 Doc ID 17528 Rev 4
SPEAr1310
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
time, without notice.
All ST products are sold pursuant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products
or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such
third party products or services or any intellectual property contained therein.
UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS
OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT
RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING
APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY,
DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE
GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void
any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any
liability of ST.
ST and the ST logo are trademarks or registered trademarks of ST in various countries.
Information in this document supersedes and replaces all information previously supplied.
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.
© 2010 STMicroelectronics - All rights reserved
STMicroelectronics group of companies
Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan -
Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America
www.st.com
Doc ID 17528 Rev 4 57/57
Loading...