ST MP34DT01 User Manual
MEMS audio sensor omnidirectional digital microphone
Features
■ Single supply voltage
■ Low power consumption
■ 120 dBSPL acoustic overload point
■ 63 dB signal-to-noise ratio
■ Omnidirectional sensitivity
■ –26 dBFS sensitivity
■ PDM output
■ HCLGA package
– Top-port design
– SMD-compliant
– EMI-shielded
–ECOPACK
Applications
■ Mobile terminals
■ Laptop and notebook computers
■ Portable media players
■ VoIP
■ Speech recognition
■ A/V eLearning devices
■ Gaming and virtual reality input devices
■ Digital still and video cameras
■ Antitheft systems
Table 1. Device summary
®,
RoHS, and “Green” compliant
MP34DT01
Datasheet − production data
HCLGA 3x4x1 4LD
Description
The MP34DT01 is an ultra-compact, low-power,
omnidirectional, digital MEMS microphone built
with a capacitive sensing element and an IC
interface.
The sensing element, capable of detecting
acoustic waves, is manufactured using a
specialized silicon micromachining process
dedicated to produce audio sensors.
The IC interface is manufactured using a CMOS
process that allows designing a dedicated circuit
able to provide a digital signal externally in PDM
format.
The MP34DT01 has an acoustic overload point of
120 dBSPL with a 63 dB signal-to-noise ratio and
–26 dBFS sensitivity.
The MP34DT01 is available in a top-port, SMDcompliant, EMI-shielded package and is
guaranteed to operate over an extended
temperature range from -40 °C to +85 °C.
Part number Temperature range [°C] Package Packing
MP34DT01 -40 to +85 HCLGA (3 x 4 x 1) mm 4LD Tray
MP34DT01TR -40 to +85 HCLGA (3 x 4 x 1) mm 4LD Tape and reel
July 2012 Doc ID 022331 Rev 9 1/16
This is information on a product in full production.
www.st.com
1
Contents MP34DT01
Contents
1 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2 Acoustic and electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.1 Acoustic and electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.2 Timing characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.3 Frequency response . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
3 Sensing element . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
4 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
5 Functionality . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
5.1 L/R channel selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
6 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
7 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
2/16 Doc ID 022331 Rev 9
MP34DT01 List of tables
List of tables
Table 1. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Table 2. Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Table 3. Acoustic and electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Table 4. Distortion specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Table 5. Timing characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Table 6. Frequency response mask for digital microphones . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Table 7. Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Table 8. L/R channel selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Table 9. Recommended soldering profile limits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Table 10. HCLGA 3 mm x 4 mm x 1 mm 4-lead package dimensions . . . . . . . . . . . . . . . . . . . . . . . . 13
Table 11. Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Doc ID 022331 Rev 9 3/16
List of figures MP34DT01
List of figures
Figure 1. Pin connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Figure 2. Timing waveforms. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Figure 3. Typical frequency response normalized at 1 kHz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Figure 4. Recommended soldering profile limits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 5. HCLGA 3 mm x 4 mm x 1 mm 4-lead package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 6. Land pattern . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
4/16 Doc ID 022331 Rev 9
MP34DT01 Pin description
1 Pin description
Figure 1. Pin connections
(TOP VIEW)
Table 2. Pin description
Pin # Pin name Function
1 Vdd Power supply
2 LR Left/Right channel selection
3 CLK Synchronization input clock
4 DOUT Left/Right PDM data output
5 (ground ring) GND 0 V supply
LR
Vdd
2
3
1
4
GND
(BOTTOM VIEW)
CLK
DOUT
5
AM045273v1
Doc ID 022331 Rev 9 5/16
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