Datasheet MP34DT01 Datasheet (ST)

MEMS audio sensor omnidirectional digital microphone

Features

■ Single supply voltage

■ Low power consumption

■ 120 dBSPL acoustic overload point

■ 63 dB signal-to-noise ratio

■ Omnidirectional sensitivity

■ –26 dBFS sensitivity

■ PDM output

■ HCLGA package

– Top-port design
– SMD-compliant
– EMI-shielded
–ECOPACK

Applications

■ Mobile terminals

■ Laptop and notebook computers

■ Portable media players

■ VoIP

■ Speech recognition

■ A/V eLearning devices

■ Gaming and virtual reality input devices

■ Digital still and video cameras

■ Antitheft systems

Table 1. Device summary

®,

RoHS, and “Green” compliant

MP34DT01

Datasheet − production data

HCLGA 3x4x1 4LD

Description

The MP34DT01 is an ultra-compact, low-power,
omnidirectional, digital MEMS microphone built
with a capacitive sensing element and an IC
interface.

The sensing element, capable of detecting
acoustic waves, is manufactured using a
specialized silicon micromachining process
dedicated to produce audio sensors.

The IC interface is manufactured using a CMOS
process that allows designing a dedicated circuit
able to provide a digital signal externally in PDM
format.

The MP34DT01 has an acoustic overload point of
120 dBSPL with a 63 dB signal-to-noise ratio and
–26 dBFS sensitivity.

The MP34DT01 is available in a top-port, SMD­compliant, EMI-shielded package and is
guaranteed to operate over an extended
temperature range from -40 °C to +85 °C.

Part number Temperature range [°C] Package Packing

MP34DT01 -40 to +85 HCLGA (3 x 4 x 1) mm 4LD Tray

MP34DT01TR -40 to +85 HCLGA (3 x 4 x 1) mm 4LD Tape and reel

July 2012 Doc ID 022331 Rev 9 1/16

This is information on a product in full production.

www.st.com

1

Contents MP34DT01

Contents

1 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

2 Acoustic and electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . 6

2.1 Acoustic and electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

2.2 Timing characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

2.3 Frequency response . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

3 Sensing element . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

4 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

5 Functionality . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

5.1 L/R channel selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

6 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

7 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

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MP34DT01 List of tables

List of tables

Table 1. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Table 2. Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Table 3. Acoustic and electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Table 4. Distortion specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Table 5. Timing characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Table 6. Frequency response mask for digital microphones . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Table 7. Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Table 8. L/R channel selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Table 9. Recommended soldering profile limits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Table 10. HCLGA 3 mm x 4 mm x 1 mm 4-lead package dimensions . . . . . . . . . . . . . . . . . . . . . . . . 13

Table 11. Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Doc ID 022331 Rev 9 3/16

List of figures MP34DT01

List of figures

Figure 1. Pin connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Figure 2. Timing waveforms. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Figure 3. Typical frequency response normalized at 1 kHz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Figure 4. Recommended soldering profile limits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Figure 5. HCLGA 3 mm x 4 mm x 1 mm 4-lead package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Figure 6. Land pattern . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

4/16 Doc ID 022331 Rev 9

MP34DT01 Pin description

1 Pin description

Figure 1. Pin connections

(TOP VIEW)

Table 2. Pin description

Pin # Pin name Function

1 Vdd Power supply

2 LR Left/Right channel selection

3 CLK Synchronization input clock

4 DOUT Left/Right PDM data output

5 (ground ring) GND 0 V supply

LR

Vdd

2

3

1

4

GND

(BOTTOM VIEW)

CLK

DOUT

5

AM045273v1

Doc ID 022331 Rev 9 5/16

Acoustic and electrical specifications MP34DT01

2 Acoustic and electrical specifications

2.1 Acoustic and electrical characteristics

The values listed in the table below are specified for Vdd = 1.8 V, Clock = 2.4 MHz,
T = 25 °C, unless otherwise noted.

Table 3. Acoustic and electrical characteristics

Symbol Parameter Test condition Min. Typ.

Vdd Supply voltage 1.64 1.8 3.6 V

Idd

IddPdn

Current consumption in
normal mode

Current consumption in
power-down mode

(2)

Mean value 0.6 mA

Scc Short-circuit current 1 10 mA

AOP Acoustic overload point 120 dBSPL

So Sensitivity -29 -26 -23 dBFS

SNR Signal-to-noise ratio

A-weighted at 1 kHz,
1 Pa

PSR Power supply rejection Guaranteed by design -70 dBFS

Clock Input clock frequency

Ton Turn-on time

To p

V

V

1. Typical specifications are not guaranteed.

2. Input clock in static mode.

3. Duty cycle: min = 40% max = 60%.

4. Time from the first clock edge to valid output data.

Operating temperature
range

Low level logic

IOL

input/output voltage

High level logic

IOH

input/output voltage

(4)

(3)

1 2.4 3.25 MHz

Guaranteed by design 10 ms

-40 +85 °C

= 1 mA -0.3 0.35xVdd V

I

out

= 1 mA 0.65xVdd Vdd+0.3 V

I

out

(1)

Max. Unit

20 µA

63 dB

Table 4. Distortion specifications

Parameter Test condition Value

Distortion 100 dBSPL (50 Hz - 4 kHz) < 1% THD + N

Distortion 115 dBSPL (1 kHz) < 5% THD + N

6/16 Doc ID 022331 Rev 9

MP34DT01 Acoustic and electrical specifications

2.2 Timing characteristics

Table 5. Timing characteristics

Parameter Description Min Max Unit

f

CLK

f

PD

T

CLK

T

R,EN

T

R,DIS

T

L,EN

T

L,DIS

1. From design simulations

Clock frequency for normal mode 1 3.25 MHz

Clock frequency for power-down mode 0.23 MHz

Clock period for normal mode 308 1000 ns

Data enabled on DATA line, L/R pin = 1 18

Data disabled on DATA line, L/R pin = 1 16

Data enabled on DATA line, L/R pin = 0 18

Data disabled on DATA line, L/R pin = 0 16

Figure 2. Timing waveforms

CLK

T

R,EN

PDM R

T

R,DIS

High Z

(1)

(1)

(1)

(1)

T

CLK

T

L,DIS

High Z

ns

ns

ns

ns

PDM L

T

L,EN

High Z

High Z

AM045165v1

Doc ID 022331 Rev 9 7/16

Acoustic and electrical specifications MP34DT01

2.3 Frequency response

Figure 3. Typical frequency response normalized at 1 kHz

10

8

6

4

2

0

-2

Normalized Sensitivity [dB]

-4

-6

-8

-10

10 100 1000 10000

Frequency [Hz]

Table 6. Frequency response mask for digital microphones

Frequency / Hz

20...100 -5 +5 dBr 1kHz

100...8000 -2 +2 dBr 1kHz

8000...20000 -5 +5 dBr 1kHz

1. At T = 20 °C and acoustic stimulus = 1 Pa (94 dB SPL)

(1)

Lower limit Upper limit Unit

AM045317v1

8/16 Doc ID 022331 Rev 9

MP34DT01 Sensing element

3 Sensing element

The sensing element shall mean the acoustic sensor consisting of a conductive movable
plate and a fixed plate placed in a tiny silicon chip. This sensor transduces the sound
pressure into the changes of coupled capacity between those two plates.

Omron Corporation supplies this element for STMicroelectronics.

Doc ID 022331 Rev 9 9/16

Absolute maximum ratings MP34DT01

4 Absolute maximum ratings

Stresses above those listed as “absolute maximum ratings” may cause permanent damage
to the device. This is a stress rating only and functional operation of the device under these
conditions is not implied. Exposure to maximum rating conditions for extended periods may
affect device reliability.

Table 7. Absolute maximum ratings

Symbol Ratings Maximum value Unit

Vdd Supply voltage -0.3 to 6 V

Vin Input voltage on any control pin -0.3 to Vdd +0.3 V

T

ESD Electrostatic discharge protection 2 (HBM) kV

Storage temperature range -40 to +125 °C

STG

This device is sensitive to mechanical shock, improper handling can cause
permanent damage to the part.

This device is ESD-sensitive, improper handling can cause permanent damage to the
part.

10/16 Doc ID 022331 Rev 9

MP34DT01 Functionality

5 Functionality

5.1 L/R channel selection

The L/R digital pad lets the user select the DOUT signal pattern as shown in Tabl e 8 . The
L/R pin must be connected to Vdd or GND.

Table 8. L/R channel selection

L/R CLK low CLK high

GND Data valid High impedance

Vdd High impedance Data valid

Doc ID 022331 Rev 9 11/16

Package mechanical data MP34DT01

6 Package mechanical data

In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK

®

packages, depending on their level of environmental compliance. ECOPACK®

®

is an ST trademark.

Soldering information

The HCLGA 3x4 4LD package is also compliant with the RoHS and “Green” standards and
is qualified for soldering heat resistance according to JEDEC J-STD-020.

Landing pattern and soldering recommendations are available at www.st.com.

Figure 4. Recommended soldering profile limits

t

p

T

P

T

L

TEMPERATURE

RAMP-UP

T

SMAX

T

SMIN

t

s

PREHEAT

RAMP-DOWN

t

L

CRITICAL ZONE

TLto T

P

T25°C to PEAK

30 60 90 120 150 180 210 240 270 300 330 360 390

TIME

AM045166v1

Table 9. Recommended soldering profile limits

Description Parameter Pb free

Average ramp rate TL to T

P

Preheat

Minimum temperature
Maximum temperature
Time (T

SMIN

to T

SMAX

)

Ramp-up rate T

Time maintained above liquidous temperature
Liquidous temperature

Peak temperature T

T

SMIN

T

SMAX

SMAX

t

t

T

S

to T

L

L

P

L

Time within 5 °C of actual peak temperature 20 sec to 40 sec

Ramp-down rate 6 °C/sec max

Time 25 °C (t25 °C) to peak temperature 8 minutes max

3 °C/sec max

150 °C
200 °C

60 sec to 120 sec

60 sec to 150 sec

217 °C

260 °C max

12/16 Doc ID 022331 Rev 9

MP34DT01 Package mechanical data

Figure 5. HCLGA 3 mm x 4 mm x 1 mm 4-lead package outline

2

E1

K

E

D

1
D

1

R

E2

TOP VIEW

2
D

//

K C

K E

K D

C

K

1
G

1
N

Seating Plane

1

A

1
L

6

G

X

4

T

2

BOTTOM VIEW

L

N2

G5XG5 Pin 1 Indicator

1

1

4

2

3

T

1
T

M

T

2

3

G

2
G

G4

8053274_D

Table 10. HCLGA 3 mm x 4 mm x 1 mm 4-lead package dimensions

mm

Symbol

Min Typ Max

A1 0.900 1.000 1.100

D1 3.900 4.000 4.100

D2 0.300 0.500 0.700

R1 0.300 0.400 0.500

E1 2.900 3.000 3.100

E2 0.000 ±0.200

L1 1.300 1.350 1.400

L2 0.800 0.850 0.900

N1 0.625 0.675 0.725

N2 0.375 0.425 0.475

T1 0.900 0.950 1.000

T2 0.350 0.400 0.450

G1 3.050 3.100 3.150

G2 3.750 3.800 3.850

G3 2.050 2.100 2.150

G4 2.750 2.800 2.850

G5 0.250 0.300 0.350

G6 0.400

M0.100

K0.050

Doc ID 022331 Rev 9 13/16

Package mechanical data MP34DT01

Figure 6. Land pattern

0.85

GND

1.30

GND

CLK

DOUT

GND

0.35

0.40

LR

0.95

Vdd

Pad + solder paste

0.35

GND

0.85

2.30

14/16 Doc ID 022331 Rev 9

MP34DT01 Revision history

7 Revision history

Table 11. Document revision history

Date Revision Changes

06-Oct-2011 1 Initial release

18-Nov-2011 2 Removed “stereo” from title, Features, and Description

29-Nov-2011 3 Updated Features and Description

Updated Figure 3: Typical frequency response normalized at 1 kHz

04-Jan-2012 4

23-Mar-2012 5

Added So limits to Table 3: Acoustic and electrical characteristics
Minor textual updates

Updated Figure 5: HCLGA 3 mm x 4 mm x 1 mm 4-lead package outline
Pin 1 indicator removed from top view of package on page 1 and

Figure 1: Pin connections

Updated Table 10: HCLGA 3 mm x 4 mm x 1 mm 4-lead package

dimensions

06-Apr-2012 6

07-May-2012 7 Added V

Updated maximum supply voltage in Table 3: Acoustic and electrical

characteristics

, V

IOL

to Table 3: Acoustic and electrical characteristics

IOH

18-May-2012 8 Updated Table 5: Timing characteristics

Added Section 3: Sensing element

05-Jul-2012 9

Added Figure 6: Land pattern
Updated temperature range to -40 to +85 °C throughout datasheet

Doc ID 022331 Rev 9 15/16

MP34DT01

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