Sony Ericsson W760 Working Instruction

Working Instruction /Electrical

Working Instruction, Electrical

Applicable for W760

CONTENTS

1 Read this first!........................................................................................2

2 Lead-free soldering................................................................................3

3 BGA equipment reflow profiles.............................................................5

3.1 General.................................................................................................. 5

3.2 Temperature Measurements ................................................................. 5

3.3 Reflow Profiles ...................................................................................... 6

4 Replacement of components ................................................................7

4.1 D2404: IC IF 3.5X3.5X0.8 ..................................................................... 7

4.2 N1400: Module Bluetooth + FM STLC2592 .......................................... 8

4.3 N1200: RF-Module Thor Pre-bumped................................................... 9

4.4 N1200: RF-Module Thor Pre-bumped Continued ............................. 10

4.5 N1210: RF-Module Mammoth Pre-bumped ........................................11

4.6 N1210: RF-Module Mammoth Pre-bumped Continued..................... 12

4.7 X2200: Battery Connector ................................................................... 13

4.8 X2400: System Connector .................................................................. 14

5 Revision History...................................................................................16

1211-1562 Rev 2 1211-1562

Working Instruction/ Electrical

1 Read this first!

CAUTION Before you start replacing any components, make sure you have read and fully understood the

contents of section 2 and 3!

Use Electrostatic Discharge (ESD) equipment to avoid damaging the PBA.

Use gloves or finger cots to avoid contaminating the PBA with skin oil.

EQUIPMENT For equipment information, refer to the Electrical and Mechanical Equipment Lists.

MECHANICAL INSTRUCTIONS For phone disassembly and reassembly information, refer to the Mechanical Working

Instruction.

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Working Instruction/ Electrical

2 Lead-free soldering

THIS PRODUCT IS MANUFACTURED WITH LEAD-FREE SOLDER

AND LEAD

During electrical repair, it is critical to make sure that no lead is introduced. This symbol indicates that the product is lead- free.

-FREE COMPONENTS!

The lead-free symbol is located on the PCB as shown.

A lead-free work area must be set up completely separated from work areas that are used to make lead repairs. The leadfree work area must also be clearly labeled with the lead free symbol as shown in the adjacent picture. The items on this desk must remain lead-free. They must be adequately labeled to make their lead-free status clearly and easily recognized.

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Working Instruction/ Electrical

Lead-free soldering continued

LFS (lead-free solder) characteristics:

• High melting point (typically 217°C)

• Low wetting

• High surface tension

• Difficult to spread

• Recommended tip temperature = 370°C

WHEN SERVICING PBAS THAT HAVE BEEN MANUFACTURED

LFS (LEAD-FREE SOLDER), LFS MUST BE USED!

WITH

F NOT, THERE IS A HIGH RISK OF UNRELIABLE SOLDERING

JOINTS

Lead-free solder joints are more difficult to inspect because they do not have shiny surfaces like leaded solder joints. Also, leadfree solder does not flow as well as leaded solder, so some of the solder pad areas may remain exposed.

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Working Instruction/ Electrical

3 BGA equipment reflow profiles

3.1 General

This section contains reflow profile recommendations for mobile phones and similar products.

They are just general recommendations and considerations have to be taken for every single product.

The solder is secondary but could also affect the parameters.

In this document one alloy is specified: SnAgCu (Lead free) melting point 217°C

3.2 Temperature Measurements

At least four probes should be used.

They should be placed on components with the highest and lowest thermal mass.

The probes shall be located in the beginning, in the middle, and at the end of the board/panel.

It is recommended that the probes are soldered on the board, but glue and Kapton tape can be used.

At least one probe shall be placed in the air or on top of a component.

These values are strongly dependent on the BGA replacement equipment.

Select a nozzle size that is the same size or slightly larger than the part being replaced.

Make sure the nozzle does not affect any nearby placed components.

HESE VALUES ARE RECOMMENDATIONS AND MAY HAVE TO BE CHANGED DEPENDING ON THE TYPE OF

EQUIPMENT

HE MAXIMUM TEMPERATURE FOR ANY COMPONENT MUST NOT EX CEED 260°C!

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