Sony XM-2150GSX Service manual
XM-2150GSX
SERVICE MANUAL
Ver 1.0 2001. 12
SPECIFICATIONS
AUDIO POWER SPECIFICATIONS
POWER OUTPUT AND TOTAL HARMONIC DISTORTION
150 watts per channel minimum continuous average power into
4 ohms, both channels driven from 20 Hz to 20 kHz with no more
than 0.04% total harmonic distortion per Car Audio Ad Hoc
Committee standards.
US Model
Canadian Model
Other Specifications
Circuit system OTL (output transformerless) circuit
Inputs RCA pin jacks
Outputs Speaker terminals
Speaker impedance 2 – 8 Ω (stereo)
Maximum outputs 300 W × 2 (at 4 Ω)
Rated outputs (supply voltage at 14.4 V)
Frequency response 5 Hz – 100 kHz ( dB)
Harmonic distortion 0.005% or less (at 1 kHz, 4 Ω)
Input level adjustment range
Pulse power supply
High level input connector
Through out pin jacks
4 – 8 Ω (when used as a bridging amplifier)
760 W (monaural) at 4 Ω
150 W × 2 (20 Hz – 20 kHz, 0.04% THD,
at 4 Ω)
190 W × 2 (20 Hz – 20 kHz, 0.1% THD,
at 2 Ω)
380 W (monaural) (20 Hz – 20 kHz, 0.1% THD,
at 4 Ω)
0.2 – 6.0 V (RCA pin jacks)
0.4 – 12.0 V (High level input)
+0.5
–3
High-pass filter 50 – 300 Hz, –12 dB/oct
Low-pass filter 50 – 300 Hz, –12 dB/oct
Low boost 0 – 10 dB (40 Hz)
Power supply voltage 10.5 – 16 V
Current drain at rated output : 40 A (at 4 Ω)
Dimensions Approx. 14
Mass Approx. 3.5 kg (7 lb. 11 oz.) not incl. accessories
Supplied accessories Mounting screws (4)
Design and specifications are subject to change without
notice.
Remote input : 2 mA
1/8 × 2 1/4 × 10 1/2 in.
(358 × 50 × 264 mm)
(w/h/d) not incl. projecting parts and controls
9-873-436-01
2001L0400-1
© 2001.12
STEREO POWER AMPLIFIER
Sony Corporation
e Vehicle Company
Published by Sony Engineering Corporation
1
XM-2150GSX
Note for Replacement of FET
Change the both channels of FETs at the output stage.
If one or both parts in the following combination is broken, the
service kit should be ordered.
Service kit part No.
Q108, 112
Q208, 212
Q109, 113
Q209, 213
X-3381-586-1
X-3381-587-1
TABLE OF CONTENTS
1. GENERAL
Location and Function of Controls.......................................... 3
Connections ............................................................................. 3
2. DISASSEMBLY
2-1. Bottom Plate........................................................................ 6
2-2. Main Board ......................................................................... 6
2-3. Front Panel .......................................................................... 7
2-4. Led Board............................................................................ 7
3. ELECTRICAL ADJUSTMENT...................................... 8
4. DIAGRAMS
4-1. Block Diagram .................................................................... 9
4-2. Schematic Diagram –Main Section (1/2)– ........................ 10
4-3. Schematic Diagram –Main Section (2/2)– ........................ 11
4-4. Printed Wiring Boards –Main Section– ............................ 12
5. EXPLODED VIEWS
5-1. Heat Sink Section .............................................................. 14
5-2. Main Board Section .......................................................... 15
6. ELECTRICAL PARTS LIST ........................................ 16
Notes on Chip Component Replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY P ARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
ATTENTION AU COMPOSANT AYANT RAPPORT
LES COMPOSANTS IDENTIFIÉS P AR UNE MARQUE 0 SUR LES
DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES
SONT CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT.
NE REMPLACER CES COMPOSANTS QUE PAR DES PIÈCES
SONY DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL
OU DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY.
À LA SÉCURITÉ!!
2
SECTION 1
GENERAL
XM-2150GSX
This section is extracted
from instruction manual.
3
XM-2150GSX
4
XM-2150GSX
5
XM-2150GSX
e
SECTION 2
DISASSEMBLY
Note : Follow the disassembly procedure in the numerical order given.
2-1. BOTTOM PLATE
4 P 2.6x2.8
3 BTP 3x6
6
2 BTP 3x6
1 BTP 3x6
5 bottom plat
7 insulating sheet
2-2. MAIN BOARD
2 BTP 3x6
1 BTP 3x6
3 B.TT. 3x14
4 B.TT. 3x14
6
5 B.TT. 3x14
7 MAIN board section
8 CN808
6
2-3. FRONT P ANEL
)
XM-2150GSX
4 MAIN board
2 P 3x8
2-4. LED BOARD
1 P 3x8
3 front panel (2ch)
1 BTP 3x6
2 LED board
heat sink (main
7
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