Sony TA3020 Service Manual

TA3020
Tripath Technology, Inc. - Technical Information
STEREO 300W (4) CLASS-T DIGITAL AUDIO AMPLIFIER DRIVER
TM
USING DIGITAL POWER PROCESSING (DPP
Technical Information Revision 3.0 – September 2003
GENERAL DESCRIPTION
The TA3020 is a two-channel, 300W (4) per channel Amplifier Driver IC that uses Tripath’s proprietary Digital Power Processing (DPP power efficiency of Class-D amplifiers.
APPLICATIONS
Audio/Video Amplifiers & Receivers Pro-audio Amplifiers Automobile Power Amplifiers Subwoofer Amplifiers
BENEFITS
Reduced system cost with smaller/less
expensive power supply and heat sink
Signal fidelity equal to high quality Class-
AB amplifiers
High dynamic range compatible with
digital media such as CD and DVD
TM
) technology. Class-T amplifiers offer both the audio fidelity of Class-AB and the
FEATURES
Class-T architecture Proprietary Digital Power Processing technology “Audiophile” Sound Quality
 0.02% THD+N @ 50W, 8  0.03% IHF-IM @ 30W, 8
High Efficiency
 95% @ 150W @ 8  90% @ 275W @ 4
Supports wide range of output power levels
Up to 300W/channel (4), single-ended outputs Up to 1000W (4), bridged outputs
Output over-current protection Over- and under-voltage protection Thermally Enhanced 48-pin DIP (dual-inline
package)
TYPICAL PERFORMANCE
THD+N versus Output Power versus Supply Voltage
10
f = 1kHz
5
BBM = 80nS BW = 22Hz - 22kHz
2
1
0.5
0.2
THD+N (%)
0.1
0.05
0.02
0.01 1 5002 5 10 20 50 100 200
Output Power (W)
RL = 4
39V
45V
54V
1 TA3020 – KL Rev. 3.0/09.03
Tripath Technology, Inc. - Technical Information
Absolute Maximum Ratings
(Note 1)
SYMBOL PARAMETER Value UNITS
VPP, VNN Supply Voltage +/- 70 V
V5 Positive 5 V Bias Supply
VN10 Voltage for FET drive VNN+13 V
T
STORE
T
A
TJ Junction Temperature 150º C
ESDHB ESD Susceptibility – Human Body Model (Note 3)
ESDMM ESD Susceptibility – Machine Model (Note 4)
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur.
Note 2: This is a target specification. Characterization is still needed to validate this temperature range. Note 3: Human body model, 100pF discharged through a 1.5K resistor. Note 4: Machine model, 220pF – 240pF discharged through all pins.
Voltage at Input Pins (pins 12-16, 18, 19-26, 29-33, 37)
Storage Temperature Range -55º to 150º C
Operating Free-air Temperature Range (Note 2) -40º to 85º C
All pins
All pins
See the table below for Operating Conditions.
-0.3V to (V5+0.3V)
6
2000
200
V
V
V
Operating Conditions
(Note 5)
SYMBOL PARAMETER MIN. TYP. MAX. UNITS
VPP, VNN Supply Voltage +/- 15 +/-45 +/- 65 V
V5 Positive 5 V Bias Supply 4.5 5 5.5 V
VN10 Voltage for FET drive (Volts above VNN) 9 10 12 V
Note 5: Recommended Operating Conditions indicate conditions for which the device is functional.
See Electrical Characteristics for guaranteed specific performance limits.
2 TA3020 – KL Rev. 3.0/09.03
Tripath Technology, Inc. - Technical Information
Electrical Characteristics
TA = 25 °C. See Application/Test Circuit on page 7. Unless otherwise noted, the supply voltage is VPP=|VNN|=45V.
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNITS
I
q
I
MUTE
VIH High-level input voltage (MUTE) 3.5 V
VIL Low-level input voltage (MUTE) 1.0 V
VOH High-level output voltage (HMUTE) I
VOL Low-level output voltage (HMUTE) I
V
OFFSET
IOC Over Current Sense Voltage
I
VPPSENSE
V
VPPSENSE
I
VNNSENSE
V
VNNSENSE
Note 6: Minimum and maximum limits are guaranteed but may not be 100% tested. Note 7: These supply voltages are calculated using the I Characteristics table. The typical voltage values shown are calculated using a R value of 422kohm without any tolerance variation. The minimum and maximum voltage limits shown include either a +1% or –1% (+1% for Over-voltage turn on and Under-voltage turn off, -1% for Over-voltage turn off and Under-voltage turn on) variation of R values. These voltage specifications are examples to show both typical and worst case voltage ranges for a given R Application Information section for a more detailed description of how to calculate the over and under voltage
trip voltages for a given resistor value.
Note 8: The fact that the over-voltage turn on specifications exceed the absolute maximum of +/-70V for the TA3020 does not imply that the part will work at these elevated supply voltages. It also does not imply that the TA3020 is tested or guaranteed at these supply voltages. The supply voltages are simply a calculation based on the process spread of the I currents (see note 7). The supply voltage must be maintained below the absolute maximum of +/-70V or permanent damage to the TA3020 may occur.
Quiescent Current (No load, BBM0=1,BBM1=0, Mute = 0V)
Mute Supply Current (No load, Mute = 5V)
Output Offset Voltage No Load, MUTE = Logic low
Threshold
VPPSENSE Threshold Currents Over-voltage turn on (muted)
Threshold Voltages with
R
VPPSENSE
= 422KΩ
(Note 7,8)
VNNSENSE Threshold Currents Over-voltage turn on (muted)
Threshold Voltages with
R
VNNSENSE
= 392KΩ
(Note 7,8)
VPPSENSE
and R
VNNSENSE
(Note 6)
VPP = +45V VNN = -45V V5 = 5V VN10 = 10V VPP = +45V VNN = -45V V5 = 5V VN10 = 10V
= 3mA 4.0 V
OH
= 3mA 0.5 V
OL
90
90 45
200
1
1
20
1
60
250
25
mA mA mA mA mA mA mA mA
-750 750 mV
0.1% R
FBA
, R
FBB
, R
resistors
FBC
TBD 0.85 .97 1.09 V
Over-voltage turn off (mute off) Under-voltage turn off (mute off) Under-voltage turn on (muted)
Over-voltage turn on (muted) Over-voltage turn off (mute off) Under-voltage turn off (mute off) Under-voltage turn on (muted)
Over-voltage turn off (mute off) Under-voltage turn off (mute off) Under-voltage turn on (muted)
Over-voltage turn on (muted) Over-voltage turn off (mute off) Under-voltage turn off (mute off) Under-voltage turn on (muted)
138
62
57.6
25.9
152
65
-59.0
-25.2
162 154
79 72
68.4
65.0
33.3
30.4 174 169
86 77
-68.2
-66.2
-33.7
-30.2
178
87
75.8
37.1
191
95
-75.6
-37.6
A
µ
A
µ
A
µ
A
µ
V V V V
A
µ
A
µ
A
µ
A
µ
V V V V
and I
VNNSENSE
VNNSENSE
off the nominal 422kohm and 392kohm
VPPSENSE
VPPSENSE
or R
resistor values of 422kohm and 392kohm. Please refer to the
VPPSENSE
values shown in the Electrical
and I
VPPSENSE
VNNSENSE
and R
VNNSENSE
3 TA3020 – KL Rev. 3.0/09.03
Tripath Technology, Inc. - Technical Information
Performance Characteristics – Single Ended
TA = 25 °C. Unless otherwise noted, the supply voltage is VPP=|VNN|=45V, the input frequency is 1kHz and the measurement bandwidth is 20kHz. See Application/Test Circuit.
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNITS
P
Output Power
OUT
(continuous RMS/Channel)
THD + N Total Harmonic Distortion Plus
Noise
IHF-IM IHF Intermodulation Distortion
SNR Signal-to-Noise Ratio
CS Channel Separation
η
Power Efficiency
AV Amplifier Gain
THD+N = 0.1%, R R THD+N = 1%, R R
= 50W/Channel, RL = 8Ω
P
OUT
19kHz, 20kHz, 1:1 (IHF), R
= 30W/Channel
P
OUT
A Weighted, R
= 275W/Channel
P
OUT
0dBr = 30W, R
= 150W/Channel, RL = 8Ω
P
OUT
P
= 10W/Channel, RL = 4Ω
OUT
= 8Ω
L
= 4Ω
L
= 8Ω
L
= 4Ω
L
= 4Ω,
L
= 8Ω, f = 1kHz
L
See Application / Test Circuit
A
Channel to Channel Gain Error
VERROR
P
= 10W/Channel, RL = 4Ω
OUT
See Application / Test Circuit
e
Output Noise Voltage A Weighted, no signal, input shorted,
NOUT
= 8Ω
L
100 190 120 220
W
W W W
0.02 %
0.03 %
102 dB
97 dB
95 %
10.7 V/V
0.5 dB
260
V
µ
DC offset nulled to zero
TA3020 Pinout
VN10
LO2
LO2COM
HO2COM
HO2
OCS2LN
OCS2LP
OCS2HP
OCS2HN
VBOOT2
NC
OCR2
FBKOUT1 FBKGND1
HMUTE
FBKOUT2
DCOMP
FBKGND2
BIASCAP
INV2
OAOUT2
BBM0 BBM1
MUTE
48-pin Dip
(Top View)
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15 16
17
18 19
20
21
22 23
24
48
LO1
47
LO1COM
46
HO1COM
45
HO1
44
OCS1HN
43
OCS1HP
42
OCS1LP
41
OCS1LN
40
VBOOT1
39
VNN
38
NC
37
OCR1
36
NC
35
V5
34
AGND
33
OCR1
32
REF
31
OCR2
30
VNNSENSE
29
VPPSENSE
28
AGND
27
V5
26
OAOUT1
25
INV1
4 TA3020 – KL Rev. 3.0/09.03
Tripath Technology, Inc. - Technical Information
Pin Description
Pin
1 VN10 “Floating” supply input for the FET drive circuitry. This voltage must be stable
2,48 LO2, LO1 Low side gate drive output (Channel 2 & 1) 3,47 LO2COM, LO1COM Kelvin connection to source of low-side transistor (Channel 2 & 1) 4,46 HO2COM, HO1COM Kelvin connection to source of high-side transistor (Channel 2 & 1) 5,45 HO2, HO1 High side gate drive output (Channel 2 & 1)
6, 7 OCS2LN, OCS2LP Over Current Sense inputs, Channel 2 low-side 8, 9 OCS2HP, OCS2HN Over Current Sense inputs, Channel 2 high-side
10, 40 VBOOT2, VBOOT1 Bootstrapped voltage to supply drive to gate of high-side FET
12, 31 OCR2 Over-current threshold adjustment (Channel 2) 13, 16 FBKOUT1, FBKOUT2 Switching feedback (Channels 1 & 2) 14, 18 FBKGND1, FBKGND2 Ground Kelvin feedback (Channels 1 & 2)
15 HMUTE Logic Output. A logic high indicates both amplifiers are muted, due to the
17 DCOMP Internal mode selection. This pin must be grounded for proper device
19 BIASCAP Bandgap reference times two (typically 2.5VDC). Used to set the common
20, 25 INV2, INV1 Inverting inputs of Input Stage op amps. (Channels 2 & 1) 21, 26 OAOUT2, OAOUT1 Outputs of Input Stage op amps. (Channels 2 & 1) 22, 23 BBM0, BBM1 Break-before-make timing control to prevent shoot-through in the output FETs.
24 MUTE Logic input. A logic high puts the amplifier in mute mode. Ground pin if not
27, 35 V5 5V power supply input.
28,34 AGND Analog ground.
29 VPPSENSE Positive supply voltage sense input. This pin is used for both over and
30 VNNSENSE Negative supply voltage sense input. This pin is used for both over and under
32 REF Used to set internal bias currents. The pin voltage is typically 1.1V.
33, 37 OCR1 Over-current threshold adjustment (Channel 1)
39 VNN Negative supply voltage. 41, 42 OCS1LN, OCS1LP Over Current Sense inputs, Channel 1 low-side 43, 44 OCS1HP, OCS1HN Over Current Sense inputs, Channel 1 high-side
11, 36,
38
Function
and referenced to VNN.
(Channel 2 & 1)
mute pin state, or a “fault” such as an overcurrent, undervoltage, or overvoltage condition.
operation.
mode voltage for the input op amps. This pin is not capable of driving external circuitry.
used. Please refer to the section, Mute Control, in the Application Information.
under voltage sensing for the VPP supply.
voltage sensing for the VNN supply.
NC Not connected (bonded) internally. To minimize coupling between pins, tie
these pins to AGND (pin34).
Description
5 TA3020 – KL Rev. 3.0/09.03
Application/Test Circuit
OAOUT1
C
I
3.3uF +
V5 (Pin 27)
R
OFA
10K
Offset Trim
Circ uit
R
F
20K
R
I
49.9K
R
OFB
499K
A GND (Pin 28)
C
A
0.1uF
(Pin 28)
5V
(Pin 28)
R
REF
8.25K
1%
Ω,
INV 1
R
OFB
499K
C
OF
0.1uF
BIA SCAP
MUTE
REF1
Tripath Technology, Inc. - Technical Information
TA3020
OCS1HP
43
R
0.01
1W
DG MUR120
RG 5.6Ω, 1W
DG MUR120
RG 5.6Ω, 1W
0.01
R
OCR
20K
C
FB
A GND (Pin 28)
Ω,
Ω,
V5 (Pin 27)
*R
1.07K
Q
R
1W
R
FBA
1K
FBB
VN10
OCS1HN
44
40
VBOOT1
DS MUR120
45
HO1
HO1CO M
46
DS MUR120
48
LO1
47
LO1COM
42
OCS1LP
41
OCS1LN
37
OCR1 OCR1
33
220pF
FBKOUT1
13 14
FBKGND1
15
HMUTE
C
OCR
AGND
(Pin 28)
150pF
26
V5
25
-
+
AGND
Process ing
&
Modulation
2.5V
200K
19
V5
24
32
S
O
Q
O
S
C
S
0.1uF
DO MUR120
C
HBR
0.1uF
R 16Ω, 1W
D
MUR120
O
R
FBA
1K
*R
FBB
1.07K
SN
C
S
0.1uF
*R
13.3K
C
HBR
33uF
C
SN
220pF
FBC
D
MUR120
B
R
B
C
B
0.1uF
+
L
O
10uH
*R
FBC
13.3K
VN10
250
+
+
C
BAUX
47uF
C
O
0.22uF
+
C
S
330uF
C
S
330uF
VPP
VNN
R
Z
20
Ω,
C
Z
0.22uF
2W
R
4Ω or 8
L
(Pin 28)
C
I
3.3uF +
V5 (Pin 27)
R
OFA
10K
Offset Trim
Circ uit
*R
VNN
*R
VPP
*R
V5
*R
V5
R
I
49.9K
A GND (Pin 28)
5V
VNN1
392KΩ, 1%
VPP1
422KΩ, 1%
VNN2
1.35M
VPP1
422K
20K
R
OFB
499K
Ω,
R
0.1uF
0.1uF
1%
, 1%
F
C
C
OAOUT2
INV 2
R
OFB
499K
C
OF
0.1uF
BBM0
BBM1
DCOMP
S
S
21
V5
20
-
+
AGND
Process ing
&
Modulation
22
23
17
27
V5
28
AGND
35
V5
34
AGND
30
VNNSENSE
29
V PPSENS E
11
NC
F. BEA D
* The values of thes e components must be adjusted based on supply voltage range. See Application Information.
Analog Ground
Pow e r Ground
VN10
VN10
VNN
NC
NC
OCS2HP
8
OCS2HN
9
10
VBOOT2
DS MUR120
5
HO2
4
HO2CO M
DS MUR120
2
LO2
LO2COM
3
OCS2LP
7
6
OCS2LN
12
OCR2 OCR2
31
220pF
16
FBKOUT2
18
FBKGND2
1
39
38
36
C
OCR
AGND
VNN
(Pin 28)
150pF
C
SW
0.1uF,35V
VNN
0.01
DG MUR120
RG 5.6Ω, 1W
DG MUR120
RG 5.6Ω, 1W
0.01
R
OCR
20K
C
FB
VN10
R
S
1W
Ω,
DO MUR120
Q
O
Q
O
D
O
R
S
1W
Ω,
V5 (Pin 27)
R
R
FBA
1K
1K
A GND (Pin 28)
C
0.1uF
C
HBR
0.1uF
MUR120
FBA
*R
FBB
1.07K
S
R
SN
16Ω, 1W
C
S
0.1uF
*R
13.3K
C
HBR
33uF
C
SN
220pF
FBC
VPP
+
C
+
C
BAUX
47uF
C
O
0.22uF
+
S
330uF
C
S
330uF
VNN
R
Z
20
Ω,
C
Z
0.22uF
2W
R
4Ω or 8
L
D
MUR120
B
VN10
R
250
B
C
B
0.1uF
+
L
O
10uH
*R
FBC
13.3K
6 TA3020 – KL Rev. 3.0/09.03
Tripath Technology, Inc. - Technical Information
External Components Description
Components Description R
Inverting input resistance to provide AC gain in conjunction with RF. This input is
I
biased at the BIASCAP voltage (approximately 2.5VDC).
RF Feedback resistor to set AC gain in conjunction with RI. Please refer to the Amplifier
Gain paragraph, in the Application Information section.
CI AC input coupling capacitor which, in conjunction with RI, forms a highpass filter at
.
)CR2(1f
π=
IIC
R
FBA
R
Feedback divider resistor connected to AGND. This value of this resistor depends
FBB
Feedback divider resistor connected to V5. This resistor is normally set at 1kΩ.
on the supply voltage setting and helps set the TA3020 gain in conjunction with R R
F, RFBA,
and R
. Please see the Modulator Feedback Design paragraphs in the
FBC
Application Information Section.
R
Feedback resistor connected from either the OUT1(OUT2) to FBKOUT1(FBKOUT2)
FBC
or speaker ground to FBKGND1(FBKGND2). The value of this resistor depends on the supply voltage setting and helps set the TA3020 gain in conjunction with R R
FBA,
, and R
. It should be noted that the resistor from OUT1(OUT2) to
FBB
FBKOUT1(FBKOUT2) must have a power rating of greater than
Please see the Modulator Feedback Design paragraphs in the Application Information Section.
CFB Feedback delay capacitor that both lowers the idle switching frequency and filters
very high frequency noise from the feedback signal, which improves amplifier performance. The value of C so that the idle switching difference is greater than 40kHz. Please refer to the Application / Test Circuit.
R
Potentiometer used to manually trim the DC offset on the output of the TA3020.
OFA
R
Resistor that limits the manual DC offset trim range and allows for more precise
OFB
adjustment.
R
Bias resistor. Locate close to pin 32 and ground at pin 28.
REF
CA BIASCAP decoupling capacitor. Should be located close to pin 19 and grounded at
pin 28.
DB Bootstrap diode. This diode charges up the bootstrap capacitors when the output is
low (at VNN) to drive the high side gate circuitry. A fast or ultra fast recovery diode is recommended for the bootstrap circuitry. In addition, the bootstrap diode must be able to sustain the entire VPP-VNN voltage. Thus, for most applications, a 150V (or greater) diode should be used.
CB High frequency bootstrap capacitor, which filters the high side gate drive supply.
This capacitor must be located as close to pin 40 (VBOOT1) or pin10 (VBOOT2) for reliable operation. The “negative” side of C HO1COM (pin 46) or HO2COM (pin 4). Please refer to the Application / Test Circuit.
C
Bulk bootstrap capacitor that supplements CB during “clipping” events, which result
BAUX
in a reduction in the average switching frequency.
RB Bootstrap resistor that limits C
(bootstrap supply charging).
CSW VN10 generator filter capacitors. The high frequency capacitor (0.1uF) must be
located close to pin 1 (VN10) to maximize device performance.
CS Supply decoupling for the power supply pins. For optimum performance, these
components should be located close to the TA3020 and returned to their respective ground as shown in the Application/Test Circuit.
R
Main overvoltage and undervoltage sense resistor for the negative supply (VNN).
VNN1
Please refer to the Electrical Characteristics Section for the trip points as well as the hysteresis band. Also, please refer to the Over / Under-voltage Protection section in the Application Information for a detailed discussion of the internal circuit operation and external component selection.
R
Secondary overvoltage and undervoltage sense resistor for the negative supply
VNN2
(VNN). This resistor accounts for the internal V resistor value should be three times that of R
(Refer to the Application/Test Circuit)
2
=
DISS
should be offset between channel 1 and channel 2
FB
should be connected directly to the
B
charging current during TA3020 power up
BAUX
NNSENSE
VNN1
bias of 1.25V. Nominal
. Please refer to the Over / Under-
I, RF,
FBC
I,
)(2RVPPP
.
7 TA3020 – KL Rev. 3.0/09.03
y
Tripath Technology, Inc. - Technical Information
voltage Protection section in the Application Information for a detailed discussion of the internal circuit operation and external component selection.
R
Main overvoltage and undervoltage sense resistor for the positive supply (VPP).
VPP1
Please refer to the Electrical Characteristics Section for the trip points as well as the hysteresis band. Also, please refer to the Over / Under-voltage Protection section in the Application Information for a detailed discussion of the internal circuit operation and external component selection.
R
Secondary overvoltage and undervoltage sense resistor for the positive supply
VPP2
(VPP). This resistor accounts for the internal V resistor value should be equal to that of R
VPP1
PPSENSE
. Please refer to the Over / Under-
bias of 2.5V. Nominal
voltage Protection section in the Application Information for a detailed discussion of the internal circuit operation and external component selection.
RS Over-current sense resistor. Please refer to the section, Setting the Over-current
Threshold, in the Application Information for a discussion of how to choose the value of R
to obtain a specific current limit trip point.
S
R
Over-current “trim” resistor, which, in conjunction with RS, sets the current trip point.
OCR
Please refer to the section, Setting the Over-current Threshold, in the Application Information for a discussion of how to calculate the value of R
C
Over-current filter capacitor, which filters the overcurrent signal at the OCR pins to
OCR
OCR
.
account for the half-wave rectified current sense circuit internal to the TA3020. A typical value for this component is 220pF. In addition, this component should be located near pin 31 or pin 33 as possible.
C
Supply decoupling for the high current Half-bridge supply pins. These components
HBR
must be located as close to the output MOSFETs as possible to minimize output ringing which causes power supply overshoot. By reducing overshoot, these capacitors maximize both the TA3020 and output MOSFET reliability. These capacitors should have good high frequency performance including low ESR and low ESL. In addition, the capacitor rating must be twice the maximum VPP voltage. Panasonic EB capacitors are ideal for the bulk storage (nominally 33uF) due to their high ripple current and high frequency design.
RG Gate resistor, which is used to control the MOSFET rise/ fall times. This resistor
serves to dampen the parasitics at the MOSFET gates, which, in turn, minimizes ringing and output overshoots. The typical power rating is 1 watt.
CZ Zobel capacitor, which in conjunction with RZ, terminates the output filter at high
frequencies. Use a high quality film capacitor capable of sustaining the ripple current caused by the switching outputs.
RZ Zobel resistor, which in conjunction with CZ, terminates the output filter at high
frequencies. The combination of R
and CZ minimizes peaking of the output filter
Z
under both no load conditions or with real world loads, including loudspeakers which usually exhibit a rising impedance with increasing frequency. Depending on the program material, the power rating of R
may need to be adjusted. The typical
Z
power rating is 2 watts.
LO Output inductor, which in conjunction with CO, demodulates (filters) the switching
waveform into an audio signal. Forms a second order filter with a cutoff frequency of
C
O
Output capacitor, which, in conjunction with L waveform into an audio signal. Forms a second order low-pass filter with a cutoff
π=
frequency of
and a quality factor of
)CL2(1f
OOC
and a quality factor of
π=
)CL2(1f
OOC
, demodulates (filters) the switching
O
.
CLCRQ =
OOOL
.
Use
CLCRQ =
OOOL
a high quality film capacitor capable of sustaining the ripple current caused by the switching outputs.
DS Source to drain diodes. For these diodes to be effective they must be placed close
to the TA3020. These diodes absorb any high frequency over/ under shoots caused by the output inductor L
during high output current conditions. An ultra fast
O
recovery diode that can sustain the entire VPP-VNN voltage should be used. In most applications a 150V or greater diode must be used.
DO Source to source and drain to drain diodes. A diode must be connected from the
source of the high side MOSFET to the source of the low side MOSFET. Also, a diode must be connected from the drain of the high side MOSFET to the drain of the low side MOSFET. These diodes absorb an
high frequency over/ under shoots
8 TA3020 – KL Rev. 3.0/09.03
Tripath Technology, Inc. - Technical Information
caused by the output inductor LO during high output current conditions. An ultra fast recovery diode that can sustain the entire VPP-VNN voltage should be used. In most applications a 150V or greater diode must be used.
RSN Output snubber resistor. This resistor forms a low pass filter with CSN with a
frequency of f
= 1/(2πRSNCSN). This RC filter removes any high frequency
C
overshoots that can be present on the switching output waveform. This RC filter must be connected directly across the drain and source of the low side output MOSFET.
CSN Output snubber capacitor. This capacitor forms a low pass filter with RSN with a
frequency of f
= 1/(2πRSNCSN). This RC filter removes any high frequency
C
overshoots that can be present on the switching output waveform. This RC filter must be connected directly across the drain and source of the low side output MOSFET.
DG Gate diode, placed in parallel to the gate resistor. This diode will help discharge the
parasitic capacitance at the MOSFET gates, thus decreasing the MOSFET fall time. This helps reduce shoot through current between the top side and bottom side output MOSFETs.
9 TA3020 – KL Rev. 3.0/09.03
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