STEREO 300W (4Ω) CLASS-T DIGITAL AUDIO AMPLIFIER DRIVER
TM
USING DIGITAL POWER PROCESSING (DPP
Technical Information Revision 3.0 – September 2003
GENERAL DESCRIPTION
The TA3020 is a two-channel, 300W (4Ω) per channel Amplifier Driver IC that uses Tripath’s proprietary Digital
Power Processing (DPP
power efficiency of Class-D amplifiers.
ESDHB ESD Susceptibility – Human Body Model (Note 3)
ESDMM ESD Susceptibility – Machine Model (Note 4)
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur.
Note 2: This is a target specification. Characterization is still needed to validate this temperature range.
Note 3: Human body model, 100pF discharged through a 1.5KΩ resistor.
Note 4: Machine model, 220pF – 240pF discharged through all pins.
Voltage at Input Pins (pins 12-16, 18, 19-26, 29-33, 37)
Storage Temperature Range -55º to 150º C
Operating Free-air Temperature Range (Note 2) -40º to 85º C
All pins
All pins
See the table below for Operating Conditions.
-0.3V to (V5+0.3V)
6
2000
200
V
V
V
Operating Conditions
(Note 5)
SYMBOL PARAMETER MIN. TYP. MAX. UNITS
VPP, VNN Supply Voltage +/- 15 +/-45 +/- 65 V
V5 Positive 5 V Bias Supply 4.5 5 5.5 V
VN10 Voltage for FET drive (Volts above VNN) 9 10 12 V
Note 5: Recommended Operating Conditions indicate conditions for which the device is functional.
See Electrical Characteristics for guaranteed specific performance limits.
2 TA3020 – KL Rev. 3.0/09.03
Tripath Technology, Inc. - Technical Information
Electrical Characteristics
TA = 25 °C. See Application/Test Circuit on page 7. Unless otherwise noted, the supply voltage is VPP=|VNN|=45V.
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNITS
I
q
I
MUTE
VIH High-level input voltage (MUTE) 3.5 V
VIL Low-level input voltage (MUTE) 1.0 V
VOH High-level output voltage (HMUTE) I
VOL Low-level output voltage (HMUTE) I
V
OFFSET
IOC Over Current Sense Voltage
I
VPPSENSE
V
VPPSENSE
I
VNNSENSE
V
VNNSENSE
Note 6: Minimum and maximum limits are guaranteed but may not be 100% tested.
Note 7: These supply voltages are calculated using the I
Characteristics table. The typical voltage values shown are calculated using a R
value of 422kohm without any tolerance variation. The minimum and maximum voltage limits shown include
either a +1% or –1% (+1% for Over-voltage turn on and Under-voltage turn off, -1% for Over-voltage turn off
and Under-voltage turn on) variation of R
values. These voltage specifications are examples to show both typical and worst case voltage ranges for a
given R
Application Information section for a more detailed description of how to calculate the over and under voltage
trip voltages for a given resistor value.
Note 8: The fact that the over-voltage turn on specifications exceed the absolute maximum of +/-70V for
the TA3020 does not imply that the part will work at these elevated supply voltages. It also does
not imply that the TA3020 is tested or guaranteed at these supply voltages. The supply voltages
are simply a calculation based on the process spread of the I
currents (see note 7). The supply voltage must be maintained below the absolute maximum of
+/-70V or permanent damage to the TA3020 may occur.
Quiescent Current
(No load, BBM0=1,BBM1=0,
Mute = 0V)
Mute Supply Current
(No load, Mute = 5V)
Output Offset Voltage No Load, MUTE = Logic low
Threshold
VPPSENSE Threshold Currents Over-voltage turn on (muted)
Threshold Voltages with
R
VPPSENSE
= 422KΩ
(Note 7,8)
VNNSENSE Threshold Currents Over-voltage turn on (muted)
Over-voltage turn off (mute off)
Under-voltage turn off (mute off)
Under-voltage turn on (muted)
Over-voltage turn on (muted)
Over-voltage turn off (mute off)
Under-voltage turn off (mute off)
Under-voltage turn on (muted)
Over-voltage turn off (mute off)
Under-voltage turn off (mute off)
Under-voltage turn on (muted)
Over-voltage turn on (muted)
Over-voltage turn off (mute off)
Under-voltage turn off (mute off)
Under-voltage turn on (muted)
138
62
57.6
25.9
152
65
-59.0
-25.2
162
154
79
72
68.4
65.0
33.3
30.4
174
169
86
77
-68.2
-66.2
-33.7
-30.2
178
87
75.8
37.1
191
95
-75.6
-37.6
A
µ
A
µ
A
µ
A
µ
V
V
V
V
A
µ
A
µ
A
µ
A
µ
V
V
V
V
and I
VNNSENSE
VNNSENSE
off the nominal 422kohm and 392kohm
VPPSENSE
VPPSENSE
or R
resistor values of 422kohm and 392kohm. Please refer to the
VPPSENSE
values shown in the Electrical
and I
VPPSENSE
VNNSENSE
and R
VNNSENSE
3 TA3020 – KL Rev. 3.0/09.03
Tripath Technology, Inc. - Technical Information
Performance Characteristics – Single Ended
TA = 25 °C. Unless otherwise noted, the supply voltage is VPP=|VNN|=45V, the input frequency is 1kHz and the
measurement bandwidth is 20kHz. See Application/Test Circuit.
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNITS
P
Output Power
OUT
(continuous RMS/Channel)
THD + N Total Harmonic Distortion Plus
Noise
IHF-IM IHF Intermodulation Distortion
SNR Signal-to-Noise Ratio
CS Channel Separation
η
Power Efficiency
AV Amplifier Gain
THD+N = 0.1%, R
R
THD+N = 1%, R
R
= 50W/Channel, RL = 8Ω
P
OUT
19kHz, 20kHz, 1:1 (IHF), R
= 30W/Channel
P
OUT
A Weighted, R
= 275W/Channel
P
OUT
0dBr = 30W, R
= 150W/Channel, RL = 8Ω
P
OUT
P
= 10W/Channel, RL = 4Ω
OUT
= 8Ω
L
= 4Ω
L
= 8Ω
L
= 4Ω
L
= 4Ω,
L
= 8Ω, f = 1kHz
L
See Application / Test Circuit
A
Channel to Channel Gain Error
VERROR
P
= 10W/Channel, RL = 4Ω
OUT
See Application / Test Circuit
e
Output Noise Voltage A Weighted, no signal, input shorted,
NOUT
= 8Ω
L
100
190
120
220
W
W
W
W
0.02 %
0.03 %
102 dB
97 dB
95 %
10.7 V/V
0.5 dB
260
V
µ
DC offset nulled to zero
TA3020 Pinout
VN10
LO2
LO2COM
HO2COM
HO2
OCS2LN
OCS2LP
OCS2HP
OCS2HN
VBOOT2
NC
OCR2
FBKOUT1
FBKGND1
HMUTE
FBKOUT2
DCOMP
FBKGND2
BIASCAP
INV2
OAOUT2
BBM0
BBM1
MUTE
48-pin Dip
(Top View)
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
48
LO1
47
LO1COM
46
HO1COM
45
HO1
44
OCS1HN
43
OCS1HP
42
OCS1LP
41
OCS1LN
40
VBOOT1
39
VNN
38
NC
37
OCR1
36
NC
35
V5
34
AGND
33
OCR1
32
REF
31
OCR2
30
VNNSENSE
29
VPPSENSE
28
AGND
27
V5
26
OAOUT1
25
INV1
4 TA3020 – KL Rev. 3.0/09.03
Tripath Technology, Inc. - Technical Information
Pin Description
Pin
1 VN10 “Floating” supply input for the FET drive circuitry. This voltage must be stable
2,48 LO2, LO1 Low side gate drive output (Channel 2 & 1)
3,47 LO2COM, LO1COM Kelvin connection to source of low-side transistor (Channel 2 & 1)
4,46 HO2COM, HO1COM Kelvin connection to source of high-side transistor (Channel 2 & 1)
5,45 HO2, HO1 High side gate drive output (Channel 2 & 1)
6, 7 OCS2LN, OCS2LP Over Current Sense inputs, Channel 2 low-side
8, 9 OCS2HP, OCS2HN Over Current Sense inputs, Channel 2 high-side
10, 40 VBOOT2, VBOOT1 Bootstrapped voltage to supply drive to gate of high-side FET
39 VNN Negative supply voltage.
41, 42 OCS1LN, OCS1LP Over Current Sense inputs, Channel 1 low-side
43, 44 OCS1HP, OCS1HN Over Current Sense inputs, Channel 1 high-side
11, 36,
38
Function
and referenced to VNN.
(Channel 2 & 1)
mute pin state, or a “fault” such as an overcurrent, undervoltage, or
overvoltage condition.
operation.
mode voltage for the input op amps. This pin is not capable of driving external
circuitry.
used. Please refer to the section, Mute Control, in the Application Information.
under voltage sensing for the VPP supply.
voltage sensing for the VNN supply.
NC Not connected (bonded) internally. To minimize coupling between pins, tie
these pins to AGND (pin34).
Description
5 TA3020 – KL Rev. 3.0/09.03
Application/Test Circuit
OAOUT1
C
I
3.3uF
+
V5 (Pin 27)
R
OFA
10K
Offset Trim
Circ uit
Ω
R
F
20K
Ω
R
I
49.9K
Ω
R
OFB
499K
Ω
A GND (Pin 28)
C
A
0.1uF
(Pin 28)
5V
(Pin 28)
R
REF
8.25K
1%
Ω,
INV 1
R
OFB
499K
C
OF
0.1uF
BIA SCAP
MUTE
REF1
Ω
Tripath Technology, Inc. - Technical Information
TA3020
OCS1HP
43
R
0.01
1W
DG MUR120
RG 5.6Ω, 1W
DG MUR120
RG 5.6Ω, 1W
0.01
R
OCR
20K
C
FB
A GND (Pin 28)
Ω,
Ω,
V5 (Pin 27)
Ω
*R
1.07K
Q
R
1W
R
FBA
1K
FBB
VN10
OCS1HN
44
40
VBOOT1
DS MUR120
45
HO1
HO1CO M
46
DS MUR120
48
LO1
47
LO1COM
42
OCS1LP
41
OCS1LN
37
OCR1
OCR1
33
220pF
FBKOUT1
13
14
FBKGND1
15
HMUTE
C
OCR
AGND
(Pin 28)
150pF
26
V5
25
-
+
AGND
Process ing
&
Modulation
2.5V
200K
19
Ω
V5
24
32
S
O
Q
O
S
Ω
Ω
C
S
0.1uF
DO MUR120
C
HBR
0.1uF
R
16Ω,
1W
D
MUR120
O
R
FBA
1K
Ω
*R
FBB
1.07K
Ω
SN
C
S
0.1uF
*R
13.3K
C
HBR
33uF
C
SN
220pF
FBC
D
MUR120
B
R
B
C
B
0.1uF
+
L
O
10uH
Ω
*R
FBC
13.3K
VN10
250
Ω
Ω
+
+
C
BAUX
47uF
C
O
0.22uF
+
C
S
330uF
C
S
330uF
VPP
VNN
R
Z
20
Ω,
C
Z
0.22uF
2W
R
4Ω or 8
L
Ω
(Pin 28)
C
I
3.3uF
+
V5 (Pin 27)
R
OFA
10K
Offset Trim
Circ uit
*R
VNN
*R
VPP
*R
V5
*R
V5
R
I
49.9K
Ω
A GND (Pin 28)
5V
VNN1
392KΩ, 1%
VPP1
422KΩ, 1%
VNN2
1.35M
VPP1
422K
20K
Ω
R
OFB
499K
Ω,
Ω
R
Ω
0.1uF
0.1uF
1%
, 1%
F
Ω
C
C
OAOUT2
INV 2
R
OFB
499K
C
OF
0.1uF
BBM0
BBM1
DCOMP
S
S
21
V5
20
-
+
AGND
Ω
Process ing
&
Modulation
22
23
17
27
V5
28
AGND
35
V5
34
AGND
30
VNNSENSE
29
V PPSENS E
11
NC
F. BEA D
* The values of thes e components must be
adjusted based on supply voltage range.
See Application Information.
Analog Ground
Pow e r Ground
VN10
VN10
VNN
NC
NC
OCS2HP
8
OCS2HN
9
10
VBOOT2
DS MUR120
5
HO2
4
HO2CO M
DS MUR120
2
LO2
LO2COM
3
OCS2LP
7
6
OCS2LN
12
OCR2
OCR2
31
220pF
16
FBKOUT2
18
FBKGND2
1
39
38
36
C
OCR
AGND
VNN
(Pin 28)
150pF
C
SW
0.1uF,35V
VNN
0.01
DG MUR120
RG 5.6Ω, 1W
DG MUR120
RG 5.6Ω, 1W
0.01
R
OCR
20K
Ω
C
FB
VN10
R
S
1W
Ω,
DO MUR120
Q
O
Q
O
D
O
R
S
1W
Ω,
V5 (Pin 27)
R
R
FBA
1K
Ω
1K
A GND (Pin 28)
C
0.1uF
C
HBR
0.1uF
MUR120
FBA
Ω
*R
FBB
1.07K
S
R
SN
16Ω,
1W
Ω
C
S
0.1uF
*R
13.3K
C
HBR
33uF
C
SN
220pF
FBC
VPP
+
C
Ω
+
C
BAUX
47uF
C
O
0.22uF
+
S
330uF
C
S
330uF
VNN
R
Z
20
Ω,
C
Z
0.22uF
2W
R
4Ω or 8
L
Ω
D
MUR120
B
VN10
R
250
B
C
B
0.1uF
+
L
O
10uH
Ω
*R
FBC
13.3K
Ω
6 TA3020 – KL Rev. 3.0/09.03
Tripath Technology, Inc. - Technical Information
External Components Description
Components Description
R
Inverting input resistance to provide AC gain in conjunction with RF. This input is
I
biased at the BIASCAP voltage (approximately 2.5VDC).
RF Feedback resistor to set AC gain in conjunction with RI. Please refer to the Amplifier
Gain paragraph, in the Application Information section.
CI AC input coupling capacitor which, in conjunction with RI, forms a highpass filter at
.
)CR2(1f
π=
IIC
R
FBA
R
Feedback divider resistor connected to AGND. This value of this resistor depends
FBB
Feedback divider resistor connected to V5. This resistor is normally set at 1kΩ.
on the supply voltage setting and helps set the TA3020 gain in conjunction with R
R
F, RFBA,
and R
. Please see the Modulator Feedback Design paragraphs in the
FBC
Application Information Section.
R
Feedback resistor connected from either the OUT1(OUT2) to FBKOUT1(FBKOUT2)
FBC
or speaker ground to FBKGND1(FBKGND2). The value of this resistor depends on
the supply voltage setting and helps set the TA3020 gain in conjunction with R
R
FBA,
, and R
. It should be noted that the resistor from OUT1(OUT2) to
FBB
FBKOUT1(FBKOUT2) must have a power rating of greater than
Please see the Modulator Feedback Design paragraphs in the Application
Information Section.
CFB Feedback delay capacitor that both lowers the idle switching frequency and filters
very high frequency noise from the feedback signal, which improves amplifier
performance. The value of C
so that the idle switching difference is greater than 40kHz. Please refer to the
Application / Test Circuit.
R
Potentiometer used to manually trim the DC offset on the output of the TA3020.
OFA
R
Resistor that limits the manual DC offset trim range and allows for more precise
OFB
adjustment.
R
Bias resistor. Locate close to pin 32 and ground at pin 28.
REF
CA BIASCAP decoupling capacitor. Should be located close to pin 19 and grounded at
pin 28.
DB Bootstrap diode. This diode charges up the bootstrap capacitors when the output is
low (at VNN) to drive the high side gate circuitry. A fast or ultra fast recovery diode
is recommended for the bootstrap circuitry. In addition, the bootstrap diode must be
able to sustain the entire VPP-VNN voltage. Thus, for most applications, a 150V (or
greater) diode should be used.
CB High frequency bootstrap capacitor, which filters the high side gate drive supply.
This capacitor must be located as close to pin 40 (VBOOT1) or pin10 (VBOOT2) for
reliable operation. The “negative” side of C
HO1COM (pin 46) or HO2COM (pin 4). Please refer to the Application / Test Circuit.
C
Bulk bootstrap capacitor that supplements CB during “clipping” events, which result
BAUX
in a reduction in the average switching frequency.
RB Bootstrap resistor that limits C
(bootstrap supply charging).
CSW VN10 generator filter capacitors. The high frequency capacitor (0.1uF) must be
located close to pin 1 (VN10) to maximize device performance.
CS Supply decoupling for the power supply pins. For optimum performance, these
components should be located close to the TA3020 and returned to their respective
ground as shown in the Application/Test Circuit.
R
Main overvoltage and undervoltage sense resistor for the negative supply (VNN).
VNN1
Please refer to the Electrical Characteristics Section for the trip points as well as the
hysteresis band. Also, please refer to the Over / Under-voltage Protection section in
the Application Information for a detailed discussion of the internal circuit operation
and external component selection.
R
Secondary overvoltage and undervoltage sense resistor for the negative supply
VNN2
(VNN). This resistor accounts for the internal V
resistor value should be three times that of R
(Refer to the Application/Test Circuit)
2
=
DISS
should be offset between channel 1 and channel 2
FB
should be connected directly to the
B
charging current during TA3020 power up
BAUX
NNSENSE
VNN1
bias of 1.25V. Nominal
. Please refer to the Over / Under-
I, RF,
FBC
I,
)(2RVPPP
.
7 TA3020 – KL Rev. 3.0/09.03
y
Tripath Technology, Inc. - Technical Information
voltage Protection section in the Application Information for a detailed discussion of
the internal circuit operation and external component selection.
R
Main overvoltage and undervoltage sense resistor for the positive supply (VPP).
VPP1
Please refer to the Electrical Characteristics Section for the trip points as well as the
hysteresis band. Also, please refer to the Over / Under-voltage Protection section in
the Application Information for a detailed discussion of the internal circuit operation
and external component selection.
R
Secondary overvoltage and undervoltage sense resistor for the positive supply
VPP2
(VPP). This resistor accounts for the internal V
resistor value should be equal to that of R
VPP1
PPSENSE
. Please refer to the Over / Under-
bias of 2.5V. Nominal
voltage Protection section in the Application Information for a detailed discussion of
the internal circuit operation and external component selection.
RS Over-current sense resistor. Please refer to the section, Setting the Over-current
Threshold, in the Application Information for a discussion of how to choose the value
of R
to obtain a specific current limit trip point.
S
R
Over-current “trim” resistor, which, in conjunction with RS, sets the current trip point.
OCR
Please refer to the section, Setting the Over-current Threshold, in the Application
Information for a discussion of how to calculate the value of R
C
Over-current filter capacitor, which filters the overcurrent signal at the OCR pins to
OCR
OCR
.
account for the half-wave rectified current sense circuit internal to the TA3020. A
typical value for this component is 220pF. In addition, this component should be
located near pin 31 or pin 33 as possible.
C
Supply decoupling for the high current Half-bridge supply pins. These components
HBR
must be located as close to the output MOSFETs as possible to minimize output
ringing which causes power supply overshoot. By reducing overshoot, these
capacitors maximize both the TA3020 and output MOSFET reliability. These
capacitors should have good high frequency performance including low ESR and
low ESL. In addition, the capacitor rating must be twice the maximum VPP voltage.
Panasonic EB capacitors are ideal for the bulk storage (nominally 33uF) due to their
high ripple current and high frequency design.
RG Gate resistor, which is used to control the MOSFET rise/ fall times. This resistor
serves to dampen the parasitics at the MOSFET gates, which, in turn, minimizes
ringing and output overshoots. The typical power rating is 1 watt.
CZ Zobel capacitor, which in conjunction with RZ, terminates the output filter at high
frequencies. Use a high quality film capacitor capable of sustaining the ripple current
caused by the switching outputs.
RZ Zobel resistor, which in conjunction with CZ, terminates the output filter at high
frequencies. The combination of R
and CZ minimizes peaking of the output filter
Z
under both no load conditions or with real world loads, including loudspeakers which
usually exhibit a rising impedance with increasing frequency. Depending on the
program material, the power rating of R
may need to be adjusted. The typical
Z
power rating is 2 watts.
LO Output inductor, which in conjunction with CO, demodulates (filters) the switching
waveform into an audio signal. Forms a second order filter with a cutoff frequency
of
C
O
Output capacitor, which, in conjunction with L
waveform into an audio signal. Forms a second order low-pass filter with a cutoff
π=
frequency of
and a quality factor of
)CL2(1f
OOC
and a quality factor of
π=
)CL2(1f
OOC
, demodulates (filters) the switching
O
.
CLCRQ =
OOOL
.
Use
CLCRQ =
OOOL
a high quality film capacitor capable of sustaining the ripple current caused by the
switching outputs.
DS Source to drain diodes. For these diodes to be effective they must be placed close
to the TA3020. These diodes absorb any high frequency over/ under shoots caused
by the output inductor L
during high output current conditions. An ultra fast
O
recovery diode that can sustain the entire VPP-VNN voltage should be used. In
most applications a 150V or greater diode must be used.
DO Source to source and drain to drain diodes. A diode must be connected from the
source of the high side MOSFET to the source of the low side MOSFET. Also, a
diode must be connected from the drain of the high side MOSFET to the drain of the
low side MOSFET. These diodes absorb an
high frequency over/ under shoots
8 TA3020 – KL Rev. 3.0/09.03
Tripath Technology, Inc. - Technical Information
caused by the output inductor LO during high output current conditions. An ultra fast
recovery diode that can sustain the entire VPP-VNN voltage should be used. In
most applications a 150V or greater diode must be used.
RSN Output snubber resistor. This resistor forms a low pass filter with CSN with a
frequency of f
= 1/(2πRSNCSN). This RC filter removes any high frequency
C
overshoots that can be present on the switching output waveform. This RC filter
must be connected directly across the drain and source of the low side output
MOSFET.
CSN Output snubber capacitor. This capacitor forms a low pass filter with RSN with a
frequency of f
= 1/(2πRSNCSN). This RC filter removes any high frequency
C
overshoots that can be present on the switching output waveform. This RC filter
must be connected directly across the drain and source of the low side output
MOSFET.
DG Gate diode, placed in parallel to the gate resistor. This diode will help discharge the
parasitic capacitance at the MOSFET gates, thus decreasing the MOSFET fall time.
This helps reduce shoot through current between the top side and bottom side
output MOSFETs.
9 TA3020 – KL Rev. 3.0/09.03
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