Sony RCDW-10 Service manual
RCD-W10
SERVICE MANUAL
Ver 1.1 2003. 12
Model Name Using Similar Mechanism NEW
CD Section
CD-R/CD-RW
Section
CD Mechanism Type CDM66C-30B61B
Base Unit Type BU-30BBD61B
Optical Pick-up Type A-MAX.3
Model Name Using Similar Mechanism NEW
CD Mechanism Type CDM65-RBD1
Base Unit Type RBD1
Optical Pick-up Type KRM-220CAA
US Model
Canadian Model
DECK A (the CD player section)
System Compact disc digital audio
Laser Semiconductor laser (λ =
Frequency response 20 Hz – 20,000 Hz (±0.5
DECK B (the CD-R and CD-RW
recording section)
System Compact disc digital audio
Laser Semiconductor laser (λ =
Playable discs CD, CD-R, CD-RW
Recordable discs CD-R, CD-RW (for music
Frequency response 20 Hz - 20,000 Hz (±0.5
system
780 nm)
Emission duration:
continuous
dB)
system
780 nm)
Emission duration:
continuous
use)
dB)
SPECIFICATIONS
Inputs
ANALOG IN
(Phono jacks) Impedance: 47 kilohms
DIGITAL OPTICAL IN
(Square optical connector jack)
Outputs
ANALOG OUT
(Phono jacks) Impedance: 47 kilohms
DIGITAL OPTICAL OUT
(Square optical connector jack)
PHONES
(Phono jack) Load impedance: 32 ohms
Rated input: 500 mVrms
Minimum input
250 mVrms
Optical wavelength:
660 nm
Rated output: 2 Vrms
Load impedance: over
10 kilohms
Wavelength: 660 nm
Output level: –18 dBm
Output level: 12mW
COMPACT DISC RECORDER
General
Power requirements
North American model: 120 V AC, 60 Hz
Power consumption 25 W
Dimensions (approx.) (w/h/d) incl. projecting parts
and control 430 × 108 × 399 mm
Mass (approx.) 6.0 kg
Supplied accessories
Design and specifications are subject to change
without notice.
3
/8 × 15 3/4 inch)
( 17 × 4
(13 lbs 4 oz)
• Audio connecting cords
Phono jack × 2 (red/white) ↔
Phono jack × 2 (red/white) (2)
• Remote commander (remote) (1)
• Size AA (R6) batteries (2)
9-874-152-02
2003L16-1
© 2003.12
Sony Corporation
Home Audio Company
Published by Sony Engineering Corporation
RCD-W10
Laser component in this product is capable
of emitting radiation exceeding the limit for
Class 1.
This appliance is classified as a CLASS 1 LASER product. The
CLASS 1 LASER PRODUCT MARKING is located on the rear
exterior.
The following caution label is located inside the apparatus.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of soldering iron around 270˚C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
SAFETY CHECK-OUT
After correcting the original service problem, perform the
following safety checks before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs, screws,
and all other exposed metal parts for A C leakage. Check leakage as
described below.
LEAKAGE
The A C leakage from any e xposed metal part to earth ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microamperes).
Leakage current can be measured by any one of three methods.
1. A commercial leakage tester, such as the Simpson 229 or RCA
WT -540A. Follo w the manufacturers’ instructions to use these
instruments.
2. A battery-operated AC milliammeter. The Data Precision 245
digital multimeter is suitable for this job.
3. Measuring the voltage drop across a resistor by means of a
VOM or battery-operated A C voltmeter . The “limit” indication
is 0.75 V, so analog meters must have an accurate low-volta ge
scale. The Simpson 250 and Sanwa SH-63Trd are e xamples of
a passive VOM that is suitable. Nearly all battery operated
digital multimeters that have a 2V AC range are suitable. (See
Fig. A)
To Exposed Metal
Parts on Set
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH
MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFÉS P AR UNE MARQUE 0 SUR LES
DIAGRAMMES SCHÉMA TIQUES ET LA LISTE DES PIÈCES SONT
CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE
REMPLACER CES COMPOSANTS QUE PAR DES PIÈSES SONY
DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU
DANS LES SUPPÉMENTS PUBLIÉS PAR SONY.
0.15 µF
Fig. A. Using an A C v oltmeter to check A C leakage.
MODEL IDENTIFICATION
— BACK PANEL —
PARTS No. MODEL
4-238-401-5π
4-238-401-6πUSCanadian
1.5 kΩ
Earth Ground
AC
Voltmeter
(0.75 V)
Parts No.
2
TABLE OF CONTENTS
RCD-W10
Unleaded solder
Boards requiring use of unleaded solder are printed with the leadfree mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40°C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350°C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow) than
ordinary solder so use caution not to let solder bridges occur such
as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
1. SERVICING NOTE·····················································4
2. GENERAL ···································································5
3. DISASSEMBLY··························································6
3-1. Case (409538) ······························································· 7
3-2. Loading Panel (1CD) ···················································· 7
3-3. Loading Panel (CDR) ··················································· 8
3-4. Front Panel Section······················································· 8
3-5. DISPLAY Board ··························································· 9
3-6. CDR Mechanism Deck (CDM65-RBD1)····················· 9
3-7. Tray············································································· 10
3-8. CDR Board ································································· 10
3-9. Holder (MG) Sub Assy, Dust Cover ··························· 11
3-10. Optical Pick-Up (KRM-220CAA)······························ 11
3-11. Motor Assy (Loading)(M201) ···································· 12
3-12. Cam (CH)···································································· 12
3-13. CD Mechanism Deck (CDM66C-30B61B)················ 13
3-14. Tray (66) ····································································· 14
3-15. BD Board ···································································· 15
3-16. Optical Block Section ················································· 15
3-17. MAIN Board ······························································· 16
4. TEST MODE ···································································· 18
5. ELECTRICAL ADJUSTMENTS ······························· 21
CD SECTION ............................................................. 21
CD-R/RW SECTION.................................................. 22
6. DIAGRAMS······································································ 53
6-1. Block Diagrams – CD-R Section – ··························· 54
– CD Section – ······························· 55
– POWER/DISPLAY Section –······ 56
6-2. Printed Wiring Board – BD Section – ························ 57
6-3. Schematic Diagram – BD Section – ··························· 58
6-4. Printed Wiring Board – CD-R Section (Side A) – ······ 59
6-5. Printed Wiring Board – CD-R Section (Side B) – ······ 60
6-6. Schematic Diagram – CD-R Section (1/4) – ·············· 61
6-7. Schematic Diagram – CD-R Section (2/4) – ·············· 62
6-8. Schematic Diagram – CD-R Section (3/4) – ·············· 63
6-9. Schematic Diagram – CD-R Section (4/4) – ·············· 64
6-10. Printed Wiring Board – MAIN Section (Side A) – ····· 65
6-11. Printed Wiring Board – MAIN Section (Side B) –····· 66
6-12. Schematic Diagram – MAIN Section (1/2) – ············· 67
6-13. Schematic Diagram – MAIN Section (2/2) – ············· 68
6-14. Printed Wiring Board – DISPLAY Section – ············· 69
6-15. Schematic Diagram – DISPLAY Section – ················ 70
6-16. IC Block Diagrams ····················································· 71
6-17. IC Pin Function Description ······································· 74
7. EXPLODED VIEWS ······················································ 84
7-1. Case Section··································································84
7-2. Front Panel Section ······················································· 85
7-3. Chassis Section ····························································· 86
7-4. CDR Mechanism Deck Section (CDM65-RBD1) ········ 87
7-5. CD Mechanism Deck Section (CDM66C-30B61B)····· 88
7-6. Base Unit Section (BU-30BBD61B) ···························· 89
8. ELECTRICAL PARTS LIST······································· 90
3
RCD-W10
SECTION 1
SERVICING NOTE
Self-diagnosis Function
When the self-diagnosis function is activated to
prevent the player from malfunctioning, three
character service numbers in a combination
with a message appears in the display. In this
case, check the following table.
Message
C12/
Cannot Copy
C13/
Rec Error
C14/
TOC Error
C41/
Cannot Copy
C71/
Din Unlock
Explanation
You are trying to record a disc that
cannot be played back in DECK-A
or with an external device, such as
CD-ROM or VIDEO CD.
• Remove the disc, and then insert a
music CD for playback.
Recording has not been completed
successfully because of vibration.
• Relocate the unit in a place free of
vibration and restart the recording
again.
The disc you try to record is
excessively dirty (such as oilstained or finger marked) or
scratched. Or the disc is not
normal.
• Replace the disc with another one
and restart the recording again.
The unit did not read the TOC
information.
• Insert other discs.
The sound source you are trying to
record is a copy of a commercial
music software. Or you are trying
to record on a CD-R/CD-RW
digitally.
• Because of the restriction of the
Serial Copy Management System,
you cannot record a copy of a
commercial music software.
Neither can you record a CD-R/
CD-RW digitally.
If this message is displayed
momentarily, this is not an error. It
is caused by the digital signal
during recording.
During recording of a digital sound
source, the connecting cable has
been disconnected or the player of
the sound source has turned off.
• Connect the cable or turn on the
digital player.
NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK
OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repain parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pickup block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
The emission check enables continuous checking of the S curve.
LASER DIODE AND FOCUS SEARCH OPERATION
CHECK
Carry out the “S curve check” in “CD section adjustment” and check
that the S curve waveform is output three times.
4
SECTION 2
GENERAL
RCD-W10
3
e;
wl
wgwh ws
1 POWER button
2 H button
3 OPEN/CLOSE A button
4 CD SYNCHRO NORMAL button
5 CD SYNCHRO HIGH button
41 2 5 978 q;
qh PLAY MODE button
qj TIME button
qk DISPLAY button
ql YES button
w; l AMS L knob
6
qgqhqjqkqlw;wd wawfwjwk
qf
qa
qs
qd
6 OPEN/CLOSE A button
7 H button
8 INPUT button
9 FINALIZE button
q; ERASE button
qa SBM button and indicator
qs REC z button
qd X button
qf REC LEVEL knob
qg x button
wa CLEAR button
ws MENU/NO button
wd l AMS L knob
wf CLEAR button
wg PLAY MODE button
wh TIME button
wj x button
wk PHONES jack
wl X button
e; PHONE LEVEL knob
5
RCD-W10
Note : Disassemble the unit in the order as shown below.
SECTION 3
DISASSEMBLY
SET
CASE (409538)
LOADING PANEL (1CD)
LOADING PANEL (CDR)
FRONT PANEL SECTION
CDR MECHANISM DECK (CDM65-RBD1)
TRAY
CDR BOARD
HOLDER (MG) SUB ASSY, DUST COVER
MOTOR ASSY (LOADING) (M201)
DISPLAY BOARD
OPTICAL PICK-UP (KRM-220CAA)
CAM (CH)
CD MECHANISM DECK (CDM66C-30B61B)
MAIN BOARD
TRAY (66)
BD BOARD
OPTICAL BLOCK
SECTION
6
Note : Follow the disassembly procedure in the numerical order given.
)
RCD-W10
3-1. Case (409538)
2
two
screws
(case 3 TP2 3 x 8)
4
case (409538)
3
two
screws
(case 3 TP2 3 x 8
1
two
screws
(case 3 TP2 3 x 8)
3-2. Loading Panel (1CD)
4
loading panel (1CD)
3
two hooks
4
2
CD mechanism deck (CDM66C-30B61B)
1
Rotate the hole to the direction of arrow.
front panel side
7
RCD-W10
)
3-3. Loading Panel (CDR)
5
l
oading panel (CDR)
3
two hooks
4
2
CD mechanism deck (CDM65-RBD1)
1
Slide the lever to the direction of arrow.
3-4. Front Panel Section
4
connector
(2 core) (CN920)
5
three
screws
(+BVTP 3
×
front panel side
lever
1
c
onnector
(2 core) (CN900
8)
2
connector
(3 core) (CN690)
3
flexible flat cable
(21core) (CN671)
6
four
screws
×
(+BVTP 3
8)
7
t
wo claws
8
front panel section
8
3-5. DISPLAY Board
)
2
two knobs (AMS)
7
c
law
9
CD-EJECT board
8
Remove the soldering.
HARNESS
PROCESSING
4
CD-SW board
POWER-SW board
5
three
screws
(+BVTP 2.6
RCD-W10
×
8)
3
four
screws
(+BVTP 2.6
×
8
1
knob (AMS)
3-6. CDR Mechanism Deck (CDM65-RBD1)
3
four
4
CDR mechanism deck
(CDM65-RBD1)
qa
6
twelve
(+BVTP 2.6
screws
screws (+BVTP 3
DISPLAY board
×
8)
×
8)
q;
flexible flat cable
(21core) (CN700)
2
flexible flat cable
(11core) (CN630)
1
connector
(4P) (CN631)
9
RCD-W10
3-7. T ray
2
Pull the tray while pressing the claw of
the chassis in the direction of the arrow.
1
Slide the lever (cam (CH)) to the direction of arrow.
claw
chassis
4
t
3-8. CDR Board
ray
lever (cam (CH))
3
Pull the tray while pressing the claw of the chassis and the claw
of the tray in the direction of the arrow.
claw
chassis
front panel side
tray
claw
2
bottom plate
9
CDR board
5
flexible flat cable
(11core) (CN103)
6
c
8
c
onnector
(2 core) (CN104)
law
1
four
screws
(+BVTP 2.6
3
flexible flat cable
(32core) (CN101)
4
(11core) (CN102)
7
c
×
flexible flat cable
law
8)
10
3-9. Holder (MG) Sub Assy, Dust Cover
r
)
3
holder (MG)
sub assy
1
two claws
4
three s
(+BVTP 2.6
crews
5
dust cove
RCD-W10
×
8)
3-10. Optical Pick-Up (KRM-220CAA)
2
1
two step screws
two screws
((2X9) (G with), +p tappin)
2
two claws
6
optical pick-up
(KRM-220CAA)
3
two insulators (main)
4
two insulators (main)
5
flexible flat cable
(32core) (from optical device
11
RCD-W10
3-11. Motor Assy (Loading)(M201)
2
Remove the belt (loading) from the
pulley of the motor assy.
3
t
wo claws
1
Slide the cam (CH) to the direction of arrow.
3-12. Cam (CH)
5
holder (BU) sub assy
1
1
4
m
otor assy
(loading) (M201)
1
2
q;
Slide the cam (CH) to the
direction of arrow
pressing the claw.
A
cam (CH)
A
while
claw
6
(+PTPWH 2.6
qs
cam (CH)
qa
screw
×
7
8)
g
ear (C)
9
g
ear (B)
12
1
4
1
3
8
claw
3-13. CD Mechanism Deck (CDM66C-30B61B)
3
three
screws (+BVTP 3
4
CD mechanism deck
(CDM66C-30B61B)
×
RCD-W10
8)
1
connector
(5P) (CN680)
2
flexible flat cable
(23core) (CN101)
13
RCD-W10
k
3-14. T ray (66)
3
hook
1
Turn the cam to the
direction of arrow.
8
2
tray (66)
7
hook
4
hook
14
5
6
hoo
3-15. BD Board
3
BD board
1
Remove soldering from the four points.
2
flexible flat cable
(16core)
RCD-W10
3-16. Optical Block Section
cam (66)
3
shaft (BU holder)
4
optical block section
1
floating screw
2
Rotate the cam (66) in the direction of 2 to move
the shaft (BU holder) upper.
15
RCD-W10
)
3-17. MAIN Board
6
(5core) (CN680)
5
flexible flat cable
(4core) (CN631)
4
connector
(2 core) (CN900)
1
flexible flat cable
(21core) (CN671)
qa
connector
two
screws (+BVTT 3
7
flexible flat cable
(23core) (CN660)
qs
four
screws (+BVTT 3
×
6)
×
6)
qf
power transformer
qd
Remove the soldering.
qg
MAIN board
9
bracket (TR)
8
s
crew (+BVTP 3
q;
three
×
8)
screws (+BVTP 3
×
8
2
c
onnector
(3 core) (CN690)
3
flexible flat cable
(11core) (CN630)
16
MEMO
RCD-W10
17
RCD-W10
SECTION 4
TEST MODE
Setting the Test Mode
Procedure:
1. Press the POWER button to POWER on.
2. Press the l AMS L (DECK A), [SBM] and l AMS
L (DECK B) buttons in order without releasing the button.
3. Turn the l AMS L (DECK B) knob to select the menu.
4. Press the l AMS L (DECK B) knob to e xecute the test
mode.
Releasing the Test Mode
Procedure 1:
1. Turn the l AMS L (DECK B) knob to select the Ship
Mode.
2. Press the l AMS L (DECK B) knob to execute the Ship
Mode.
3. Press the POWER button to POWER off.
Procedure 2:
1. Press the l AMS L (DECK A), [SBM] and l AMS
L (DECK B) buttons in order without releasing the button.
2. Press the POWER button to POWER off.
Contents of test mode
No. Display Function
1 SYS Version System version display
2 CDR Version CDR version display
3BU Test Deck A BU test mode
4 SERVICE Deck A Service mode
5 Ship Mode CD Shipment mode
6 FL ALL ON Fluorescent indicator tube test
7 FL ALL OFF Fluorescent indicator tube test
8 FL ITIMATSU Fluorescent indicator tube test
9 LED CHECK LED check
10 KEY CHECK Keyboard check
11 RM CHECK Remote commander check
12 CDR History CDR error history display
13 Play Speed Deck A x4 speed
System Version Display
Procedure:
1. Enter the test mode, then turn the l AMS L (DECK B)
knob to display “SYS Version”, and press the l AMS L
(DECK B) knob.
2. The system version is displayed.
3. To exit from this mode, turn the l AMS L (DECK B)
knob to display “Ship Mode”, and press the l AMS L
(DECK B) knob to execute the Ship Mode.
4. Press the POWER button to POWER off.
CDR Version Display
Procedure:
1. Enter the test mode, then turn the l AMS L (DECK B)
knob to display “CDR Version”, and press the l AMS L
(DECK B) knob.
2. The CDR version is displayed.
3. To exit from this mode, turn the l AMS L (DECK B)
knob to display “Ship Mode”, and press the l AMS L
(DECK B) knob to execute the Ship Mode.
4. Press the POWER button to POWER off.
BU Test Mode (Deck A)
Procedure:
1. Enter the test mode, then turn the l AMS L (DECK B)
knob to display “BU Test”, and press the l AMS L
(DECK B) knob.
2. “bdt S CURVE” is displayed. This test mode is used in the Electrical Adjustment section.
3. Turn the l AMS L (DECK B) knob. “bdt RAM READ”,
“bdt RAM WRITE”, “bdt COMOUT”, “bdt FB TUNE” and “bdt
ERR RATE” are displayed.
4. To exit from this mode, press the MENU/NO button and turn
the l AMS L (DECK B) knob to display “bdt ERR
RATE”.
5. Press the l AMS L (DECK A), [SBM] and l AMS
L (DECK B) buttons in order without releasing the button.
6. Press the POWER button to POWER off.
Service Mode (Deck A)
Procedure:
1. Enter the test mode, then turn the l AMS L (DECK B)
knob to display “SERVICE”, and press the l AMS L
(DECK B) knob.
2. “SERVICE MODE” is displayed.
3. Press the ERASE button, the “SLED OUT” is displayed and
the sled moves to the outermost position.
4. Press the FINALIZE button, the “SLED IN” is displayed and
the sled moves to the innermost position.
5. Press the l AMS L (DECK B) knob, then “SERVICE
MODE” is displayed again.
6. To exit from this mode, press the l AMS L (DECK A),
[SBM] and l AMS L (DECK B) buttons in order with-
out releasing the button.
7. Press the POWER button to POWER off.
Note: Always move the pick-up to the most inside position when
exiting from this mode.
Ship Mode
Procedure:
1. Enter the test mode, then turn the l AMS L (DECK B)
knob to display “Ship Mode”, and press the l AMS L
(DECK B) knob.
2. “Push POWER!” is displayed.
3. Press the POWER button to POWER off.
FL ALL ON Mode
Procedure:
1. Enter the test mode, then turn the l AMS L (DECK B)
knob to display “FL ALL ON”, and press the l AMS L
(DECK B) knob.
2. All segments of fluorescent indicator tube and LED turn on.
3. Press the MENU/NO button, then “FL ALL ON” is displayed
again.
4. To exit from this mode, turn the l AMS L (DECK B)
knob to display “Ship Mode”, and press the l AMS L
(DECK B) knob to execute the Ship Mode.
5. Press the POWER button to POWER off.
18
RCD-W10
FL ALL OFF Mode
Procedure:
1. Enter the test mode, then tur n the l AMS L (DECK B)
knob to display “FL ALL OFF”, and press the l AMS L
(DECK B) knob.
2. All segments of fluorescent indicator tube and LED turn off.
3. Pr ess the MENU/NO button, then “FL ALL OFF” is displayed
again.
4. To exit from this mode, turn the l AMS L (DECK B)
knob to display “Ship Mode”, and press the l AMS L
(DECK B) knob to execute the Ship Mode.
5. Press the POWER button to POWER off.
FL ITIMATSU Mode
Procedure:
1. Enter the test mode, then tur n the l AMS L (DECK B)
knob to display “FL ITIMATSU”, and press the l AMS
L (DECK B) knob.
2. Checkered patterns of segments are displayed.
3. Pr ess the MENU/NO button, then “FL ITIMA TSU” is displayed
again.
4. To exit from this mode, turn the l AMS L (DECK B)
knob to display “Ship Mode”, and press the l AMS L
(DECK B) knob to execute the Ship Mode.
5. Press the POWER button to POWER off.
LED Check Mode
Procedure:
1. Enter the test mode, then tur n the l AMS L (DECK B)
knob to display “LED CHECK”, and press the l AMS L
(DECK B) knob.
2. T urn the l AMS L (DECK A) or (DECK B) knob clock-
wise.
3. Pr ess the MENU/NO button, then “LED CHECK” is displayed
again.
4. To exit from this mode, turn the l AMS L (DECK B)
knob to display “Ship Mode”, and press the l AMS L
(DECK B) knob to execute the Ship Mode.
5. Press the POWER button to POWER off.
CDR History Display
Procedure:
1. Enter the test mode, then turn the l AMS L (DECK B)
knob to display “CDR History”, and press the l AMS L
(DECK B) knob.
2. “00 ######## ########” is displayed as the first error hitory.
3. Turn the l AMS L (DECK B) knob to select the error
history. The number of error histories is ten in all.
(Refer to “Contents of CDR error history”.)
4. Press the MENU/NO b utton, then “CDR Histor y” is displayed
again.
5. To exit from this mode, turn the l AMS L (DECK B)
knob to display “Ship Mode”, and press the l AMS L
(DECK B) knob to execute the Ship Mode.
6. Press the POWER button to POWER off.
Play Speed Selection Mode (Deck A)
Procedure:
1. Enter the test mode, then turn the l AMS L (DECK B)
knob to display “Play Speed”, and press the l AMS L
(DECK B) knob.
2. “x4 Play” is displayed. If a CD is in the deck A, pressing the
H button executes the 4 times speed playback.
3. Press the x button to stop the playback.
4. Press the MENU/NO button, then “Play Speed” is displayed
again.
5. To exit from this mode, turn the l AMS L (DECK B)
knob to display “Ship Mode”, and press the l AMS L
(DECK B) knob to execute the Ship Mode.
6. Press the POWER button to POWER off.
Contents of CDR error history
display(example)
1 2
3 4
00 05070D80
KEY Check Mode
Procedure:
1. Enter the test mode, then tur n the l AMS L (DECK B)
knob to display “KEY CHECK”, and press the l AMS L
(DECK B) knob.
2. “Got l keys” is displayed.
3. Pr ess the b uttons, and when all the buttons are pressed (without
the POWER button), “Got 27 keys” will be displayed.
4. To exit from this mode, press the l AMS L (DECK A),
[SBM] and l AMS L (DECK B) buttons in order with-
out releasing the button.
5. Press the POWER button to POWER off.
Remote Commander Check
Procedure:
1. Enter the test mode, then tur n the l AMS L (DECK B)
knob to display “RM CHECK”, and press the l AMS L
(DECK B) knob.
2. Press the H key on the remote commander, then “Got
PlayCom” is displayed.
Press the MENU/NO button, then “RM CHECK” is displayed again.
3.
4. To exit from this mode, turn the l AMS L (DECK B)
knob to display “Ship Mode”, and press the l AMS L
(DECK B) knob to execute the Ship Mode.
5. Press the POWER button to POWER off.
000E2E0D
5 6
(hexadecimal)
1 Order of the error history
00 to 09: ten error histories in all
2 Error contents
01: unable to focus on
02: Q code/ATIP discontinuous (several frames preceding)
03: Q code/ATIP unreadable
04: search taking more than sixteen seconds
05: focus failure
06: sled over run
07: not passing by start time to write
08: audio buffer over
09: sync failure
OA: Spindle lock taking more than 8 secouds
example : 05 is focus failure
19
RCD-W10
3 Operation mode
bit 7: Speed
0: normal speed
1: x4 speed
bit 6 to bit 0: Number of inner condition
01: POWER off condition/during shift to POWER on
02: POWER off and shipment setting/during shift to POWER
off and shipment setting
03: stop condition/during stop
04: during start up of servo
05: during TOC reading and others
06: during CD TEXT reading
07: during standby(waiting for command from the CD sys-
tem)/during search
08: during playback
09: during manual search(playback)
0A:during pause
0B:during manual search(pause)
0C:during OPC
0D:recording standby/during recording pause
(enable to shift to recording)
0E: during recording
0F: unable to record (waiting for shift to being recordable)
10: PMA updating
11: during operation of unfinalize
12: during operation of finalize
13: PMA erasing
14: emergency
15: recording preparation
16: recording end
5 Write POWER (integer of mW x 10, av ailab le during write
processing)
examples: 00 means unavailable
(when 3 operation mode is not recording)
: A3 means 163(decimal), i.e. 16.3 mW
6 ATIME (min)/(sec)/(frame)
example: 0E, 2E, 0D means 14 : 46 : 13
Abbreviations:
ATIP : Absolute Time In Pre-groove
OPC : Optimum POWER Control
PMA : Program Memory Area
examples :
bit
HEX
77654 321
0000 0111
07
00
1001 0001
91
11 1
4 Start time of read in(compression method)
bit 15 to bit 13 : (min)
0: 97 min
1: 96 min
2: 95 min
7: others
bit 12 to bit 7: (sec)
bit 6 to bit 0: (frame)
examples :
HEX
bit
0 Operation mode
normal speed, during
standby(waiting for
command from the CD
system)/during search
during operation of
0000 1101 1000 0000
0D,80
97(min) 27(sec)
x4 speed,
unfinalize
7
654 321
0(frame)
015 14 13 12 11 10 9 8 Start time of read in
97 : 27 : 00
11,16
20
0001 0001 0001 0110
34(sec)97(min) 22(frame)
97 : 34 : 22
SECTION 5
0V
Center of
waveform
B
Symmetry
A (DC voltage)
level=1.1 ±0.6Vp-p
e
p
e
ELECTRICAL ADJUSTMENTS
RCD-W10
CD SECTION (DECK A)
Note :
1. CD Block is basically designed to operate without adjustment.
Therefore, check each item in order given.
2. Use YEDS-18 disc (3-702-101-01) unless otherwise indicated.
3. Use an oscilloscope with more than 10MΩ impedance.
4. Clean the object lens by an applicator with neutral detergent
when the signal level is low than specified value with the
following checks.
S Curve Check
Connection :
oscilloscop
(DC range)
BD board
TP (FE)
TP (DVC)
Procedure :
1. Connect an oscilloscope to test point TP (FE) and TP (DVC) on
the BD board.
2. Turn the power on.
3. Load the disc (YEDS-18).
4. Enter the test mode, select the BU Test asd press the l
AMS L (DECK B) knolo to display “bdt S CURVED”.
5. Press the l AMS L (DECK B) knob. “LD AL” is
displayed and playback starts automatically.
6. Check the oscilloscope waveform (S-curve) is symmetrical
between A and B. And confirm peak to peak level within 3.6 ±
0.5 Vp-p.
7. Press the MENU/NO button to stop playback.
8. Exit fromthe test mode.
(Refer to the TEST MODE Section)
+
–
Note: A clear RF signal waveform means that the shape “◊” can be
clearly distinguished at the center of the waveform.
VOLT/DIV : 200mV
TIME/DIV : 500ns
level : 1.1 ± 0.3Vp-p
E-F Balance (1 Track jump) Check
Connection :
oscilloscope
(DC range)
BD board
TP (TE)
TP (DVC)
+
–
Procedure:
1. Connect an oscilloscope to TP (TE) and TP (DVC).
2. Turn the power on.
3. Load the disc (YEDS-18) and playback the number five track.
4. Press the CD X (DECK A) button.
(Becomes the 1 track jump mode.)
5. Confirm the level B and A (DC voltage) on the oscilloscope
waveform.
symmetry
A
within 3.6
B
Note: Try to measure several times to make sure than the ratio of A
: B or B : A is more than 10 : 7.
RF Level Check
Connection :
oscilloscop
(AC range)
BD board
TP (RFAC)
TP (DVC)
+
–
Procedure :
1. Connect an oscilloscope to TP (RFAC) and TP (DVC).
2. Turn the power on.
3. Load the disc (YEDS-18) and playback the number five track.
4. Confirm that oscilloscope waveform is clear and check RF signal
level is correct or not.
±
0.5 Vp-
Specification level: x 100=less than ±22%
A
B
[BD BOARD] — SIDE A —
TP (DVC)
TP (TE)
TP (FE)
IC104
IC101
IC103
TP (RFAC)
21
RCD-W10
CD-R/RW SECTION
*The following is the method of locating the faulty point and
electrical adjustment.
1. Connection and Setting of Programs
PC
3
(w/ SerialI/F)
1-1. Connection
5
Oscilloscope
(A)
MPXOUT
To
RCD-W10
(B) (C) (D)
0-756-358-11
CDM65-RBD1 SERVICE
RESET
Jig
CONTROL FIRM
(B) (C) (D)
COM1
8
RS-232C
Jig
2
9
Cables for Jig connecting
Cable
6
Laser Power
Meter
7
Test Disc
CDM65-RBD1
jig
1
CDM65-RBD1
22
4 Fig. Position of Jig (Set the jig after removing the cover of CDM65-RBD1)
1-2. Equipments to prepare
RCD-W10
Ver 1.1 2003.12
1 Test Object Both RBD1 and CDM65-RBD1 shall be tested.
RBD1 : Flash Memory Writing of of
Circuit Test by Self-diagnostics
CDM65-RBD1 : Electrical Adjustment
Performance Test
2 Jig (With 9 Cables, Parts No.J-2501-223-A)
3 PC Windows95/98/2000/Me with COMport (RS-232C)
4 Programs TeraTerm Pro + Service macro
5 Oscilloscope More than 150MHz
6 Laser Power Meter LEADER LPM-8001 (Parts No.J-2501-046-A)
7 Test Disc
PATD-012 : (Parts No.4-225-203-1) Adjustment for Playback (CD,CD-R)
TCD-W091W : (Parts No.J-2501-226-A) Adjustment for Playback (CD-RW)
CRM74 (Blank CD-R) : Adjustment and Check for Recording (CD-R)
CWM74 (Blank CD-RW) : Check for Recording (CD-RW)
TCD-W032W : (Parts No.J-2501-227-A) Defocus tolerance (CD-RW)
8 RS-232C Cable
L=2000mm
(E)
D-sub 9pin Female cross cable
54321
9876
1
2
3
4
5
6
7
8
9
54321
9876
1
2
3
4
5
6
7
8
9
9 Cables for Jig connecting
:mandatory
: not use
L=300mm
(A)
PH 5p
(B)
PH 4p
(C)
FFC 11p 1.0mm pitch (J-2501-200-A)
(D)
FFC 5p 1.0mm pitch (J-2501-212-A)
23
RCD-W10
1-3. Setting of Programs (Tera Term Pro and Service macro)
* Confirmation of System (Windows 98 is used in this explanation) Preparation for Terminal software
1) Set up the serial port from OS.
a) Select Start → Settings → Control P anel and select System →
Device manager → Communication Port (COMn)
(see Fig. 1-1)
* Specify the COM port that connected with JIG of CDM65.
b) Double click COMn (as you connect to the Jig-CDM65)
Set the parameters as below.
Bits per second : 38400
Data bits : 8
Parity : non
Stop bits : 1
Flow control : hardware
(see Fig.1-2)
4 Fig. 1-1
24
4 Fig. 1-2
c) Press “Advanced...” button (see Fig.1-2)
Remove the check “Use FIFO buffers ...”
(see Fig.1-3)
4 Fig. 1-3
2) Unzip the file “ttermp23.zip” by PC.
(The file “ttermp23.zip” is distributed together with the service manual.)
3) After unzip the files, you can find setup.exe.
Double click the setup.exe.
Please install as the installer is.
Do not change the directory that files are installed. (use default)
4) Unzip the file “files-0208.zip” by PC.
Copy all “ttl” file and “FUNC” folder which are contained in “files-0208” and paste them in the “Ttermpro” file as below.
(The file “files-0208.zip” is distributed together with the service manual.)
Ttermpro
01ldp_S.ttl
...
RCD-W10
Ver 1.1 2003.12
10vwdcC_S.ttl
FUNC
AMS.ttl
...
VERCHK.ttl
4 Fig. 1-4
Note : Do not change the directory path.
5) Start-up the TeraTermPro
Double click the ttermpro.exe.
6) Set up the TeraTermPro (IMPORTANT!!)
a) Select Setup → Serial Port... and set the parameters as below.
Port : (As you connect to the Jig-CDM65)
Baud rate : 38400
Data : 8 bit
Parity : none
Stop : 1 bit
Flow control : hardware
Transmit delay : 0 msec/char 10 msec/line
After settings, press “OK” button. (see Fig.1-5)
4 Fig. 1-5
25
RCD-W10
b) Terminal setup
Set the parameters as below.
New-line receive : CR
transmit : CR
After settings, press “OK” button. (see Fig.1-6)
c) General setup
Select the language and press “OK” button. (see Fig.1-7)
4 Fig. 1-6
4 Fig. 1-7
d) Saving the setup
Select Setup → Save setup... and save as teraterm.ini in the
Ttermpro directory. (see Fig.1-8)
7) Connect the JIG and CDM65.
8) Confirm the S510 on JIG is ‘CONTROL’.
9) Power on the CDM65 and press SW101(RESET) on JIG.
“CDM65-RBD1 has connected with this PC (^^)” is displayed.
(see Fig.1-9)
If above message is not displayed, you may hav e some mistakes.
Please confirm previous setting procedures again.
4 Fig. 1-8
4 Fig. 1-9
26
2.
Repair Works That Require Electrical Adjustment
In the case of repair works as shown below, electrical adjustment is required.
Locating the faulty point
RCD-W10
KRM-220CAA
is replaced.
No
RBD1
is replaced.
No
The parts shown
in the List (1)
is replaced.
No
Electrical adjustment
is not required.
Yes
Yes
Yes
Electrical adjustment
List (1) : IC101, IC103, IC171, IC201, IC502
27
RCD-W10
3. Locating the Faulty Point
3-1. Laser Power Check
1) Select the menu as follows. Control → Macro, and select
LDPtestL_S.ttl.
Press “Open”. (Fig. 3-1, 3-2)
4 Fig. 3-1
4 Fig. 3-2
2) Press the “RESET” button (SW101) of the jig as prompted by the display.
3) Place probe of a laser power meter in the specified position
following the display as shown in Fig. 3-3. (See Fig. 3-3-a)
4 Fig. 3-3
sensor probe
CDM65-RBD1
jig
optical pick-up
4 Fig. 3-3-a
Note : Do not add stress to an optical pick-up.
28
4) When the display shown in Fig. 3-4 appears, set the Range of a
laser power meter to “1 mW” and press “OK”.
5) Check that the laser power meter reading satisfies the following
requirement. When the laser power satisfies the required
specification, press “OK”. (Fig. 3-5)
LEADER LPM-8001 : 0.76 to 0.86 mW
RCD-W10
4 Fig. 3-4
6) When the display shown in Fig. 3-6 appears, set the Range of a
laser power meter to “10 mW” and press “OK”.
7) Check that the laser power meter reading satisfies the following
requirement. When the laser power satisfies the required
specification, press “OK”. (Fig. 3-7)
LEADER LPM-8001 : 4.5 to 4.7 mW
4 Fig. 3-5
4 Fig. 3-6
4 Fig. 3-7
8) Check that the laser power meter reading satisfies the following
requirement. When the laser power satisfies the required
specification, press “OK”. (Fig. 3-8)
LEADER LPM-8001 : 9.2 to 9.6 mW
4 Fig. 3-8
29
RCD-W10
9) Check that the message “Power Check End” appears on display .
(Fig. 3-9)
If the measurement result is outside the specification value,
either perform Section 4. CDM65-RBD1 Electrical Adjustment,
or locate the cause of the error by performing the Laser
Deterioration Judgment.
3-2. Laser Deterioration Judgment
1) Select the menu as follows. Control → Macro, and select
10vwdcC_S.ttl.
Press “Open”. (Fig. 3-10, 3-11)
4 Fig. 3-9
4 Fig. 3-10
4 Fig. 3-11
2) Press the “RESET” button (SW101) of the jig as prompted by the display.
3) When the message [OK] appears as shown in Fig. 3-12, press
the “OK” button.
When the laser unit KRM-220CAA (Op) is normal without
deterioration of laser, the message [OK] appears. If the laser
unit is deteriorated, the message [NG] appears. Then, replace
the laser unit KRM-220CAA (Op).
4 Fig. 3-12
30
Loading...