Sony MZE-77 Service manual

MZ-E77

SERVICE MANUAL

Ver 1.0 2000. 03

Photo: Silver type

US and foreign patents licensed from Dolby
Laboratories Licensing Corporation.

SPECIFICATIONS

E Model

Tourist Model

Model Name Using Similar Mechanism MZ-E90
MD Mechanism Type MT-MZE90-166
Optical Pick-up Mechanism Type LCX-2E

System

Audio playing system

MiniDisc digital audio system

Laser diode properties

Material: GaAlAs
Wavelength: λ = 790 nm
Emission duration: continuous
Laser output: less than 44.6 µW*
* This output is the value measured at a distance

of 200 mm from the objective lens surface on
the optical pick-up block with 7 mm aperture.

Revolutions

600 rpm to 2250 rpm

Error correction

Advanced Cross Interleave Reed Solomon Code
(ACIRC)

Sampling frequency

44.1 kHz

Coding

Adaptive TRansform Acoustic Coding (ATRAC)

Modulation system

EFM (Eight to Fourteen Modulation)

Number of channels

2 stereo channels
1 monaural channel

Frequency response

20 to 20,000 Hz ± 3 dB

Wow and Flutter

Below measurable limit

Outputs

Headphones: stereo mini-jack, maximum output
level 5 mW + 5 mW, load impedance 16 ohms

General

Power requirements

Nickel metal hydride rechargeable battery
NH-14WM (supplied)
One LR6 (size AA) battery (not supplied)
Sony AC Power Adaptor AC-E15L* (not
supplied) connected to the DC IN 1.5V jack

Battery operation time

Battery life*

Batteries

Ni-MH
rechargeable battery
(NH-14WM)

One LR6 (size AA)
alkaline battery

One LR6 (size AA)
alkaline battery
and a Ni-MH
rechargeable
battery
(NH-14WM)

* The battery life may be shorter depending on

operating conditions and the temperature of
the location.

** With a fully charged battery

Playback

Approx. 21 hours**

Approx. 31 hours

Approx. 56 hours**

Dimensions

Approx. 78.3 × 13.9 × 71.4 mm (w/h/d)

1

(3

/8 × 9/16 × 2

parts and controls

Mass

Approx. 85 g (3.0 oz.) the player only
Approx. 128 g (4.5 oz.) incl. a premastered MD
and a nickel metal hydride rechargeable battery
NH-14WM

Supplied accessories

Battery Charger (1)
Rechargeable battery (1)
Rechargeable battery carrying case (1)
Headphones with a remote control (1)
Dry battery case (1)
Carrying pouch (1)

Design and specifications are subject to change

without notice.

7

/8 in.) not including projecting

PORTABLE MINIDISC PLAYER

TABLE OF CONTENTS

p

1. SERVICING NOTES............................................... 3

2. GENERAL ................................................................... 4

3. DISASSEMBLY ......................................................... 5

4. TEST MODE.............................................................. 9

5. ELECTRICAL ADJUSTMENTS......................... 14

6. DIAGRAMS

6-1. Block Diagram –RF Section– ......................................... 19

6-2. Block Diagram –SERVO Section – ................................ 21

6-3. Block Diagram –MAIN Section – .................................. 23

6-4. Printed Wiring Board

–MAIN Board (Component Side) – ............................... 25

6-5. Printed Wiring Board

–MAIN Board (Conductor Side) – ................................. 27

6-6. Schematic Diagram –MAIN Board (1/4) – .................... 29

6-7. Schematic Diagram –MAIN Board (2/4) – .................... 31

6-8. Schematic Diagram –MAIN Board (3/4) – .................... 33

6-9. Schematic Diagram –MAIN Board (4/4) – .................... 35

6-10. Printed Wiring Board –SYSTEM Board – ..................... 37

6-11. Schematic Diagram –SYSTEM Board – ........................ 39

6-12. Printed Wiring Board –SW Board – ............................... 41

6-13. Schematic Diagram –SW Board – .................................. 43

6-14. IC Pin Function Description ........................................... 49

Features

• Small body almost the size of a MiniDisc
jacket

Ideal weight and size; fits in your shirt
pocket.

• Personalized sound through Digital

Sound Preset functions

You can store two sets of sound quality
adjustments (made during playback) to
two switches.

• Low power-consumption design enables
extended battery life.

• Simple “One-Touch Eject” function for
easy MiniDisc handling

A single press of the OPEN button causes
the player lid to open and the MiniDisc to
eject.

• Easy-to-operate headphones remote
control with backlit LCD

The LCD displays disc and track
information, playback mode as well as
battery condition. Keep the main unit in
your pocket and operate the MiniDisc
player through the “slim stick” remote
control.

• Shock-resistant memory offsets up to 40
seconds of o

tical read errors.

7. EXPLODED VIEWS................................................ 56

8. ELECTRICAL PARTS LIST ............................... 58

SAFETY-RELATED COMPONENT WARNING!!

COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED
LINE WITH MARK 0 ON THE SCHEMATIC DIA GRAMS
AND IN THE PARTS LIST ARE CRITICAL TO SAFE
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANU AL OR IN SUPPLEMENTS PUB­LISHED BY SONY.

– 2 –

SECTION 1

SW board (S809)

SERVICING NOTES

NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT

The laser diode in the optical pick-up block may suffer electro­static break-down because of the potential difference generated
by the charged electrostatic load, etc. on clothing and the human
body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.

NOTES ON LASER DIODE EMISSION CHECK

Never look into the laser diode emission from right above when
checking it for adjustment. It is feared that you will lose your sight.

NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK
(LCX-2E)

The laser diode in the optical pick-up block may suffer electro­static break-down easily. When handling it, perform soldering
bridge to the laser-tap on the flexible board. Also perform mea­sures against electrostatic break-down sufficiently before the op­eration. The flexible board is easily damaged and should be handled
with care.

• When repairing this set with the power on, if you remove the
upper panel assy, this set stops working.
In this case, you can work without the set stopping by fastening
the hook of the open/close detect switch (SW board (S809))
with tape.

• This set is designed to perform automatic adjustment for each
adjustment and write its value to EEPROM. Therefore, when
EEPROM (IC802) has been replaced in service, be sure to per­form automatic adjustment and write resultant values to the new
EEPROM.
After EEPROM (IC802) is replaced, digital sound preset set­ting value for display is changed to “00”. Please make sure to
check that digital sound preset setting value for display is “01”.
(Refer to page 14)

laser-tap

OPTICAL PICK-UP FLEXIBLE BOARD

CAUTION

Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous ra­diation exposure.

Flexible Circuit Board Repairing

• Keep the temperature of the soldering iron around 270 ˚C dur­ing repairing.

• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).

• Be careful not to apply force on the conductor when soldering
or unsoldering.

Notes on chip component replacement

• Never reuse a disconnected chip component.

• Notice that the minus side of a tantalum capacitor may be dam­aged by heat.

• Replacement of CXD2661GA-2 (IC601) and CXR701080­010GA (IC801) used in this set requires a special tool. There­fore, they cannot be replaced.

– 3 –

LOCATION OF CONTROLS

8

7

SECTION 2

GENERAL

9

6

5

4

1 OPR indicator
2 HOLD switch
3 >/B and . keys
4 x key
5 DIGITAL SOUND PRESET switch
6 AVLS switch

Remote commander with headphones

3

2

5

1

6

qa

7 Battery cover
8 VOLUME +/– keys
9 External battery terminal
0 OPEN button
qa i (headphone) jack

7

8

0

4

3

1 Headphone
2 B > and . keys
3 VOL +/– keys
4 Display window
5 DISPLAY key
6 PLAYMODE key
7 X key
8 HOLD switch
9 x key

– 4 –

9

21

SECTION 3

3 two screws

(MI1.4)

3 two screws

(MI1.4)

4 lid assy, upper

2

1

y

DISASSEMBLY

Note: This set can be disassemble according to the following sequence.

Set

LID ASSY, UPPER

Lid Assy, Upper

strip,
ornamental

Holder Assy

“Chassis Assy, set”, “Case, Battery”,
MAIN board, SW board

Mechanism Deck
(MT-MZE90-166)

Service Assy, OP
(LCX-2E)

Panel Assy Bottom

HOLDER ASSY

3 holder ass

2 shaft

1 shaft

– 5 –

MECHANISM DECK
(MT-MZE90-166)

2 screw (MD)

1 seal (moire)

3 claw

8 flexible board (CN551)

PANEL ASSY, BOTTOM

Note: When installing, fit three knobs.

4

6

9 mechanism deck

(MT-MZE90-166)

5 claw

5 claw

7 flexible board (CN501)

knob

1

2 screw

(M1.4)

2 two screws

(MI1.4)

2 two screws

(MI1.4)

3 panel assy, bottom

– 6 –

STRIP, ORNAMENTAL

7

strip, ornamental

2 lid, battery case

1 claw

6

5 claw

4 claw

3 claw

9 button (open)

“CHASSIS ASSY, SET”, “CASE, BATTERY”,
MAIN BOARD, SW BOARD

6 case, battery

5 SW board

flexible board

3 Remove the solder

of terminal board (minus).

8 terminal

board (minus)

8 strip, ornamental

9 chassis assy, set

3 Remove the solder

of terminal (plus) assy,
battery.

8 terminal (plus)

assy, battery

7 screw

(MI1.4)

4 MAIN board

2 flexible board

(CN802)

1 four screws

(M1.4)

– 7 –

SERVICE ASSY, OP
(LCX-2E)

5 service assy, OP

(LCX-2E)

4 screw

(M1.4)

3 screw

(M1.4)

1 washer

2 gear (SA)

– 8 –

SECTION 4

TEST MODE

Outline

• This set provides the Overall adjustment mode that allows CD
and MO discs to be automatically adjusted when in the test mode.
In this overall adjustment mode, the disc is discriminate between
CD and MO, and each adjustment is automatically executed in
order. If a fault is found , the system displays its location. Also,
the manual mode allows each individual adjustment to be auto­matically adjusted.

• Operation in the test mode is performed with the remote com­mander. A key having no particular description in the te xt, indi­cates a remote commander key.

Setting Method of Test Mode

There are two different methods to set the test mode:
1 Short BP801 (TEST) on the SYSTEM board with a solder

bridge (connect pin y; of IC801 to the ground). Then, turn on
the power.

– SYSTEM BOARD (Component Side) –

BP801
(TEST)

Operation in Setting the Test Mode

• When the test mode becomes active, first the display check mode
is selected. (Press the x key once, when the display check mode
is not active)

• Other mode can be selected from the display check mode.

• When the test mode is set, the LCD repeats the following dis­play.

LCD display

All lit

All off

Microprocessor
version
display

• When the X key is pressed and hold down, the display at that
time is held so that display can be checked.

888

004 V1.600

F1SHUF

REC

u

Releasing the Test Mode

For test mode set with the method 1:
Turn off the power and open the solder bridge on BP801 (TEST)
on the SYSTEM board.

Note: Remove the solders completely. Remaining could be shorted with

the chassis, etc.

For test mode set with the method 2:
Turn off the power.

Note: If electrical adjustment (see page 14) has not been finished com-

pletely, always start in the test mode. (The set cannot start in nor­mal mode)

2 In the normal mode, turn on the HOLD switch on the set. While

pressing the x key on the set, press the following remote
commander keys in the following order:

N > t N > t . t . t N > t
. t N > t . t X t X

– 9 –

Configuration of Test Mode

[Test Mode $Display Check Mode%]

Press the [VOL +] key

[Manual Mode]

Press the x key

[Servo Mode]

[Audio Mode]
[Power Mode]

[OP Alignment Mode]

Press the . or [VOL --] key

[Overall Adjustment Mode]

Press the x key

press the [DISPLAY] key

[Self-Diagnosis Display Mode]

Press the x key

Press the

for several seconds (about 3 seconds).

[DISPLAY] key

[Key Check Mode]

Quit the key check or open the upper panel

Manual Mode

Mode to adjust or check the operation of the set by function.
Normally, the adjustment in this mode is not executed.
However, the Manual mode is used to clear the memory before
performing automatic adjustments in the Overall Adjustment mode.

• Transition method in Manual Mode

1. Setting the test mode. (See page 9)

2. Press the [VOL +] key activates the manual mode where the
LCD display as shown below.

LCD display

[Major item switching]

N

key

x

>

key

[Medium item switching]

N

>

key

x

key

[Minor item switching]

[VOL +]

[VOL --]

key:100th place of mode number

increase.

key:100th place of mode number

decrease.

[VOL +]

[VOL --]

>

key:10th place of mode number

increase.

key:10th place of mode number

decrease.

N

key: Unit place of mode number

increase.

[Adjusted value variation]

[VOL +]

[VOL --]

key:Increases the

adjusted value

key:Decreases the

adjusted value

[Adjusted value write]

X

key: When adjusted value is

changed:
Adjusted value is written.
When adjusted value is
not changed:
That item is adjusted
automatically.

000 Manual

3. During each test, the optical pick-up moves outward or in­ward while the
seconds respectively.

4. Each test item is assigned with a 3-digit mode number;
100th place is a major item, 10th place is a medium item, and
unit place is a minor item.

N > or . key is pressed for several

– 10 –

5. The display changes a shown below each time the
key is pressed.

• Address & Adjusted Value Display

LCD display

011 C68S01

mode number

address

• Jitter Value & Adjusted Value Display

LCD display

adjusted value

011 OFFJ01

mode number

jitter value

• Block Error Value & Adjusted Value Display

LCD display

adjusted value

011 063B01

block error value

mode number

• ADIP Error Value & Adjusted Value Display

LCD display

adjusted value

[DISPLAY]

Self-Diagnosis Display Mode

• This set uses the self-diagnosis system in which if an error oc-

curs in playback mode, the error is detected by the model con­trol and power control blocks of the microprocessor and infor­mation on the cause is stored as history in EEPROM.
By viewing this history in test mode, it helps you to analyze a
fault and determine its location.

1. Setting the test mode. (See page 9)

2. In the display check mode, press the [DISPLAY] key activates
the self-diagnosis display mode where the LCD display as shown
below.

LCD display

000 1st0**

history code

3. Then, each time the N > key is pressed, LCD display de­scends by one as shown below. Also, the LCD display ascends
by one when the . key is pressed.

1

000 1st0**

error display code

011 059A01

ADIP error value

mode number

• Item Title Display

LCD display

adjusted value

011 LrefPw 01

mode number

item title

However in the power mode (mode number 700’s), only the
item is displayed.

6. Quit the manual mode, and press the
test mode (display check mode).

Overall Adjustment Mode

Mode to adjust the servo automatically in all items.
Normally, automatic adjustment is executed in this mode at the
repair.
For further information, refer to “Section 5 Electrical Adjustments”.
(See page 14)

adjusted value

x key to return to the

000 1st100

000 1st200
000 N 0**
000 N 100
000 N 200
000 N-10**

4. Quit the self-diagnosis display mode, and press the x key to
return to the test mode (display check mode).

000 N-1100
000 N-1200
000 N-20**
000 N-2100
000 N-2200
000 R 0000

1

– 11 –

• Description of Indication History

History code number Description

1st 0 The first error
1st 1 Displays “00”
1st 2 Displays “00”
N 0 The last error
N 1 Displays “00”
N 2 Displays “00”
N-1 0 One error before the last.
N-1 1 Displays “00”
N-1 2 Displays “00”
N-2 0 Two errors before the last.
N-2 1 Displays “00”
N-2 2 Displays “00”
REC Total recording time (Displays “0000” in this set)

• Description of Error Indication Codes

Problem Indication code Meaning of code Description

No error 00 No error Normal condition

01

Servo error 02 High temperture High temperture

03 Focus error Forcus could not be applied
04 Spindle error Abnormal lotation of disc
21 Initial low battery Abnormal voltage at initialization

Power error

22 Low battery Momentary interruption detected
23 Low battery NI Momentary interruption detected (NiMH)
24 Low battery AM Momentary interruption detected (AM)

Illegal access target address Attempt to access an abnormal address
was specified

Reset the error display code

After servicing, reset the error display code.

1. Setting the test mode. (See page 9)

2. Press the [DISPLAY] key activates the self-diagnosis display mode.

3. To reset the error display code, press the X key (2 times) when the code is displayed (except “R0000”).
(All the data on the 1st, N, N-1, and N-2 will be reset)

– 12 –

Key Check Mode

This set can check if the set and remote commander function nor­mally.

• Setting Method of Key Check Mode

1. Setting the test mode. (See page 9)

2. Press the [DISPLAY] key for several seconds (about 3 sec­onds) activates the key check mode. (At the last two digits,
AD value of remote commander key line is displayed in hexa­decimal)

LCD display

000 **

∗∗: AD value of the remote commander key (hexadecimal 00

to FF)

3. When each key on the set and on remote commander is pressed,

its name is displayed on the LCD. (The operated position is
displayed for 4 seconds after the slide switch is operated. If
any other key is pressed during this display, the LCD switches
to its name display.)

Example1: When >/N key on the set is pressed:

LCD display

000 FF **

∗∗: AD value of the remote commander key (hexadecimal 00

to FF)

Example2: When N > key on the remote commander is

pressed:

LCD display

000 rPLAY **

∗∗: AD value of the remote commander key (hexadecimal 00

to FF)

4. When all the keys on the set and on the remote commander are

considered as OK, the following displays are shown for 4 sec­onds.
(The key pressed to enter the Key Check mode has been check ed
even if it is not pressed in this mode)

Example1: When the keys on the set are considered as OK:

LCD display

000 SET OK **

∗∗: AD value of the remote commander key (hexadecimal 00

to FF)

Example2: When the keys on the remote commander are con-

sidered as OK:

LCD display

000 RMC OK **

∗∗: AD value of the remote commander key (hexadecimal 00

to FF)

5. When all the key have been checked or when the top panel is

opened during this checking, the system terminates the Key
Check mode and return to the test mode (display check mode).

– 13 –

SECTION 5

ELECTRICAL ADJUSTMENTS

Outline

• In this set, automatic adjustment of CD and MO can be per­formed by entering the test mode. (See page 9)
However , before starting automatic adjustment, the memory clear
and power adjustment must be performed in the manual mode.

• A key having no particular description in the text, indicates a
remote commander key.

Precautions for Adjustment

1. Adjustment must be done in the test mode only.

After adjusting, release the test mode.

2. Use the following tools and measuring instruments.

• Test CD disc TDYS-1
(Part No. : 4-963-646-01)

• Recorded MO disc PTDM-1
(Part No. : J-2501-054-A)

Available SONY MO disc (recorded)

• Digital voltmeter

3. Unless specified otherwise, supply DC 1.2V from the DC IN
jack.

4. Switch position

AVLS switch ................................................ NORM

DIGITAL SOUND PRESET switch ........... OFF

HOLD switch ............................................... OFF

Adjustment Sequence

Adjustment must be done with the following steps.

1. NV Reset (Memory clear)

r

2. Digital Sound Preset Setting Manual Mode

r

3. Power Supply Manual Adjustment

r

4. CD Overall Adjustment

r Overall Mode

5. MO Overall Adjustment















NV Reset

• Setting method of NV reset

1. Select the manual mode of test mode, and set mode num­ber 021NV Reset. (See page 10)

LCD display

021 ResNV

2. Press the X key.

LCD display

021 ResOK?

3. Press the X key once more.

LCD display

021 Res***

NV reset (after several seconds)

021 Reset!

4. Press the x key to quit the manual mode, and activate
the test mode.

Digital Sound Preset Setting

1. Select the manual mode of the test mode, and set the item
number 045. (See page 10)

LCD display

045 D.S.P **

∗∗: Adjustment value of digital sound preset set up.

2. Adjust [VOL +] key so that the adjustment value becomes

01.

LCD display

045 XXXS01

3. Press the X key to write the adjusted value.

Power Supply Manual Adjustment

• Adjustment sequence

Adjustment must be done with the following steps.

1. Vc PWM Duty (L) adjustment (item number: 762)

r

2. Vrem PWM Duty (L) adjsutment (item number: 764)

r

3. Vc PWM Duty (H) adjustment (item number: 765)

r

4. Vrem PWM Duty (H) adjustment (item number: 766)

– 14 –

• Adjustment method of Vc PWM Duty (L)
(item number: 762)

1. Select the manual mode of the test mode, and set the item num-

ber 762. (See page 10)

LCD display

• Adjustment method of Vrem PWM Duty (H)
(item number: 766)

1. Select the manual mode of the test mode, and set the item

number 766. (See page 10)

LCD display

762 Vc1PWM

2. Connect a digital voltmeter to the TP901 (VC) on the MAIN
board, and adjust
(voltage down) so that the voltage becomes 2.32 V.

[VOL +] key (voltage up) or [VOL --] key

+0.005
–0.01

Proceed to the next adjustment without pressing the X key if
voltage is already adjusted.

digital

voltmeter

MAIN board

TP901 (VC)

TP912 (GND)

3. Press the X key to write the adjusted value.

• Adjustment method of Vrem PWM Duty (L)

(item number: 764)

1. Select the manual mode of the test mode, and set the item num­ber 764. (See page 10)

LCD display

764 Vr1Vc1

2. Connect a digital voltmeter to the TP903 (VR) on the MAIN
board, and adjust
(voltage down) so that the voltage becomes 2.25 V.
Proceed to the next adjustment without pressing the X key if
voltage is already adjusted.

3. Press the

• Adjustment method of Vc PWM Duty (H)

(item number: 765)

1. Select the manual mode of the test mode, and set the item num­ber 765. (See page 10)

LCD display

[VOL +] key (voltage up) or [VOL --] key

digital

voltmeter

MAIN board

TP903 (VC)

TP912 (GND)

X key to write the adjusted value.

+0.005
–0.01

766 VrhVch

2. Connect a digital voltmeter to the TP903 (VR) on the MAIN
board, and adjust
(voltage down) so that the voltage becomes 2.6 ± 0.015 V.
Proceed to the next adjustment without pressing the X key if
voltage is already adjusted.

3. Press the X key to write the adjusted value.

Adjustment and Connection Location:

– MAIN Board (Component side) –

TP901 (VC)

+

C917

CN501

20

1

C557

L551

C902

L903

C918

R922

36 25

R921

37

R920

R918

+

C553

48

C915

C916

112

R943

C908

R940

C855

R551

R809

CN802

1

[VOL +] key (voltage up) or [VOL --] key

digital

voltmeter

MAIN board

TP903 (VC)

TP912 (GND)

A

+

IC901

R552 C552

85

IC552

C901

24

13

R936

R505

R517

C527

R516

C551

R630

C619

A

D902

D901

K

K

R941

R903

C905

R902

R909

L902

C906

R904

R905

R910

R942

+

C911

D903

AK

C903

L905

TP912 (GND)

R518

C507

C506

C530

22 1

23 44

C505

C504

C503

C502

R501

IC501

+

L904

Q901

R937R938

G

D

S

TP903 (VR)

R502

C501

R503

Q902

BCE

R944

L901

C904
+

C907

+

C529

C

Q501

B

E

R519

R521

C519

765 VchPWM

2. Connect a digital voltmeter to the TP901 (VC) on the MAIN
board, and adjust
(voltage down) so that the voltage becomes 2.75 ± 0.015 V.
Proceed to the next adjustment without pressing the X key if
voltage is already adjusted.

3. Press the

[VOL +] key (voltage up) or [VOL --] key

digital

voltmeter

MAIN board

TP901 (VC)

TP912 (GND)

X key to write the adjusted value.

– 15 –

Overall Adjustment Mode

• Configuration of overall adjustment

N >

key . key

Overall adjustment mode

(Title display)

6. Insert MO disc in the set, and press the
Overall MO Adjustment mode. Automatic adjustments are
made.

LCD display

N > key to set the

XXX MO RUN

CD overall

adjusting

All item

OK

x

key

CD overall

x

key

x

key

x

key

adjustment

MO overall

adjusting

MO overall
adjustment

OK

OK

N >

NG item exists
or

x

key

CD overall

adjustment

NG

key

NG item exists
or

x

key

MO overall
adjustment

NG

[Test mode $display check mode%]

Note: Adjust the CD first, when performing adjustment.

• Adjustment Method of Overall CD and MO Adjustment
Mode

1. Setting the test mode. (See page 9)

2. Press the [VOL --] key activates the overall adjustment mode.

LCD display

000 AssyFF

XXX: Item number for which an adjustment is being executed.

7. If NG in the overall MO adjustments, return to Reset NV and
perform the adjustment again.

LCD display

000 *** NG

∗∗∗: NG item number.

8. If OK through the overall MO adjustments, press the x key
to return to the test mode and terminate the Overall Adjustment
mode.

LCD display

000 MO OK

• Overall CD and MO adjustment items

1. Overall CD adjustment items

Item No. Descr iption

312
313 CD electrical offset adjustment

314
328 CD TWPP gain adjustment
321 CD tracking error gain adjustment
323
332
336 CD ABCD level adjustment
344 CD focus gain adjustment
345 CD tracking gain adjustment
521
522
341 CD focus bias adjustment

tracking error

CD

CD two-axis sensitivity adjustment

offset adjustment

3. Insert CD disc in the set, and press the . key to set the
Overall CD Adjustment mode . Automatic adjustments are made.

LCD display

XXX CD RUN

XXX: Item number for which an adjustment is being executed.

4. If NG in the overall CD adjustments, return to Reset NV and
perform the adjustment again.

LCD display

000 *** NG

∗∗∗: NG item number.

5. If OK through the overall CD adjustments, then perform over­all MO adjustments.

LCD display

000 CD OK

– 16 –

2. Overall MO adjustment items

Item No. Descr iption

112
113

114
118
221 Low reflective CD tracking error gain adjustment
223
232
236 Low reflective CD ABCD level adjustment
244 Low reflective CD focus gain adjustment
245 Low reflective CD tracking gain adjustment
121 MO tracking error gain adjustment
122 MO tracking error offset adjustment
134 MO TWPP gain adjustment
131
132
136 MO ABCD level adjustment
144 MO focus gain adjustment
145 MO tracking gain adjustment
141 MO focus bias adjustment

MO electrical offset adjustment

Low reflective CD tracking error offset adjustment

MO double speed read TWPP offset adjustment

– 17 –

6-1. BLOCK DIAGRAM – RF Section –

MZ-E77

SECTION 6

DIAGRAMS

OPTICAL PICK-UP BLOCK

JX JY JX

IX IY

IX

CD

A

B

F

MON

(LCX-2E)

IY

IX

JX

JY

A

B

C

D

LD

AVCC

MAIN BOARD (1/3 )

RF AMP,FOCUS/TRACKING ERROR AMP

CN501

VREF

6

6

IY

9

9

IX

10

10

JX

14

14

JY

15

15

A

16

16

B

17

17

C

7

7

D

8

8

MON

18

18

5

5

LD-A

12

LD-K

13

AVCC

20

S0

11

S0
S1

S1

19

AUTOMATIC

POWER

12

CONTROL

13

20

11
19

AVCC AVCC

L501

Q501

L502

4

VREF

IY

8

IX

9

JX

10

JY

11

A

12

B

14

C

5

D

6

A-C

13

D-C

7

PD-NI

18

PD-O

20

22

DVDD

40

AVCC

RF,AMP,

FOCUS

ERROR,

TRACKING

ERROR

TPP/WPP

APC

IC501

PEAK

/BOTM

RF OUT

PEAK

BOTM

ABCD

ADIP IN

ADIP

PD-NI

OFTRK

XRST

SBUS

SCK

S MON

DIGITAL SIGNAL PROCESSOR,

DIGITAL SERVO SIGNAL PROCESSOR,

EFM/ACIRC ENCODER/DECODER,

SHOCK PROOF MEMORY CONTROLLER,

16M BIT D-RAM

IC601(1/2)

CN801

(1/3)

24

RFI

33

29
28

41

FE

42

TE

1
44
21

19

31

VC

26

25

23
24
43

78

84
85

86

87

96

99

106

89

12

4

PEAK
BOTM

ABCD

FE

TE

ADIP

APCREF

VC

MNT2

XRST

AOUT L
AOUT R

AVD1
AVD2

VDIOSC

VDI01
VDI02

VDI03
VDD RAM
VDD RAM

MNT3

SWDT

SCLK
XLAT

SRDT

SENS

SQSY

XINT

CS DSP

27

76
92
18

53
100
125
144
146

5
6
7

8
10
11
13
16
32

AVCC

L601

7
5

31

25
45
17
43
19
44
41
13

29
11
35
40
48

16
33

42

L IN
R IN

FOK
SDO0
SCK0

XLAT

SDI0
SENSE
SQSY
XINT
XCS DSP

OFTRK
VREF MON
SSB DATA
SSB CLK

S MON

PS S0
PD S1
XICRST

B

(Page 23)

TRK+

2

2

TRACKING

COIL

2-AXIS

DEVICE

FOCUS

COIL

05

TRK-

1

1

FCS+

4

4

FCS-

3

3

TRK+

TRK-

FCS+

FCS-

A

(Page 21)

• SIGNAL PATH

: PLAYBACK

– 19 – – 20 –

MZ-E77

6-2. BLOCK DIAGRAM – SERVO Section –

M902

(SLED)

MM

M901

(SPINDLE)

5

7

6
8

1

2

3

4

SLED1+

SLED1-

SLED2+

SLED2-

CLVN

CLVU

CLVV

CLVW

MAIN BOARD (2/3)

TRK+

TRK-

A

(Page 19)

CN551

5

7

6
8

1

2

3

4

FCS+

FCS-

UNREG

AVCC

30
29
33
32

11
12

26
28

37
38

39

40

46
47
44
43
42

7
4
8
5

9

FO3
VM34
VM3
RO3

FO1
VM1
VM12
RO1

FO2
VM2

RO2

FO4
RO4

COM
CPW1

CPV1

CPU1

UO
VMU
VO

VMVW

WO

SLED

VOLTAGE MONITOR

IC552

5
6

3
2

FOCUS/TRACKING COIL DRIVE,
SPINDLES/SLED MOTOR DRIVE

PRE

DRIVER

PRE

DRIVER

PRE

DRIVER

PRE

DRIVER

PRE

DRIVER

IC551

7

1

HI-BRIDGE

CONTROL

HI-BRIDGE

CONTROL

HI-BRIDGE

CONTROL

HI-BRIDGE

CONTROL

3 PHASE

CONTROL

BIAS

RI3

RI1

RI2

PWM24

RI4

COW0

COV0

COU0

W1

PWM1

DIGITAL SIGNAL PROCESSOR,

DIGITAL SERVO SIGNAL PROCESSOR,

EFM/ACIRC ENCODER/DECODER,

SHOCK PROOF MEMORY CONTROLLER,

16M BIT D-RAM

IC601(2/2)

VDCO

VDC1

VDC2

SLCV

139

SLCU

138

FI3

21
22

FI1

16
15

13

FI2

14
25

FI4

23
24

34

35

36

48

V1

1

U1

2
3

OE

17

110
109

111
112

134
133
141

135
140

132

131

130

FFCLR

TFDR
TRDR

FFDR
FRDR

SLDV
SLDU
SLVS

SLDW
SLCW

SPCW

SPCV

SPCU

D

(Page 24)

VDC3
VDC4

VDC5
DAVDDL
DAVDDR

OSCI

OSCO

SPVS

SPDU

SPDV

SPDW

108
136

124

127

128

129

VREG

1
36
37
68

VLD

25
26

19

20

X601

22.5792MHz

SPINDLE SERVO DRIVE SWITCH

SPINDLE SERVO DRIVE SWITCH

IC504

1
7
6
3

IC505

1
7
6
3

2

5

2

5

CN801

(2/3)

21
27
30
26
28

32

SPDL START SW
SLD 1 MON
CLV W
CLV V
CLV U

SPDL PWM

C

(Page 23)

– 21 –

18

VC

VG VG

20

05

– 22 –

6-3. BLOCK DIAGRAM – MAIN Section –

MZ-E77

B

(Page 20)

C

(Page 22)

L IN

R IN

FOK
SDO0
SCK0

XLAT

SDI0

SENSE

SQSY

XINT

XCS DSP

OFTRK

VREF MON

SSB DATA

SSB CLK

S MON

PD S0
PD S1

XICRST

SPDL START SW

SLD 1 MON

CLV W

CLV V
CLV U

SPDL PWM

SYSTEM BOARD MAIN BOARD (3/3 )

CN803
(1/2)

7

5

UNREG

AVCC

REFERENCE

VOLTAGE

SWITCHING

Q301

EEPROM

IC802

4

DI

3

DO

2

SK

1

XCS

119
31
25

45
17
43
19
44
41

13

29
11

35
40
48

16
33

42

21
27
30
26
28
32

X801

16.9344MHz

XCS NV
FOK

52

SO0

12

SCK0

13

8

XLAT
SI0

11

6

SENSE
SQSY

53
55

XINT
XCS DSP

9

2

OFTRK

82

VREF MON
SSB DATA

102

103

SSB CLK

79

S MON

36

PD S0

38

PDS1

68

XICRST

49

SPDL START SW
SLD 1 MON

35
26

CLV W

25

CLV V

24

CLV U

67

SPDL PWM

45

XTAL

46

EXTAL

IN L

22

IN R

21

+B

1

VCC

20

VREF IN

13

SYSTEM CONTROL

HEADPHONE AMP

IC301

BEEP OUT A

BEEP OUT A

BEEP

IC801

OPEN CLOSE SW

REG CTL PWM

OUT L

OUT R

STB

MUTE

MUTE

XHP STB

BEEP

RMC DTCK

SET KEY 2

XAVLS

SET KEY 1

WK DET

OPR LED

HOLD SW

RMC KEY

VBKAN

VC PWM

VB MON

VRM PWM

SERON

SLEEP
FFCLR

XRST

VDD
VDD
VDD

AVDD

VDD

AVREF

VRM MON

CN803

2

4

24
23

15
18
17

117

23
18

19
87

115

86
83
84
69
73

85

78

66

80

65

64
58
40
39
43
16
47
74
93

105

92

89

(2/2)

UNREG

AVCC

L OUT

1

R OUT

3

RMC DATA

38
22

24

SET KEY

14
18

OPEN/CLOSE

9

OPR LED

20

HOLD SW

37

RMC KEY

39

10

VC PWM

50

VRM PWM

49

REG CTL PWM

46

SERON

47
36
15
34

12

DBB

AVLS

XWK1

VSTB

SLEEP
FFCLR

XRST

VDD

38
22

24
14
18

20
37

39

10

50

49

46
47
36
15
34

12

CN801
(3/3)

1

3

9

NOISE
FILTER

NOISE
FILTER

UNREG

VDD

VREG

VLD

CN802 CN804

POWER CONTROL

34

XWK2

35

XWK1

39

VRMS

33

XWK3

38

VSTB

32

XWK4

22

INM1

RF1

24

23

RF2

20

INM2

43

CLK

15

SERON

36

SLEEP

37

FFCLR

40

XRST

30

VC

45

VREF

21

DTC

1

2
3
4
5

OPEN/CLOSE

6

7

HOLD SW

8

IC901

SWVG

VR OUT

VC ON

VC IN

VREG

DBB

DBB1

AVLS

SET KEY

XWK1

OPR LED

VG

VR

L2

VB

L1

FB

VLD

19

17

12

25

26

44

28

29
31

9
10
11

VDD

SW BOARD

DIGITAL SOUND PRESET

9

8
7
6
5
4

3

2

D903

L905

L903

AVCC

L904

D902

L902

L901

D901

OPR

VG

RCH

LCH

GND

GND

KEY

DATA

S806

OFF 1 2

D801

S808

HOLD

OFF HOLD

B+ SWITCH

Q901, 902

J301

(HEADPHONE)

i

S809

(OPEN/CLOSE)

S807

AVLS

NORM LIMIT

(BATTERY CASE)

• SIGNAL PATH

S801 – 805

RECHARGEABLE

BATTERY

(NICKEL-METAL)

NH-14WN

1.2V 1400mAh

DRY BATTERY

SIZE "AA"

(IEC DESIGNATION R6)

1PC. 1.5V

: PLAYBACK

S801

x

S802

> / N

S803

.

S804

VOLUME

-

-

S805

VOLUME

+

DC IN 1.5V

–

+

(Page 22)

05

D

– 23 – – 24 –

MZ-E77

e

6-4. PRINTED WIRING BOARD – MAIN Board (Component Side) –

• Semiconductor

Location

Ref. No. Location

D101 J-5
D201 I-4
D601 H-8
D855 I-6
D901 A-9
D902 A-8
D903 D-9

IC501 G-9
IC504 I-5
IC505 I-6
IC551 G-4
IC552 G-7
IC601 J-9
IC901 B-7

Q501 F-11
Q901 D-10
Q902 D-11

Note on Printed Wiring Board:

• Y : parts extracted from the conductor side.

f

•

• b : Pattern from the side which enables seeing.

(The other layers' patterns are not indicated.)

Caution:
Pattern face side: Parts on the pattern face side seen from
(Conductor Side) the pattern face are indicated.
Parts face side: Parts on the parts face side seen from
(Component Side) the parts face are indicated.

• Main board is four-layer printed board.

• Lead Layouts

: internal component.

However, the patterns of layers 2 and 3 have not been in­cluded in this diagrams.

IC601 is not replaceable

*

surfac

1 2 3 4 5 6 7 8 9 10 11 12 13

MAIN BOARD

A

+

B

+

C952

C

L554

D

MOTOR FLEXIBLE

BOARD

1-675-668-

E

M901

(SPINDLE)

F

M902

(SLED)

1

2

3

4

5

M

6

7

8

G

12

RECHARGEABLE

BATTERY

(NICKEL-METAL)

NH-14WM

1.2V 1400mAh

H

(Page 42)

I

J

A

SW
BOARD
CN804

SWITCH FLEXIBLE

BOARD

1-675-336-

11

K

18

+

1

L552

C555
+

12

L553

C351

R

COM

(COMPONENT SIDE)

C953

+

C556

R555

CN551

R822

C559

R554

IC551

R821

C954

C554

48 37

13 24

D201

AK

L501

C518

R556

L

C558

GND

C917

CN501

20

1

R553

C557

36

25

C561

85

14

R828

KA

D101

C854

KEY

L551

IC504

FB802

C853

DATA

TP901

(VC)

R918

+

C553

C521

85

C522

IC505

14

54
KK

D855

KAK
123

C851

VDD

C916

R819

R817

FB801

C902

R818

R943

+

C918

R922

R921

C908

CN802

R816

L903

36 25

37

R920

48

C915

112

R940

TP912
(GND)

C855

R551

R809

1

9

L502

25

CN801

1

+

C901

IC901

R936

R552 C552

85

IC552

14

RB551

+

C524

26

50

C551

A

D902

K

R902

24

R904

R942

13

R518

C530

R505

R517

C527

22 1

R516

R630

C619

23 44

RB552

C517

D601

C526

AK

C619

111112 108

114116 113

117118 115

120121 119

123124 122

127126 125

129130 128

132133 131

135137 134

R620

C101

C201

138139 136

141142

+

+

C104

C204

A

D901

K

R941

R903

C905

R909

C906

R905

R910

L905

D903

AK

C507

C506

IC501

C516

C615

R615

R515

C515

101

105

107

102

104

106

140

23

1 11121518 25262832361473839

6 10131619

4

5 8 9 141720

7

X601

+

C505

C513

C511

C616

L902

C911

C504

C503

C509

C510

IC601

24 23 27 31 34 35

21 22 29 30 33 143

R603

C903

PICK-UP BLOCK

C502

R501

*

R105

+

G

S

C618

Q901

OPTICAL

(LCX-2E)

C501

C614

R612

R614

R610

C607

R205

D

R502

145747577798081838486878990919395949899

146 67 69

144 40 41

C605

L904

R937R938

TP903

(VR)

R503

C508

C620

R611

R609

72

70737678828588929697100103109110 71

68 66 65

64 63 62

59 60 61

56 57 58

53 55 54

50 51 52

47 48 49

46 45 44

37 42 43

C606

+

R504

C613

R608

Q902

BCE

R944

R607

R602

C529

L901

B

R519

C

Q501

R521

C519

C904
+

R601

+

C603

C604C608

R604

C612

E

L601

C610
+

C907

C611

R606

R605

C609

+

1-677-152-

(BATTERY CASE)

(IEC DESIGNATION R6)

+

11

(11)

DRY BATTERY

SIZE “AA”

1PC. 1.5V

DC IN 1.5V

–

+

Lead layout of conv entional IC CSP (chip size package)

05

– 25 –

J301

i

(HEADPHONE)

B

(Page 38)

SYSTEM

BOARD

CN803

– 26 –

6-5. PRINTED WIRING BOARD – MAIN Board (Conductor Side) –

MAIN BOARD

(CONDUCTOR SIDE)

MZ-E77

12345678910111213

A

B

C

D

E

F

G

H

I

J

05

1-677-152-

11

(11)

K

– 27 – – 28 –

MZ-E77

6-6. SCHEMATIC DIAGRAM – MAIN Board (1/4) – • See page 45 for Waveforms. • See page 46 for IC Block Diagram.

(Page 31)

(Page 35)

(Page 35)

Note on Schematic Diagram:

• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.

• All resistors are in Ω and 1/
specified.

• % : indicates tolerance.

• A : B+ Line.

• Power voltage is dc 1.5V and fed with regulated dc po wer
supply from battery terminal.

4

W or less unless otherwise

(Page 34)

• Voltages and wav eforms are dc with respect to ground in
playback mode.
no mark : PLAYBACK

• Voltages are taken with a VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal produc­tion tolerances.

• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc­tion tolerances.

– 29 – – 30 –

• Circled numbers refer to waveforms.

• Signal path.
E : PLAYBACK

Note: The components identified by mark 0 or dotted line

with mark 0 are critical for safety.
Replace only with part number specified.

6-7. SCHEMATIC DIAGRAM – MAIN Board (2/4) –• See page 45 for Waveforms.

MZ-E77

(Page 43)

(Page 30)

(Page 34)

(Page 34)

Note on Schematic Diagram:

• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.

• All resistors are in Ω and 1/
specified.

• % : indicates tolerance.

f

•

• C : panel designation.

: internal component.

4

W or less unless otherwise

– 31 –

(Page 36)

• A : B+ Line.

• Power voltage is dc 1.5V and fed with regulated dc po wer

supply from battery terminal.

• Voltages and wav eforms are dc with respect to ground in
playback mode.
no mark : PLAYBACK

: Impossible to measure

∗

• Voltages are taken with a VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal produc­tion tolerances.

• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc­tion tolerances.

• Circled numbers refer to waveforms.

– 32 –

• Signal path.

E : PLAYBACK

IC601 is not replaceable

*

• The voltage and waveform of CSP (chip size package)
cannot be measured, because its lead layout is different
form that of conventional IC.

MZ-E77

6-8. SCHEMATIC DIAGRAM – MAIN Board (3/4) –• See page 45 for Waveform. • See page 48 for IC Block Diagram.

Note on Schematic Diagram:

• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.

• All resistors are in Ω and 1/
specified.

• % : indicates tolerance.

• A : B+ Line.

• Power voltage is dc 1.5V and f ed with regulated dc power

supply from battery terminal.

• Voltages and waveform are dc with respect to ground in
playback mode.
no mark : PLAYBACK

• Voltages are taken with a VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal produc­tion tolerances.

• Waveform is taken with a oscilloscope.
Voltage variations may be noted due to normal produc­tion tolerances.

• Circled number refers to waveform.

4

W or less unless otherwise

(Page 29)

(Page 31)

(Page 31)

(Page 35)

– 33 – – 34 –

6-9. SCHEMATIC DIAGRAM – MAIN Board (4/4) –• See page 45 for Waveforms. • See page 47 for IC Block Diagram.

MZ-E77

(Page 29)

(Page 31)

(Page 34)

(Page 39)

(Page 30)

– 35 –

Note on Schematic Diagram:

• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.

• All resistors are in Ω and 1/
specified.

• C : panel designation.

• A : B+ Line.

• Total current is measured with MD installed.

4

W or less unless otherwise

• Power voltage is dc 1.5V and fed with regulated dc po wer
supply from battery terminal.

• Voltages and wav eforms are dc with respect to ground in
playback mode.
no mark : PLAYBACK

• Voltages are taken with a VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal produc­tion tolerances.

– 36 –

• Waveforms are taken with a oscilloscope.

Voltage variations may be noted due to normal produc­tion tolerances.

• Circled numbers refer to waveforms.

• Signal path.

E : PLAYBACK

MZ-E77

e

6-10. PRINTED WIRING BOARD – SYSTEM Board –

• Semiconductor

Location

Ref. No. Location

IC301 F-3
IC801 F-6
IC802 F-8

Q301 G-3

A

B

C

1 2 3 4 5 6 7 8

SYSTEM BOARD

(COMPONENT SIDE)

Note on Printed Wiring Board:

• Y : parts extracted from the conductor side.

f

•

• b : Pattern from the side which enables seeing.

(The other layers' patterns are not indicated.)

Caution:
Pattern face side: Parts on the pattern face side seen from
(Conductor Side) the pattern face are indicated.
Parts face side: Parts on the parts face side seen from
(Component Side) the parts face are indicated.

• System board is four-layer printed board.

• Lead Layouts

Lead layout of conv entional IC CSP (chip size package)

: internal component.

However, the patterns of layers 2 and 3 have not been in­cluded in this diagrams.

IC801 is not replaceable

*

surfac

D

E

F

G

BP801
(TEST)

1-677-232-

11

(11)

R806

1

SYSTEM BOARD

C102

R103

R203

C202

(CONDUCTOR SIDE)

R204

C305

7

C306

+

12

+

+

C304

+

Q301

C203

BCE

IC301

R302

R303

C103

16

1813

C303

R104

24

19

C302

+

R201

R202

R301

CN803

R101

R102

25

C301

B

MAIN

05

BOARD

CN801

50

R801

R802

C802

R826

26

(Page 26)

C803

R810

93 92 91 61 55 56

96 95 94 52 53 54

99 98 97 49 50 51

102 101 100 46 47 48

105 104 103 43 45 44

108 107 106 40 41 42

109 110 111 37 38 39

113 114 112 34 35 36

117 116 115 4 7 10 13 16 19 22

C809

119 118 2 6 8 11 14 17 21 23 26 28 31

120 1 3 5 9 12 15 18 20 24 25 29 30

C804

R804

R803

83 81 78 74 72 69 6488 87 86 63 60 58

84 80 77 75 71 68 6590 89 85 62 59 57

82 79 76 73 70 67 66

C811

IC801

C806

C807

*

27 32 33

R808

R807

R827

41

IC802

58

R815

C808

X801

1-677-232-

1-677-232-

11

11

(11)

(11)

– 37 – – 38 –

6-11. SCHEMATIC DIAGRAM – SYSTEM Board – • See page 45 for Waveforms. • See page 48 for IC Block Diagram.

MZ-E77

(Page 36)

Note on Schematic Diagram:

• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.

• All resistors are in Ω and 1/
specified.

f

•

• A : B+ Line.

• Power voltage is dc 1.5V and fed with regulated dc po wer

• Voltages and wav eforms are dc with respect to ground in

• Voltages are taken with a VOM (Input impedance 10 MΩ).

• Waveforms are taken with a oscilloscope.

• Circled numbers refer to waveforms.

• Signal path.

: internal component.

supply from battery terminal.
playback mode.

no mark : PLAYBACK

Voltage variations may be noted due to normal produc­tion tolerances.

Voltage variations may be noted due to normal produc­tion tolerances.

E : PLAYBACK

: Impossible to measure

∗

4

W or less unless otherwise

– 39 – – 40 –

IC801 is not replaceable

*

• The voltage and waveform of CSP (chip size package)
cannot be measured, because its lead layout is different
form that of conventional IC.

MZ-E77

6-12. PRINTED WIRING BOARD – SW Board –

1 2 3 4 5 6 7 8 9 10

A

B

C

D

SW BOARD

S804

VOLUME –

SW BOARD

R813

(COMPONENT SIDE)

(CONDUCTOR SIDE)

S807

AVLS

NORM , LIMIT

R814

S805

VOLUME +

S806

DIGITAL SOUND PRESET

OFF , 1 , 2

S801

x

S809

(OPEN/CLOSE)

S803

.

R812

SWITCH FLEXIBLE

BOARD

1-675-336-

S808

HOLD

OFF , HOLD

>/N

11

R811

1-677-151-

S802

CN804

91

1-677-151-

D801

OPR

(Page 25)

A

11

(11)

MAIN

BOARD

CN802

11

(11)

05

Note on Printed Wiring Board:

• Y : parts extracted from the conductor side.

z

•

(The other layers' patterns are not indicated.)

Caution:
Pattern face side: Parts on the pattern face side seen from
(Conductor Side) the pattern face are indicated.
Parts face side: Parts on the parts face side seen from
(Component Side) the parts face are indicated.

: Through hole.

– 41 –

– 42 –

6-13. SCHEMATIC DIAGRAM – SW Board –

MZ-E77

(Page 32)

Note on Schematic Diagram:

• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.

• All resistors are in Ω and 1/
specified.

• C : panel designation.

4

W or less unless otherwise

– 43 – – 44 –

• Waveforms
– MAIN Board –

1 IC501 1 (TE), IC601 oh (TE)

(PLAYBACK mode)
100 mV/DIV, 1 µs/DIV

Approx.
12 mVp-p

2 IC501 8, 9, q;, qa (IY, IX, JX, JY)

(PLAYBACK mode)
100 mV/DIV, 5 µs/DIV

Approx.
140 mVp-p

6 IC504 5, 6, IC505 1, 2, 5, 6,

IC551 1, 2, rk (V1, U1, W1)
IC601 <zxm, <zx,, <zx. (SPDU, SPDV, SPDW)
(PLAYBACK mode)
1 V/DIV, 5 ms/DIV

2.4 Vp-p

11 ms

7 IC551 ef, eg, eh (COW0, COV0, COU0)

IC601 <zc/, <zcz, <zcx (SPCU, SPCV, SPCW)
(PLAYBACK mode)
1 V/DIV, 5 ms/DIV

– SYSTEM Board –

q; IC801 wf, wg, wh (CLV U, CLV V, CLV W)

(PLAYBACK mode)
1 V/DIV, 5 ms/DIV

2.4 Vp-p

11 ms

qa IC801 rg (XTAL)

1 V/DIV, 20 ns/DIV

1.2 Vp-p

• IC Block Diagrams
– MAIN Board –

IC501 SN761056DBT

1

TE

2

REXT

3

WPPLPF

VREF11

4

C

5

D

6

7

D-C

TRACKING

ERROR

AMP

TPP/WPP

ADIP TEMP

ABCD

AMP

ADIP

TON BOTM

TON PEAK

AW+DW

CSL
TON
NPP

A+B+C+D

44

ADIPIN

DWBPF
DW

TE

S-MONITOR

I+J

AWBPF
MIJ
MALFA
D-C
A-C
VREF075
CSLO
AW
PK/BTM
TWPP

43

S-MON

42

FE

41

ABCD

3 IC501 ed (RF OUT),

IC601 uk (RFI) (PLAYBACK mode)
500 mV/DIV, 10 µs/DIV

4 IC501 rs (FE),

IC601 ij (FE) (PLAYBACK mode)
100 mV/DIV, 1 µs/DIV

Approx.

1.2 Vp-p

Approx.
10 mVp-p

12 ms

8 IC601 w; (OSCO)

500 mV/DIV, 20 ns/DIV

44.3 ns

9 IC901 rd (CLK)

1 V/DIV, 2 µs/DIV

2.4 Vp-p

1.7 Vp-p

59.1 ns

qs IC801 yf (REG CTL PWM)

1 V/DIV, 2 µs/DIV

7.5 µs

qd IC801 yj (SPDL PWM)

(PLAYBACK mode)
1 V/DIV, 2 µs/DIV

2.4 Vp-p

A-C

TON-C

CIG

CDN

PD-NI

PD-I

PD-O

ADFG

DVDD

AVCC

40

OFC-C1

IY

8

IX

9

JX

10

JY

11

A

12
13

B

14

15

16

17

18
19
20

21

22

AUTOMATIC

POWER CONTRL

FOCUS

ERROR

AMP

T-ON

POWER

SUPPLY

RF

AMP

PEAK/BOTM

SERIAL

INTERFACE

39
38
37
36
35

34

33

32

31

30

29

28

27

26

25
24
23

OFC-C2
PS
LP

EQ

AGND

RF

CCSL2

VC

VREF075

PEAK

BOTM

DGND

OFTRK

XRST
SCK
SBUS

5 IC504 1, 2, IC551 3 (PWM1),

IC601 <zxv (SPVS) (PLAYBACK mode)
1 V/DIV, 2 µs/DIV

5.6 µs

2.4 Vp-p

7.5 µs

– 45 –

2.4 Vp-p

2.4 Vp-p

5.6 µs

– 46 –

IC551 XC111256FTA

WI

48

VC

VI

PWM

VM1

1

UI

2
3

4

3PHASE

CONTROL

VG

VC

GNDUV

UO

VMU

47 46 45 44 43 42 41

VG

VC

PRE

DRIVER

VC

COM

CPWI

CPVI

CPUI

GNDW

WO

VMVW

VO

39 38 37

40

+
–

+
–

+
–

VC

VG

VC

CPUO

36

CPVO

35

CPWO

34

VM3

33

RO1

PGND1

FO1

VM12

RO2

PGND2

FO2

VM2

5
6
7

8

9
10
11

12

PRE

DRIVER

VG

PRE

DRIVER

H-BRIDGE
CONTROL

VC

VC

H-BRIDGE
CONTROL

14 15 16 1713

FI2

RI2

RI1

VC

ROE

BIAS

VC

18

OE

FI1

VG

VC

GND

H-BRIDGE
CONTROL

VC

H-BRIDGE
CONTROL

242322212019

VG

FI3

FI4

RI3

RI4

PRE

DRIVER

VC

PRE

DRIVER

VG

32
31
30

29

28

27

26
25

RO3
PGND3
FO3

VM34

RO4

PGND4

FO4
PWM24

– 47 –

IC901 MPC18A31FTA

DCIN

INM5

RF5

BATM

INM3

INP3

RF3

VREG

VLD

CHGSW

48

DCIN

1

2

RS

3

4

5
6
7

8

9

FB

10

11
12

VR

VB

DCIN

++

–

+

VREG

+

–

RF4

–

+

–

DCIN

CHGB

47 46

VC

STEP-UP

DC/DC

CONVERTER

CHGMON

BANDGAP

REFERENCE

+

–

VREF

+

–

VB

44 43

–

CLK

RSTREF42CRST41XRST

VR

–

+

40

VC

+

–

RF1

VC

+

RF2

VRMC

39

VC

VC

PWM

VC

PWM

FFCLR

VBTB

3845

XRST

VBVC

VC

VG

STEP-UP

PRE DRIVER

VG

STEP-UP

PRE DRIVER

FFCLR

37

SYSTEM

CONTROL

SAW

OSC2

36

SLEEP

35

XWK1

34

XWK2

33

XWK3

32

XWK4

31

VCIN

30

VC

29

VCON

28

L1

27

PGND

26

L2

25

VROUT

13 14 15

RF4

INM4

– SYSTEM Board –
IC301 TA2131FL (EL)

MT SW

PW SW

18 17 16 15 14 13

MTSWBST

MT TC

VCC1

BEEP

OUTB

BEEP

OUTA

INB

INA

PW
SW

19

20

21

22

PW

23

A

24

VCC2

OUTA

PWR

GND

PW

SW

B

SERON

BST SW

OUTB

ADD

16

PWMVC

BEEP

17

BEEP IN

18

SWVG

BST2

GND

GND

DET

19

V REF

BST
AGC

VG

BST1

20

VREF IN

654321

GC IN

INM2

12

11

10

9

8

7

21

DTC

VREF

LPF1

BST NF1

LPF2

BST NF2

BST OUT

22

INM1

23

RF2

24

RF1

– 48 –

6-14. IC PIN FUNCTION DESCRIPTION

• MAIN BOARD IC501 SN761056DBT (RF AMP, FOCUS/TRACKING ERROR AMP)

Pin No. Pin Name I/O Description

1 TE O Tracking error signal output to the CXD2661GA (IC601)
2 REXT — Connected to the external resistor for the ADIP amplifier control

3 WPPLPF — Connected to the external capacitor for low-pass filter of the TPP/WPP
4 VREF11 O Reference voltage output terminal (+1.1V)
5 C I Signal (C) input from the optical pick-up detector
6 D I Signal (D) input from the optical pick-up detector
7 D-C I Signal (D) input from the optical pick-up detector (AC input)
8 IY I I-V converted RF signal (IY) input from the optical pick-up block detector

9 IX I I-V converted RF signal (IX) input from the optical pick-up block detector
10 JX I I-V converted RF signal (JX) input from the optical pick-up block detector
11 JY I I-V converted RF signal (JY) input from the optical pick-up block detector
12 A I Signal (A) input from the optical pick-up detector
13 A-C I Signal (A) input from the optical pick-up detector (AC input)
14 B I Signal (B) input from the optical pick-up detector
15 TON-C — Connected to the external capacitor for the TON hold
16 CIG — Connected to the external capacitor for low-pass filter of the NPP divider denominator
17 CDN — Connected to the external capacitor for low-pass filter of the CSL divider denominator
18 PD-NI I Light amount monitor input terminal (non-invert input)
19 PD-I I Light amount monitor input terminal (invert input)
20 PD-O O Light amount monitor output terminal
21 ADFG O ADIP duplex FM signal (22.05 kHz ± 1 kHz) output to the CXD2661GA (IC601)
22 DVDD — Power supply terminal (+2.4V) (digital system)
23 SBUS I/O Two-way SSB serial data bus with the system controller (IC801)
24 SCK I SSB serial clock signal input from the system controller (IC801)
25 XRST I Reset signal input from the system controller (IC801) “L”: reset
26 OFTRK I Off track signal input from the CXD2661GA (IC601)
27 DGND — Ground terminal (digital system)
28 BOTM O Light amount signal (RF/ABCD) bottom hold output to the CXD2661GA (IC601)
29 PEAK O Light amount signal (RF/ABCD) peak hold output to the CXD2661GA (IC601)
30 VREF075 — Connected to the external capacitor for the internal reference voltage
31 VC O Middle point voltage (+1.2V) generation output terminal
32 CCSL2 — Connected to the external capacitor for low-pass filter of the TPP/WPP
33 RF OUT O Playback EFM RF signal output to the CXD2661GA (IC601)
34 AGND — Ground terminal (analog system)
35 EQ — Connected to the external capacitor for the RF equalizer
36 LP — Connected to the external capacitor for the RF equalizer
37 PS — Connected to the external capacitor for the RF equalizer
38 OFC-2 — Connected to the external capacitor for the RF AC coupling
39 OFC-1 — Connected to the external capacitor for the RF AC coupling
40 AVCC — Power supply terminal (+2.4V) (analog system)
41 ABCD O Light amount signal (ABCD) output to the CXD2661GA (IC601)
42 FE O Focus error signal output to the CXD2661GA (IC601)
43 S-MON O Servo signal monitor output to the system controller (IC801)
44 ADIP-IN I ADIP duplex FM signal (22.05 kHz ± 1 kHz) input terminal Not used

– 49 –

• MAIN BOARD IC601 CXD2661GA-2

(DIGITAL SIGNAL PROCESSOR, DIGITAL SERVO SIGNAL PROCESSOR, EFM/ACIRC ENCODER/DECODER,
SHOCK PROOF MEMORY CONTROLLER, ATRAC ENCODER/DECODER, D/A CONVERTER, 16M BIT D-RAM)

Pin No. Pin Name I/O Description

1VDCO— Power supply terminal (+1.8V) (for internal logic)

2, 3 MNT0, MNT1 O Operation monitor signal output terminal Not used (open)

4 MNT2 O Off track signal output to the SN761056DBT (IC501) and system controller (IC801)

5 MNT3 O

6 SWDT I Serial data input from the system controller (IC801) and EEPROM (IC802)
7 SCLK I Serial clock signal input from the system controller (IC801)
8 XLAT I Serial data latch pulse input from the system controller (IC801)

9 VSCO — Ground terminal (for internal logic)
10 SRDT O Serial data output to the system controller (IC801) and EEPROM (IC802)
11 SENS O Internal status (SENSE) output to the system controller (IC801)
12 XRST I Reset signal input from the system controller (IC801) “L”: reset

13 SQSY O

Focus OK signal output to the system controller (IC801) “H” is output when focus is on
(“L”: NG)

Subcode Q sync (SCOR) output to the system controller (IC801)
“L” is output every 13.3 msec Almost all, “H” is output

14 MTFLGL O

15 TST1 I Input terminal for the test (normally : fixed at “L”)
16 XINT O Interrupt status output to the system controller (IC801)
17 TST2 I Input terminal for the test (normally : fixed at “L”)
18 VDIOSC — Power supply terminal (+2.4V) (for oscillator cell)
19 OSCI I System clock input terminal (22.5792 MHz)
20 OSCO O System clock output terminal (22.5792 MHz)
21 VSIOSC — Ground terminal (for oscillator cell)
22 DAVSSL — Ground terminal (for internal D/A converter L-ch)
23 VREFL O Reference voltage output terminal (for internal D/A converter L-ch)
24 AOUTL O Playback analog signal (L-ch) output to the headphone amp (IC301)
25 DAVDDL — Power supply terminal (+2.4V) (for internal D/A converter L-ch)
26 DAVDDR — Power supply terminal (+2.4V) (for internal D/A converter R-ch)
27 AOUTR O Playback analog signal (R-ch) output to the headphone amp (IC301)
28 VREFR O Reference voltage output terminal (for internal D/A converter R-ch)
29 DAVSSR — Ground terminal (for internal D/A converter R-ch)
30 VSC1 — Ground terminal (for internal logic)

31 XTSL I

32 CD DSP I Chip select signal input from the system controller (IC801)
33 TST4 I Input terminal for the test (normally : fixed at “L”)
34 DOUT O Digital audio signal output terminal when playback mode Not used (open)
35 DT72 O Not used (open)

36, 37 VDC1, VDC2 — Power supply terminal (+1.8V) (for internal logic)

38 DATAI I Input terminal of external audio data to the internal D/A converter Not used (open)

39 to 41 TST5 to TST7 I Input terminal for the test (normally : fixed at “L”)

42 DADT O Playback data signal output to the external D/A converter Not used (open)
43 LRCK O L/R sampling clock signal (44.1 kHz) output to the external D/A converter Not used (open)
44 VSC2 — Ground terminal (for internal logic)
45 XBCK O Bit clock signal (2.8224 MHz) output to the external D/A converter Not used (open)

Muting applied to analog signal input in non-signal status causes the signal to be “H”
automatically Not used (open)

Input terminal for the system clock frequency setting
“L”: 45.1584 MHz, “H”: 22.5792 MHz (fixed at “H” in this set)

– 50 –

Pin No. Pin Name I/O Description

46 FS256 O Clock signal (11.2896 MHz) output to the external D/A converter Not used (open)

47 to 52

55 to 59

64 to 67 D1, D2, D0, D3 I/O Two-way data bus with the external D-RAM Not used (open)

100 VDIO2 — Power supply terminal (+2.2V) (for I/O cell)
101 VSIO2 — Ground terminal (for I/O cell)
102 F0CNT O Center frequency control signal output terminal of internal circuit filter Not used (open)

A03, A04, A02,

A05, A01, A06

53 VDIO1 — Power supply terminal (+2.4V) (for I/O cell)
54 VSIO1 — Ground terminal (for I/O cell)

A00, A07, A10,

A08, A09

60 XRAS O Row address strobe signal output to the external D-RAM “L” active Not used (open)
61 IXOE O Output enable signal output terminal “L” active Not used (open)
62 IXWE O Data write enable signal output terminal “L” active Not used (open)
63 XCAS O Column address strobe signal output to the external D-RAM “L” active Not used (open)

68 VDC3 — Power supply terminal (+1.8V) (for internal logic)
69 VSC3 — Ground terminal (for internal logic)
70 A11 O Address signal output to the external D-RAM Not used (open)
71 XOE O Output enable signal output to the external D-RAM “L” active Not used (open)
72 XWE O Data write enable signal output to the external D-RAM “L” active Not used (open)
73 MVCI I Digital in PLL oscillation input from the external VCO Not used (fixed at “L”)
74 ASYO O Playback EFM full-swing output terminal
75 ASYI I Playback EFM asymmetry comparator voltage input terminal
76 AVD1 — Power supply terminal (+2.4V) (analog system)
77 BIAS I Playback EFM asymmetry circuit constant current input terminal
78 RFI I Playback EFM RF signal input from the SN761056DBT (IC501)
79 AVS1 — Ground terminal (analog system)
80 PCO O Phase comparison output for master clock of the recording/playback EFM master PLL
81 FILI I Filter input for master clock of the recording/playback EFM master PLL
82 FILO O Filter output for master clock of the recording/playback EFM master PLL
83 CLTV I Internal VCO control voltage input of the recording/playback EFM master PLL
84 PEAK I Light amount signal (RF/ABCD) peak hold input from the SN761056DBT (IC501)
85 BOTM I Light amount signal (RF/ABCD) bottom hold input from the SN761056DBT (IC501)
86 ABCD I Light amount signal input from the SN761056DBT (IC501)
87 FE I Focus error signal input from the SN761056DBT (IC501)
88 AUX1 I Auxiliary signal input terminal Not used (fixed at “H”)
89 VC I Middle point voltage (+1.2V) input terminal
90 ADIO O Monitor output of the A/D converter input signal Not used (open)
91 ADRT I A/D converter operational range upper limit voltage input terminal (fixed at “H” in this set)
92 AVD2 — Power supply terminal (+2.4V) (analog system)
93 AVS2 — Ground terminal (analog system)
94 ADRB I A/D converter operational range lower limit voltage input terminal (fixed at “L” in this set)
95 SE I Sled error signal input terminal Not used (open)
96 TE I Tracking error signal input from the SN761056DBT (IC501)
97 DCHG I Connected to the +2.4V power supply
98 APC I Error signal input for the laser automatic power control Not used (fixed at “H”)
99 ADFG I ADIP duplex FM signal (22.05 kHz ± 1 kHz) input from the SN761056DBT (IC501)

O Address signal output to the external D-RAM Not used (open)

O Address signal output to the external D-RAM Not used (open)

– 51 –

Pin No. Pin Name I/O Description

2

103 XLRF O Serial latch signal output terminal Not used (open)
104 CKRF O Serial clock signal output terminal Not used (open)
105 DTRF O Write data output terminal Not used (open)

106 APCREF O

107 LDDR O PWM signal output for the laser automatic power control Not used (open)
108 VDC4 — Power supply terminal (+1.8V) (for internal logic)
109 TRDR O Tracking servo drive PWM signal (–) output to the XC111256FTA (IC551)
110 TFDR O Tracking servo drive PWM signal (+) output to the XC111256FTA (IC551)
111 FFDR O Focus servo drive PWM signal (+) output to the XC111256FTA (IC551)
112 FRDR O Focus servo drive PWM signal (–) output to the XC111256FTA (IC551)
113 FS4 O Clock signal output terminal (X' tal system 176.4 kHz) Not used (open)
114 SRDR O Sled servo drive PWM signal (–) output terminal Not used (open)
115 SFDR O Sled servo drive PWM signal (+) output terminal Not used (open)
116 VSC4 — Ground terminal (for internal logic)
117 SPRD O Spindle servo drive PWM signal (–) output terminal Not used (open)
118 SPFD O Spindle servo drive PWM signal (+) output terminal Not used (open)
119 FGIN I FG signal input terminal for spindle servo Not used (open)

120 to 12

147 to 168

TEST1 to TEST3 I Input terminal for the test (normally : fixed at “L”)

123 MTFLGR O

124 SPVS O Spindle servo drive voltage control signal output to the XC111256FTA (IC551)
125 VDI03 — Power supply terminal (+2.2V) (for I/O cell)
126 VSI03 — Ground terminal (for I/O cell)
127 SPDU O Spindle servo (U) drive signal output to the XC111256FTA (IC551)
128 SPDV O Spindle servo (V) drive signal output to the XC111256FTA (IC551)
129 SPDW O Spindle servo (W) drive signal output to the XC111256FTA (IC551)
130 SPCU I Spindle servo (U) timing signal input from the XC111256FTA (IC551)
131 SPCV I Spindle servo (V) timing signal input from the XC111256FTA (IC551)
132 SPCW I Spindle servo (W) timing signal input from the XC111256FTA (IC551)
133 SLDU O Sled servo (1+) drive signal output to the XC111256FTA (IC551)
134 SLDV O Sled servo (1–) drive signal output to the XC111256FTA (IC551)
135 SLDW O Sled servo (2+) drive signal output to the XC111256FTA (IC551)
136 VDC5 — Power supply terminal (+1.8V) (for internal logic)
137 VSC5 — Ground terminal (for internal logic)
138 SLCU I Sled servo (1) timing signal input from the XC111256FTA (IC551)
139 SLCV I Sled servo (2) timing signal input from the XC111256FTA (IC551)
140 SLCW O Sled servo (2–) timing signal output to the XC111256FTA (IC551)
141 SLVS O Sled servo voltage control signal output to the XC111256FTA (IC551)
142 BYPS O By-pass transistor control signal output terminal Not used (open)
143 DVSSDRAM — Ground terminal (for internal 16M bit D-RAM)
144 DVDDDRAM — Power supply terminal (+2.4V) (for internal 16M bit D-RAM)
145 DVSSDRAM — Ground terminal (for internal 16M bit D-RAM)
146 DVDDDRAM — Power supply terminal (+2.4V) (for internal 16M bit D-RAM)

NC — Not used (open)

Control signal output to the reference voltage generator circuit for the laser automatic power
control

Muting applied to analog signal input in non-signal status causes the signal to be “H”
automatically Not used (open)

– 52 –

• SYSTEM BOARD IC801 CXR701080-010GA (SYSTEM CONTROLLER)

Pin No.

1
2

3, 4

5
6 SENSE I Internal status (SENSE) input from the CXD2661GA (IC601)
7
8

9 XCS DSP O Chip select signal output to the CXD2661GA (IC601)
10
11
12 SO0 O Serial data output to the CXD2661GA (IC601)
13 SCK0 O Serial clock signal output to the CXD2661GA (IC601) and EEPROM (IC802)
14 NC I Not used (open)
15 VSS
16
17
18
19

20 to 22

23 XHP STBY O

24 CLV U
25
26

27 to 32

33 LD ON O Laser diode on/off control signal output terminal “L”: laser off, “H”: laser on Not used (open)
34
35
36
37 REG CTL CLK O Synchronizing external clock signal output terminal Not used (open)
38
39
40
41
42 NC O Not used (open)

43

44
45 XTAL O
46 EXTAL I
47 VDD
48 NC

49

50 NC I Not used (open)

Pin Name

NC

OFTRK

NC
NC

NC

XLAT

NC
SI0

VDD

NC

BEEP

RMC DTCK

NC

CLV V

CLV W

NC

NC

SLD MON 1

PD S0

PD S1
FFCLR
SLEEP

NC

XRST

VSS

SPDL START

SW

I/O Description

I

Not used (open)

I

Off track signal input from the CXD2661GA (IC601)

I

Not used (open)

O

Not used (open)

O

Not used (open)

O

Serial data latch pulse output to the CXD2661GA (IC601)

O

Not used (open)

I

Serial data input from the CXD2661GA (IC601)

—

Ground terminal

—

Power supply terminal (+2.4V)

O

Not used (open)

O

Beep sound control signal output to the headphone amp (IC301)

I/O

TSB serial communication data input/output terminal for remote commander with headphone

O

Not used (open)
Standby on/off control signal output to the headphone amp (IC301)

“L”: standby mode, “H”: amp on

O

Spindle servo (U) drive signal input from the XC111256FTA (IC551)

O

Spindle servo (V) drive signal input from the XC111256FTA (IC551)

O

Spindle servo (W) drive signal input from the XC111256FTA (IC551)

O

Not used (open)

I

Not used (fixed at “H”)

I

Sled servo timing signal input from the CXD2661GA (IC601)

O

PD IC mode switching signal output to the optical pick-up block

O

PD IC mode switching signal output to the optical pick-up block

O

Input latch output for starting signal to the MPC18A31FTA (IC901)

O

System sleep control signal output to the MPC18A31FTA (IC901) “H”: sleep on

I

Not used (fixed at “L”)

System reset signal input from the MPC18A31FTA (IC901) “L”: reset

I

For several hundreds msec. after the power supply rises, “L” is input, then it changes to “H”

—

Ground terminal
Main system clock output terminal (16.9344 MHz)
Main system clock input terminal (16.9344 MHz)

—

Power supply terminal (+2.4V)

I/O

Not used (open)

O Spindle servo start switching signal output terminal

– 53 –

Pin No.

51 NC I Not used (fixed at “H”)

52

Pin Name

FOK

I/O Description

Focus OK signal input from the CXD2661GA (IC601) “H”: is input when focus is on

I

(“L”: NG)

53

54
55
56 NC I Not used (open)
57
58
59 NC O Not used (open)
60

61, 62

63
64
65
66
67
68 XIC RST O Reset signal output to the SN761056DBT (IC501) and CXD2661GA (IC601) “L”: reset
69
70 NC I Not used (fixed at “L”)

71, 72 NC O Not used (open)

73
74
75 NC I
76
77
78 VBKAN I
79 S MON I
80 VB MON I
81 NC I
82 VREF MON I
83 WK DET I

84

85 RMC KEY I
86 SET KEY 1 I Set key (S801 to 805) input terminal (A/D input) (x, >/N, .,VOL +/– keys input)
87 SET KEY 2 I Set switch (S806) input terminal (A/D input) (DIGITAL SOUND PRESET switch input)
88 NC I
89 VRM MON I
90 NC I
91 AD GND — Ground terminal (for A/D converter)
92 AVREF I Input terminal for power supply voltage adjustment reference voltage (+2.4V) (for A/D converter)
93 AVDD —

94, 95 TEST0, TEST1 I

96 TDI I

SQSY

NC

XINT

NC

SERON

XTEST

SET CODE0,

SET CODE1
SET CODE2

REG CTL PWM

VRM PWM

VC PWM

SPDL PWM

OPR

XHOLD SW

VDD

NC

VSS

OPEN CLOSE

SW

Subcode Q sync (SCOR) input from the CXD2661GA (IC601)

I

“L” is input every 13.3 msec Almost all, “H” is input

I

Not used (fixed at “H”)

I

Interrupt status input from the CXD2661GA (IC601)

O

Not used (open)

O

Series power supply control signal output to the MPC18A31FTA (IC901)

I

Setting terminal for the test mode “L”: test mode (normally: open)

I

Destination setting terminal for the test mode Fixed at “L” in this set

I

Destination setting terminal for the test mode Open in this set

O

Synchronizing external clock signal output to the MPC18A31FTA (IC901)

O

VREM power supply voltage control PWM signal output to the MPC18A31FTA (IC901)

O

System power supply voltage control PWM signal output to the MPC18A31FTA (IC901)

O

Spindle servo drive voltage control PWM signal output to the XC111256FTA (IC551)

O

OPR LED (D801) drive signal output terminal “H”: LED on

I

HOLD switch (S808) input terminal “L”: hold on

—

Power supply terminal (+2.4V)
Not used (open)

O Not used (open)

—

Ground terminal
Sub power supply input terminal
Servo signal monitor input from the SN761056DBT (IC501) (A/D input)
Un-regulator power supply voltage monitor input terminal (A/D input)
Not used (fixed at “L”)
Reference voltage monitor input from the SN761056DBT (IC501) (A/D input)
Set key starting detect signal input terminal (A/D input)

Upper panel open/close detect switch (S809) input terminal (A/D input)

I

“L”: upper panel close
Remote commander with headphone key input terminal (A/D input)

Not used (fixed at “H”)
VREM voltage monitor input terminal (A/D input)
Not used (fixed at “L”)

Power supply terminal (+2.4V) (for A/D converter)
Input terminal for the test (normally: fixed at “L”)
Data input terminal for JTAG scan test Not used (open)

– 54 –

Pin No. Pin Name I/O

97 TMS I
98 TCX I

99 TRST I
100 TDO O
101 NC O
102 SSB DATA I/O Two-way SSB serial data bus with the SN761056DBT (IC501)
103 SSB CLK O SSB serial clock signal output to the SN761056DBT (IC501)
104 FLASH WR EN I
105 VDD —
106 VSS — Ground terminal

107 to 109

110, 111 NC O

112

113, 114 NC I

115 XAVLS I
116 NC O
117 MUTE O Analog muting on/off control signal output to the headphone amp (IC301) “H”: muting on
118 NC O
119 XCS NV O
120 NC O

NC I

XRST MTR DRV

Test mode control signal input terminal for JTAG scan test Not used (open)
Clock signal input terminal for JTAG scan test Not used (open)
Reset signal input terminal for JTAG scan test Not used (open)
Data output terminal for JTAG scan test Not used (open)
Not used (open)

Write enable signal input terminal Not used (fixed at “H”)
Power supply terminal (+2.4V)

Not used (fixed at “H”)
Not used (open)

O Reset signal output terminal “L”: reset Not used (open)

Not used (open)
Set switch (S807) input terminal (A/D input) (AVLS switch input) “L”: limit
Not used (open)

Not used (open)
Chip select signal output to the EEPROM (IC802)
Not used (open)

Description

– 55 –

SECTION 7

EXPLODED VIEWS

NOTE:

• -XX and -X mean standardized parts, so they
may have some difference from the original
one.

• Color Indication of Appearance Parts
Example:
KNOB, BALANCE (WHITE) . . . (RED)

↑↑

Parts Color Cabinet's Color

(1) CABINET SECTION

5

A

4

18

20

• Items marked “*” are not stocked since they
are seldom required for routine service. Some
delay should be anticipated when ordering
these items.

• The mechanical parts with no reference num­ber in the exploded views are not supplied.

• Accessories and packing materials are given
in the last of the electrical parts list.

The components identified by
mark 0 or dotted line with mark
0 are critical for safety.
Replace only with part number
specified.

8

MT-MZE90-166

7

25

6

A

5

10

26

11

12

14

13

15

17

4

16

20

21

22

23

19

4

3

2

Ref. No. Part No. Description Remark

1 X-3378-970-1 PANEL ASSY (S), BOTTOM

1 X-3378-971-1 PANEL ASSY (O), BOTTOM

1 X-3378-972-1 PANEL ASSY (L), BOTTOM (BLUE)...(BLUE)
2 3-045-470-01 KNOB (AVLS) (SILVER)...(SILVER)
2 3-045-470-11 KNOB (AVLS) (ORANGE)...(ORANGE)

2 3-045-470-21 KNOB (AVLS) (BLUE)...(BLUE)
3 3-044-831-01 KNOB (HOLD) (SILVER)...(SILVER)
3 3-044-831-11 KNOB (HOLD) (ORANGE)...(ORANGE)
3 3-044-831-21 KNOB (HOLD) (BLUE)...(BLUE)
4 4-218-233-25 SCREW (1.4), MI

5 4-218-233-05 SCREW (1.4), MI
6 X-3378-967-1 PANEL ASSY (S), UPPER (SILVER)...(SILVER)
6 X-3378-968-1 PANEL ASSY (O), UPPER

6 X-3378-969-1 PANEL ASSY (L), UPPER (BLUE)...(BLUE)
7 X-4951-947-1 HOLDER ASSY

8 4-223-906-01 SCREW (MD), STEP
9 4-963-883-71 SCREW (M1.4), MI
10 X-3378-668-1 CHASSIS ASSY, SET

1

4

(SILVER)...(SILVER)

(ORANGE)...(ORANGE)

(ORANGE)...(ORANGE)

9

9

27

9

24

not supplied

Ref. No. Part No. Description Remark

11 3-044-833-01 LID, BATTERY CASE (SILVER)...(SILVER)
11 3-044-833-11 LID, BATTERY CASE (ORANGE)...(ORANGE)
11 3-044-833-21 LID, BATTERY CASE (BLUE)...(BLUE)
12 X-4952-176-1 TERMINAL (PLUS) ASSY, BATTERY
13 3-044-832-01 STRIP, ORNAMENTAL

14 3-044-838-01 BUTTON (OPEN)
15 A-3322-552-A SW BOARD, COMPLETE
16 1-675-336-11 SWITCH FLEXIBLE BOARD
17 3-044-837-01 CASE, BATTERY
18 4-223-105-01 ESCUTCHEON

19 4-223-920-01 TERMINAL BOARD (MINUS)
20 4-963-883-22 SCREW (M1.4), PRECISION PAN
21 3-042-755-01 SPACER (SYSTEM BOARD)
22 A-3322-554-A MAIN BOARD, COMPLETE
23 A-3322-555-A SYSTEM BOARD, COMPLETE

24 3-045-136-01 SHEET, INSULATING
25 3-047-261-01 SEAL (MOIRE) (GREEN/CIRCLE)...(SILVER)
25 3-047-261-11 SEAL (MOIRE) (BROWN/DOT)...(ORANGE)
25 3-047-261-21 SEAL (MOIRE) (LIGHT GREEN/WAVE)...(BLUE)
26 X-3378-684-1 BRACKET (STOP) ASSY

27 4-212-901-11 TERMINAL

– 56 –

(2) MECHANISM DECK SECTION

(MT-MZE90-166)

55

54

53

M901

52

51

60

57

59

63

62

61

A

57

57

A

56

M902

58

60

57

Ref. No. Part No. Description Remark

51 1-675-668-11 MOTOR FLEXIBLE BOARD
52 4-963-883-42 SCREW (M1.4), PRECISION PAN
53 X-4951-926-1 CHASSIS ASSY
54 4-222-206-01 SPRING, THRUST
55 4-222-216-01 GEAR (SA)

56 3-338-645-31 WASHER (0.8-2.5)
57 4-963-883-31 SCREW (M1.4), PRECISION PAN
58 3-349-825-21 SCREW

– 57 –

The components identified by mark 0 or dotted
line with mark 0 are critical for safety.
Replace only with part number specified.

Ref. No. Part No. Description Remark

59 4-222-208-01 GEAR (SB)
60 4-222-204-01 BEARING
61 4-222-203-01 SCREW, LEAD

0 62 X-4952-387-1 SERVICE ASSY, OP (LCX-2E)

63 4-222-205-01 SPRING, RACK

M901 8-835-666-01 MOTOR, DC SSM-01C14A/C-NP (SPINDLE)
M902 1-763-399-11 MOTOR, DC (SLED) (WITH PULLY)

MAIN

SECTION 8

ELECTRICAL PARTS LIST

NOTE:

• Due to standardization, replacements in the
parts list may be different from the parts speci­fied in the diagrams or the components used
on the set.

• -XX and -X mean standardized parts, so they
may have some difference from the original
one.

• RESISTORS
All resistors are in ohms.
METAL: Metal-film resistor.
METAL OXIDE: Metal oxide-film resistor.
F: nonflammable

Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark

A-3322-554-A MAIN BOARD, COMPLETE

*********************

< CAPACITOR >

C101 1-125-926-11 TANTALUM CHIP 4.7uF 20% 6.3V
C104 1-164-942-11 CERAMIC CHIP 0.0068uF 10% 16V
C201 1-125-926-11 TANTALUM CHIP 4.7uF 20% 6.3V
C204 1-164-942-11 CERAMIC CHIP 0.0068uF 10% 16V
C351 1-107-820-11 CERAMIC CHIP 0.1uF 16V

C501 1-125-777-11 CERAMIC CHIP 0.1uF 10% 6.3V
C502 1-127-772-11 CERAMIC CHIP 33000PF 10% 10V
C503 1-164-940-11 CERAMIC CHIP 0.0033uF 10% 16V
C504 1-164-940-11 CERAMIC CHIP 0.0033uF 10% 16V
C505 1-164-943-11 CERAMIC CHIP 0.01uF 10% 16V

C506 1-127-772-11 CERAMIC CHIP 33000PF 10% 10V
C507 1-127-772-11 CERAMIC CHIP 33000PF 10% 10V
C508 1-164-938-11 CERAMIC CHIP 0.0015uF 10% 16V
C509 1-164-940-11 CERAMIC CHIP 0.0033uF 10% 16V
C510 1-164-845-11 CERAMIC CHIP 5PF 0.25PF 16V

C511 1-164-845-11 CERAMIC CHIP 5PF 0.25PF 16V
C513 1-164-858-11 CERAMIC CHIP 22PF 5% 16V
C515 1-107-820-11 CERAMIC CHIP 0.1uF 16V
C516 1-125-777-11 CERAMIC CHIP 0.1uF 10% 6.3V
C517 1-164-943-11 CERAMIC CHIP 0.01uF 10% 16V

C518 1-117-720-11 CERAMIC CHIP 4.7uF 10V
C519 1-164-940-11 CERAMIC CHIP 0.0033uF 10% 16V
C521 1-164-943-11 CERAMIC CHIP 0.01uF 10% 16V
C522 1-164-943-11 CERAMIC CHIP 0.01uF 10% 16V
C524 1-117-919-11 TANTALUM CHIP 10uF 20% 6.3V

C526 1-127-772-11 CERAMIC CHIP 33000PF 10% 10V
C527 1-127-772-11 CERAMIC CHIP 33000PF 10% 10V
C529 1-117-919-11 TANTALUM CHIP 10uF 20% 6.3V
C530 1-164-939-11 CERAMIC CHIP 0.0022uF 10% 16V
C551 1-125-777-11 CERAMIC CHIP 0.1uF 10% 6.3V

C552 1-125-777-11 CERAMIC CHIP 0.1uF 10% 6.3V
C553 1-107-765-11 TANTALUM CHIP 3.3uF 20% 16V
C554 1-107-765-11 TANTALUM CHIP 3.3uF 20% 16V
C555 1-135-238-21 TANTALUM CHIP 6.8uF 20% 10V
C556 1-135-238-21 TANTALUM CHIP 6.8uF 20% 10V

C557 1-127-772-11 CERAMIC CHIP 33000PF 10% 10V
C558 1-127-772-11 CERAMIC CHIP 33000PF 10% 10V
C559 1-127-772-11 CERAMIC CHIP 33000PF 10% 10V
C561 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C603 1-107-820-11 CERAMIC CHIP 0.1uF 16V

• Items marked “*” are not stocked since they
are seldom required for routine service.
Some delay should be anticipated when order­ing these items.

• SEMICONDUCTORS
In each case, u: µ, for example:
uA. . : µA. . uPA. . : µPA. .
uPB. . : µPB. . uPC. . : µPC. .
uPD. . : µPD. .

• CAPACITORS
uF: µF

• COILS
uH: µH

C604 1-107-820-11 CERAMIC CHIP 0.1uF 16V
C605 1-115-156-11 CERAMIC CHIP 1uF 10V
C606 1-117-919-11 TANTALUM CHIP 10uF 20% 6.3V
C607 1-115-156-11 CERAMIC CHIP 1uF 10V
C608 1-107-820-11 CERAMIC CHIP 0.1uF 16V

C609 1-119-749-11 TANTALUM CHIP 33uF 20% 4V
C610 1-131-862-11 TANTALUM CHIP 47uF 20% 4V
C611 1-164-943-11 CERAMIC CHIP 0.01uF 10% 16V
C612 1-125-891-11 CERAMIC CHIP 0.47uF 10% 10V
C613 1-164-935-11 CERAMIC CHIP 470PF 10% 16V

C614 1-127-772-11 CERAMIC CHIP 33000PF 10% 10V
C615 1-125-777-11 CERAMIC CHIP 0.1uF 10% 6.3V
C616 1-107-820-11 CERAMIC CHIP 0.1uF 16V
C618 1-125-891-11 CERAMIC CHIP 0.47uF 10% 10V
C619 1-164-943-11 CERAMIC CHIP 0.01uF 10% 16V

C620 1-164-850-11 CERAMIC CHIP 10PF 0.5PF 16V
C851 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C853 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C854 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C855 1-164-156-11 CERAMIC CHIP 0.1uF 25V

C901 1-104-752-11 TANTALUM CHIP 33uF 20% 6.3V
C902 1-107-810-11 TANTALUM CHIP 33uF 20% 4V
C903 1-104-752-11 TANTALUM CHIP 33uF 20% 6.3V
C904 1-119-749-11 TANTALUM CHIP 33uF 20% 4V
C905 1-107-819-11 CERAMIC CHIP 0.022uF 10% 16V

C906 1-107-819-11 CERAMIC CHIP 0.022uF 10% 16V
C907 1-109-982-11 CERAMIC CHIP 1uF 10% 10V
C908 1-125-777-11 CERAMIC CHIP 0.1uF 10% 6.3V
C911 1-117-919-11 TANTALUM CHIP 10uF 20% 6.3V
C915 1-164-943-11 CERAMIC CHIP 0.01uF 10% 16V

C916 1-164-943-11 CERAMIC CHIP 0.01uF 10% 16V
C917 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V
C918 1-164-943-11 CERAMIC CHIP 0.01uF 10% 16V
C952 1-127-569-11 TANTALUM CHIP 100uF 20% 4V
C953 1-127-569-11 TANTALUM CHIP 100uF 20% 4V

C954 1-164-156-11 CERAMIC CHIP 0.1uF 25V

* CN501 1-778-168-11 CONNECTOR, FFC/FPC (ZIF) 20P
* CN551 1-793-124-21 CONNECTOR, FPC (ZIP) 8P
* CN801 1-793-607-21 CONNECTOR, BOARD TO BOARD 50P
* CN802 1-785-219-22 CONNECTOR, FPC (ZIF) 9P

The components identified by
mark 0 or dotted line with mark
0 are critical for safety.
Replace only with part number
specified.

When indicating parts by reference
number, please include the board.

< CONNECTOR >

– 58 –

MAIN

Ref. No. Part No. Description Remark

< DIODE >

D101 8-719-056-72 DIODE UDZ-TE-17-2.4B
D201 8-719-056-72 DIODE UDZ-TE-17-2.4B
D601 8-719-421-27 DIODE MA728
D855 8-719-066-17 DIODE FTZ6.8E-T148
D901 8-719-066-16 DIODE RB491D-T146

D902 8-719-066-16 DIODE RB491D-T146
D903 8-719-420-51 DIODE MA729

< FERRITE BEAD >

FB801 1-414-228-11 FERRITE BEAD
FB802 1-414-228-11 FERRITE BEAD

< IC >

IC501 8-759-641-94 IC SN761056DBT
IC504 8-759-647-75 IC TC7W66FK (TE85R)
IC505 8-759-647-75 IC TC7W66FK (TE85R)
IC551 8-759-660-29 IC XC111256FTA
IC552 8-759-358-40 IC TLC372CPW-E20

@ IC601 8-752-400-59 IC CXD2661GA-2

IC901 8-759-642-13 IC MPC18A31FTA

< JACK >

Ref. No. Part No. Description Remark

R519 1-218-977-11 RES, CHIP 100K 5% 1/16W
R521 1-218-446-11 METAL CHIP 1 5% 1/16W
R551 1-218-965-11 RES, CHIP 10K 5% 1/16W
R552 1-218-965-11 RES, CHIP 10K 5% 1/16W

R553 1-218-965-11 RES, CHIP 10K 5% 1/16W
R554 1-218-965-11 RES, CHIP 10K 5% 1/16W
R555 1-218-965-11 RES, CHIP 10K 5% 1/16W
R556 1-216-864-11 METAL CHIP 0 5% 1/16W
R601 1-218-929-11 RES, CHIP 10 5% 1/16W

R602 1-218-929-11 RES, CHIP 10 5% 1/16W
R603 1-216-811-11 METAL CHIP 150 5% 1/16W
R604 1-218-973-11 RES, CHIP 47K 5% 1/16W
R605 1-218-965-11 RES, CHIP 10K 5% 1/16W
R606 1-218-977-11 RES, CHIP 100K 5% 1/16W

R607 1-218-987-11 RES, CHIP 680K 5% 1/16W
R608 1-218-977-11 RES, CHIP 100K 5% 1/16W
R609 1-216-861-11 METAL CHIP 2.2M 5% 1/16W
R610 1-218-990-11 SHORT 0
R611 1-218-975-11 RES, CHIP 68K 5% 1/16W

R612 1-218-971-11 RES, CHIP 33K 5% 1/16W
R614 1-218-965-11 RES, CHIP 10K 5% 1/16W
R615 1-218-990-11 SHORT 0
R619 1-218-990-11 SHORT 0
R620 1-218-990-11 SHORT 0

J301 1-793-288-61 JACK (i (HEADPHONE))

< COIL >

L501 1-469-570-21 INDUCTOR 10uH
L502 1-469-570-21 INDUCTOR 10uH
L551 1-410-389-31 INDUCTOR CHIP 47uH
L552 1-410-389-31 INDUCTOR CHIP 47uH
L553 1-414-400-41 INDUCTOR 22uH

L554 1-414-400-41 INDUCTOR 22uH
L601 1-469-570-21 INDUCTOR 10uH
L901 1-419-258-21 CHOKE COIL 68uH
L902 1-419-368-21 CHOKE COIL 47uH
L903 1-469-525-91 INDUCTOR 10uH

L904 1-414-398-11 INDUCTOR 10uH
L905 1-414-404-41 INDUCTOR 100uH

< TRANSISTOR >

Q501 8-729-922-10 TRANSISTOR 2SA1577-QR
Q901 8-729-046-48 FET FDV303N
Q902 8-729-037-53 TRANSISTOR 2SB1462J-QR (TX). SO

< RESISTOR >

R105 1-218-951-11 RES, CHIP 680 5% 1/16W
R205 1-218-951-11 RES, CHIP 680 5% 1/16W
R501 1-218-971-11 RES, CHIP 33K 5% 1/16W
R502 1-218-979-11 RES, CHIP 150K 5% 1/16W
R503 1-216-864-11 METAL CHIP 0 5% 1/16W

R630 1-218-965-11 RES, CHIP 10K 5% 1/16W
R809 1-218-973-11 RES, CHIP 47K 5% 1/16W
R816 1-218-957-11 RES, CHIP 2.2K 5% 1/16W
R817 1-218-941-11 RES, CHIP 100 5% 1/16W
R818 1-218-941-11 RES, CHIP 100 5% 1/16W

R819 1-218-989-11 RES, CHIP 1M 5% 1/16W
R821 1-218-990-11 SHORT 0
R822 1-218-985-11 RES, CHIP 470K 5% 1/16W
R828 1-218-973-11 RES, CHIP 47K 5% 1/16W
R902 1-218-983-11 RES, CHIP 330K 5% 1/16W

R903 1-218-961-11 RES, CHIP 4.7K 5% 1/16W
R904 1-218-983-11 RES, CHIP 330K 5% 1/16W
R905 1-218-961-11 RES, CHIP 4.7K 5% 1/16W
R909 1-218-959-11 RES, CHIP 3.3K 5% 1/16W
R910 1-218-959-11 RES, CHIP 3.3K 5% 1/16W

R918 1-216-855-11 METAL CHIP 680K 5% 1/16W
R920 1-218-871-11 METAL CHIP 10K 0.5% 1/16W
R921 1-218-979-11 RES, CHIP 150K 5% 1/16W
R922 1-218-989-11 RES, CHIP 1M 5% 1/16W
R936 1-218-979-11 RES, CHIP 150K 5% 1/16W

R937 1-218-989-11 RES, CHIP 1M 5% 1/16W
R938 1-218-989-11 RES, CHIP 1M 5% 1/16W
R940 1-218-977-11 RES, CHIP 100K 5% 1/16W
R941 1-218-967-11 RES, CHIP 15K 5% 1/16W
R942 1-218-963-11 RES, CHIP 6.8K 5% 1/16W

R943 1-218-957-11 RES, CHIP 2.2K 5% 1/16W
R944 1-218-981-11 RES, CHIP 220K 5% 1/16W

R504 1-216-864-11 METAL CHIP 0 5% 1/16W
R505 1-208-691-11 METAL CHIP 2.2K 0.5% 1/16W
R515 1-208-691-11 METAL CHIP 2.2K 0.5% 1/16W
R516 1-208-691-11 METAL CHIP 2.2K 0.5% 1/16W
R517 1-208-691-11 METAL CHIP 2.2K 0.5% 1/16W

R518 1-218-985-11 RES, CHIP 470K 5% 1/16W

– 59 –

< COMPOSITION CIRCUIT BLOCK >

RB551 1-233-965-11 RES, NETWORK (CHIP TYPE) 4.7K
RB552 1-233-979-11 RES, NETWORK (CHIP TYPE) 1M

@Replacement of CXD2661GA-2 (IC601) used

in this set requires a special tool. Therefore,
it cannnot be replaced.

MAIN SW SYSTEM

Ref. No. Part No. Description Remark

< VIBRATOR >

X601 1-781-654-21 VIBRATOR, CERAMIC (22.5792MHz)

**************************************************************

A-3322-552-A SW BOARD, COMPLETE

*******************

< CONNECTOR >

CN804 1-793-606-21 CONNECTOR, FFC/FPC (ZIF) 9P

< DIODE >

D801 8-719-061-82 LED TLSU1002 (TPX1, SONY) (OPR)

< RESISTOR >

R811 1-216-831-11 METAL CHIP 6.8K 5% 1/16W
R812 1-216-833-11 RES, CHIP 10K 5% 1/16W
R813 1-216-835-11 METAL CHIP 15K 5% 1/16W
R814 1-216-839-11 METAL CHIP 33K 5% 1/16W

< SWITCH >

S801 1-771-138-21 SWITCH, KEY BOARD (x)
S802 1-771-138-21 SWITCH, KEY BOARD (>/N)
S803 1-771-138-21 SWITCH, KEY BOARD (.)
S804 1-771-138-21 SWITCH, KEY BOARD (VOLUME –)
S805 1-771-138-21 SWITCH, KEY BOARD (VOLUME +)

S806 1-571-506-41 SWITCH, SLIDE (DIGITAL SOUND PRESET)
S807 1-571-275-31 SWITCH, SLIDE (AVLS)
S808 1-571-275-31 SWITCH, SLIDE (HOLD)
S809 1-771-483-61 SWITCH, PUSH (1 KEY) (OPEN/CLOSE)

**************************************************************

A-3322-555-A SYSTEM BOARD, COMPLETE

***********************

< CAPACITOR >

C102 1-125-899-11 TANTALUM CHIP 220uF 20% 4V
C103 1-115-467-11 CERAMIC CHIP 0.22uF 10% 10V
C202 1-125-899-11 TANTALUM CHIP 220uF 20% 4V
C203 1-115-467-11 CERAMIC CHIP 0.22uF 10% 10V
C301 1-117-919-11 TANTALUM CHIP 10uF 20% 6.3V

C302 1-107-820-11 CERAMIC CHIP 0.1uF 16V
C303 1-125-837-11 CERAMIC CHIP 1uF 10% 6.3V
C304 1-125-926-11 TANTALUM CHIP 4.7uF 20% 6.3V
C305 1-125-838-11 CERAMIC CHIP 2.2uF 10% 6.3V
C306 1-117-919-11 TANTALUM CHIP 10uF 20% 6.3V

Ref. No. Part No. Description Remark

< IC >

IC301 8-759-598-15 IC TA2131FL (EL)

@ IC801 8-752-914-08 IC CXR701080-010GA

IC802 8-759-566-18 IC AK6480BH-E2

< TRANSISTOR >

Q301 8-729-037-52 TRANSISTOR 2SD2216J-QR (TX). SO

< RESISTOR >

R101 1-218-967-11 RES, CHIP 15K 5% 1/16W
R102 1-218-961-11 RES, CHIP 4.7K 5% 1/16W
R103 1-218-961-11 RES, CHIP 4.7K 5% 1/16W
R104 1-218-929-11 RES, CHIP 10 5% 1/16W
R201 1-218-967-11 RES, CHIP 15K 5% 1/16W

R202 1-218-961-11 RES, CHIP 4.7K 5% 1/16W
R203 1-218-961-11 RES, CHIP 4.7K 5% 1/16W
R204 1-218-929-11 RES, CHIP 10 5% 1/16W
R301 1-218-935-11 RES, CHIP 33 5% 1/16W
R302 1-218-963-11 RES, CHIP 6.8K 5% 1/16W

R303 1-218-981-11 RES, CHIP 220K 5% 1/16W
R801 1-218-981-11 RES, CHIP 220K 5% 1/16W
R802 1-218-981-11 RES, CHIP 220K 5% 1/16W
R803 1-218-985-11 RES, CHIP 470K 5% 1/16W
R804 1-218-973-11 RES, CHIP 47K 5% 1/16W

R806 1-218-977-11 RES, CHIP 100K 5% 1/16W
R807 1-218-959-11 RES, CHIP 3.3K 5% 1/16W
R808 1-218-959-11 RES, CHIP 3.3K 5% 1/16W
R810 1-218-973-11 RES, CHIP 47K 5% 1/16W
R815 1-218-941-11 RES, CHIP 100 5% 1/16W

R826 1-216-864-11 METAL CHIP 0 5% 1/16W
R827 1-218-989-11 RES, CHIP 1M 5% 1/16W

< VIBRATOR >

X801 1-781-575-21 VIBRATOR, CERAMIC (16.9344MHz)

**************************************************************

MISCELLANEOUS

**************

16 1-675-336-11 SWITCH FLEXIBLE BOARD
51 1-675-668-11 MOTOR FLEXIBLE BOARD

0 62 X-4952-387-1 SERVICE ASSY, OP (LCX-2E)

M901 8-835-666-01 MOTOR, DC SSM-01C14A/C-NP (SPINDLE)
M902 1-763-399-11 MOTOR, DC (SLED) (WITH PULLY)

************************************************************

C802 1-107-820-11 CERAMIC CHIP 0.1uF 16V
C803 1-164-935-11 CERAMIC CHIP 470PF 10% 16V
C804 1-164-943-11 CERAMIC CHIP 0.01uF 10% 16V
C806 1-125-891-11 CERAMIC CHIP 0.47uF 10% 10V
C807 1-125-891-11 CERAMIC CHIP 0.47uF 10% 10V

C808 1-107-820-11 CERAMIC CHIP 0.1uF 16V
C809 1-107-820-11 CERAMIC CHIP 0.1uF 16V
C811 1-107-820-11 CERAMIC CHIP 0.1uF 16V

< CONNECTOR >

* CN803 1-793-608-21 CONNECTOR, BOARD TO BOARD 50P

– 60 –

@Replacement of CXR701080-010GA (IC801)

used in this set requires a special tool. There­fore, it cannnot be replaced.

The components identified by mark 0 or dotted
line with mark 0 are critical for safety.
Replace only with part number specified.

Ref. No. Part No. Description Remark

ACCESSORIES & PACKING MATERIALS

*******************************

1-418-493-61 REMOTE CONTROL UNIT (RM-MZ2S)

0 1-528-580-21 BATTERY CHARGER (BC-7HT) (Tourist)
0 1-528-866-11 BATTERY CHARGER (BC-9HP2) (Hong Kong)

1-528-918-11 BATTERY CASE
1-569-007-11 ADAPTOR, CONVERSION 2P (Tourist)

1-756-036-11 BATTERY, NICKEL HYDROGEN
3-043-060-01 CASE, CHARGE (C/D)
3-045-575-01 CASE, CARRYING
3-046-782-01 MANUAL, INSTRUCTION (JAPANESE,

ENGLISH) (Tourist)

3-046-782-11 MANUAL, INSTRUCTION (ENGLISH, CHINESE)

(Hong Kong)

8-953-304-90 RECEIVER MDR-E805SP

Ref. No. Part No. Description Remark

– 61 –

The components identified by mark 0 or dotted
line with mark 0 are critical for safety.
Replace only with part number specified.

MZ-E77

9-927-660-11

Sony Corporation

Personal Audio Division Company

– 62 –

Printed in Japan C 2000. 3

2000C0526-1

Published by General Engineering Dept.