Sony MDRRF-950 Service manual

Download

Page 1

MDR-RF950

SERVICE MANUAL

Ver 1.0 1998. 06

MDR-RF950 is headphones in MDR-RF950RK.

SPECIFICATIONS

US Model

Canadian Model

TABLE OF CONTENTS

1. GENERAL ................................................................. 2

2. DISASSEMBLY ......................................................... 3

3. ELECTRICAL ADJUSTMENTS

3-1. Checking/Adjusting Receiving Frequency ..................... 5

3-2. Checking/Adjusting Degree of Modulation

of Main Carrier (L + R) .................................................. 6

3-3. Checking/Adjusting Separation...................................... 7

4. DIAGRAMS

4-1. Printed W iring Boards..................................................... 11

4-2. Schematic Diagram......................................................... 13

5. EXPLODED VIEWS................................................ 15

6. ELECTRICAL PARTS LIST ............................... 17

Notes on chip component replacement

• Never reuse a disconnected chip component.

• Notice that the minus side of a tantalum capacitor may be damaged by heat.

WIRELESS STEREO HEADPHONES

MICROFILM

Page 2

This section is extracted from instruction manual.

SECTION 1

GENERAL

– 2 –

Page 3

• This set can be disassembled in the order shown below.

SECTION 2

DISASSEMBLY

SET FRONT PLATE ASSY

Note: Follow the disassembly procedure in the numerical order given.

RX-BASE BOARD SW BOARD

HANGER COVER (L)

FRONT PLATE ASSY

Remove two solders of driver lead.

front plate assy

RX-BASE BOARD

hanger cover (R)

three screws (P2

Remove four solders of leads.

RX-BASE board

ear pad

two screws (P2

10)

Remove three solders of leads.

– 3 –

Page 4

SW BOARD

)

screw (P2 × 6)

switch support

SW board

two head bands

head cushion ass

HANGER COVER (L)

two screws

10)

(P2

two screws

(P2

Remove two solders of battery lead.

hanger cover (L

– 4 –

Page 5

SECTION 3

ELECTRICAL ADJUSTMENTS

Note:

1. The adjustments should be performed in the order given.

2. The transmitter (TMR-RF950R) already checked and adjusted should be used.

3-1. Receiving Frequency Check and Adjustment

Preparation:

AF OSC

+ –

–

DC voltmeter

oscilloscope

+ –

ATT

+ –

600

AUDIO IN (Lch) 1 kHz 316 mVrms

TMR-RF950R

Transmitter

Ω

MDR-RF950

5 m

Headphones

[RX-BASE board] – Conductor Side –

Procedure:

1. Set the channel of the transmitter to CH2.

2. Turn OFF the noise filter switch on the transmitter.

3. Enter 1 kHz 316 mVrms signal only to the Lch on the transmitter.

4. Place the transmitter away from the headphone (MDR-RF950) more than 5 m.

5. Set the volume control (RV301) on the RX-BASE board to the minimum position.

6. Set the tuning control (RV302) on the RX-BASE board to the center position.

7. Connect a DC voltmeter and an oscilloscope between IC301 pin @¡ and ground on the RX-BASE board.

8. After confirming that demodulated 1 kHz waveform (about 13 mV) appears on the oscilloscope, check that the DC v oltmeter indicates DC1 V to 1.2 V.

9. If demodulated 1 kHz waveform does not appear on the oscilloscope, or if the voltage is out of the specif ied value, adjust the air-core coil (L301) on the RX-BASE board so that the demodulated 1 kHz waveform appears on the oscilloscope, and under this condition, adjust finely the air-core coil (L301) so that the DC voltmeter indicates DC1.1 V.

10. Finally, check that signals are receiv ed when the channel is changed ov er to CH1/CH3 on the transmitter , then when the tuning control (RV302) on the RX-BASE board is rotated.

Adjustment Location: RX-BASE board (See page 9.)

– 5 –

Page 6

3-2. Degree of Modulation of Main Carrier (L + R) Check and Adjustment

Preparation:

AF OSC

ATT

+ –

–

AC voltmeter

oscilloscope

+ –

600

AUDIO IN (Lch) 1 kHz 316 mVrms

TMR-RF950R

Transmitter

Ω

MDR-RF950

Headphones

[RX-BASE board] – Conductor Side –

Procedure:

1. Set the channel of the transmitter to CH2.

2. Turn OFF the noise filter switch on the transmitter.

3. Enter 1 kHz 316 mVrms signal only to the Lch on the transmitter.

4. Set the volume control (RV301) on the RX-BASE board to the minimum position.

5. Connect an AC voltmeter and an oscilloscope between IC 301 pin @¡ and ground on the RX-BASE board.

6. Rotating the tuning control (RV302) on the RX-BASE board, receive signals.

7. After confirming that demodulated 1 kHz waveform appears on the oscilloscope, check that the AC voltmeter indicates 12 mVrms to 15 mVrms.

8. If out of the specified value, rotate RV404 on the TX-BASE board in the transmitter (TMR-RF950R) so as to attain 13.5 mVrms.

Adjustment Location: TX-BASE board in the transmitter (TMR-RF950R) (See page 8.)

– 6 –

Page 7

3-3. Separation Check and Adjustment

Preparation:

AF OSC

+ –

–

AC voltmeter

oscilloscope

ATT

+ –

600

Ω

AUDIO IN (Lch or Rch) 1 kHz 316 mVrms

TMR-RF950R

Transmitter

MDR-RF950

Headphones

–

[RX-BASE board] – Conductor Side –

Procedure:

1. Set the channel of the transmitter to CH2.

2. Turn OFF the noise filter switch on the transmitter.

3. Enter 1 kHz 316 mVrms signal only to the Lch on the transmitter.

4. Connect an AC voltmeter and an oscilloscope to the Lch speaker output (both ends of MDD01) on the RX-BASE board.

5. Rotating the tuning control (RV302) on the RX-BASE boar d, receive signals.

6. Adjust the volume control (RV301) on the RX-BASE board so that the Lch speaker output (both ends of MDD01) on the RX-BASE board becomes 155 mVrms.

7. Connect an AC voltmeter and oscilloscope to the Rch speaker output (both ends of MDD02) and measure voltage.

8. Check that a difference in speaker output level between Lch and Rch (i. e., separation) is o v er 20 dB. If not o v er 20 dB, rotate RV303 on the RX-BASE board to minimize the Rch output, then reconfirm that a difference in speaker output level between Lch and Rch is over 20 dB.

9. Enter 1kHz 316 mVrms signal only to the Rch on the transmitter.

10. Adjust the volume control (R V301) on the RX-B ASE board so that the Rch speak er output (voltage across MDD02) on the RX-BASE board become 155 mVrms.

11. Connect an AC voltmeter and oscilloscope to the Lch speaker output (both ends of MDD01) and measure voltage.

12. Check that a difference in speaker output level between Lch and Rch (i.e., separation) is over 20 dB.

Adjustment Location: RX-BASE board (See page 9.)

– 7 –

Page 8

Adjustment Location:

Transmitter (TMR-RF950R)

RV404 Degree of Modulation of Main Carrier (L + R) Adjustment

NOISE FILTER

OFF

[TX-BASE board] – Component Side –

S401

J402

(Rch)

J403 (Lch)

S402

CH2

CHANNEL

CH1

CH3

– 8 –

Page 9

SECTION 4

DIAGRAMS

Headphone (MDR-RF950)

[RX-BASE board] – Component Side –

RV302

TUNING

MAX

RV301

VOL

MIN

[RX-BASE board] – Conductor Side –

IC301

• IC Block Diagrams IC301 CXA1611N-T4

L301 Receiving Frequency Adjustment

RV303 Separation Adjustment

IC302 LA4533M

POWER

PWR

R-IN GND

L-IN REG

SWITCH

2 3

BIAS

4 5 6

AMP

MUTE

R-OUT

9 8

GND

L-OUT VCC

– 9 – – 10 –

Page 10

Page 11

Page 12

SECTION 5

EXPLODED VIEWS

NOTE:

• -XX and -X mean standardized parts, so they may have some difference from the original one.

• Color Indication of Appearance Parts Example: KNOB, BALANCE (WHITE) . . . (RED)

↑↑

Parts Color Cabinet's Color

(1) HEADPHONE (R) SECTION

• Items marked “*” are not stocked since they are seldom required for routine service. Some delay should be anticipated when ordering these items.

• The mechanical parts with no reference number in the exploded views are not supplied.

(2) HEADPHONE (L) SECTION

MDD02

Ref. No. Part No. Description Remark

1 4-971-700-01 PAD, EAR 2 X-4950-190-1 PLATE (R) ASSY, FRONT 3 4-999-774-01 REGISTER, HOUSING 4 4-999-773-01 HOUSING (R) 5 4-999-769-11 COVER (R), HANGER

* 6 A-4542-518-A RX-BASE BOARD, COMPLETE

7 4-210-255-01 SUPPORT, SWITCH

* 8 1-670-527-11 SW BOARD

Ref. No. Part No. Description Remark

9 4-999-767-01 HANGER (R) 10 7-685-106-19 SCREW +P 2X10 TYPE2 NON-SLIT 11 4-966-791-11 STOPPER (UPPER) 12 4-966-792-11 STOPPER (LOWER) 13 3-318-203-62 SCREW (B1.7X4), TAPPING

14 7-685-104-19 SCREW +P 2X6 TYPE2 NON-SLIT MDD02 1-505-117-21 DRIVER (R-CH)

Ref. No. Part No. Description Remark

51 4-999-771-01 SUSPENDER 52 4-978-518-02 BASE, SUSPENDER 53 4-978-519-01 CUSHION, HEAD 54 3-318-203-62 SCREW (B1.7X4), TAPPING 55 4-966-792-11 STOPPER (LOWER)

56 4-966-791-11 STOPPER (UPPER) 57 4-999-765-01 BAND, HEAD 58 7-685-106-19 SCREW +P 2X10 TYPE2 NON-SLIT 59 4-999-766-11 HANGER (L) (US) 59 4-999-766-21 HANGER (L) (Canadian)

60 4-210-258-01 TERMINAL (MIDWAY), BATTERY

MDD01

Ref. No. Part No. Description Remark

61 4-210-257-01 TERMINAL (-), BATTERY 62 4-210-256-01 TERMINAL (+), BATTERY 63 4-999-770-11 LID, BATTERY CASE 64 4-999-768-01 COVER (L), HANGER 65 4-999-772-01 HOUSING (L)

66 4-999-774-01 REGISTER, HOUSING 67 X-4950-189-1 PLATE (L) ASSY, FRONT 68 4-971-700-01 PAD, EAR 69 7-685-104-19 SCREW +P 2X6 TYPE2 NON-SLIT MDD01 1-505-117-21 DRIVER (L-CH)

– 15 – – 16 –

Page 13

SECTION 6

ELECTRICAL PARTS LIST

FE RX-BASE

NOTE:

• Due to standardization, replacements in the parts list may be different from the parts specified in the diagrams or the components used on the set.

• -XX and -X mean standardized parts, so they may have some difference from the original one.

• RESISTORS All resistors are in ohms. METAL: Metal-film resistor. METAL OXIDE: Metal oxide-film resistor. F: nonflammable

Ref. No. Part No. Description Remark

FE BOARD

********

(Included in RX-BASE BOARD, COMPLETE)

< CAPACITOR >

C1 1-162-906-11 CERAMIC CHIP 1.5PF 0.25PF 50V C2 1-162-927-11 CERAMIC CHIP 100PF 5% 50V C3 1-162-964-11 CERAMIC CHIP 0.001uF 10% 50V C4 1-162-908-11 CERAMIC CHIP 3PF 0.25PF 50V C5 1-162-918-11 CERAMIC CHIP 18PF 5% 50V

C6 1-162-964-11 CERAMIC CHIP 0.001uF 10% 50V C8 1-162-910-11 CERAMIC CHIP 5PF 0.25PF 50V C9 1-162-920-11 CERAMIC CHIP 27PF 5% 50V C10 1-162-905-11 CERAMIC CHIP 1PF 0.25PF 50V C12 1-162-915-11 CERAMIC CHIP 10PF 0.5PF 50V

C13 1-162-905-11 CERAMIC CHIP 1PF 0.25PF 50V C14 1-162-925-11 CERAMIC CHIP 68PF 5% 50V C15 1-162-927-11 CERAMIC CHIP 100PF 5% 50V C16 1-162-906-11 CERAMIC CHIP 1.5PF 0.25PF 50V C17 1-162-964-11 CERAMIC CHIP 0.001uF 10% 50V

C20 1-162-964-11 CERAMIC CHIP 0.001uF 10% 50V C21 1-162-964-11 CERAMIC CHIP 0.001uF 10% 50V C23 1-162-906-11 CERAMIC CHIP 1.5PF 0.25PF 50V C24 1-162-906-11 CERAMIC CHIP 1.5PF 0.25PF 50V C28 1-162-917-11 CERAMIC CHIP 15PF 5% 50V

C30 1-162-921-11 CERAMIC CHIP 33PF 5% 50V C39 1-162-964-11 CERAMIC CHIP 0.001uF 10% 50V C40 1-162-909-11 CERAMIC CHIP 4PF 0.25PF 50V C41 1-162-910-11 CERAMIC CHIP 5PF 0.25PF 50V C43 1-162-964-11 CERAMIC CHIP 0.001uF 10% 50V

• Items marked “*” are not stocked since they are seldom required for routine service. Some delay should be anticipated when ordering these items.

• SEMICONDUCTORS In each case, u: µ, for example: uA. . : µA. . uPA. . : µPA. . uPB. . : µPB. . uPC. . : µPC. . uPD. . : µPD. .

• CAPACITORS uF: µF

• COILS uH: µH

When indicating parts by reference number, please include the board.

Ref. No. Part No. Description Remark

L2 1-469-237-21 INDUCTOR 0.68uH L3 1-414-665-11 INDUCTOR CHIP 12nH L4 1-414-665-11 INDUCTOR CHIP 12nH L5 1-414-660-11 INDUCTOR CHIP 4.7nH

L6 1-414-660-11 INDUCTOR CHIP 4.7nH

< TRANSISTOR >

Q1 8-729-046-22 FET 3SK240 (TE85L) Q3 8-729-230-81 TRANSISTOR 2SC3606 Q4 8-729-232-73 TRANSISTOR 2SC4320 (TE85L)

< RESISTOR >

R1 1-216-845-11 METAL CHIP 100K 5% 1/16W R4 1-216-853-11 METAL CHIP 470K 5% 1/16W R5 1-216-845-11 METAL CHIP 100K 5% 1/16W R7 1-216-809-11 METAL CHIP 100 5% 1/16W R8 1-218-293-11 RES,CHIP 24K 5% 1/16W

R10 1-216-845-11 METAL CHIP 100K 5% 1/16W R11 1-216-810-11 METAL CHIP 120 5% 1/16W R12 1-216-809-11 METAL CHIP 100 5% 1/16W

< CAPACITOR >

THC1 1-104-511-51 CERAMIC 0.001uF THC2 1-111-231-43 CERAMIC 2PF 99% THC3 1-111-231-43 CERAMIC 2PF 99%

< SAW RESONANTOR >

X1 1-767-906-11 RESONANTOR, SAW

************************************************************

C44 1-162-927-11 CERAMIC CHIP 100PF 5% 50V

< IC >

IC1 8-759-469-63 IC S-81215SGUP-DQK-T1

< RESISTOR >

JR1 1-216-864-11 METAL CHIP 0 5% 1/16W JR2 1-216-864-11 METAL CHIP 0 5% 1/16W

< COIL >

L1 1-469-237-21 INDUCTOR 0.68uH

* A-4542-518-A RX-BASE BOARD, COMPLETE

************************

(Including FE BOARD)

< CAPACITOR >

C301 1-126-154-11 ELECT 47uF 20% 6.3V C302 1-164-489-11 CERAMIC CHIP 0.22uF 10% 16V C303 1-163-239-11 CERAMIC CHIP 33PF 5% 50V C306 1-163-037-11 CERAMIC CHIP 0.022uF 10% 25V C307 1-163-121-11 CERAMIC CHIP 150PF 5% 50V

C309 1-126-572-11 ELECT 4.7uF 20% 35V C310 1-164-004-11 CERAMIC CHIP 0.1uF 10% 25V

– 17 –

Page 14

RX-BASE

Ref. No. Part No. Description Remark

C311 1-163-243-11 CERAMIC CHIP 47PF 5% 50V C312 1-163-021-00 CERAMIC CHIP 0.01uF 10% 50V C313 1-163-113-00 CERAMIC CHIP 68PF 5% 50V

C314 1-163-125-00 CERAMIC CHIP 220PF 5% 50V C315 1-124-233-11 ELECT 10uF 20% 16V C316 1-163-023-00 CERAMIC CHIP 0.015uF 5% 50V C317 1-163-021-00 CERAMIC CHIP 0.01uF 10% 50V C318 1-164-346-11 CERAMIC CHIP 1uF 16V

C319 1-164-505-11 CERAMIC CHIP 2.2uF 16V C320 1-164-346-11 CERAMIC CHIP 1uF 16V C321 1-164-346-11 CERAMIC CHIP 1uF 16V C322 1-124-242-00 ELECT 33uF 20% 25V C323 1-163-243-11 CERAMIC CHIP 47PF 5% 50V

C324 1-164-004-11 CERAMIC CHIP 0.1uF 10% 25V C325 1-164-004-11 CERAMIC CHIP 0.1uF 10% 25V C326 1-124-434-00 ELECT 220uF 20% 4V C327 1-124-434-00 ELECT 220uF 20% 4V C328 1-124-434-00 ELECT 220uF 20% 4V

C329 1-164-346-11 CERAMIC CHIP 1uF 16V C330 1-163-009-11 CERAMIC CHIP 0.001uF 10% 50V C331 1-163-224-11 CERAMIC CHIP 7PF 0.25PF 50V C332 1-163-113-00 CERAMIC CHIP 68PF 5% 50V C333 1-163-021-00 CERAMIC CHIP 0.01uF 10% 50V

Ref. No. Part No. Description Remark

JR311 1-216-295-00 SHORT 0

JR312 1-216-295-00 SHORT 0 JR313 1-216-295-00 SHORT 0 JR314 1-216-295-00 SHORT 0 JR315 1-216-295-00 SHORT 0 JR316 1-216-296-00 SHORT 0

< COIL >

L301 1-416-796-11 COIL, AIR-CORE L302 1-412-933-11 INDUCTOR 0.33uH

< TRANSISTOR >

Q301 8-729-230-49 TRANSISTOR 2SC2712-YG Q302 8-729-230-49 TRANSISTOR 2SC2712-YG Q303 8-729-230-49 TRANSISTOR 2SC2712-YG Q304 8-729-230-49 TRANSISTOR 2SC2712-YG Q305 8-729-230-49 TRANSISTOR 2SC2712-YG

Q306 8-729-920-31 TRANSISTOR DTC343TK Q307 8-729-230-49 TRANSISTOR 2SC2712-YG Q308 8-729-040-78 TRANSISTOR DTA124GKA-T146 Q309 8-729-027-36 TRANSISTOR DTA143XKA-T146

< RESISTOR >

C334 1-124-233-11 ELECT 10uF 20% 16V C335 1-163-245-11 CERAMIC CHIP 56PF 5% 50V C336 1-163-245-11 CERAMIC CHIP 56PF 5% 50V C337 1-163-021-00 CERAMIC CHIP 0.01uF 10% 50V C338 1-163-037-11 CERAMIC CHIP 0.022uF 10% 50V

C339 1-164-489-11 CERAMIC CHIP 0.22uF 10% 16V C340 1-164-346-11 CERAMIC CHIP 1uF 16V C341 1-164-161-11 CERAMIC CHIP 2200PF 5% 50V C350 1-163-021-00 CERAMIC CHIP 0.01uF 10% 50V

< CERAMIC FILTER >

CF301 1-577-588-11 FILTER, CERAMIC CF302 1-567-163-11 FILTER, CERAMIC

< DIODE >

D301 8-719-045-99 DIODE RD2.2M-T1B D302 8-719-002-81 DIODE 1T363 D303 8-719-066-69 LED BR2434D (POWER)

< IC >

IC301 8-752-066-93 IC CXA1611N-T4 IC302 8-759-802-75 IC LA4533M IC303 8-759-195-02 IC TC7S86F-TE85L IC304 8-759-096-87 IC TC7WU04FU(TE12R)

< SHORT >

JR301 1-216-296-00 SHORT 0 JR302 1-216-296-00 SHORT 0 JR303 1-216-296-00 SHORT 0 JR304 1-216-296-00 SHORT 0 JR305 1-216-296-00 SHORT 0

JR306 1-216-295-00 SHORT 0 JR308 1-216-295-00 SHORT 0 JR309 1-216-295-00 SHORT 0 JR310 1-216-295-00 SHORT 0

R301 1-216-121-00 RES,CHIP 1M 5% 1/10W R302 1-216-101-00 METAL CHIP 150K 5% 1/10W R303 1-216-081-00 METAL CHIP 22K 5% 1/10W R304 1-216-061-00 METAL CHIP 3.3K 5% 1/10W R305 1-216-103-00 RES,CHIP 180K 5% 1/10W

R306 1-216-113-00 METAL CHIP 470K 5% 1/10W R307 1-216-097-00 RES,CHIP 100K 5% 1/10W R308 1-216-073-00 METAL CHIP 10K 5% 1/10W R309 1-216-089-00 RES,CHIP 47K 5% 1/10W R310 1-216-041-00 METAL CHIP 470 5% 1/10W

R311 1-216-049-11 RES,CHIP 1K 5% 1/10W R312 1-216-113-00 METAL CHIP 470K 5% 1/10W R313 1-216-061-00 METAL CHIP 3.3K 5% 1/10W R314 1-216-051-00 RES,CHIP 1.2K 5% 1/10W R315 1-216-067-00 METAL CHIP 5.6K 5% 1/10W

R316 1-216-061-00 METAL CHIP 3.3K 5% 1/10W R317 1-216-061-00 METAL CHIP 3.3K 5% 1/10W R318 1-216-067-00 METAL CHIP 5.6K 5% 1/10W R319 1-216-061-00 METAL CHIP 3.3K 5% 1/10W R320 1-216-097-00 RES,CHIP 100K 5% 1/10W

R321 1-216-093-00 METAL CHIP 68K 5% 1/10W R322 1-216-093-00 METAL CHIP 68K 5% 1/10W R323 1-216-125-00 METAL CHIP 1.5M 5% 1/10W R324 1-216-025-00 RES,CHIP 100 5% 1/10W R325 1-216-057-00 METAL CHIP 2.2K 5% 1/10W

R326 1-216-061-00 METAL CHIP 3.3K 5% 1/10W R327 1-216-025-00 RES,CHIP 100 5% 1/10W R328 1-216-077-00 METAL CHIP 15K 5% 1/10W R329 1-216-001-00 METAL CHIP 10 5% 1/10W R330 1-216-001-00 METAL CHIP 10 5% 1/10W

R331 1-216-097-00 RES,CHIP 100K 5% 1/10W R334 1-216-097-00 RES,CHIP 100K 5% 1/10W R335 1-216-029-00 METAL CHIP 150 5% 1/10W R342 1-216-062-11 RES,CHIP 3.6K 5% 1/10W R345 1-216-089-11 METAL CHIP 47K 5% 1/10W

– 18 –

Page 15

RX-BASE SW

Ref. No. Part No. Description Remark

R348 1-216-069-00 METAL CHIP 6.8K 5% 1/10W R349 1-216-001-00 METAL CHIP 10 5% 1/10W R350 1-216-053-00 METAL CHIP 1.5K 5% 1/10W

< VARIABLE RESISTOR >

RV301 1-223-968-11 RES, VAR, CARBON 20K/20K (VOL) RV302 1-225-641-11 RES, VAR, CARBON 10K (TUNING) RV303 1-238-857-11 RES, ADJ, CERMET 22K

************************************************************

* 1-670-527-11 SW BOARD

*********

< SWITCH >

SW1 1-572-467-61 SWITCH, PUSH (1 KEY) (POWER)

************************************************************

MISCELLANEOUS

**************

MDD01 1-505-117-21 DRIVER (L-CH) MDD02 1-505-117-21 DRIVER (R-CH)

Ref. No. Part No. Description Remark

– 19 –

Page 16

MDR-RF950

9-924-925-11

Sony Corporation

Personal A&V Products Company

– 20 –

98F057022-1

Published by Quarity Engineering Dept.

(Shibaura)