Sony MDRRF-940-R Service manual
MDR-RF940R
SERVICE MANUAL
MDR-RF940R is headphones
in MDR-RF940RK.
SPECIFICATIONS
AEP Model
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C during
repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering or
unsoldering
MICROFILM
HEADPHONES
This section is extracted from
instruction manual.
SECTION 1
GENERAL
– 2 –
SECTION 2
DISASSEMBLY
MDR-RF940R
• This set can be disassembled in the order shown below.
SET
Note: Follow the disassembly procedure in the numerical order given.
HOUSING (R)
(Page 3)
HOUSING (L), SW BOARD
(Page 3)
HANGER (R), RX BOARD
(Page 4)
HANGER (L)
(Page 4)
HOUSING (R)
3
two bosses
5
housing (R)
HANGER (R), RX BOARD
3
hanger (R)
4
RX board
5
screw
(PWH 2.6
×
6)
1
two screws
(P 2
6
two head bands
2
two screws
(P 2
×
10)
7
suspender ass’y
×
6)
4
front plate (R)
HOUSING (L), SW BOARD
2
four screws
(P 2
×
6)
3
screw (P 2 × 6)
1
ear pad
5
front plate (L)
2
two screws
(P 2
4
two bosses
×
6)
6
housing (L)
7
SW board
HANGER (L)
2
two screws
(P 2
6
suspender ass’y
×
10)
5
two head bands
1
two screws
×
(P 2
6)
4
screw
(PWH 2.6
3
hanger (L)
×
6)
– 3 –
1
ear pad
– 4 –
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