Sony MDRIF-8000 Service manual

MDR-IF8000

SERVICE MANUAL

Ver 1.0 2002.02

• MDR-IF8000 is the component model block one in MDR-DS8000.

COMPONENT MODEL NAME FOR MDR-DS8000

DIGITAL SURROUND PROCESSOR DP-IF8000 CORDLESS STEREO HEADPHONES MDR-IF8000

US Model

Canadian Model

AEP Model

SPECIFICATIONS

Playback frequency range 12 – 24,000 Hz Power requirements Rechargeable nickel metal hydride

batteries (supplied or sold separately) or R6 (size AA) alkaline batteries

Mass Approx.350 g (10 oz)(including the

suppliedrechargable nickel-metal hydride batteries)

9-873-527-01

CORDLESS STEREO HEADPHONES

Sony Corporation

Parsonal Audio Company Published by Sony Engineering Corporation

MDR-IF8000

Notes on chip component replacement

• Never reuse a disconnected chip component.

• Notice that the minus side of a tantalum capacitor may be damaged by heat.

Flexible Circuit Board Repairing

• Keep the temperature of soldering iron around 270˚C during repairing.

• Do not touch the soldering iron on the same conductor of the circuit board (within 3 times).

• Be careful not to apply force on the conductor when soldering or unsoldering.

Repair MDR-IF8000 and DP-IF8000 in a pair.

TABLE OF CONTENTS

1. GENERAL .......................................................................... 2

2. DISASSEMBLY

2-1. Hanger (R) .......................................................................... 3

2-2. VOL Board, RX1 Board, RX2 Board ................................. 3

2-3. PD1 Board........................................................................... 4

2-4. Driver ASSY (SP31) (R-ch Section),

DriverASSY (SP11) (L-ch Section)..................................... 4

2-5. Hanger (L), Headband (R) ASSY, Headband (F) ASSY,

SW Board ............................................................................ 5

3. ELECTRICAL ADJUSTMENTS ................................. 6

4. DIAGRAMS

4-1. Block Diagrams ...................................................................7

4-2. Printed Wiring Board – RX1 Section – ...............................8

4-3. Schematic Diagram – RX1 Section – .................................9

4-4. Printed Wiring Board – RX2 Section – ............................10

4-5. Schematic Diagram – RX2 Section (1/2) – ....................... 11

4-6. Schematic Diagram – RX2 Section (2/2) – ....................... 12

5. EXPLODED VIEWS

5-1. Driver Section.................................................................... 14

5-2. Hanger Section .................................................................. 15

LOCA TING THE CONTROLS

SECTION 1

GENERAL

1 Infrared sensor

There are infrared sensors in two locations on both sides.

2 Battery case

Press and lift up the lid to open it. This battery case is for the supplied rechargeable batteries and R6 (size AA) alkaline batteries only.

3 Self-adjusting band

The headphones automatically turn on when you put on the headphones.

4 POWER indicator

By pulling up the self-adjusting band, the indicator lights red when battery power is sufficient.

6. ELECTRICAL PARTS LIST ........................................16

This section is extracted from instruction manual.

6 7

5 RESET button (See page 21 for

details)

Use to reset the location information of the head tracking function.

6 HEAD TRACKING switch (See page

21 for details)

To activate the head tracking function, switch it to ON when the output mode of the processor is set to VIRTUAL (other than OFF).

7 VOL (Volume) control

Use to adjust the volume.

8 Ear pad (right) 9 Ear pad (left)

SECTION 2

Remove solder (four places)

Hanger (R)

Hanger lid (R) ASSY

Screw (+P 2X8)

Chassis

Lid (R), rear

Screw (+P 2X5)

Two screws (+P 2X5)

Screw (+P 2X8)

DISASSEMBLY

• The equipment can be removed using the following procedure.

Driver ASSY (SP31) (R-CH SECTION)

MDR-IF8000

Hanger (R)

VOL board, RX1 board, RX2 board

Set

Hanger (L)

PD2 board Head band (R) ASSY, Head band (F) ASSY, SW board

Driver ASSY (SP11) (L-CH SECTION)

Note : Follow the disassembly procedure in the numerical order given.

2-1. HANGER (R)

PD1 board

2-2. VOL BOARD, RX1 BOARD, RX2 BOARD

Lid (R), rear

RX2 board

VOL board

Remove solder (six places)

CN502

RX1 board

chassis

MDR-IF8000

2-3. PD1 BOARD

• Can remove PD2 board with similar method.

Screw (M1.7X5)

PD1 board

Window, ray catcher

Remove solder (two places)

2-4. DRIVER ASSY (SP31) (R-CH SECTION), DRIVER ASSY (SP11) (L-CH SECTION)

• Can remove driver ASSY (SP11) L-CH with similar method.

Pad, ear

Tow screws (M1.7X5)

Claw

Ring (ear pad R)

Driver ASSY (SP31)

Screw (+P2X5)

Attach the cushion

Cushion

Applied the bond in outside lap with 2mm width

Bond: Sony bond SC608LV (7-432-912-52)

Claw

Remove solder (two places)

Driver ASSY

Plate, support

Three screws (+P2X5)

Claw

Frame (R) ASS

2-5. HANGER (L), HEADBAND (R) ASSY, HEAD BAND (F) ASSY, SW BOARD

Headband (F) ASSY

R-CH section

Headband (R) ASSY

Screw (+P2X4)

Remove solder

(two places)

Lid (R), rear

Screw (+P2X4)

Two screws (+P2X5)

Screw (+P2X8)

Screw (+P2X5)

SW board

Hanger (L)

L-CH section

MDR-IF8000

C129

RV121

R104

C108

C105

R137

R136

R107

C145

C101

C136

C134

R130

R128

R103

C131

C130

C132

C102

C115

C104

C103

L153

R140

IC101

C133

C114

C116

L152

C109

C107

R153

SECTION 3

ELECTRICAL ADJUSTMENT

0dB=0.775V

CAUTION:

1. Apply a 2.4 volt DC supply voltage.

2. Use the processor section (DP-IF8000) as a test jig to align the headphones (MDR-IF8000).

[BPF ADJUSTMENT]

Setup:

1. Set the processor section (DP-IF8000) to test mode, and generate a -10dB signal. (Refer to the DP-IF8000 service manual.)

2. Adjust RV11 (VOLUME) on the VOL board to a minimum.

Connection and adjustment points:

RX2 BOARD (SIDE B)

Spectrum analyzer

RV121

Procedure

1. Connect a spectrum analyzer to the RX2 board as shown in the above drawing.

2. Adjust the spectrum analyzer output waveform by rotating R V121 so that the center of the waveform is 4.5 MHz with a uniform balance on both sidebands.

about 25dB

about 1.25MHz

4.5MHz

about 1.25MHz

+ 14 hidden pages