Sony ICDST-25 Service manual

ICD-ST25
SERVICE MANUAL
Ver 1.0 2004.03
SPECIFICATIONS
Recording media Built-in flash memory 32MB,
Recording time See page 11. Frequency range • ST: 80 Hz - 13,500 Hz
Speaker Approx. 28 mm (1 Power output 300 mW Input/Output • Microphone jack (minijack, stereo)
Playback speed control +100% to -50% (DPC) Power requirements Two LR03 (size AAA) alkaline batteries: 3 V DC Dimensions (w/h/d)
Mass (incl. batteries) 75 g (2.65 oz) Supplied accessories Stereo Ear Receiver × 1
Design and specifications are subject to change without notice.
Stereo/Monaural recording
• SP: 80 Hz - 7,000 Hz
• LP: 80 Hz - 3,500 Hz
– input for plug in power, minimum input level
0.6 mV, 3 kilohms or lower impedance microphone
• Headphones jack (minijack, stereo) output
for 8 - 300 ohms ear receiver
• USB connector
DC IN 3V jack (excluding the Korean and the People’s Republic of China models)
(not incl. projecting parts and controls)
41.5 × 103.6 × 13.3 mm (1 11/16 × 4 1/8 × 17/
USB Connecting cable × 1 Application Software (CD-ROM) × 1 Carring Case x 1 LR03 (size AAA) alkaline batteries × 2*
*For the United States model only
1
/8 in.) dia.
US Model
Canadian Model
UK Model
Korea Model
Tourist Model
in.)
32
9-877-590-01
2004C1678-1 © 2004.03
IC RECORDER
Sony Corporation
Personal Audio Company Published by Sony Engineering Corporation
ICD-ST25

TABLE OF CONTENTS

1. GENERAL ·········································································· 3
2. DISASSEMBLY
2-1. Case Block Assy ··························································· 4 2-2. F-SW Board ·································································· 5 2-3. MAIN Board ································································· 5 2-4. S-SW Board, Microphone Block Assy ························· 6 2-5. Microphone Unit··························································· 7 2-6. The Cautions At The Time Of A Microphone
Block Assy··································································· 8
3. TEST MODE······································································ 9
4. DIAGRAMS
4-1. Block Diagrams
– MAIN Section -1 – ·················································· 13 – MAIN Section -2 – ·················································· 14
– PANEL/POWER Section –······································ 15 4-2. Printed Wiring Board – MAIN Board (Side A) – ······· 16 4-3. Printed Wiring Board – MAIN Board (Side B) – ······· 17 4-4. Printed Wiring Board – F-SW Board –······················· 18 4-5. Printed Wiring Board – S-SW Board –······················· 19 4-6. Schematic Diagram – MAIN Board (1/5) – ··············· 20 4-7. Schematic Diagram – MAIN Board (2/5) – ··············· 21 4-8. Schematic Diagram – MAIN Board (3/5) – ··············· 22 4-9. Schematic Diagram – MAIN Board (4/5) – ··············· 23 4-10. Schematic Diagram – MAIN Board (5/5) – ··············· 24 4-11. IC Pin Function Descriptions······································ 29
5. EXPLODED VIEWS
5-1. Upper Lid Block ························································· 34 5-2. Case Block ·································································· 35
6. ELECTRICAL PARTS LIST······································· 36
Notes on chip component replacement
•Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam­aged by heat.
Replacement of IC6001 used in this set requires a special tool.
The voltage and waveform of CSP (chip size package) cannot be measured, because its lead layout is different from that of con ven­tional IC.
Lead layouts
surface
Lead layout of
conventional IC
Unleaded solder
Boards requiring use of unleaded solder are printed with the lead­free mark (LF) indicating the solder contains no lead. (Caution: Some printed circuit boards may not come printed with the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40°C higher than ordinary solder. Ordinary soldering irons can be used but the iron tip has to be applied to the solder joint for a slightly longer time. Soldering irons using a temperature regulator should be set to about 350°C. Caution: The printed pattern (copper foil) may peel away if the heated tip is applied for too long, so be careful!
• Strong viscosity Unleaded solder is more viscous (sticky , less prone to flow) than ordinary solder so use caution not to let solder bridges occur such as on IC pins, etc.
• Usable with ordinary solder It is best to use only unleaded solder but unleaded solder may also be added to ordinary solder.
CSP (chip size package)
2
Index to Parts and Controls
2 Press the jog lever (x•B).
The month digits will flash.
3 Set the month and day in
sequence, then press the jog lever (xB). The hour digits will flash.
5
Set the time.
1 Press the jog lever up or down
(>/.) to select the digits of the hour.
2 Press the jog lever (x•B).
The minute digits will flash.
3 Set the minute. 4 Press the jog lever (xB).
The menu mode will be
displayed again.
Note
If you do not press the jog lever (xB) for more than one minute, the clock setting mode is cancelled and the window will return to normal display.
6
Turn the jog lever toward MENU.
The window will return to normal display.
1 If the unit is left unused for more than 3
seconds in the stop mode after the clock is set, the display will show the current time (page 27).
v
Refer to the pages indicated in parentheses for details.
Front
SECTION 1

GENERAL

Rear
ICD-ST25
This section is extracted from instruction manual.
qj
qk
ql
wa
1 Built-in microphone (12, 14) 2 Built-in microphone (12, 14) 3 OPR (operation) indicator
(12, 20)
4 DIRECTNL (directional)
switch (14)
5 ERASE button (37) 6 A-B
button (34, 44)
7 DIVIDE/
button (33, 40)
8 Display window (24) 9 DPC ON/OFF switch (31)
Step 2: Setting the Clock
You need to set the clock to use the alarm function or record the date and time. Clock setting display appears when you insert batteries for the first time, or when you insert batteries after the unit has been without batteries for a certain period of time. In this case, proceed from step 4.
1
Turn the jog lever toward MENU.
The menu mode will be displayed in the display window.
2
Press the jog lever up or down (>/.) to select “SET DATE”.
(repeat)/PRIORITY
(bookmark)
Jog lever
Press down (.).
0 Speaker
K zREC (record) /REC
PAUSE button (12, 35)
L xSTOP button (13, 21) M Jog lever
FOLDER/MENU/
.(review/fast backward)/ > (cue/fast forward)/ xB (play/stop•enter)
N VOICE UP (Digital Voice
Up) switch (30)
O VOL (volume) +/– buttons
(20)
Press up (>).
Turn toward MENU.
Press the center (xB).
w;
qh USB connector (56) qj m (microphone) jack (17) qk i (headphones) jack (18, 20) ql HOLD switch (29, 51) w;
DC IN 3V jack (6)
For Korean and the People’s
( Republic of China Models, this jack does not exist.)
wa
Battery compartment (6)
3
Press the jog lever (x•B).
The date and time setting window is displayed. The year digits will flash.
4
Set the date.
1 Press the jog lever up or down
>/.
( the year.
) to select the digits of
3
ICD-ST25
Note : Disassemble the unit in the order as shown below.
SET
2-1. CASE BLOCK ASSY (Page 4)
SECTION 2

DISASSEMBLY

2-3. MAIN BOARD (Page 5)
2-4. S-SW BOARD, MICROPHONE BLOCK ASSY (Page 6)
2-5. MICROPHONE UNIT (Page 7)
Note : Follow the disassembly procedure in the numerical order given.

2-1. CASE BLOCK ASSY

1
two screws
(+B 1.7
×
7)
2-2. F-SW BOARD (Page 5)
two claws
claw
3
Remove two solders
of the MAIN board.
two claws
claw
4
case block assy
2
claw
flexible board
4

2-2. F-SW BOARD

d
1
two screws
(1.7 × 2.5)
2
speaker (2.8cm)(SP3001)
3
tapping screw
(1.7 × 2.5)
4
F-SW boar
ICD-ST25

2-3. MAIN BOARD

5
MAIN board
4
5
upper lid block assy
1
flexible board of
microphone unit
2
flexible board
3
case assy
claw
5
ICD-ST25
y

2-4. S-SW BOARD, MICROPHONE BLOCK ASSY

6
ornament (L)
5
S-SW board
4
button (5D)
7
microphone block assy
2
tapping pan screw
(M1.4
3
ornament (R) block ass
1
×
3)
lid (connector)
6

2-5. MICROPHONE UNIT

t
4
Microphone part is turned in the direction of arrow A,
and it removes in the direction of arrow
screw hole part
B
8
microphone cushion
B
.
7
microphone cover
9
microphone uni
0
microphone case
ICD-ST25
adhesive sheet
3
Microphone unit flexible
board is removed.
A
2
1
pan
tapping screw
(M1.4
click plate
×
2)
6
pan
(M1.4
5
microphone base
tapping screw
×
4.5)
7
ICD-ST25

2-6. THE CAUTIONS AT THE TIME OF A MICROPHONE BLOCK ASSY

microphone unit
flexible board
microphone base
2
It inserts in a microphone base.
screw hole part
3
It turns in the direction of an arrow.
click plate
microphone cover
1
pan
tapping screw
(M1.4
microphone cushion
microphone unit
microphone case
×
4.5)
4
pan
tapping screw
(M1.4
×
2)
microphone base
8
SECTION 3
DSP STEREO through mode / MIC : L / MUTE : ON / VOL-LEVEL : 12
t "L / on / 12 / DSP ST"
DSP MONO through mode / MIC : H / MUTE : OFF / VOL-LEVEL : 23
t "H / oF / 23 / DSP MO"
1k sine wave output mode / MUTE : ON / VOL-LEVEL : 06 t "on / 06 / SIN"
:
:
DSP MO SIN DSP ST
AU IO DSP ST
23
DSP MO
oF
H
m
12
DSP ST
on
L
m
06
SIN
on
.
>
(select), (set)
x
x x x
x B
x B

TEST MODE

ICD-ST25
[Setting Method of the Test Mode]
To enter the test mode, turn on the HOLD . switch while pressing the x key and VOL+ key at the same time with the power on.
[Exiting Method of the Test Mode]
Exit the test mode by turning off the power.
[Initial Status of the Test Mode]
When the test mode is set, the LCD display appears as shown below .
LCD display (Example)
69
101
01ST25
69 101 01 ST25
Iris(DSP) version : 69 SakuraR(CPU) version : 1.01 LPEC ST version : 01 Model code : ST25
[Flow Chart of the Test Mode]
START
TEST MODE
>
.
.
>
>
>
>
>
RST
MENU
.
KEY
COUNT
.
USB
.
LED
.
BATTKEY
.
.
AU IO
.
.
.
LCD
SLEEP
BEEP
RTC
>
>
>
>
Initial status of test mode
Model code, LPEC ST,
>
F/W version display
>
.
[Operation in the Test Mode]
After entering the test mode, you can move within the test menu by pressing the . / > key. You can move to the submenu by pressing the xB key. Then each test mode can be executed.
1. LCD test
• LCD is tested of all light-on and all light-off.
x B x B
LCD
x
ALL
LCD
:
OFF LCD CHK LCD ALL LCD
:
>
.
CBA
H
STSP
M
m
L
★ ★
88
YM
888888
D E
REC
888
MM DS
LP
(select), (set)
(LCD off)
x x x
CHK
START
.
CHK
END
>
2. Audio test
Perform the through-playback and sine wave output.
• Contents of the submenu DSP ST: DSP STEREO through mode DSP MO: DSP MONO through mode SIN: 1 kHz sine wave output mode
• Select the microphone sensitivity with the A-B HtLtHtLtHt
...
switch.
•The VOR detection operation can be checked by the LED. Sound: The red LED is turned on. No sound: The red LED is
turned off.
• MUTE can be set to “ON” or “OFF” with the ERASE key.
•The sound volume can be adjusted with the VOL+ key or
VOL- key during the audio test except the MUTE mode.
• In the directional microphone selection, ON/OFF of the
DIRECTNL switch is performed with the DIVIDE key. DIRECTNL switch ON : The green LED is turned on.
OFF : The green LED is turned off.
• In the audio test mode the operation is performed according to
JACK detection.
•The microphone sensitivity, sound volume and MUTE (on/off)
are displayed on the LCD.
•The microphone sensitivity selection and the VOR test are
effective in the through-playback mode.
•The directional microphone selection is effective in the DSP
MONO through mode.
Turn off the power (Extract the batteries or DC jack)
END
TEST MODE
9
ICD-ST25
ON
LED
LED
x
x B
USB
OFF
VBUS
ON
VBUS
PC
LINK
HOLD.
ON
x
Suspend mode
cut Vbuscut Vbus
Vbus
on
x B
RST
MENU
KEY
PUSH INIT
OK
ALL
x
All keys are entered
In the case that the initialization and reset operation end correctly.
(blinking)
x B
3. Sleep test
•Pressing the xB key causes the set to enter the sleep state.
•When the HOLD . switch is ON, the LCD is turned off. When OFF, the LCD is turned on.
•Press any keys to exit the sleep state.
x B
(with HOLD.
OFF status)
SLEEP
x B
(with HOLD.
ON status)
SOON
INSLEEP
(LCD OFF)
any keys any keys
4. Beep test
• Beep sound of 1.3 kHz or 2 kHz is output.
>
x B
BEEP 1.3K
x
2.0K
1.3K
: :
.
(select), (set)
x B
1.3K 2.0K
x x
7. Battery remaining power and DC IN test
•The detected A/D value (hexadecimal) of the battery remaining power is displayed. When DC jack is inserted, the battery mark on the LCD is turned off.
DC jack
x B
x
FF
BATTBATT BATTBATT
is inserted
DC jack is extracted
8. LED test
• LEDs (OPR: red and green, BL: green) are all turned on.
9. USB test
• When the menu starts the USB self-check, either presence or absence of the Vbus is judged. (Vbus is present: “ON VBUS”, Vbus is absent: “OFF VBUS”)
•The USB driver always works re gardless of presence or absence of the USB signal only when Vbus is available during the USB test. At this time, turning on HOLD . causes the set to mov e to the suspend state. Turning of f the Vb us causes the set to return to the test menu.
• In the menumode if the Vbus is supplied, any key will not w ork. Therefore the Vbus will be supplied after surely pressing the xB key.
5. RTC test
•Perform the function test of the RTC and EEPROM. (1) RTC EEPROM test
Confirmation of writing, reading (verifying) and erasing of arbitrary data with the specified registers.
(2) RTC clock function test
Confirmation that RTC updates the time to the microcomputer at one second interval.
• OK, NG judgement is performed to the test result. When NG, it is displayed which device RTC or EEPROM becomes NG.
(All OK : "RTC OK" / RTC NG : "RTC BAD" / EEPROM NG : "EEP BAD")
x B
OK
RTC
x
RTC
6. Key entry test
•When the any key is pressed, the entry ke y and the A/D converted
value (hexadecimal) of the three channel keys are displayed.
•When the x key is pressed, the A/D value of the ke y is displayed
while the key is depressed. When the key is released, the screen returns to the test menu.
x B
oFFFF
KEYiFFKEY
x
10. Menu reset
•Pressing the xB key causes the set to enter the menu
initialization standby state.
•When the following keys are all entered, the EEPROM initialization (returning setting in the menu and user name to default value) and formatting process (deleting all message files in the flash memory) are executed. At the same time, the W ak eUp signal is checked, too.
Check keys: VOL- , VOL+ , A-B , ERASE ,
DIVIDE , DPC ON , DPC OFF , . ,
x•B , > , FOLDER , MENU , x ,
z REC , HOLD
OFF ,
DIRECTNL ON
.
ON , HOLD
, and DIRECTNL
.
OFF, VOICE UP ON, VOICE UP OFF
• If all tests end in success, “-ALLOK-” is displayed. If initialization in the EEPROM is NG, “INIT. NG” appears.
•Turn off the power to exit the test mode.
10
11. Key durable test
•Pressing the xB key makes the count to "------" and sets test
standby status. Once more pressing the xB key mak es the count to "000000" and sets the key durable test. In this mode any key input and slide switch operation are counted and the number is displayed. Turn off the power to exit this mode.
any keys or slide switches operation
x B x B
KEY
COUNT
KEY
------
x
KEY
000000
Key durable test
KEY
000001
ICD-ST25
11
ICD-ST25
SECTION 4

DIAGRAMS

Note on Schematic Diagrams:
• All capacitors are in µF unless otherwise noted. pF: µµF 50 WV or less are not indicated except for electrolytics and tantalums.
• All resistors are in and 1/ specified.
f
C : panel designation.
A : B+ Line.
•Power voltage is dc 3V and fed with regulated dc power
•Voltages and waveforms are dc with respect to ground
•Voltages are taken with a VOM (Input impedance 10 M).
•Wav eforms are taken with a oscilloscope.
• Circled numbers refer to waveforms.
• Signal path.
Replacement of IC6001 used in this set requires a spe-
The voltage and waveform of CSP (chip size package)
: internal component.
supply from DC IN jack (J5001). under no-signal (detuned) conditions.
no mark : PB []: REC
Voltage variations may be noted due to normal produc­tion tolerances.
Voltage variations may be noted due to normal produc­tion tolerances.
F : PB L : REC
cial tool. cannot be measured, because its lead layout is different
from that of conventional IC.
: Impossible to measure
4
W or less unless otherwise
Note on Printed Wiring Boards:
Y : parts extracted from the conductor side.
b : Pattern from the side which enables seeing.
The other layers’ patterns are not indicated.
Caution: Pattern face side: Parts on the pattern face side seen from (SIDE B) the pattern face are indicated. Parts face side: Parts on the parts face side seen from (SIDE A) the parts face are indicated.
MAIN board is multi-layer printed board. However, the patterns of intermediate-layer have not been included in the diagram.
Replacement of IC6001 used in this set requires a spe-
cial tool.
Lead layouts
surface
Lead layout of
conventional IC
CSP (chip size package)
• WA VEFORMS
1
IC6003 3 (XXT)
88.5 ns
1 V/DIV, 40 ns/DIV
2
IC6003 1 (FOUT)
1 V/DIV, 40 ns/DIV
88.5 ns
3.3 Vp-p
4.1 Vp-p
3
IC3004 6 (MCLK)
1 V/DIV, 40 ns/DIV
4
IC7003 <z/, (XTAL)
1 V/DIV, 100 ns/DIV
88.5 ns
244 ns
4.1 Vp-p
3.4 Vp-p
5
IC8001 qd (X OUT)
(When the USB is connected)
8.33 ns
1 V/DIV, 40 ns/DIV
6
IC7004 5 (FOUT)
1 V/DIV, 10 µs/DIV
3.7 Vp-p
3.2 Vp-p
30.5 ns
12

4-1. BLOCK DIAGRAMS – MAIN SECTION -1 –

MIC1
(ZOOM)
MIC2
(L-CH)
MIC3
(R-CH)
J3001
m
PLUG IN POWER
Q3002
Q3004
4
2
IC3002
MIC AMP
IN+
REG
OUT
STBY
ICD-ST25
6
3
26
6
24
29
2
1
MICVCC
INTINL
INTINR
EXTINR
EXTINL
CTL1
IC3001
MIC AMP
OUTL
OUTR
INT/EXT
VCC
IC3004
ADC, DAC, HEADPHONE AMP
AINR2
25
STDO
BICK
LRCK
SDTI
9
7
5
8
AINL2
26
13
17
Q3001
16
Q5008
7
B+ SWITCH
AVDD
AINL1
28
AINR1
27
STDO
BCLK
LRCK
A
SO
XRST
J3002
SP3001
(SPEAKER)
B
POWER AMP
5
VO1
8
VO2
D902
(OPR)
(REC/PB)
XBATTEN
IC3003
XSHUT-
DOWN
4
-IN
1
RED(REC)
GREEN(PB)
13
8
6
5
12
3
2
SI/PO DRIVER
MONOMIC
SPAMP
XREDLED
XGRLED
XBATTEN
CLK
DATA
IC7001
XADAPDN
XDSPRST
Q3003 MUTE
HPMUTE
XSTMIC
XLIGHT1
XLIGHT2
MCLK
CDTI
CCLK
MIN
CSN
IC6003
CLOCK GEN
XT
FOUT
XXT XCONT
6
4
3
18
2
1
HPR
14
HPL
15
MOUT
17
PDN
1
X6001
11.2896MHz 5
15
7
9
11
4
14
D7002
(LCD PANEL LIGHT)
D7003
3 4
MCLK
IC7004
REAL TIME CLOCK
CLK
9
XIRQ
DI
7
DO
8
FOUT
CE
10
Signal path
: PB
: REC
3
5
46
HPJACK
115
SPICLK
45
SPIDATA
IC7003 (1/3)
CPU
XMICJACK
DSPSYSCLK
102
18
XADACS
BEEP
100
AUSCK
99
AUSOT
98
10112116
AUSIN
RTCCS
13
X0A32K
111
XRTCINTR
1313
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