Personal Audio Company
Published by Sony Engineering Corporation
ICD-ST10/ST20
TABLE OF CONTENTS
1. GENERAL ·········································································· 3
2. DISASSEMBLY
2-1. Upper Lid Block Assembly ·········································· 4
2-2. F-SW Board ·································································· 5
2-3. MAIN Board ································································· 5
2-4. S-SW Board, Microphone Block Assembly ················· 6
2-5. Microphone Unit··························································· 6
2-6. The Cautions at the Time of a Microphone Block
– Main Section-1 –······················································12
– Main Section-2 –······················································13
– Panel/Power Section – ············································· 14
4-2. Printed Wiring Board – MAIN Board (Side A) – ······· 15
4-3. Printed Wiring Board – MAIN Board (Side B) –······· 16
4-4. Printed Wiring Board – F-SW Board – ······················· 17
4-5. Printed Wiring Board – S-SW Board – ······················· 18
4-6. Schematic Diagram – MAIN Board (1/5) – ··············· 19
4-7. Schematic Diagram – MAIN Board (2/5) – ··············· 20
4-8. Schematic Diagram – MAIN Board (3/5) – ··············· 21
4-9. Schematic Diagram – MAIN Board (4/5) – ··············· 22
4-10. Schematic Diagram – MAIN Board (5/5) – ··············· 23
4-11. IC Block Diagrams ····················································· 24
4-12. IC Pin Function Descriptions······································ 27
Flexible Circuit Board Repairing
•Keep the temperature of the soldering iron around 270°C during
repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering or
unsoldering.
Notes on chip component replacement
•Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be damaged by heat.
✩Replacement of IC6001 used in this set requires a special tool.
• The voltage and waveform of CSP (chip size package) cannot be
measured, because its lead layout is diff erent from that of con v entional IC.
• Lead layouts
surface
Lead layout of
conventional IC
CSP (chip size package)
5. EXPLODED VIEWS
5-1. Upper Lid Block ························································· 32
5-2. Case Block ·································································· 33
6. ELECTRICAL PARTS LIST ······································· 34
Unleaded solder
Boards requiring use of unleaded solder are printed with the leadfree mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40°C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350°C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow) than
ordinary solder so use caution not to let solder bridges occur such
as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
2
Index to Parts and Controls
2 Press the jog lever (x•B).
The month digits will flash.
3 Set the month and day in
sequence, then press the jog lever
(x•B).
The hour digits will flash.
5
Set the time.
1 Press the jog lever up or down
(>/.)toselect the digits of
the hour.
2 Press the jog lever (x•B).
The minute digits will flash.
3 Set the minute.
4 Press the jog lever (x•B).
The menu mode will be
displayed again.
Note
If you do not press the jog lever
(x•B) for more than one minute,
the clock setting mode is cancelled
and the window will return to
normal display.
6
Turnthe jog lever toward
MENU.
The window will return to normal
display.
1 If the unit is left unused for more than 3
seconds in the stop mode after the clock
is set, the display will show the current
time.
v
Refer to the pages indicated in parentheses for details.
Front
1
2
3
4
5
6
7
8
9
0
K
L
M
N
O
SECTION 1
GENERAL
Rear
ICD-ST10/ST20
This section is extracted from
instruction manual.
You need to set the clock to use the alarm function or record the date and
time.
Clock setting display appears when you insert batteries for the first time,
or when you insert batteries after the unit has been without batteries for a
certain period of time. In this case, proceed from step 4.
1
Turn the jog lever toward
MENU.
The menu mode will be displayed in
the display window.
2
Press the jog lever up or down
(>/.
3
Press the jog lever (x•B).
The date and time setting window is
displayed. The year digits will flash.
4
Set the date.
1 Press the jog lever up or down
) to select “SET DATE”.
(
>/.
the year.
Jog lever
Press up (>).
Press down (.).
) to select the digits of
K zREC (record) /REC
PAUSE button
L xSTOP button
M Jog lever
FOLDER/MENU/
.(review/fast backward)/
> (cue/fast forward)/
x• B (play/stop•enter)
N VOL (volume) +/– buttons
O USB connector
Turn toward MENU.
Press the center
(x•B).
S
P m (microphone) jack
Q i (headphones) jack
R HOLD switch
S DC IN 3V jack
T Battery compartment
3
ICD-ST10/ST20
Note : Disassemble the unit in the order as shown below.
SET
UPPER LID BLOCK ASSEMBLY
SECTION 2
DISASSEMBLY
MAIN BOARD
MICROPHONE BLOCK ASSEMBLY
S-SW BOARD,
MICROPHONE UNIT
Note : Follow the disassembly procedure in the numerical order given.
2-1. Upper Lid Block Assembly
1
two tapping screws
(B 1.7
×
7)
two claws
F-SW BOARD
claw
3
Remove the
two solderings.
2
flexible board
two claws
claw
claw
4
upper lid block assembly
4
2-2. F-SW Board
d
2
(SP3001)
1
two screws
(1.7 × 2.5)
speaker (2.8 cm)
3
tapping screw
(1.7 × 2.5)
4
F-SW board
ICD-ST10/ST20
2-3. MAIN Board
5
MAIN board
4
5
upper lid sub block assembly
1
microphone unit
flexible board
2
flexible boar
3
claw
case block
5
ICD-ST10/ST20
y
n
2-4. S-SW Board, Microphone Block Assembly
6
ornament (L)
5
S-SW board
4
button (5D)
7
microphone block assembl
2
pan tapping screw
(M 1.4 × 3)
2-5. Microphone Unit
4
Microphone part is turned in the direction of arrow A,
and it removes in the direction of arrow B.
screw hole part
B
A
2
click plate
3
1
lid (connector)
ornament (R)
7
microphone case
8
microphone cushio
9
microphone unit
q;
microphone cover
3
Microphone unit flexible
board is removed.
6
adhesive sheet
1
pan tapping screw
(M 1.4 × 2)
6
pan tapping screw
(M 1.4 × 4.5)
5
microphone base
2-6. The Cautions at the Time of a Microphone Block Assembly
2
microphone unit
flexible board
It inserts in a microphone base.
screw hole part
3
It turns in the direction of an arrow.
microphone case
1
pan tapping screw
(M 1.4
×
4.5)
ICD-ST10/ST20
microphone cushion
microphone unit
microphone cover
click plate
4
pan tapping screw
×
(M 1.4
2)
microphone base
7
ICD-ST10/ST20
SECTION 3
TEST MODE
[Setting Method of the Test Mode]
To enter the test mode, turn on the HOLD . switch while pressing
the x key and VOL+ key at the same time with the power on.
[Exiting Method of the Test Mode]
Exit the test mode by turning off the power.
[Initial Status of the Test Mode]
When the test mode is set, the LCD display appears as shown below.
LCD display (Example)
A B
5A
102
01ST20
5A
102
01
ST20
Iris(DSP) version : 5A
SakuraR(CPU) version : 1.02
(In α version or β version, A or B is displayed)
LPEC ST version : 01
Model code : ST20
[Flow Chart of the Test Mode]
START
TEST MODE
>
.
.
>
>
>
>
>
RST
MENU
.
KEY
COUNT
.
USB
.
LED
.
BATTKEY
.
.
AU IO
.
.
.
LCD
SLEEP
BEEP
RTC
>
>
>
>
Initial status of test mode
Model code, LPEC ST,
>
F/W version display
>
.
[Operation in the Test Mode]
After entering the test mode, you can move within the test menu by
pressing the . / > key. You can move to the submenu by
pressing the x•B key. Then each test mode can be executed.
1. LCD test
• LCD is tested of all light-on and all light-off.
x Bx B
LCD
x
ALL
LCD
:
OFF LCD
CHK LCD
ALL LCD
:
>
.
CBA
H
STSP
M
m
L
★
★
88
★
YM
888888
D E
REC
888
MM DS
LP
(select),(set)
(LCD off)
xxx
CHK
START
.
CHK
END
>
2. Audio test
Perform the through-playback and sine wave output.
• Contents of the submenu
DSP ST: DSP STEREO through mode
DSP MO: DSP MONO through mode
SIN: 1 kHz sine wave output mode
• Select the microphone sensitivity with the A-B
HtMtLtHtMt
...
switch.
•The VOR detection operation can be checked by the LED.
Sound: The red LED is turned on. No sound: The red LED is
turned off.
• MUTE can be set to “ON” or “OFF” with the ERASE key.
•The sound volume can be adjusted with the VOL+ key or
VOL- key during the audio test except the MUTE mode.
• In the directional microphone selection, ON/OFF of the
DIRECTNL switch is performed with the DIVIDE key.
DIRECTNL switch ON : The green LED is turned on.
OFF : The green LED is turned off.
• In the audio test mode the operation is performed according to
JACK detection.
•The microphone sensitivity, sound volume and MUTE (on/off)
are displayed on the LCD.
•The microphone sensitivity selection and the VOR test are
effective in the through-playback mode.
•The directional microphone selection is effective in the DSP
MONO through mode.
Tu rn off the power
(Extract the batteries or DC jack)
END
TEST MODE
DSP STEREO through mode / MIC : M / MUTE : ON / VOL-LEVEL : 12
DSP MONO through mode / MIC : H / MUTE : OFF / VOL-LEVEL : 23
1k sine wave output mode / MUTE : ON / VOL-LEVEL : 06 t "on / 06 / SIN"
x B
AU IO DSP ST
x
:
DSP MO
SIN
DSP ST
:
.
M
m
on
DSP ST
t "M / on / 12 / DSP ST"
t "H / oF / 23 / DSP MO"
>
(select),(set)
H
m
12
23
oF
DSP MO
x B
on
06
SIN
xxx
8
ICD-ST10/ST20
FF
BATTBATTBATTBATT
DC jack
is inserted
DC jack
is extracted
x
x B
ON
LED
LED
x
x B
3. Sleep test
•Pressing the x•B key causes the set to enter the sleep state.
•When the HOLD . switch is ON, the LCD is turned off.
When OFF, the LCD is turned on.
•Press any keys to exit the sleep state.
x B
(with HOLD.
OFF status)
SLEEP
x B
(with HOLD.
ON status)
SOON
INSLEEP
(LCD OFF)
any keysany keys
4. Beep test
• Beep sound of 1.3 kHz or 2 kHz is output.
x B
BEEP1.3K
x
2.0K
1.3K
:
:
.
(select),(set)
1.3K 2.0K
xx
x B
>
5. RTC test
•Perform the function test of the RTC and EEPROM.
(1) RTC EEPROM test
Confirmation of writing, reading (verifying) and erasing of
arbitrary data with the specified registers.
(2) RTC clock function test
Confirmation that RTC updates the time to the microcomputer
at one second interval.
• OK, NG judgement is performed to the test result.
When NG, it is displayed which device RTC or EEPROM
becomes NG.
(All OK : "RTC OK" / RTC NG : "RTC BAD" / EEPROM NG
: "EEP BAD")
x B
OK
x
RTCRTC
6. Key entry test
•When the any key is pressed, the entry key and the A/D converted
value (hexadecimal) of the two channel keys are displayed.
•When the x key is pressed, the A/D value of the key is displayed
while the key is depressed. When the key is released, the screen
returns to the test menu.
x B
oFF
KEYiFFKEY
x
7. Battery remaining power and DC IN test
•The detected A/D value (hexadecimal) of the battery remaining
power is displayed. When DC jack is inserted, the battery mark
on the LCD is turned off.
8. LED test
• LEDs (OPR: red and green, BL: green) are all turned on.
9. USB test
• When the menu starts the USB self-check, either presence or
absence of the Vbus is judged.
(Vbus is present: “ON VBUS”, Vbus is absent: “OFF VBUS”)
•The USB driver always works regardless of presence or absence
of the USB signal only when Vbus is available during the USB
test. At this time, turning on HOLD . causes the set to move
to the suspend state. Turning off the Vbus causes the set to return
to the test menu.
• In the menumode if the Vbus is supplied, any key will not work.
Therefore the Vbus will be supplied after surely pressing the x •B
key.
USB
x B
OFF
VBUS
Vbus
on
x
ON
VBUS
HOLD.
ON
LINK
cut Vbuscut Vbus
PC
Suspend
mode
10. Menu reset
•Pressing the x•B key causes the set to enter the menu
initialization standby state.
•When the following keys are all entered, the EEPROM
initialization (returning setting in the menu and user name to
default value) and formatting process (deleting all message files
in the flash memory) are executed. At the same time, the WakeUp
signal is checked, too.
Check keys: VOL- , VOL+ , A-B , ERASE ,
DIVIDE , DPC ON , DPC OFF , . ,
x•B , > , FOLDER , MENU , x ,
z REC , HOLD
OFF ,
DIRECTNL ON
.
ON , HOLD
, and DIRECTNL
.
OFF
• If all tests end in success, “-ALLOK-” is displayed. If initialization
in the EEPROM is NG, “INIT. NG” appears.
•Turn off the power to exit the test mode.
All keys
x B
RST
MENU
are entered
KEY
PUSHINIT
(blinking)
x
In the case that
the initialization
and reset operation
end correctly.
OK
ALL
9
ICD-ST10/ST20
11. Key durable test
•Pressing the x•B key makes the count to "------" and sets test
standby status.
Once more pressing the x•B key makes the count to "000000"
and sets the key durable test.
In this mode any key input and slide switch operation are counted
and the number is displayed.
Turn off the power to exit this mode.
x Bx B
KEY
COUNT
KEY
------
x
000000
Key durable
test
KEY
any keys or slide
switches operation
KEY
000001
10
SECTION 4
DIAGRAMS
ICD-ST10/ST20
Note on Schematic Diagrams:
• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in Ω and 1/
specified.
f
•
• C : panel designation.
• A : B+ Line.
•Power voltage is dc 3V and fed with regulated dc power
•Voltages and waveforms are dc with respect to ground
•Voltages are taken with a VOM (Input impedance 10 MΩ).
•Waveforms are taken with a oscilloscope.
• Circled numbers refer to waveforms.
• Signal path.
✩Replacement of IC6001 used in this set requires a spe-
• The voltage and waveform of CSP (chip size package)
: internal component.
supply from DC IN jack (J5001).
under no-signal (detuned) conditions.
no mark : PB
[]: REC
Voltage variations may be noted due to normal production tolerances.
Voltage variations may be noted due to normal production tolerances.
F: PB
L : REC
cial tool.
cannot be measured, because its lead layout is different
from that of conventional IC.
: Impossible to measure
∗
4
W or less unless otherwise
Note on Printed Wiring Boards:
• Y : parts extracted from the conductor side.
• b : Pattern from the side which enables seeing.
The other layers’ patterns are not indicated.
Caution:
Pattern face side:Parts on the pattern f ace side seen from
(SIDE B)the pattern face are indicated.
Parts face side:Parts on the parts face side seen from
(SIDE A)the parts face are indicated.
• MAIN board is multi-layer printed board. However, the
patterns of intermediate-layer have not been included in
the diagram.
✩Replacement of IC6001 used in this set requires a spe-
cial tool.
• Lead layouts
surface
Lead layout of
conventional IC
CSP (chip size package)
• WA VEFORMS
1
IC6003 3 (XXT)
88.5 ns
1 V/DIV, 40 ns/DIV
2
IC6003 1 (FOUT)
1 V/DIV, 40 ns/DIV
88.5 ns
3.3 Vp-p
4.1 Vp-p
3
IC3004 6 (MCLK)
1 V/DIV, 40 ns/DIV
4
IC7003 <z/, (XTAL)
1 V/DIV, 100 ns/DIV
88.5 ns
244 ns
4.1 Vp-p
3.4 Vp-p
5
IC8001 qd (X OUT)
(When the USB is connected)
8.33 ns
1 V/DIV, 40 ns/DIV
6
IC7004 5 (FOUT)
1 V/DIV, 10 µs/DIV
3.7 Vp-p
3.2 Vp-p
30.5 ns
1111
ICD-ST10/ST20
4-1. Block Diagrams – Main Section-1 –
MIC1
(ZOOM)
MIC2
(L-CH)
MIC3
(R-CH)
J3001
m
PLUG IN POWER
Q3002
Q3004
4
2
IC3002
MIC AMP
IN+
REG
OUT
STBY
6
3
26
6
24
29
2
1
MICVCC
INTINL
INTINR
EXTINR
EXTINL
CTL1
IC3001
MIC AMP
OUTL
OUTR
INT/EXT
VCC
IC3004
ADC, DAC, HEADPHONE AMP
AINR2
25
STDO
BICK
LRCK
SDTI
9
7
5
8
AINL2
26
13
17
Q3001
16
Q5008
7
B+ SWITCH
AVDD
AINL1
28
AINR1
27
STDO
BCLK
LRCK
A
SO
XRST
J3002
SP3001
(SPEAKER)
B
POWER AMP
5
VO1
8
VO2
D902
(OPR)
(REC/PB)
XBATTEN
IC3003
XSHUT-
DOWN
4
-IN
1
RED(REC)
GREEN(PB)
13
8
6
5
12
3
2
SI/PO DRIVER
MONOMIC
SPAMP
XREDLED
XGRLED
XBATTEN
CLK
DATA
IC7001
XADAPDN
XDSPRST
Q3003
MUTE
HPMUTE
XSTMIC
XLIGHT1
XLIGHT2
MCLK
CDTI
CCLK
MIN
CSN
IC6003
CLOCK GEN
XT
FOUT
XXT
XCONT
6
4
3
18
2
1
HPR
14
HPL
15
MOUT
17
PDN
1
X6001
11.2896MHz
5
15
7
9
11
4
14
D7002
(LCD PANEL LIGHT)
D7003
3
4
MCLK
IC7004
REAL TIME CLOCK
CLK
9
XIRQ
DI
7
DO
8
FOUT
CE
10
Signal path
: PB
: REC
3
5
46
HPJACK
115
SPICLK
45
SPIDATA
IC7003 (1/3)
CPU
XMICJACK
DSPSYSCLK
102
18
BEEP
XADACS
100
AUSCK
99
98
AUSOT
10112116
AUSIN
RTCCS
13
X0A32K
111
XRTCINTR
1212
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