• HCD-EC59 is the amplifi er , USB, CD player and
tuner section in MHC-EC59.
• MPEG Layer-3 audio coding technology and patents licensed from Fraunhofer IIS and Thomson.
• Windows Media is either a registered trademark or trademark of Microsoft Corporation in the
United States and/or other countries.
• This product is protected by certain intellectual property rights of Microsoft Corporation. Use or
distribution of such technology outside of this product is prohibited without a license from Microsoft or an authorized Microsoft subsidiary.
SPECIFICATIONS
Main unit
Amplier section
e following measured at AC 127 V, 60 Hz
(Mexican model)
e following measured at AC 220 V,
50/60 Hz (Argentine model)
e following measured at AC 120 V, 220 V,
240 V, 50/60 Hz (Other models)
Power output (rated):
25 W + 25 W (at 6 Ω, 1 kHz, 1%
THD)
RMS output power (reference):
60 W + 60 W (per channel at 6 Ω,
1 kHz)
Inputs
PC IN (stereo mini jack):
Sensitivity 800 mV, impedance
22 kilohms
Outputs
PHONES (stereo mini jack):
accepts headphones with an
impedance of 8 Ω or more
Model Name Using Similar MechanismHCD-EX6/EX6T
Base Unit NameBU-D1BD74UR
Optical Pick-up Block NameDA11MMVGP
General
Power requirements
Mexican model:
AC 127 V, 60 Hz
Argentine model:
AC 220 V, 50/60 Hz
Other models:
AC 120 V, 220 V or 230 V 240 V,
50/60 Hz, adjustable with voltage
selector
Power consumption: 85 W
(0.5 Wat the Power Saving Mode)
Dimensions (W/H/D) (excl. speakers)
Approx. 200 mm × 306 mm ×
305 mm
Mass (excl. speakers): Approx. 3.8 kg
Design and specications are subject to
change without notice.
Standby power consumption: 0.5 W
Halogenated ame retardants are not used
6-4. Top Panel Section ........................................................... 35
7. ELECTRICAL PARTS LIST .............................. 36
Accessories are given in the last of the electrical parts list.
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
2
SECTION 1
SERVICING NOTES
HCD-EC59
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic break-down because of the potential difference generated by
the charged electrostatic load, etc. on clothing and the human body .
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused
on the disc refl ective surface by the objective lens in the optical
pickup block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the leadfree mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
MODEL IDENTIFICATION
- Back Panel -
Model
Number
Label
ModelPart No.
Argentina model
Mexican model
African model
120V AC area in E model,
Chilean and Peruvian models
4-184-199-0[]
4-184-200-0[]
4-184-201-0[]
4-187-950-0[]
LASER DIODE AND FOCUS SEARCH OPERATION
CHECK
During normal operation of the equipment, emission of the laser
diode is prohibited unless the upper lid is closed while turning on
the SW305 (push switch type).
The following checking method for the laser diode is operable.
• Method
Emission of the laser diode is visually checked.
1. Open the upper lid.
2. Push the SW305 as shown in Fig. 1.
Note: Do not push the detection lever strongly, or it may be bent or
damaged.
3. Check the object lens for confi rming normal emission of the
laser diode. If not emitting, there is a trouble in the automatic
power control circuit or the optical pick-up.
In this operation, the object lens will move up and down 2
times along with inward motion for the focus search.
SW305
Fig. 1. Method to push the SW305
3
HCD-EC59
–
CAPACITOR ELECTRICAL DISCHARGE PROCESSING
When checking the board, the electrical discharge is necessary for the electric shock prevention.
Connect the resistors referring to the fi gure below.
• MAIN board (C622, C626)
Both ends of respective capacitors.
MAIN Board (Conductor Side) –
C626
C622
800 :/2 W
MAIN BOARD SERVICE POSITION
• SIDE PANEL (L) was removed.
800 :/2 W
MAIN board
– Rear side view –
4
PT-SWITCH BOARD SERVICE POSITION
• SIDE PANEL (R) was removed.
HCD-EC59
BD74UR BOARD SERVICE POSITION
• SIDE PANEL (L) and (R) are removed, and the set is laid.
PT-SWITCH board
top panel block
BD74UR board
5
HCD-EC59
DISASSEMBLY
• This set can be disassembled in the order shown below.
2-1. DISASSEMBLY FLOW
SET
2-2. SIDE PANEL (L)/(R)
(Page 7)
2-3. TOP PANEL ASSY
(Page 7)
SECTION 2
2-4. FRONT PANEL BLOCK
(Page 8)
2-5. KNOB (VOL)
(Page 8)
2-6. MAIN BOARD
(Page 9)
2-7. BASE UNIT
(BU-D1BD74UR)
(Page 10)
2-8. OPTICAL PICK-UP BLOCK
(DA11MMVGP)
(Page 10)
6
Note: Follow the disassembly procedure in the numerical order given.
2-2. SIDE PANEL (L)/(R)
two claws
4
two screws
2
(BVTP3 u 10)
three screws
1
(case 3 TP2)
side panel (L)
5
3
two claws
4
HCD-EC59
two screws
2
(BVTP3 u 10)
2-3. TOP PANEL ASSY
Lift up the side of the top panel assy in the back and
6
remove the two claws in front of the top panel assy.
two claws
5
connector
3
(SW305)
3
side panel (R)
5
three screws
1
(case 3 TP2)
two screws
2
(BVTP3 u 10)
top panel assy
7
4 flexible flat cable (25 core)
(CN403)
screw
1
(KTP3 u 10)
screw
1
(KTP3 u 10)
7
HCD-EC59
2-4. FRONT PANEL BLOCK
1 flexible flat cable (25 core)
(CN607)
3 screw (BVTP3 u 10)
4 lead wire (from USB board)
7
claw
6
front panel block
8
5 three screws
(BVTT3 u 8)
6
2-5. KNOB (VOL)
Note: This illustration sees the front panel block from PANEL board side.
PANEL board
knob (VOL)
3
2 flexible flat cable (9 core)
(CN605)
claw
front panel block
1 flexible flat cable (25 core)
(CN901)
hole
Push the knob (VOL) by flat-head screwdriver.
2
8
2-6. MAIN BOARD
HCD-EC59
8 screw
(BVTP3 u 10)
4 connector
(CN604)
8 screw
(BVTP3 u 10)
9 lead wire
(from USB board)
3 connector
(CN609)
1 flexible flat cable (25 core)
(CN607)
5 flexible flat cable (5 core)
(CN603)
2 flexible flat cable
(9 core) (CN605)
0 MAIN board
6 connector
(CN633)
7 fan motor connector
(CN601)
8 two screws
(BVTP3 u 10)
:LUHVHWWLQJ
MAIN
board
back
panel
MAIN
board
9
HCD-EC59
2-7. BASE UNIT (BU-D1BD74UR)
Note 1: This illustration sees the top panel assy from base unit side.
two insulators
4
(blue)
four floating screws
1
(PTPWHM2.6)
base unit
7
(BU-D1BD74UR)
2
two insulators
3
(gray)
four claws
5
Note 2: Four claws might be fixed by bond.
Please fix four claws by the bond
when you replace the cover (D1).
cover (D1)
6
2-8. OPTICAL PICK-UP BLOCK (DA11MMVGP)
Note 1: When disconnecting the wire (fl at type) (16 core) of optical pick-up block, solder the short-land.
tapping screw (P2)
5
optical pick-up block
7
(DA11MMVGP)
Note 2: When assembling the optical pick-up block,
remove the solder of short-land after
connecting the wire (flat type) (16 core).
shaft (support)
6
wire (flat type) (16 core) (optical pick-up)
3
Solder the short-land.
2
10
Remove four solders.
1
BD74UR board block
4
SECTION 3
TEST MODE
HCD-EC59
COLD RESET
The cold reset clears all data including preset data stored in the
memory to initial conditions. Execute this mode when returning
the set to the customer.
Procedure:
1. In the standby status, press the [
] button to turn the power
?/1
on.
2. Press three buttons of [
], [FUNCTION] and [
x
] simultane-
?/1
ously.
3. When “RESET” appears, the set enters standby status.
PANEL TEST MODE
Enter The Panel Test Mode
Procedure:
1. In the standby status, press the [
] button to turn the power
?/1
on.
2. Press three buttons of [DSGX], [x] and [
] simultaneously.
?/1
3. When the panel test mode is activated, LEDs and segments of
the liquid crystal display are all turned on.
Version Check
Procedure:
1. In the panel test mode (all LEDs and segments of the liquid
crystal display are turned on), press the [FUNCTION] button.
2. On the liquid crystal display, date and version are displayed
“xxxxxxxx”.
3. From this status, press the [u] button, and the destination and
model name are displayed.
4. T o release from this mode, press three buttons of [DSGX], [
and [
] simultaneously.
?/1
x
Key Test Mode
Procedure:
1. In the panel test mode (all LEDs and segments of the liquid
crystal display are turned on), press the [x] button.
2. The message “KEY0 0 0” displayed. Whenever any buttons
are pressed, the value is changed.
3. T o release from this mode, press three buttons of [DSGX], [x]
and [
] simultaneously.
?/1
CHANGE-OVER THE AM TUNING INTERVAL
The AM tuning interval can be changed over 9 kHz or 10 kHz.
Procedure:
1. Press the [
] button to turn the power on.
?/1
2. Press the [FUNCTION] button to select TUNER AM function.
3. Press the [
] button again to turn the power off (standby).
?/1
4. After pressing the [DISPLAY] button, while pressing the
[TUNING +
M L
] button, press the [
?/1
] button.
5. It turns power on and display “9k STEP” or “10k STEP”, and
thus the tuning interval is changed over.
CD SERVICE MODE
This mode can move the SLED of the optical pick-up, and also can
turn the optical pick-up laser power on and off.
Procedure:
1. Press the [
2. Press three buttons of [u], [ENTER] and [
] button to turn the power on.
?/1
?/1
ously.
3. Press the [FUNCTION] button to select CD function.
4. It enters the CD service mode and displays “SERVICE”.
5. To release from this mode, press three buttons of [u], [ENTER] and [
] simultaneously.
?/1
Key Operation:
[TUNING +
M L
], [– TUNING
l m
]:
Use these keys to move the SLED. When [TUN-
ING +
M L
] is pressed in this mode, the SLED
moves to outer circumference and the message
]
When [– TUNING
“SLED OUT” is displayed.
l m
] is pressed in this
mode, the SLED moves to inner circumference and
the message “SLED IN” is displayed.
[CD]:
Use this key to turn the optical pick-up laser power
on and off. When the laser power is turned on, the
message “LD ON” is displayed. When the laser
power is turned off, the message “LD OFF” is displayed.
] simultane-
CD POWER MANAGE
This mode is for switch the CD power supply on/off. Even if this
state pulls out AC plug, it is held.
Procedure:
1. Press the [
] button to turn the power on.
?/1
2. Press the [FUNCTION] button to select CD function.
3. Press the [
] button again to turn the power off (standby).
?/1
4. After pressing the [DISPLAY] button, while pressing the [x]
button, press the [
?/1
] button.
5. It turns power on and display “CD/USB”, then display “PWR
ON” or “PWR OFF”.
11
HCD-EC59
CD FACTORY MODE
Note 1: Do not enter the this mode while any other test mode is in prog-
ress.
Note 2: Do not enter any other test mode while the this mode is in prog-
ress.
Procedure:
1. Press the [
2. Press the [FUNCTION] button to select CD function
3. Press three buttons of [u], [USB] and [
4. It enters the CD factory mode and the message “FACTORY”
is displayed. When the [CD] button is pressed, the following
message (initial display) is displayed.
– ON
S character mode setting
Tracking servo setting
RF gain setting
Key Operation:
[CD]:
The display changes in the following order when-