•For ADJUSTMENTS (SECTION 6), refer to SERVICE MANUAL, ADJ (9-876-736-51).
•For INSTRUCTION MANUAL, refer to SERVICE MANUAL, LEVEL 1 (9-876-736-41).
• Reference No. search on printed wiring boards is available.
• Note in Lens Frame Installation
• Exchange Method of Barrier Assy
• HELP: Sheet attachment positions and procedures of processing the flexible boards/harnesses are shown.
•When the machine needs to be repaired, make sure to follow the item of “LCD TYPE CHECK”.
On the CH-146, SY-102, SW-422, MS-204, MS-205 flexible, JK-263 and SP-045 flexible boards
This service manual procides the information that is premised the
circuit board replacement service and not intended repair inside
the CH-146, SY-102, SW-422, MS-204, MS-205 flexible, JK-263
and SP-045 flexible boards.
Therefore, schematic diagram, printed wiring board and electrical
parts list of the CH-146, SY-102, SW-422, MS-204, MS-205
flexible, JK-263 and SP-045 flexible boards are not shown.
The following pages are not shown.
FRAME SCHEMATIC DIAGRAM
FRAME SCHEMATIC DIAGRAM
SCHEMATIC DIAGRAMS
SCHEMATIC DIAGRAMS
Schematic diagram ............... Pages 4-9 to 4-28
Printed wiring board .............. Pages 4-39 to 4-48
Mounted parts location.......... Pages 4-54 and 4-55
Electrical parts list ................. Pages 5-7 to 5-8
The above-described information is shown in
service manual Level 3.
REPAIR PARTS LIST
REPAIR PARTS LIST
and 5-10 to 5-13
DIGITAL STILL CAMERA
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SPECIFICATIONS
x Camera
[System]
Image device
Total pixels number of camera
Effective pixels number of camera
LensCarl Zeiss Vario-Tessar
Exposure control
White balance
File format (DCF compliant)
Recording media
FlashRecommended distance (ISO set to
9.04 mm (1/1.8 type) color CCD
Primary color filter
Approx. 5 255 000 pixels
Approx. 5 090 000 pixels
3 zo om lens
f = 7.9 – 23.7 mm (38 – 114 mm when
converted to a 35 mm still camera)
F2.8 – 5.2
Design and specifications are subject to change
without notice.
— 2 —
DSC-W1/W12
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH
MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY .
SAFETY CHECK-OUT
After correcting the original service problem, perform the following
safety checks before releasing the set to the customer.
1.Check the area of your repair for unsoldered or poorly-soldered
connections. Check the entire board surface for solder splashes
and bridges.
2.Check the interboard wiring to ensure that no wires are
"pinched" or contact high-wattage resistors.
3.Look for unauthorized replacement parts, particularly
transistors, that were installed during a previous repair . Point
them out to the customer and recommend their replacement.
4.Look for parts which, through functioning, show obvious signs
of deterioration. Point them out to the customer and
recommend their replacement.
5.Check the B+ voltage to see it is at the values specified.
6.Flexible Circuit Board Repairing
•Keep the temperature of the soldering iron around 270˚C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFÉS P AR UNE MARQUE 0 SUR LES
DIAGRAMMES SCHÉMA TIQUES ET LA LISTE DES PIÈCES SONT
CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE
REMPLACER CES COMPOSANTS QUE PAR DES PIÈSES SONY
DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU
DANS LES SUPPÉMENTS PUBLIÉS PAR SONY.
Unleaded solder
Boards requiring use of unleaded solder are printed with the leadfree mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40°C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350°C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky , less prone to flow) than
ordinary solder so use caution not to let solder bridges occur such
as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
— 3 —
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TABLE OF CONTENTS
SectionTitlePage
1.SERVICE NOTE
1-1. Note for Repair ································································1-1
1-2. Discharging of the ST-101 Flexible Board’s Charging
Capacitors (C102 and C103) ···········································1-1
1-3. Note in Lens Frame Installation ······································1-2
1-4. Description on Self-diagnosis Display ···························· 1-2
2.DISASSEMBLY
2-1. Flow Chart ·······································································2-1
2-2. SY-102 Board Service Position ·······································2-3
2-3. Exchange Method of Barrier Assy ··································2-5
2-3-1.Peel Off Old Ornamental Ring A ····································2-5
2-3-2.Remove Old Barrier Assy················································2-6
2-3-3.Install New Barrier Assy ·················································2-6
2-3-4.Adhere the Ornamental Ring A ·······································2-7
2-4. Circuit Boards Location ··················································2-8
US-011 FLEXIBLE······················································· 4-51
4-4. Mounted Parts Location ················································ 4-53
5.REPAIR PARTS LIST
5-1. Exploded Vie ws ·······························································5-2
5-1-1.Cabinet Block Section ·····················································5-2
5-1-2.Main Block Section ·························································5-3
5-1-3.Lens Block Section··························································5-4
5-1-4.Side Frame Block Section ···············································5-5
5-2. Electrical Parts List ·························································5-6
— 4 —
1-1. NOTE FOR REPAIR
When installing a connector, don’t press down at wire of connector.
It is possible that a wire is snapped.
DSC-W1/W12
SECTION 1
SERVICE NOTE
Make sure that the flat cable and flexible board are not cracked of
bent at the terminal.
Do not insert the cable insufficiently nor crookedly.
Cut and remove the part of gilt
which comes off at the point.
(Be careful or some
pieces of gilt may be left inside)
When remove a connector, don’t pull at wire of connector.
It is possible that a wire is snapped.
1-2. DISCHARGING OF THE ST-101
FLEXIBLE BOARD’S CHARGING
CAPACITORS (C102 AND C103)
The charging capacitors (C102 and C103) of the ST-101 flexible
board are charged up to the maximum 300 V potential.
There is a danger of electric shock by this high voltage when the
capacitor is handled by hand. The electric shock is caused by the
charged voltage which is kept without discharging when the main
power of the unit is simply turned off. Therefore, the remaining
voltage must be discharged as described below.
Preparing the Short Jig
To preparing the short jig, a small clip is attached to each end of a
resistor of 1 kΩ /1 W (1-215-869-11).
Wrap insulating tape fully around the leads of the resistor to prevent
electrical shock.
1 kΩ/1 W
Wrap insulating tape.
Discharging the Capacitor
Short-circuit between the positive and the negative terminals of
charged capacitor with the short jig about 10 seconds.
Capacitor
ST-101
R:1 kΩ/1 W
(Part code:
1-215-869-11)
ST kemikon sheet
1-1
DSC-W1/W12
1-3. NOTE IN LENS FRAME INSTALLATION
When tightening a screw, have both sides of the lens block assembly so as not for the load to depend.
Lens frame
Lens block assembly
1-4. DESCRIPTION ON SELF-DIAGNOSIS DISPLAY
M1.4 × 4
Display Code
C:32:ss
C:13:ss
E:61:ss
E:91:ss
E:92:ss
Self-diagnosis display
• C: ss: ss
You can reverse the camera
malfunction yourself. (However,
contact your Sony dealer or local
authorized Sony service facility
when you cannot recover from the
camera malfunction.)
• E: ss: ss
Contact your Sony dealer or local
authorized Sony service facility.
Countermeasure
Turn the power off and on again.
Format the “Memory stick”.
Insert a new “Memory Stick”.
Checking of lens drive circuit.
Checking of flash unit or replacement
of flash unit.
Insert batteries correctly.Batteries are not inserted correctly.
Turn the power off and on again.
Trouble with hardware.
Unformatted memory stick is inserted.
Memory stick is broken.
When failed in the focus and zoom
initialization.
Abnormality when flash is being
charged.
Batteries were installed or removed when
using the AC adaptor.
Cause
1-2E
Caution Display During Error
SYSTEM ERROR
FORMAT ERROR
MEMORY STICK ERROR
—
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SECTION 2
DISASSEMBLY
2-1. FLOW CHART
The following flow chart shows the disassembly procedure.
3
1
1 Lock ace screw (M1.7)
2 Claw
3 Rear cabinet
4 Side cover
5 Sheet (S)
6 Mic harness: CN102
7 Lock ace screw (M1.7)
8 Front cabinet
2
4
HELP
1
7
x4
x2
8
6
5
3
4
9
6
7
qa
0
qs
1
2
1 Claw
2 Claw
5
8
x1
x1
3 Control SW block
4 Control SW block flexible: CN702
5 ST-101 flexible: CN601
Note: High-voltage cautions
Discharging the Capacitor
Short-circuit between the two
points with the short jig about 10
seconds.
Torque driver
Soldering iron
Weight about 60g
Adhesive (Super X) (Note)
Note: Use adhesive (Super X) or an equivalent article.
Don’t use what becomes white after drying like a quick-drying glue.
DSC-W1/W12
1
2
3
2-3-1. PEEL OFF OLD ORNAMENTAL RING A
The Ornamental Ring A has adhered to the Barrier Assy strongly and accordingly, use a soldering iron to weaken the adhesive force.
Heat four circled portions with the soldering iron.
Heating temperature is about 300ºC.
Beware of a burn since the entire Ornamental Ring becomes hot.
* As the adhesive force of Ornamental Ring A is considerably large, the forced peeling will damage the group-1 frame.
Insert the tip of tweezers, etc. into a notch of the group-1 frame and prize the ring.
* Take extreme care so as not to damage the coated surface of the group-1 frame.
In case of difficult peeling, heat the ring again with the soldering iron.
If this re-heating failed, it may be advisable that the ring be peeled while heating the portions 1 → 2 → 3 → 4 in the under figure one
by one sequentially.
* Discard the removed Ornamental Ring A.
4
2
Tip
3
1
2-5
DSC-W1/W12
2-3-2. REMOVE OLD BARRIER ASSY
1 Remove two screws.
* Discard the removed screws.
2 Remove the Barrier Assy.
* Discard the removed Barrier Assy.
1
2
1
* After removing the Barrier Assy, if the “G1 Dust-Proof Ring” was removed, it must be returned to the home position.
In returning the ring, adjust the location of a projection to the lens direction.
This is an important part to prevent the dust and light from coming in.
* After removing the Barrier Assy, take extreme care not to drop dust or foreign substances in the lens barrel.
2-3-3. INSTALL NEW BARRIER ASSY
1 Install new Barrier Assy by paying attention to the projection of the Barrier Assy in relation to the position shown in the under figure.
2 Tighten two screws.
* Tightening torque = 0.5 kgf
Projection
1
2
2
2-6
DSC-W1/W12
2-3-4. ADHERE THE ORNAMENTAL RING A
Apply an adhesive to four recesses on the top surface of the Barrier Assy.
* Do not apply too much adhesive. (Make quantity of adhesives into the quantity in which a groove hides.)
Meeting a “notch” of the Ornamental Ring A with a “projection” of the group-1 frame, push the Ornamental Ring A into the group-1 frame.
* The projection of the spring for preventing static electricity must be tilted.
Put the 60g weight on the Ornamental Ring A so that the Ornamental Ring A does not float up until the adhesive hardens.
Note: Be careful not to give a shock.
* After the weight was put, no gap must be present in full circumference between Ornamental Ring A and group-1 frame.
A gap, if present, causes the crackle sound NG.
* The weight must push in the Ornamental Ring A only.
If the weight is put on the mold part of the Barrier Assy, the Ornamental Ring A will float up.
Do not put the weight on a black mold part.
Notch
Adhesive
Adhesive
Adhesive
Projection
Adhesive
Completion after 30 minutes.
Not gap in full circumference.
2-7
DSC-W1/W12
2-4. CIRCUIT BOARDS LOCATION
US-011 flexible
SY-102
(including CH-146)
CH-146
SW-422
ST-100
ST-101 flexible
(included in SY-102)
MS-205 flexible
JK-263
CD-507 flexible
MS-204
SP-045 flexible
Board NameFunction
CD-507 flexibleCCD IMAGER
CH-146CCD SIGNAL PROCESS
(included in SY-102)
JK-263JACK
MS-204LCD DRIVE, MS CONNECTOR
MS-205 flexibleCONNECTOR
SP-045 flexibleSPEAKER
ST-100FLASH DRIVE
ST-101 flexibleCHARGING CAPACITOR, FLASH UNIT
SY-102CAMERA MODULE, CAMERA DSP, LENS DRIVE,
(Including CH-146)SH DSP, FRONT CONTROL, DC/DC CONVERTER
SW-422AUDIO, CONTROL SWITCH
US-011 flexibleUSB CONNECTOR
2-8E
DSC-W1/W12
HELP
Sheet attachment positions and procedures of processing the flexible boards/harnesses are shown.
Mic harness
US-011 flexible board
Front side
Sheet (S)
HELP
3. BLOCK DIAGRAMS
Link
Link
POWER BLOCK DIAGRAM (1/2)OVERALL BLOCK DIAGRAM (1/2)
POWER BLOCK DIAGRAM (1/2)OVERALL BLOCK DIAGRAM (1/2)