Sony DR-BT1,DR-BT1K Service Manual

DR-BT1/BT1K

US Model

SERVICE MANUAL

BLUETOOTH EARSET SYSTEM

SPECIFICATIONS

Ver. 1.1 2005.01

Sony Corporation

Personal Audio Company

Published by Sony Engineering Corporation

9-879-223-02

2005A02-1

© 2005.01

General

Bluetooth Compliance: Bluetooth standard Ver. 1.1
Output power: Bluetooth standard Power Class2
Frequency band: 2.4GHz band ( 2.4000 GHz – 2.4835

GHz )

Max. Communication range:

Line of sight approx. 10 m

Supplied accessory: AC power adaptor (1),

Hanger (S) (1), Car attachment (1)
Battery charger (1) (BT1 only)

Bluetooth earset DR-BT1

Supported Bluetooth Profiles:

Headset Profile, Hands-free Profile

Power source: DC 3.7 V: Built-in Li-ion rechargeable

battery
Typical Talk time: 7 hours
Typical Standby Time: 160 hours
Mass: Approx. 20 g

Receiver

Type: Open air, dynamic
Driver unit: 13.5 mm dome type (CCAW Voice

Coil)
Sensitivity: 104 dB/mW
Impedance: 16 Ω at 1 kHz
Power handling capacity: 50 mW (IEC)
Reproduction frequency range:

50 – 20,000 Hz

Microphone

Type: Flexible pipe microphone
Unit: Electret condenser
Output impedance: Under 2.2 kΩ
Open circuit voltage level: -42 dB(0 dB = 1 V/Pa)
Effective frequency range: 100 – 5,000 Hz

Bluetooth earset adaptor DRC-BT1 (BT1K only)

Supported Bluetooth Profiles:

Headset Profile

Power source: DC 1.2 V: Built-in Ni-MH rechargeable

battery
Typical Talk time: 5 hours
Typical Standby Time: 100 hours
Cord: 0.20 m (Max. stretch length 0.7m)
Plug: 2.5 mm tri-pole plug
Mass: Approx. 35 g (without cord)

Design and specifications are subject to change without notice.

Photo : DR-BT1K

DR-BT1/BT1K

2

TABLE OF CONTENTS

Notes on chip component replacement

• Never reuse a disconnected chip component.

• Notice that the minus side of a tantalum capacitor may be
damaged by heat.

Unleaded solder

Boards requiring use of unleaded solder are printed with the lead
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)

: LEAD FREE MARK

Unleaded solder has the following characteristics.

• Unleaded solder melts at a temperature about 40°C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to
be applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set
to about 350°C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!

• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.

• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder
may also be added to ordinary solder.

1. SERVICING NOTES........................................................ 3

2. GENERAL ........................................................................... 3

3. DIAGRAMS

3-1. Block Diagrams ···························································· 5
3-2. Printed Wiring Boards – Headset Board– ···················· 6
3-3. Schematic Diagram – Headset Board– ························ 7
3-4. Printed Wiring Boards

– Adaptor Board (BT1K only)– ·································· 8
3-5. Schematic Diagram – Adaptor Board (BT1K only)–··· 9
3-6. Printed Wiring Boards

– Charger Board (BT1 only)– ··································· 10
3-7. Schematic Diagram – Charger Board (BT1 only)–···· 11

4. EXPLODED VIEWS

4-1. Headset Section ·························································· 12
4-2. Adaptor Section (BT1K) ············································ 13
4-3. Charger Section (BT1) ··············································· 14

5. ELECTRICAL PARTS LIST........................................ 15

• MOD2 (bluetooth module), IC7 (+2.8V REG) on
HEADSET board cannot be replaced individually.
Replace it with “HEADSET BOARD, COMPLETE”.

• MOD1 (bluetooth module) on ADAPTOR board cannot be
replaced individually.
Replace it with “ADAPTOR BOARD, COMPLETE”.

DR-BT1/BT1K

3

SECTION 1

SERVICING NOTES

In case of replacing a nickel hydrogen battery in the adaptor (BT-1K), replace two battery pads and a battery sheet at the same time.

two battery pads

battery sheet

cabinet (lower

)

nickel hydrogen battery

SECTION 2

GENERAL

This section is extracted
from instruction manual.

Identifying

Bluetooth earset

R

L

1

23

4

5

6

7

8

1 Hanger
2 Multifunction button

Controls various functions of the Bluetooth earset.

3 LED indicator

Indicates the status of the Bluetooth earset.

4 VOLUME +
5 VOLUME -
6 Pipe microphone
7 Housing
8 Contact terminals

Bluetooth earset adaptor (BT1K only)

1

3

4

5

6

2

1 LED indicator

Indicates the status of the Bluetooth earset adaptor.

2 Power on button
3 Pairing / Power off button
4 Contact pins
5 Belt clip
6 DC IN 4.5 V jack

Battery charger (BT1 only)

1

2

3

1 Contact pins
2 Belt clip
3 DC IN 4.5 V jack

DR-BT1/BT1K

4

SECTION 3

DIAGRAMS

For schematic diagrams.
Note:

• All capacitors are in µF unless otherwise noted. (p: pF)
50 WV or less are not indicated except for electrolytics
and tantalums.

• All resistors are in Ω and 1/4 W or less unless otherwise
specified.

•%: indicates tolerance.

• C : panel designation.

• A : B+ Line.

• Power voltage are dc 3.7 V (Headset) or dc 1.2 V (Adap­tor) and fed with regulated dc power supply from battery
terminal.

•Voltages are dc with respect to ground under tolerances.
no mark : STANDBY
(): TALKING
<>: AC ADAPTOR IN

•Voltages are taken with a VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal produc­tion tolerances.

• Signal path.
F : AUDIO

NOTE FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS.

Caution:
Parts face side: Parts on the parts face side seen from
(Side A) the parts face are indicated.
Pattern face side: Parts on the pattern face side seen from
(Side B) the pattern face are indicated.

For printed wiring boards.
Note:

• X : parts extracted from the component side.

• Y : parts extracted from the conductor side.

• : Pattern from the side which enables seeing.

(The other layers' patterns are not indicated.)

• MOD2 (bluetooth module), IC7 (+2.8V REG) on HEADSET board
cannot be replaced individually.
Replace it with “HEADSET BOARD, COMPLETE”.

• MOD1 (bluetooth module) on ADAPTOR board cannot be replaced
individually.
Replace it with “ADAPTOR BOARD, COMPLETE”.

• MOD2 (bluetooth module), IC7 (+2.8V REG) on HEADSET board
cannot be replaced individually.
Replace it with “HEADSET BOARD, COMPLETE”.

• MOD1 (bluetooth module) on ADAPTOR board cannot be replaced
individually.
Replace it with “ADAPTOR BOARD, COMPLETE”.

• HEADSET board is four-layer pritnted board.However, the patterns
of flayer 2 and 3 have not been included in this diagrams.

DR-BT1/BT1K

55

DR-BT1/BT1K

3-1. BLOCK DIAGRAM

• Signal path

F : AUDIO

D10

(BLUE)

PIO1

10

14

2

23

3

1

2

+1.5V REG.

IC3

29

MIC1

MIC

ANT

INH

IC2

BATT

30

ANT2

ANTENNA

SPEAKER

6

3

1

2

7

8

CHGN

MIC_N

PIO0

VDD_IO

RESETB

DC/DC CONVERTER

IC9

5

1

4

CN2

IC4

1 2

SP1

S4

MULITI FUNCTION

4

3

LED DRIVER

Q16

D11

(GREEN)

26

15

24

PIO4

IC7

PIO3

3

4

22

6

1

+2.8V REG.

D9

PIO5

S3

VOL +

S2

VOL -

P1O9

VREG_IN

CHARGE

TERMINAL

RECHAGEABLE

BATTERY (LI-ION)

3.7V

1

2

3

4

B2

Q14
INV.

Q15

DELAY SWITCH

1

PIO11

MOD2

RECEIVER/TRANSMITTER,

MIC AMP,AF AMP,

BLUETOOTH CONTROL

SPKR_P

SPKR_N

PIO10

10

29

2

25

ANT

1

ANT1

ANTENNA

5

MIC_P

PIO11

VDD_IO

CN1

3

LED DRIVER

Q8

11

POWER ON

IC5

6

1

2

DC/DC CONVERTER

+B SWITCH

Q4,5

Pairing/

Power off

PIO9

PIO1

BATTERY

LEVEL DETECT

RECHARGEABLE

BATTERY (NI-MH)

1.2V

B1

28

PIO2

MOD1

RECEIVER,TRANSMITTER

MIC AMP,AF AMP,

BLUETOOTH CONTROL

SPKR_P

P1

PHONE MIC_P

PHONE SPKR_P

(PHONE PLUG)

Q17,18

BUFFER

CN3

4

SWITCHING

Q6

IC1

3

STAT1

IC6

BATT

9

1
2

7

3

OUT

LI-ION BATTERY

CHARGE MANAGEMENT

TEMPERATURE

DETECT

TIME LEDN

D8

(CHARGE)

BATTERY

CHARGER

J1

DC IN 4.5V

10

BUFFER

Q13

CE

IN

VCC

1

2

3

4

1

2

3

4

CN3

STAT1

IC6

BATT

9

1
2

7

3

OUT

LI-ION BATTERY

CHARGE MANAGEMENT

10

BUFFER

Q13

SE

IN

VCC

(BT1K ONLY)

ADAPTOR

HEAD SET

J1

DC IN 4.5V

Q1,3

(BT1 ONLY)

CHARGER

D5

(BLUE)

D6

(GREEN)

S1

S5

D7

D4

Q7(2/2)

Q7(1/2)

14

VDD_IO

15

VREG_IN

D3

D2

CURRENT
CONTROL

Q2

+VB

+VB

-

+

-

+

DR-BT1/BT1K

66

DR-BT1/BT1K

3-2. PRINTED WIRING BOARD – HEADSET BOARD –

: Uses unleaded solder.

Ref. No. Location

D9 D-3
D10 D-2
D11 D-2

IC7 A-4

MOD2 B-2

Q14 B-4
Q15 B-4
Q16 D-2

• Semiconductor Location

HEADSET BOARD

11

(11)

1-864-044-

11

(11)

1-864-044-

11

(11)

1-864-046-

11

(11)

1-864-046-

(

SIDE A

)

HEADSET BOARD

CONNECTOR BOARD

(

SIDE A

)

CONNECTOR BOARD

(

SIDE B

)(

SIDE B

)

1

1

2

8

9

15

1623

24

30

E

E

136

4

1
534

C23

R43

D9

S3

R50

D11

C24

R47

R49

R48

R38

R42

C33

R41

D10

R46

Q16

R63

MIC1

SP1

SPEAKER

C34

L5

L6

C27

IC7

C20

C19

L2

MOD2

C22

R39

R44

C21

ANT2

R55

R45

R40

S2

C25

R56

C38

C40

C35

CN2

Q15

Q14

R64

C53

MULTI

FUNCTION

B2

RECHARGEABLE

BATTERY(LI-ION

)

+

3.7V

E

VOL

+

S4

VOL

-

ADAPTOR

(Page 8)

BT1K

CHARGER
(Page 10)

BT1

2

3 4 5 6 7

8

A

1

B

C

D

E