2.4.1 Description of procedure.......................................................................................................................................... 6
2.4.1.2. Repair by component change ........................................................................................................................... 6
2.4.1.3 Repair by SW-booting....................................................................................................................................... 6
2.4.2 List of material......................................................................................................................................................... 6
2.4.2.2 Jigs and Tools.................................................................................................................................................... 6
2.4.2.3 Special tools ...................................................................................................................................................... 7
2.4.2.4 Working materials............................................................................................................................................. 7
3.2.1 Fault Symptoms for customers:......................................................................................................................... 8
3.2.2 Fault Symptom on GSM tester:......................................................................................................................... 8
3.2.3 Component Information .................................................................................................................................... 8
3.4.1 Description of procedure................................................................................................................................... 9
3.4.1.2 Repair by component change ........................................................................................................................ 9
3.4.1.3 Repair by SW-booting................................................................................................................................... 9
3.4.2 List of material .................................................................................................................................................. 9
3.4.3 Jigs and Tools.................................................................................................................................................. 10
3.4.4 Special tools .................................................................................................................................................... 10
3.4.5 Working materials........................................................................................................................................... 10
4.2.1 Fault Symptoms for customers:....................................................................................................................... 11
4.2.2 Fault Symptom on GSM tester:....................................................................................................................... 11
4.2.3 Component Information .................................................................................................................................. 11
4.4.1 Description of procedure................................................................................................................................. 12
1.1.1.2 Repair by component change ...................................................................................................................... 12
4.4.1.3 Repair by SW-booting................................................................................................................................. 12
4.4.2 List of material ................................................................................................................................................ 12
4.4.2.2 Jigs and Tools.............................................................................................................................................. 12
4.4.3 Special tools .................................................................................................................................................... 13
4.4.4 Working materials........................................................................................................................................... 13
The connector (1610) is the battery connector with 3 contacts.
During power on, 3.5V to 4.2V is supplied to the handset via VBat.
VERROR is provided to the Battery, goes into the Power Management Unit control charge.
The connector (1660) is I/O connector (12 contacts) used the adapter charger.
The adapter charger uses the PIN1 for V_EXTERNAL _Charge and PIN2 GND
BOTTOM
Visually check pins for oxidation or deformity.
Visual inspection of the fittings and I/O pads solder joints (short circuit, leak, poor
brightness).
Measure pins to test points (Vexternal charge, GND) with a multimeter to check for
continuity
3.4.1.2 Repair by component change
1. Use a hot air nozzle to remove the defective connector.
Do not apply exessive heat and flow to avoid to destroy the adjoining solder
joints.
2. Level the solder joint on the pads (eventually add solder).
3. Secure new connector on the PCBA.
4. Reheat the solder on the pads with a fine-tipped soldering iron to allow the solder
to flow on th the connector’s pins.
3.4.1.3 Repair by SW-booting
Not possible!
3.4.1.4 Test
Plugthe adapter charger and check if there is a signal on test point F611
(V_EXT_CHARGE)
Visual inspection of the solder joints (bad soldering, poor brightness, no joint, bad
placement, no component).
4.4.1.2 Repair by component change
1. Use a hot air nozzle to remove the charge chip (pos. 7600) and the zener diode
(pos. 6630) and a fine-tipped soldering iron for the other components.
2. Level the solder joint on the pads (eventually add solder).
3. Peplace a new component on the pads.
4. Reheat the solder on the pads with a fine-tipped soldering iron to allow the solder
to flow on the contacts (eventually add solder with a solder wire).
4.4.1.3 Repair by SW-booting
Not possible!
4.4.1.4 Test
Measure the electrical value by applying a multimeter on the pads.
Or the charge chip, plug the charger and check the stoke running on the LCD.