SIEMENS XELIBRI X4 REPAIR DOCUMENTATION LEVEL 2.5

Information and Communication Mobile

Level 2.5

Repair

Documentation for XELIBRI

X2 & X4

Issue Date Author Description

0.9 15.04.03 Noblet First release

1.0 22.05.03 Lerner Layout update and 1st official release

V 1.0 Page 1 of 14 ICM MP CCQ

GRM

X2 / X4 Company Confidential

04/03

Information and Communication Mobile

Mobile Phones

Table of Contents:

1 XELIBRI Level2.5 Repair Location Code........................................................................................ 4

2 BATTERY CONNECTOR................................................................................................................. 5

2.1 Affected Units................................................................................................................................................ 5

2.1.1 Type: Xelibri ................................................................................................................................................... 5

2.1.2. Affected IMEIs/Date Codes: All/All................................................................................................................... 5

2.1.3. Affected SW-versions: All .................................................................................................................................. 5

2.1.4 Fault Code for LSO reporting: NA........................................................................................................................ 5

2.2 Fault Description ..........................................................................................................................................5

2.2.1 Fault Symptoms for customers:................................................................................................................................ 5

2.2.2 Fault Symptom on GSM tester:................................................................................................................................ 5

2.2.3 Component Information........................................................................................................................................... 5

2.3. Priority: ........................................................................................................................................................6

2.4. Repair document..........................................................................................................................................6

2.4.1 Description of procedure.......................................................................................................................................... 6

2.4.1.1. Diagnosis.......................................................................................................................................................... 6

2.4.1.2. Repair by component change ........................................................................................................................... 6

2.4.1.3 Repair by SW-booting....................................................................................................................................... 6

2.4.1.4 Test.................................................................................................................................................................... 6

2.4.2 List of material......................................................................................................................................................... 6

2.4.2.1 Components....................................................................................................................................................... 6

2.4.2.2 Jigs and Tools.................................................................................................................................................... 6

2.4.2.3 Special tools ...................................................................................................................................................... 7

2.4.2.4 Working materials............................................................................................................................................. 7

2.4.3 Drawing.................................................................................................................................................................... 7

3 I/O CONNECTOR ............................................................................................................................. 8

3.1 Affected Units...........................................................................................................................................8

3.1.1 Type: Xelibri ................................................................................................................................................. 8

3.1.2 Affected IMEIs/Date Codes: All/All................................................................................................................. 8

3.1.3 Affected SW-versions: All............................................................................................................................... 8

3.1.4 Fault Code for LSO reporting: NA.................................................................................................................... 8

3.2 Fault Description......................................................................................................................................8

3.2.1 Fault Symptoms for customers:......................................................................................................................... 8

3.2.2 Fault Symptom on GSM tester:......................................................................................................................... 8

3.2.3 Component Information .................................................................................................................................... 8

3.3 Priority:.....................................................................................................................................................9

3.4 Repair document...................................................................................................................................... 9

3.4.1 Description of procedure................................................................................................................................... 9

3.4.1.1 Diagnosis....................................................................................................................................................... 9

3.4.1.2 Repair by component change ........................................................................................................................ 9

3.4.1.3 Repair by SW-booting................................................................................................................................... 9

3.4.1.4 Test................................................................................................................................................................ 9

3.4.2 List of material .................................................................................................................................................. 9

3.4.2.1 Components................................................................................................................................................... 9

3.4.3 Jigs and Tools.................................................................................................................................................. 10

3.4.4 Special tools .................................................................................................................................................... 10

3.4.5 Working materials........................................................................................................................................... 10

3.4.6 Drawing........................................................................................................................................................... 10

V 1.0 Page 2 of 14 ICM MP CCQ

GRM

X2 / X4 Company Confidential

04/03

Information and Communication Mobile

Mobile Phones

4 Other SMT components................................................................................................................... 11

4.1 Affected Units.........................................................................................................................................11

4.1.1 Type: Xelibri ............................................................................................................................................... 11

4.1.2 Affected IMEIs/Date Codes: All/All............................................................................................................... 11

4.1.3 Affected SW-versions: All............................................................................................................................. 11

4.1.4 Fault Code for LSO reporting: NA.................................................................................................................. 11

4.2 Fault Description....................................................................................................................................11

4.2.1 Fault Symptoms for customers:....................................................................................................................... 11

4.2.2 Fault Symptom on GSM tester:....................................................................................................................... 11

4.2.3 Component Information .................................................................................................................................. 11

4.3 Priority:...................................................................................................................................................12

4.4 Repair document.................................................................................................................................... 12

4.4.1 Description of procedure................................................................................................................................. 12

4.4.1.1 Diagnosis..................................................................................................................................................... 12

1.1.1.2 Repair by component change ...................................................................................................................... 12

4.4.1.3 Repair by SW-booting................................................................................................................................. 12

4.4.1.4 Test.............................................................................................................................................................. 12

4.4.2 List of material ................................................................................................................................................ 12

4.4.2.1 Components................................................................................................................................................. 12

4.4.2.2 Jigs and Tools.............................................................................................................................................. 12

4.4.3 Special tools .................................................................................................................................................... 13

4.4.4 Working materials........................................................................................................................................... 13

4.4.5 Drawing........................................................................................................................................................... 13

5 TEST POINTS LOCATION............................................................................................................ 13

6 PCB OVERVIEW ............................................................................................................................ 14

V 1.0 Page 3 of 14 ICM MP CCQ

GRM

X2 / X4 Company Confidential

04/03

Information and Communication Mobile

1 XELIBRI Level2.5 Repair Location Code

Single side product

I/O connector Battery connector

Mobile Phones

Other SMT components

V 1.0 Page 4 of 14 ICM MP CCQ

GRM

X2 / X4 Company Confidential

04/03

Information and Communication Mobile

Mobile Phones

2 BATTERY CONNECTOR

2.1 Affected Units

2.1.1 Type: Xelibri

2.1.2 Affected IMEIs/Date Codes: All/All

2.1.3 Affected SW-versions: All

2.1.4 Fault Code for LSO reporting: NA

2.2 Fault Description

2.2.1 Fault Symptoms for customers:

Can’t power on under normal opertion

Can’t charge this handset when power off

2.2.2 Fault Symptom on GSM tester:

This fault can not be detected with a GSM-Tester

2.2.3 Component Information

The connector (1610) is the battery connector with 3 contacts. During power on, 3.5V to 4.2V is supplied to the handset via VBat. VERROR is provided to the Battery, goes into the Power Management Unit control charge.

V 1.0 Page 5 of 14 ICM MP CCQ

GRM

X2 / X4 Company Confidential

04/03

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