Siemens C75 Service Manual
Company Confidential s Com
Copyright 2005© Siemens AG
Service Repair Documentation
Level 2.5 light – C75
Release Date Department Notes to change
1.0 08.06.2005 ICM MP CCQ GRM T New document
Service Repair Documentation
TI_Repair_L2,5L_C75_R1.0
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Company Confidential s Com
Copyright 2005© Siemens AG
Introduction
This Service Repair Documentation is intended to carry out repairs on Siemens repair level
2.5 light. The described failures shall be repaired in Siemens authorized local workshops
only,
The level 2.5 (former Level 2.5e) partners are obliged to repair level 2 classified boards, up
to their repair level, under consideration of the information given by level 2.5 (former level
2.5e) repair instruction.
All repairs have to be carried out in an ESD protected environment and with ESD protected
equipment/tools. For all activities the international ESD regulations have to be considered.
Assembling/disassembling has to be done according to the latest C75 Level 2 repair
documentation. It has to be ensured that every repaired mobile Phone is checked according
to the latest released General Test Instruction document (both documents are available in
the Technical Support section of the C-market).
Check at least weekly C-market for updates and consider all C75 related Customer Care
Information
C75 Partnumber on IMEI label: S30880-S6970-#xxx
, while # may be any letter (A-Z) and xxx may be any number from 100, 101, 102....
Scrap Handling: All Scrap information given in this manual are related to the
SCRAP-Rules and instructions.
Attention: Consider the new "LEAD-FREE" soldering rules
(available in the communication market), avoid excessive heat.
If you have any questions regarding the repair procedures or technical questions spare not
hesitate to contact our technical support team in Kamp-Lintfort, Germany:
Tel.: +49 2842 95 4666
Fax: +49 2842 95 4302
E-mail: st-support@siemens.com
Service Repair Documentation
TI_Repair_L2,5L_C75_R1.0
Page 2 of 13
Company Confidential s Com
Copyright 2005© Siemens AG
Table of Content
1 C75 board layout...........................................................................................................................4
2 Connector SIM Card Reader.........................................................................................................5
3 Connector IO Jack.........................................................................................................................6
4 Connector Board to Board.............................................................................................................8
5 Connector Battery .........................................................................................................................9
6 Connector Camera......................................................................................................................10
7 Connector Display.......................................................................................................................10
8 IRDA............................................................................................................................................12
9 JOYSTICK...................................................................................................................................13
Service Repair Documentation
TI_Repair_L2,5L_C75_R1.0
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Confidential s
Copyright 2005© Siemens AG
1 C75 board layout
Jigs, Tools and working materials for all described repairs:
- hot air blower
- soldering gun
- tweezers
- flux
- solder
Connector
Camera
Connector
Display
IRDA
Joystick
Connector
SIM Card
Reade
Connector
Board to
Board
IO Jack
Slim
Connector
Antenna
Service Repair Documentation
TI_Repair_L2,5L_C75_R1.0
Connector
Battery
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