This Service Repair Documentation is intended to carry out repairs on Siemens repair level
2.5 light. The described failures shall be repaired in Siemens authorized local workshops
only,
The level 2.5 (former Level 2.5e) partners are obliged to repair level 2 classified boards, up
to their repair level, under consideration of the information given by level 2.5 (former level
2.5e) repair instruction.
All repairs have to be carried out in an ESD protected environment and with ESD protected
equipment/tools. For all activities the international ESD regulations have to be considered.
Assembling/disassembling has to be done according to the latest C75 Level 2 repair
documentation. It has to be ensured that every repaired mobile Phone is checked according
to the latest released General Test Instruction document (both documents are available in
the Technical Support section of the C-market).
Check at least weekly C-market for updates and consider all C75 related Customer Care
Information
C75 Partnumber on IMEI label: S30880-S6970-#xxx
, while # may be any letter (A-Z) and xxx may be any number from 100, 101, 102....
Scrap Handling: All Scrap information given in this manual are related to the
SCRAP-Rules and instructions.
Attention: Consider the new "LEAD-FREE" soldering rules
(available in the communication market), avoid excessive heat.
If you have any questions regarding the repair procedures or technical questions spare not
hesitate to contact our technical support team in Kamp-Lintfort, Germany:
Charging Problems No connection to GRT
Problems with external loudspeaker or microphone when using a car kit Tbd.
Problems with accessories connected at the IO connector
Connector IO Jack
Use soldering iron to remove defective component. Avoid excessive heat! Watch surrounding components!
Resolder new component afterwards.
E-commerce order number: L36334-Z93-C303
E-commerce order name: IO-JACK SLIM 12-POL
Soldering temperature: ~ 360°C TIP Temp.
IRIS Diagnose Code: 46100 Interface/Charging Connector/Mechanical Damage
The MMC Reader is located on the opposite of the SLIM-Lumberg connector.
Therefore the risk to damage the plastic material of this MMC-Reader is
potentially high if excessive heat is used while removal or soldering of the
SLIM-Lumberg connector.
Please follow these instructions:
a) Remove the SLIM-Lumberg connector with a soldering iron and Desolder
Wick
b) Clean the Pads afterwards
c) Solder the new connecter by using soldering iron under consideration of
the max. allowed temperature range.
Samples of critical area:
Lock mechanism damagedLock mechanism OK
Service Repair Documentation
TI_Repair_L2,5L_C75_R1.0
Keyboard malfunction Keyboard malfunction
Keypad illumination does not work Tbd.
Connector Board to Board
Use hot air blower to remove defective component. Avoid excessive heat! Watch surrounding components!
Resolder new component afterwards.
E-commerce order number: L50634-Z97-C383
E-commerce order name: CONNECTOR BOARD TO BOARD 12-POL. X75
Soldering temperature: ~ 360°C TIP Temp.
IRIS Diagnose Code: 32100 Keys / Main / No Function
Use hot air blower to remove defective component. Avoid excessive heat! Watch surrounding components!
Resolder new component afterwards.
E-commerce order number: L36315-Z77-C218
E-commerce order name: JOYSTICK
Soldering temperature: ~ 360°C TIP Temp.
IRIS Diagnose Code: 32100 Keys / Main / No Function
32200 Keys / Main / Reduced Functionality
Page 13 of 13
Service Repair Documentation
TI_Repair_L2,5L_C75_R1.0
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