µC compatible power switch with diagnostic feedback
for 12 V DC grounded loads
•
Most suitable for resistive and lamp loads
•
Replaces electromechanical relays and discrete circuits
vervoltage Protection
perating voltage
active channels
n-state resistance
L(SCr)
PROFET® BTS720L1
V
bb(AZ)
V
bb(on)
one
two parallelfour paralle
5.0 ... 24V
1005025
43V
m
Ω
A
A
General Description
N channel vertical power FET with charge pump, ground referenced CMOS compatible input and diagnostic
feedback, monolithically integrated in Smart SIPMOS technology. Fully protected by embedded protection
functions.
Pin Definitions and Functions
PinSymbol Function
1,10,
11,12,
15,16,
19,20
3IN1Input 1 .. 4, activates channel 1 .. 4 in case of
5IN2logic high signal
7IN3
9IN4
18OUT1Output 1 .. 4, protected high-side power output
17OUT2of channel 1 .. 4. Design the wiring for the
14OUT3max. short circuit current
13OUT4
4ST1/2Diagnostic feedback 1/2 of channel 1 and
8ST3/4Diagnostic feedback 3/4 of channel 3 and
2GND1/2 Ground 1/2 of chip 1 (channel 1 and channel 2)
6GND3/4 Ground 3/4 of chip 2 (channel 3 and channel 4)
V
bb
Positive power supply voltage. Design the
wiring for the simultaneous max. short circuit
currents from channel 1 to 4 and also for low
thermal resistance
channel 2, open drain, low on failure
channel 4, open drain, low on failure
Pin configuration
Vbb1
GND1/2 219 V
IN1 318 OUT1
ST1/2 417 OUT2
IN2 516 V
GND3/4 615 V
IN3 714 OUT3
ST3/4 813 OUT4
IN4 912 V
Vbb1011 V
•
(top view)
20 V
bb
bb
bb
bb
bb
bb
)
1
With external current limit (e.g. resistor R
connection, reverse load current limited by connected load.
Semiconductor Group Page 1 of 14 26.Feb.96
=150 Ω) in GND connection, resistor in series with ST
Supply voltage (overvoltage protection see page 4)
Supply voltage for full short circuit protection
T
= -40 ...+150°C
j,start
V
V
bb
bb
43V
24V
Semiconductor Group Page 226.Feb.96
BTS720L1
Maximum Ratings at
T
= 25°C unless otherwise specified
j
ParameterSymbolValuesUnit
Load current (Short-circuit current, see page 5)
)
Load dump protection
)
3
R
= 2 Ω,
I
t
= 200 ms; IN = low or high,
d
each channel loaded with
2
V
LoadDump
R
= 4.7 Ω,
L
=
U
+
V
,
A
U
s
Operating temperature range
Storage temperature range
Power dissipation (DC)
(all channels active)
5
T
T
Electrostatic discharge capability (ESD)
= 13.5 V
A
= 25°C:
a
= 85°C:
a
I
L
V
Load dump
T
j
T
stg
P
tot
V
ESD
self-limitedA
)
4
-40 ...+150
60V
°C
-55 ...+150
3.7
W
1.9
1.0kV
(Human Body Model)
Input voltage (DC)
Current through input pin (DC)
Current through status pin (DC)
see internal circuit diagram page 8
V
I
I
IN
ST
IN
-10 ... +16V
±2.0
mA
±5.0
Thermal resistance
junction - soldering point
junction - ambient
5)
5),6)
each channel:
one channel active:
all channels active:
R
R
thjs
thja
15K/W
41
34
Electrical Characteristics
Parameter and Conditions,
at Tj = 25 °C,
V
= 12 V unless otherwise specified
bb
each of the four channels
Load Switching Capabilities and Characteristics
On-state resistance (Vbb to OUT)
IL = 2 Aeach channel,
two parallel channels,
four parallel channels,
)
2
Supply voltages higher than V
150 Ω resistor in the GND connection and a 15 kΩ resistor in series with the status pin. A resistor for input
protection is integrated.
3)
R
= internal resistance of the load dump test pulse generator
I
4)
V
Load dump
)
5
Device on 50mm*50mm*1.5mm epoxy PCB FR4 with 6cm
connection. PCB is vertical without blown air. See page 14
)
6
Soldering point: upper side of solder edge of device pin 15. See page 14
is setup without the DUT connected to the generator per ISO 7637-1 and DIN 40839
require an external current limit for the GND and status pins, e.g. with a
bb(AZ)
T
= 25°C:
j
T
= 150°C:
j
T
= 25°C:
j
T
= 25°C:
j
SymbolValuesUnit
mintypmax
R
ON
--
85
170
100
200
43
22
2
(one layer, 70µm thick) copper area for V
mΩ
50
25
bb
Semiconductor Group Page 326.Feb.96
BTS720L1
Parameter and Conditions,
at Tj = 25 °C,
V
= 12 V unless otherwise specified
bb
each of the four channels
Nominal load currentone channel active:
two parallel channels active:
four parallel channels active:
Device on PCB5),
T
= 85°C,
a
T
≤ 150°C
j
Output current while GND disconnected or pulled
up; V
Turn-on time
Turn-off timeto 10%
R
= 12
L
= 30 V,
bb
Ω
,
V
= 0, see diagram page 9
IN
T
=-40...+150°C
j
to 90%
V
V
OUT
OUT
Slew rate on
10 to 30%
V
OUT
R
= 12
,
L
Ω
,
T
=-40...+150°C:
j
Slew rate off
70 to 40%
V
OUT
,
R
= 12
L
Ω
,
T
=-40...+150°C:
j
Operating Parameters
)
Operating voltage
Undervoltage shutdown
Undervoltage restart
7
T
=-40...+150°C:
j
T
=-40...+150°C:
j
T
=-40...+25°C:
j
T
=+150°C:
j
Undervoltage restart of charge pump
see diagram page 13
Thermal overload trip temperature
Thermal hysteresis
=-40°C:
j
T
=25°C:
j
T
=+150°C:
j
T
=-40°C:
j,start
= 25°C:
j,start
SymbolValuesUnit
mintypmax
I
L(SCp)
I
L(SCr)
t
off(SC)
T
jt
T
∆
jt
16
12
7
--
--
--
--
--
22
18
11
10
10
10
3.8
28
24
15
--
--
--
----ms
3
150----°C
--10--K
A
A
Reverse Battery
)
Reverse battery voltage
Drain-source diode voltage
= - 2.9 A,
L
I
j
T
= +150°C
10
(V
Diagnostic Characteristics
Open load detection current,
each channel,
Open load detection voltage
Internal output pull down
(OUT to GND), V
OUT
= 5 V
)
> V
out
bb
(on-condition)
T
= -40°C:
j
T
= 25°C:
j
T
= +150°C:
j
two parallel channels
four parallel channels
)
11
T
=-40..+150°C:
j
T
=-40..+150°C:
j
-
V
bb
-
V
ON
I
L (OL)
V
OUT(OL)
R
O
----32V
--610--mV
4
800
800
550
--
1450
--
1300
--
1200
mA
234V
41030k
Ω
)
10
Requires a 150 Ω resistor in GND connection. The reverse load current through the intrinsic drain-source
diode has to be limited by the connected load. Note that the power dissipation is higher compared to normal
operating conditions due to the voltage drop across the intrinsic drain-source diode. The temperature
protection is not active during reverse current operation! Input and Status currents have to be limited (see
max. ratings page 3 and circuit page 8).
11)
External pull up resistor required for open load detection in off state.
Semiconductor Group Page 526.Feb.96
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