On-state resistance
Load current (ISO)
Current limitation
TO-220AB/7
Standard
R
ON
I
L(ISO
I
L(SCr
V
bb(AZ
V
bb(on
1
43V
5.0 ... 24V
both
parallel
10050
4.48.5A
1010A
7
General Description
N channel vertical power FET with charge pump, ground referenced CMOS compatible input and diagnostic
feedback, monolithically integrated in Smart SIPMOS technology. Fully protected by embedded protection
functions.
m
Ω
+ V
bb
OUT1
4
1
7
Load
O2
Load GND
Voltage
source
V
Logic
Voltage
sensor
3
IN1
IN2
6
ESD
5
ST
PROFET
Logic
Overvoltage
protection
Level shifter
Rectifier 1
Charge
pump 1
Charge
pump 2
Level shifter
Rectifier 2
GND
2
Current
limit 1
Current
limit 2
Signal GND
Gate 1
protection
Open load
Short to Vbb
detection 1
Gate 2
protection
Open load
Short to Vbb
detection 2
Temperature
sensor 1
Temperature
sensor 2
OUT2
RR
O1
GND
)
1
With external current limit (e.g. resistor R
=150 Ω) in GND connection, resistor in series with ST
GND
connection, reverse load current limited by connected load.
Semiconductor Group112.96
BTS 620 L1
)
)
PinSymbolFunction
1OUT1 (Load, L)Output 1, protected high-side power output of channel 1
2GNDLogic ground
3IN1Input 1, activates channel 1 in case of logical high signal
4V
bb
Positive power supply voltage,
the tab is shorted to this pin
5ST
Diagnostic feedback: open drain, low on failure
6IN2Input 2, activates channel 2 in case of logical high signal
7OUT2 (Load, L)Output 2, protected high-side power output of channel 2
at
T
= 25 °C unless otherwise specified
Maximum Ratings
j
ParameterSymbolValuesUnit
Supply voltage (overvoltage protection see page 3)
Supply voltage for full short circuit protection
T
=-40 ...+150°C
j Start
)
Load dump protection
)
3
R
= 2 Ω,
I
R
= 2.7 Ω,
L
2
V
LoadDump
t
= 200 ms, IN= low or high
d
=
U
A
+
V
,
s
U
= 13.5 V
A
Load current (Short circuit current, see page 4)
Operating temperature range
Storage temperature range
Power dissipation (DC), TC ≤ 25 °C
Electrostatic discharge capability (ESD
(Human Body Model
acc. MIL-STD883D, method 3015.7 and ESD assn. std. S5.1-1993
all other pins:
Input voltage (DC)
Current through input pin (DC)
Current through status pin (DC)
see internal circuit diagrams page 6
IN:
V
bb
V
bb
V
Load dump
I
L
T
j
T
stg
P
tot
V
ESD
V
IN
I
IN
I
ST
43V
24V
)
4
60V
self-limitedA
-40 ...+150
°C
-55 ...+150
75W
1.0
kV
2.0
-10 ... +16V
±2.0
mA
±5.0
Thermal Characteristics
Parameter and ConditionsSymbolValuesUnit
mintypmax
Thermal resistancechip - case, both channels:
each channel:
junction - ambient (free air):
)
2
Supply voltages higher than V
150 Ω resistor in the GND connection and a 15 kΩ resistor in series with the status pin. A resistor for the
protection of the input is integrated.
3)
R
= internal resistance of the load dump test pulse generator
I
4)
V
Load dump
is setup without the DUT connected to the generator per ISO 7637-1 and DIN 40839
require an external current limit for the GND and status pins, e.g. with a
bb(AZ)
R
R
thJC
thJA
--
--
--
--
--
--
Semiconductor Group2
1.7
3.4
75
K/W
Electrical Characteristics
)
BTS 620 L1
Parameter and Conditions,
at
T
= 25 °C,
j
V
= 12 V unless otherwise specified
bb
each channel
Load Switching Capabilities and Characteristics
On-state resistance (pin 4 to 1 or 7)
I
= 2 A
L
each channel
T
=25 °C:
j
T
=150 °C:
j
Nominal load current, ISO Norm (pin 4 to 1 or 7
V
= 0.5 V,
ON
T
= 85 °Ceach channel:
C
both channels parallel:
Output current (pin 1 or 7) while GND disconnected
or GND pulled up,
V
bb
=30 V,
V
= 0, see diagram
IN
page 7
Turn-on time IN to 90%
Turn-off timeIN to 10%
R
= 12 Ω
L
T
=-40...+150°C
,
j
V
V
OUT
OUT
:
:
Slew rate on
10 to 30%
OUT
R
,
= 12 Ω
L
T
=-40...+150°C
,
j
V
Slew rate off
70 to 40%
V
OUT
,
R
L
= 12 Ω
T
=-40...+150°C
,
j
SymbolValuesUnit
mintypmax
R
ON
I
L(ISO)
--80
3.5
6.8
160
4.4
8.5
100
200
mΩ
--
--
I
L(GNDhigh)
t
on
t
off
dV /dt
on
-dV/dt
off
----10mA
80
80
200
200
400
400
0.1--1V/µs
0.1--1V/µs
A
µs
Operating Parameters
)
Operating voltage
Operating voltage
5
)
6
Undervoltage shutdown
Undervoltage restart
T
=-40...+150°C:
j
T
=-40...+150°C:
j
T
=-40...+150°C:
j
T
Undervoltage restart of charge pump
see diagram page 10
in table of protection functions and circuit diagram page 7.
V
= 5.6 V typ without charge pump,
bb
V
= 5.6 V typ without charge pump,
bb
Semiconductor Group3
V
V
OUT
OUT
≈
V
- 2 V
bb
≈
V
- 2 V
bb
BTS 620 L1
)
j
j
j
j
j
j
Parameter and Conditions,
at
T
= 25 °C,
j
V
= 12 V unless otherwise specified
bb
Leakage output current (included in
IN
V
=0
Operating current (Pin 2)8),
both channels on,
=-40...+150°C
T
Operating current (Pin 2)
one channel on,
=-40...+150°C:
T
each channel
V
IN
8)
=5 V
I
bb(off
)
Protection Functions
Initial peak short circuit current limit (pin 4 to 1
or 7)
T
=-40°C:
T
=25°C:
T
=+150°C:
j
Repetitive short circuit shutdown current limit
T
=
T
j
(see timing diagrams, page 9)
jt
Thermal overload trip temperature
Thermal hysteresis
)
Reverse battery (pin 4 to 2)
Reverse battery voltage drop
= -2.9 A, each channel
I
L
9
(V
out
> V
bb
)
T
=150 °C:
j
SymbolValuesUnit
mintypmax
I
L(off)
I
GND
I
GND
I
L(SCp)
I
L(SCr)
----12
--46mA
--23mA
16
12
7
22
18
11
28
24
15
--10--A
T
∆T
-
V
-V
jt
jt
bb
ON(rev)
150----°C
--10--K
----32V
--
610--
mV
A
µ
A
Diagnostic Characteristics
Open load detection current
(on-condition, )
Open load detection voltage
)
10
(off-condition)
T
=-40 °C
T
=25°C:
T
=150°C:
T
j
=-40..150°C:
j
:
I
L (OL)
V
OUT(OL)
800
800
550
--
1450
--
1300
--
1200
234V
Internal output pull down
(pin 1
)
8
Add
)
9
Requires 150 Ω resistor in GND connection. The reverse load current through the intrinsic drain-source
diode has to be limited by the connected load. Note that the power dissipation is higher compared to normal
operating conditions due to the voltage drop across the intrinsic drain-source diode. The temperature
protection is not active during reverse current operation! Input and Status currents have to be limited (see
max. ratings page 2 and circuit page 7).
10)
External pull up resistor required for open load detection in off state.
7 to 2),
or
, if
I
ST
> 0, add
I
ST
V
OUT
=5 V,
, if
I
IN
=-40..150°C
T
j
>5.5 V
V
IN
R
O
41030k
mA
Ω
Semiconductor Group4
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