On-state resistance
Load current (ISO)
Current limitation
TO-220AB/7
7
1
Standard
Straight leads
R
ON
I
L(ISO
I
L(SCr
V
bb(AZ
V
bb(on
1
43V
5.0 ... 34V
both
parallel
200100
2.34.4A
44A
7
1
SMD
feedback for 12 V and 24 V DC grounded loads
•
All types of resistive, inductive and capacitve loads
•
Replaces electromechanical relays, fuses and discrete circuits
General Description
N channel vertical power FET with charge pump, ground referenced CMOS compatible input and diagnostic
feedback, monolithically integrated in Smart SIPMOS technology. Fully protected by embedded protection
functions.
m
Ω
7
Voltage
source
V
Logic
Voltage
sensor
3
IN1
IN2
6
ESD
5
ST
PROFET
Logic
Overvoltage
protection
Level shifter
Rectifier 1
Charge
pump 1
Charge
pump 2
Level shifter
Rectifier 2
GND
2
Current
limit 1
Current
limit 2
Signal GND
)
1
With external current limit (e.g. resistor R
=150 Ω) in GND connection, resistor in series with ST
GND
connection, reverse load current limited by connected load.
Gate 1
protection
Limit for
unclamped
ind. loads 1
Open load
Short to Vbb
detection 1
Gate 2
protection
Limit for
unclamped
ind. loads 2
Open load
Short to Vbb
detection 2
Temperature
sensor 1
Temperature
sensor 2
+ V
OUT1
OUT2
bb
4
1
7
Load
Load GND
Semiconductor Group1
BTS 612 N1
j,
Parameter and Conditions,
at
T
= 25 °C,
j
V
= 12 V unless otherwise specified
bb
each channel
SymbolValuesUnit
mintypmax
PinSymbolFunction
1OUT1 (Load, L)Output 1, protected high-side power output of channel 1
2GNDLogic ground
3IN1Input 1, activates channel 1 in case of logical high signal
4V
bb
Positive power supply voltage,
the tab is shorted to this pin
5ST
Diagnostic feedback: open drain, low on failure
6IN2Input 2, activates channel 2 in case of logical high signal
7OUT2 (Load, L)Output 2, protected high-side power output of channel 2
at
T
= 25 °C unless otherwise specified
Maximum Ratings
j
ParameterSymbolValuesUnit
Supply voltage (overvoltage protection see page 4)
Supply voltage for full short circuit protection
T
=-40 ...+150°C
j Start
)
Load dump protection
)
3
R
= 2 Ω,
I
R
= 5.3 Ω,
L
2
V
LoadDump
t
= 200 ms, IN= low or high
d
=
U
A
+
V
,
s
U
= 13.5 V
A
Load current (Short circuit current, see page 5)
Operating temperature range
Storage temperature range
Power dissipation (DC), TC ≤ 25 °C
V
bb
V
bb
V
Load dump
I
L
T
j
T
stg
P
tot
43V
34V
)
4
60V
self-limitedA
-40 ...+150
°C
-55 ...+150
36W
Inductive load switch-off energy dissipation, single pulse
V
= 12V,
one channel,
both channels parallel,
see diagrams on page 9
Electrostatic discharge capability (ESD)IN:
(Human Body Model)all other pins:
acc. MIL-STD883D, method 3015.7 and ESD assn. std. S5.1-1993
Input voltage (DC)
Current through input pin (DC)
Current through status pin (DC)
see internal circuit diagrams page 8
T
= 150°C,
start
T
= 150°C const.
C
I
= 2.3 A, Z
L
I
= 4.4 A, Z
L
= 89 mH, 0
L
= 47 mH, 0 Ω:580
L
Ω
:
E
AS
V
ESD
V
I
I
IN
IN
ST
-10 ... +16V
290mJ
1.0
2.0
±
±
2.0
5.0
mA
kV
)
2
Supply voltages higher than V
150 Ω resistor in the GND connection and a 15 kΩ resistor in series with the status pin. A resistor for the
protection of the input is integrated.
3)
R
= internal resistance of the load dump test pulse generator
I
4)
V
Load dump
is setup without the DUT connected to the generator per ISO 7637-1 and DIN 40839
require an external current limit for the GND and status pins, e.g. with a
bb(AZ)
Semiconductor Group2
BTS 612 N1
Parameter and Conditions,
at
T
= 25 °C,
j
V
= 12 V unless otherwise specified
bb
each channel
SymbolValuesUnit
mintypmax
Thermal Characteristics
Parameter and ConditionsSymbolValuesUnit
mintypmax
Thermal resistancechip - case, both channels:
each channel:
junction - ambient (free air):
R
R
thJC
thJA
--
--
--
--
--
--
3.5
7.0
75
K/W
SMD version, device on PCB5):37
Electrical Characteristics
Parameter and Conditions,
at
T
= 25 °C,
j
V
= 12 V unless otherwise specified
bb
Load Switching Capabilities and Characteristics
On-state resistance (pin 4 to 1 or 7)
I
= 1.8 A
L
each channel
Nominal load current, ISO Norm (pin 4 to 1 or 7)
V
= 0.5 V,
ON
T
= 85 °Ceach channel:
C
Output current (pin 1 or 7) while GND disconnected
or GND pulled up,
V
bb
=30 V,
page 9
Turn-on time IN to 90%
Turn-off timeIN to 10%
R
= 12
L
T
=-40...+150°C
Ω
,
j
Slew rate on
10 to 30%
V
OUT
R
= 12
,
L
Slew rate off
70 to 40%
V
OUT
,
R
= 12
L
each channel
T
=25 °C:
j
T
=150 °C:
j
both channels parallel:
V
= 0, see diagram
IN
T
=-40...+150°C
Ω
,
j
T
=-40...+150°C
Ω
,
j
V
V
OUT
OUT
SymbolValuesUnit
mintypmax
R
:
:
I
I
t
t
dV /dt
-dV/dt
ON
L(ISO)
L(GNDhigh)
on
off
on
off
--160
1.8
3.5
320
2.3
4.4
200
400
----10mA
80
80
200
200
400
400
0.1--1V/µs
0.1--1V/µs
m
Ω
--
A
--
µ
s
)
5
Device on 50mm*50mm*1.5mm epoxy PCB FR4 with 6cm
connection. PCB is vertical without blown air.
Semiconductor Group3
2
(one layer, 70µm thick) copper area for V
bb
BTS 612 N1
j
j
j
Parameter and Conditions,
at
T
= 25 °C,
j
V
= 12 V unless otherwise specified
bb
each channel
Operating Parameters
)
Operating voltage
Undervoltage shutdown
Undervoltage restart
6
T
j
T
j
T
Undervoltage restart of charge pump
see diagram page 12
in table of protection functions and circuit diagram page 8.
ON(CL)
I
> 0, add
ST
I
IN
, if
V
= 5.6 V typ without charge pump,
bb
V
>5.5 V
IN
Semiconductor Group4
V
OUT
≈
V
- 2 V
bb
BTS 612 N1
j
j
)
Parameter and Conditions,
at
T
= 25 °C,
j
V
= 12 V unless otherwise specified
bb
each channel
Protection Functions
Initial peak short circuit current limit (pin 4 to 1
or 7)
=-40°C:
T
=25°C:
T
=+150°C:
j
T
Repetitive short circuit shutdown current limit
T
=
T
j
(see timing diagrams, page 11)
jt
Output clamp (inductive load switch off)
at
V
=
V
-
OUT
bb
V
ON(CL)
I
= 40 mA:
L
Thermal overload trip temperature
Thermal hysteresis
)
Reverse battery (pin 4 to 2)
Reverse battery voltage drop
= -1.9 A, each channel
I
L
9
(V
out
> V
bb
)
T
=150 °C:
j
SymbolValuesUnit
mintypmax
I
L(SCp)
I
L(SCr)
5.5
4.5
2.5
9.5
7.5
4.5
13
11
7
--4--A
V
ON(CL)
T
jt
∆T
-
V
-V
jt
bb
ON(rev)
414753V
150----°C
--10--K
----32V
--
610--
mV
A
Diagnostic Characteristics
Open load detection current
(included in standby current
I
bb(off
Open load detection voltage
I
)
=-40..150°C:
T
j
L(off)
V
OUT(OL)
--30--
A
µ
234V
)
9
Requires 150 Ω resistor in GND connection. The reverse load current through the intrinsic drain-source
diode has to be limited by the connected load. Note that the power dissipation is higher compared to normal
operating conditions due to the voltage drop across the intrinsic drain-source diode. The temperature
protection is not active during reverse current operation! Input and Status currents have to be limited (see
max. ratings page 2 and circuit page 8).
Semiconductor Group5
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