Siemens BSS149 Datasheet

SIPMOS Small-Signal Transistor BSS 149
V
I
D
R
N channel
Depletion mode
High dynamic resistance
Available grouped in V
Type Ordering
BSS 149 Q67000-S252 E6325: 2000 pcs/carton;
DS
DS(on)
200 V
0.35 A
3.5
Code
GS(th)
Tape and Reel Information
1
Pin Configuration Marking Package 123
G D S SS149 TO-92
Maximum Ratings Parameter Symbol Values Unit
Drain-source voltage V Drain-gate voltage,
R
= 20 k V
GS
Gate-source voltage Gate-source peak voltage, aperiodic Continuous drain current, Pulsed drain current, Max. power dissipation,
T
= 34 ˚C I
A
T
= 25 ˚C I
A
T
= 25 ˚C P
A
Operating and storage temperature range
V V
D
D puls
T
j
DS
DGR
GS
gs
tot
, T
stg
200 V 200
± 14 ± 20
0.35 A
1.05
1.0 W – 55 … + 150 ˚C
3
2
Thermal resistance, chip-ambient
R
thJA
125 K/W
(without heat sink) DIN humidity category, DIN 40 040 E – IEC climatic category, DIN IEC 68-1 55/150/56
Semiconductor Group 1 04.97
BSS 149
Electrical Characteristics
at Tj = 25 ˚C, unless otherwise specified.
Parameter Symbol Values Unit
min. typ. max.
Static Characteristics
Drain-source breakdown voltage
V
= 3 V, ID = 0.25 mA
GS
Gate threshold voltage
V
= 3 V, ID = 1 mA
DS
Drain-source cutoff current
V
= 200 V, VGS = 3 V
DS
T
= 25 ˚C
j
T
= 125 ˚C
j
Gate-source leakage current
V
= 20 V, VDS = 0
GS
Drain-source on-resistance
V
= 0 V, ID = 0.05 A
GS
Dynamic Characteristics
Forward transconductance
V
2 × IR
DS
DS(on)max
, ID = 0.35 A
Input capacitance
V
= 0, VDS = 25 V, f = 1 MHz
GS
Output capacitance
V
= 0, VDS = 25 V, f = 1 MHz
GS
Reverse transfer capacitance
V
= 0, VDS = 25 V, f = 1 MHz
GS
Turn-on time
V
=30V,VGS = 2 V ... + 5 V,RGS =50Ω,
DD
I
=0.29 A
D
Turn-off time t
V
=30V,VGS = 2 V ... + 5 V, RGS =50Ω,
DD
I
=0.29 A
D
t
, (ton = t
on
, (t
off
+ tr)
d(on)
= t
d(off)
+ tf)
off
V
(BR)DSS
V
GS(th)
I
DSS
I
GSS
R
DS(on)
g
fs
C
iiss
C
oss
C
rss
t
d(on)
t
r
t
d(off)
t
f
V
200
1.8 1.2 0.7 µA
– –
– –
0.2 200
nA
10 100
2.5 3.5
S
0.4 0.6 – pF
500 670
–4060
–1220 – 7 10 ns –2030
–6080 –5065
Semiconductor Group 2
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