Datasheet X0202MA1BA2, X0205NA2BL2, X0205NA1BA2, X0205MN5BA4, X0205MA2BL2 Datasheet (SGS Thomson Microelectronics)

®

X02 Ser ies

SENSITIVE 1.25A SCRs

MAIN FEATURES:

Symbol Value Unit

I

T(RMS)

V

DRM/VRRM

I

GT

1.25 A

600 and 800 V

50 to 200 µA

DESCRIPTION

Thanks to highly sensitive triggering levels, the
X02 SCR series is suitable for all applications
where the available gate current is limited, such as
ground fault circuit interruptors, overvoltage
crowbar protection in low power supplies,
capacitive ignition circuits, ...
Available in though-hole or surface-mount
packages, these devices a re opt imized in forward
voltage drop and inrush current capabilities, for
reduced power los ses and high reliability in harsh
environments.

TO-92

(X02xxA)

A

G

K

SOT-223

(X02xxN)

ABSOLUTE RATINGS (lim iting values)

Symbol Parameter Value Unit

I

T(RMS)

IT

(AV)

I

TSM

²

I

dI/dt

I

GM

P

G(AV)

T

stg

Tj

RMS on-state current
(180° conduction angle)

Average on-state current
(180° conduction angle)

Non repetitive surge peak on-state
current

tI

²

t Value for fusing

Critical rate of rise of on-state current

= 2 x IGT , tr ≤ 100 ns

I

G

Peak gate current tp = 20 µs Tj = 125°C 1.2 A
Average gate power dissipation Tj = 125°C 0.2 W

Storage junction temperature range
Operating junction temp erature range

September 2000 - Ed: 3

TO-92 TI = 55°C

SOT-223 Ttab = 95°C

1.25 A

TO-92 TI = 55°C

0.8 A

SOT-223 Ttab = 95°C

tp = 8.3 ms

Tj = 25°C

25

tp = 10 ms 22.5
tp = 10 ms Tj = 25°C 2.5

F = 60 Hz Tj = 125°C 50 A/µs

- 40 to + 150

- 40 to + 125

A

2

S

A

°C

1/6

X02 Series

ELECTRICAL CHARACTERISTICS (Tj = 25°C, unless otherwise specified)

Symbol Test Conditions

X02xx

02 05

I

GT

VD = 12 V RL = 140 Ω

V

GT

V
V

dV/dt V

V

V

I

DRM

I

RRM

VD = V

GD

IRG = 10 µA

RG

I

I

H

I

L

TM

to

R

= 50 mA RGK = 1 kΩ

T

IG = 1 mA RGK = 1 kΩ MAX.

= 67 % V

D

ITM = 2.5 A tp = 380 µs
Threshold voltage Tj = 125°C MAX. 0.9 V
Dynamic resistance Tj = 125°C MAX. 200 mΩ

d

V

DRM

RL = 3.3 kΩ RGK = 1 kΩ

DRM

RGK = 1 kΩ

DRM

= V

RGK = 1 kΩ

RRM

Tj = 125°C MIN.

Tj = 110°C MIN. 10 15 V/µs

Tj = 25°C MAX. 1.45 V

Tj = 25°C MAX. 5

Tj = 125°C 500

MIN. - 20

MAX. 200 50
MAX. 0.8 V

0.1 V

MIN.

8V

MAX. 5 mA

6

THERMAL RESISTANCES

Symbol Parameter Value Unit

R
R

R

th(j-l)
th(j-t)

th(j-a)

Junction to leads (DC)

TO-92 60

Junction to tab (DC) SOT-223 25
Junction to ambient (DC) TO-92 150

S = 5 cm

²

SOT-223 60

Unit

µA

mA

µA

°C/W

S = Copper surface under tab

PRODUCT SELECTOR

Part Number

600 V 800 V

X0202MA X 200 µA TO-92
X0202MN X 200 µA SOT-223
X0202NA X 200 µA TO-92
X0202NN X 200 µA SOT-223
X0205MA X 50 µA TO-92
X0205MN X 50 µA SOT-223
X0205NA X 50 µA TO-92
X0205NN X 50 µA SOT-223

2/6

Voltage

Sensitivity

Package

X02 Series

ORDERING INFORMATION

X 02 02 M A 1BA2

Blank

SENSITIVE
SCR
SERIES

CURRENT: 1.25A

SENSITIVITY:

VOLTAGE:
M: 600V
N: 800V

PACKAGE:
A:TO-92
N: SOT-223

PACKING MODE:
1BA2:TO-92 Bulk
2BL2:TO-92 Ammopack
5BA4: SOT-223 Tape & Reel

02: 200µA
05: 50µA

OTHER INFORMATION

Part Number Marking Weight Base Quantity Packing mode

X02xxyA 1BA2 X02xxyA 0.2 g 2500 Bulk
X02xxyA 2BL2 X02xxyA 0.2 g 2000 A mmop ack
X0202yN 5BA4 X2y 0.12 g 1000 Tape & reel
X0205yN 5BA4 X5y 0.12 g 1000 Tape & reel

Note: xx = sensitivity, y = voltage

Fig. 1: Maximum average power dissipation

versus average on-state current.

P(W)

1.2

1.0

0.8

0.6

0.4

0.2

0.0

0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9

IT(av)(A)

Fig. 2-1: Average and D.C. on-state current
versus lead temperature (SOT-223/TO-92).

IT(av)(A)

1.4

1.2

1.0

0.8

0.6

0.4

0.2

0.0
02550

SOT-223

TO-92

TO-92

Tlead orTlab(°C)

75

SOT-223

100 125

3/6

X02 Series

Fig. 2-2: Average and D.C. on-state current

versus ambient temperature (device mounted o n
FR4 with recommended pad layout) (SOT-223/
TO-92).

IT(av)(A)

1.4

1.2

1.0

0.8

0.6

0.4

0.2

0.0
02550

SOT-223

TO-92

SOT-223

TO-92

Tamb(°C)

75

100 125

Fig. 4: Relative variation of gate trigger current,
holding current and latching current versus
junction temperature (typical values).

IGT,IH, IL[Tj]/IGT, IH, IL[Tj] = 25°C]

1.50

1.25

1.00

0.75

0.50

0.25

0.00

-40 -20 0 20 40 60 80 100 120 140

Tj(°C)

Ω

Fig. 3: Relative variation of thermal impedance
junction to ambient versus pulse duration
(SOT-223/TO-92).

K = [Zth(j-a)/Rth(j-a)]

1.00

TO-92

0.10

0.01
1E-2 1E-1 1E+0 1E+1 1E+2 5E+2

SOT-223

tp(s)

Fig. 5: Relative variation of holding current
versus gate-cathode resistance (typical values).

IH[Rgk] / IH[Rgk = 1 kΩ]

4.0

3.5

3.0

2.5

2.0

1.5

1.0

0.5

0.0
1E-2 1E-1 1E+0 1E+1

Rgk(kΩ)

Tj = 25°C

Fig. 6: Relative variation of dV/dt immunity
versus gate-cathode resistance (typical values).

dV/dt[Rgk]/dV/dt

10.0

1.0

0.1

0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0

4/6

[

Rgk=1kΩ]

Rgk(kΩ)

Tj = 125°C

VD = 0.67xVDRM

Fig. 7: Relative variation of dV/dt immunity
versus gate-cathode capacitance (typical values).

dV/dt[Cgk] / dV/dt[Rgk = 1k ]Ω

20
18
16
14
12
10

8
6
4
2
0

0

24

6810

Cgk(nF)

12 14

16 18 20

22

X02 Series

Fig. 8: Surge peak on-state current versus

number of cycles.

ITSM(A)

25

20

Nonrepetitive

15

10

5

0

1 10 100 1000

Repetitive

Tamb=25°C

Tjinitial=25°C

tp=10ms

Onecycle

Number of cycles

Fig. 10: On-state characteristics (maximum
values).

ITM(A)

3E+1

1E+1

1E+0

1E-1

VTM(V)

2.0 2.5 3.0 3.5 4.0 4.51.51.00.5

Fig. 9: Non-repetitive surge peak on-state
current for a sinusoidal pulse with width

tp < 10 ms, and corresponding value of I²t.

ITSM(A), I t(A S)

300

100

10

1

22

tp(ms)

1.00 10.000.100.01

Fig. 11: Thermal resistance junct ion to ambient
versus copper surface under tab (Epoxy printed
circuit board FR4, copper thickness: 35 µm)
(SOT-223).

Rth(j-a) (°C/W)

130
120
110
100

90
80
70

60

50

40
30

20
10

0

S(cm )

2

4.0 4.5 5.03.53.02.52.01.51.00.50.0

PACKAGE MECHANICAL DATA

TO-92 (Plastic)

BAC

F

D

DIMENSIONS

REF .

a

Millimeters Inches

Min. Typ. Max. Min. Typ. Max.

A 1.35 0.053
B 4.70 0.185
C 2.54 0.100
D 4.40 0.173

E

E 12.70 0.500
F 3.70 0.146
a 0.50 0.019

5/6

X02 Series

PACKAGE MECHANICAL DATA

SOT-223 (Plastic)

A

A1

B

e1

D

B1

H

E

e

V

DIMENSIONS

c

REF.

Millimeters Inches

Min. Typ. Max. Min. Typ. Max.

A 1.80 0.071

A1 0.02 0.1 0.0008 0.004

B 0.60 0.70 0.85 0.024 0.027 0.034

B1 2.90 3.00 3.15 0.114 0.118 0.124

c 0.24 0.26 0.35 0.009 0.010 0.014

D 6.30 6.50 6.70 0.248 0.256 0.264

e 2.3 0.090

e1 4.6 0.181

E 3.30 3.50 3.70 0.130 0.138 0.146

H 6.70 7.00 7.30 0.264 0.276 0.287

V 10° max

FOOTPRINT DIMENSIONS (in millimete r s )
SOT-223 (Plastic)

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6/6

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