SGS Thomson Microelectronics M27C160 Datasheet

M27C160
16 Mbit (2Mb x8 or 1Mb x16) UV EPROM and OTP EPROM
5V ± 10% SUPPLY VOLTAGE in READ
OPERATION
FAST ACCESS TIME: 70ns
BYTE-WIDE or WORD-WIDE
CONFIGURABLE
LOW POWER CONSUMPTION
– Active Current 70mA at 8MHz – Standby Current 100µA
PROGRAMMING VOLTAGE: 12.5V ± 0.25V
PROGRAMMING TIME: 100µs/byte (typical)
ELECTRONIC SIGNATURE
– Manufacturer Code: 0020h – Device Code: 00B1h
42
1
FDIP42W (F)
PLCC44 (K)
42
1
PDIP42 (B)
44
SO44 (M)
1
DESCRIPTION
The M27C160 is a 16 Mbit EPROM offered in the two ranges UV (ultra violet erase) and OTP (one time programmable). It is ideally suited for micro­processor systems requiringlargedataorprogram storage and is organised as either 2 Mbit words of 8 bit or 1 Mbit words of 16 bit. The pin-out is com­patible with a 16 Mbit Mask ROM.
The FDIP42W (window ceramic frit-seal package) has a transparent lid which allows the user to ex­pose the chipto ultraviolet lightto erase thebitpat­tern.
Table 1. Signal Names
A0-A19 Address Inputs Q0-Q7 Data Outputs Q8-Q14 Data Outputs Q15A–1 Data Output / Address Input E Chip Enable G BYTEV V
CC
V
SS
PP
Output Enable Byte Mode / Program Supply Supply Voltage Ground
Figure 1. Logic Diagram
V
CC
20
A0-A19
BYTEV
E
G
PP
M27C160
V
SS
Q15A–1
15
Q0-Q14
AI00739B
1/16February 1999
M27C160
Figure 2A. DIP Pin Connections
A18 A19
1 2
A7
3
A6
4
A5
5 6
A4
7
A3 A2
8 9
A1
10
V
SS
Q0 Q8 Q1 Q9
Q10
Q3
Q11
A0
M27C160
11
E
12 13
G
14 15 16 17 18 19 20 21
42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22
AI00740
A8A17 A9 A10 A11 A12 A13 A14 A15 A16 BYTEV V
SS
Q15A-1 Q7 Q14 Q6 Q13 Q5Q2 Q12 Q4 V
CC
PP
Figure 2B. PLCC Pin Connections
SS
A18
A5
A6
A4 A3 A2 A1 A15 A0
E
12
V
SS
Q0 Q8 Q1
Q9
Q2
Q10
V
1
M27C160
23
Q3
NC
Q11
44
V
CC
A17A8A19
A7
Q4
A9
Q12
A10
Q5
A11
34
Q13
A12 A13 A14
A16 BYTEV V
SS
Q15A–1G Q7 Q14 Q6
AI03012
PP
Figure 2C. SO Pin Connections
1
NC NC
2
A17 A8
V
Q10
Q11
A7 A6 A5 A4 A3 A2 A1 A0
SS
Q0 Q8
Q9
Q3
3 4 5 6 7 8 9 10 11
M27C160
12
E
13 14
G
15 16 17Q1 18 19 20 21
44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 2322
AI01264
A19A18
A9 A10 A11 A12 A13 A14 A15 A16 BYTEV V
SS
Q15A-1 Q7 Q14 Q6 Q13 Q5Q2 Q12 Q4 V
CC
PP
Warning: NC = Not Connected.
Anew patterncanthenbewrittenrapidly to the de­vice by following the programming procedure.
For applications where the content is programmed only one time and erasure is not required, the M27C160 is offered in PDIP42, PLCC44 and SO44 packages.
DEVICE OPERATION
The operating modes of the M27C160 are listed in the Operating Modes Table.Asinglepowersupply is required in the read mode. All inputs are TTL compatible except for VPPand 12V on A9 for the Electronic Signature.
Read Mode
The M27C160 has two organisations, Word-wide and Byte-wide.The organisation is selected bythe signal level on the BYTEVPPpin. When BYTEV
PP
is at VIHthe Word-wide organisation is selected and the Q15A–1 pin is used for Q15 Data Output. When the BYTEVPPpinis at VILthe Byte-wide or­ganisation is selected and the Q15A–1 pin isused for the Address Input A–1. When the memory is logically regarded as 16 bit wide, but read in the Byte-wide organisation, then with A–1 at VILthe lower 8 bits of the 16 bit data are selected and with A–1 at VIHthe upper 8 bits of the 16 bit data are selected.
2/16
M27C160
Table 2. Absolute Maximum Ratings
(1)
Symbol Parameter Value Unit
T
A
T
BIAS
T
STG
(2)
V
IO
V
CC
(2)
V
A9
V
PP
Note: 1. Except for the rating ”Operating Temperature Range”, stresses above those listed in the Table ”Absolute Maximum Ratings” may
cause permanent damage to the device. These are stress ratings only and operation of thedevice at these or any other conditions above those indicated in the Operating sections of this specification is not implied. Exposure to Absolute Maximum Rating condi­tions for extended periods may affect device reliability. Refer also to the STMicroelectronics SURE Program andother relevant qual­ity documents.
2. Minimum DC voltage on Input or Output is –0.5V with possible undershoot to –2.0V for a period less than 20ns. Maximum DC voltage on Output is V
3. Depends on range.
Ambient Operating Temperature Temperature Under Bias –50 to 125 °C Storage Temperature –65 to 150 °C
Input or Output Voltage (except A9) –2 to 7 V Supply Voltage –2 to 7 V A9 Voltage –2 to 13.5 V Program Supply Voltage –2 to 14 V
+0.5V with possible overshoot to VCC+2V for a period less than 20ns.
CC
(3)
–40 to 125 °C
Table 3. Operating Modes
Mode E G
Read Word-wide Read Byte-wide Upper V Read Byte-wide Lower Output Disable V Program
V Verify Program Inhibit Standby Electronic Signature
Note: X = VIHor VIL,VID= 12V ± 0.5V.
V
IL
IL
V
IL
IL
Pulse V
IL
V
IH
V
IH
V
IH
V
IL
V V V
V
V
V
X X X Hi-Z Hi-Z Hi-Z
V
BYTEV
PP
IL
IL
IL
IH
IH
IL
IH
IL
V
IH
V
IL
V
IL
X X Hi-Z Hi-Z Hi-Z
V
PP
V
PP
V
PP
V
IH
A9 Q0-Q7 Q8-Q14 Q15A–1
X Data Out Data Out Data Out X Data Out Hi-Z V X Data Out Hi-Z
IH
V
IL
X Data In Data In Data In X Data Out Data Out Data Out X Hi-Z Hi-Z Hi-Z
V
ID
Codes Codes Code
Table 4. Electronic Signature
Identifier A0 Q7 Q6 Q5 Q4 Q3 Q2 Q1 Q0 Hex Data
Manufacturer’s Code V Device Code
Note: Outputs Q8-Q15 are set to ’0’.
IL
V
IH
The M27C160 has two control functions, both of which must be logically active in order to obtain data at the outputs. In addition the Word-wide or Byte- wide organisation must be selected.
Chip Enable (E) is the powercontrolandshould be used fordeviceselection. Output Enable (G) is the output control and should be used to gate data to
00100000 20h 10110001 B1h
the output pins independent of device selection. Assuming that the addresses are stable, the ad­dress access time (t from E to output (t
ELQV
output after a delay of t
) is equal to the delay
AVQV
). Data is available at the
from the falling edge
GLQV
of G, assuming that E has been low and the ad­dresseshavebeenstablefor at least t
AVQV-tGLQV
3/16
.
M27C160
Table 5. AC Measurement Conditions
High Speed Standard
Input Rise and Fall Times 10ns 20ns Input Pulse Voltages 0 to 3V 0.4V to 2.4V Input and Output Timing Ref. Voltages 1.5V 0.8V and 2V
Figure 3. Testing Input Output Waveform
High Speed
3V
1.5V
0V
Standard
2.4V
0.4V
Table 6. Capacitance
Symbol Parameter Test Condition Min Max Unit
C
IN
C
OUT
Note: 1. Sampled only, not 100% tested.
(1)
(TA=25°C, f = 1 MHz)
Input Capacitance (except BYTEVPP)V Input Capacitance (BYTEV Output Capacitance
2.0V
0.8V
AI01822
)V
PP
Figure 4. AC Testing Load Circuit
1.3V
1N914
3.3k
DEVICE UNDER
TEST
C
L
CL= 30pF for High Speed CL= 100pF for Standard CLincludes JIG capacitance
=0V
IN
= 0V 120 pF
IN
V
=0V
OUT
10 pF
12 pF
OUT
AI01823B
Standby Mode
The M27C160 has astandby mode which reduces the active current from 50mA to 100µA. The M27C160 is placed in the standby mode by apply­ing a CMOS high signal to the Einput. When in the standby mode, the outputs are in a high imped­ance state, independent of the G input.
Two Line Output Control
Because EPROMs are usually used in larger memory arrays, this product features a 2 line con­trol function which accommodates the use of mul­tiple memory connection. The two line control function allows:
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a. the lowest possible memory power dissipation, b. complete assurance that output bus contention
will not occur.
For the most efficient use of these two control lines, Eshould be decodedand used as the prima­ry device selecting function, while G should be made a common connection to all devices in the array and connected to the READ line from the system control bus. Thisensures that all deselect­ed memory devices are in their lowpower standby mode and that the output pins are only active when data is required from a particular memory device.
M27C160
Table 7. Read Mode DC Characteristics
(1)
(TA= 0 to 70 °C or –40 to 85 °C; VCC=5V±5% or 5V ± 10%; VPP=VCC)
Symbol Parameter Test Condition Min Max Unit
I
I
I
CC
I
CC1
I
CC2
I V
V
IH
V
V
Note: 1. VCCmust be applied simultaneously with or before VPPand removed simultaneously or after VPP.
Input Leakage Current
LI
Output Leakage Current
LO
Supply Current
Supply Current (Standby) TTL Supply Current (Standby) CMOS Program Current
PP
Input Low Voltage –0.3 0.8 V
IL
(2)
Input High Voltage 2 Output Low Voltage
OL
Output High Voltage TTL
OH
2. Maximum DC voltage on Output is V
CC
+0.5V.
I
OUT
I
OUT
0V V
0V V
E=V
E=V
E>V
I
OH
V
IN
CC
V
OUT
IL
= 0mA, f = 8MHz
IL
= 0mA, f = 5MHz
E=V
CC
V
PP=VCC
I
= 2.1mA
OL
= –400µA
CC
,G=VIL,
,G=VIL,
IH
– 0.2V
2.4 V
±1 µA
±10 µA
70 mA
50 mA
1mA
100 µA
10 µA
V
+1
CC
0.4 V
V
System Considerations
The power switching characteristics of Advanced CMOS EPROMs require carefull decoupliing of the suppliesto the devices. Thesupply current I
CC
has three segments of importance to the system designer: the standby current, the active current and the transient peaks that are produced by the falling and rising edges of E.
The magnitude of the transient current peaks is dependant on the capacititive and inductive load­ing of the device outputs. The associated transient voltage peaks can be supressed by complying with thetwo line output control andby properly se­lected decoupling capacitors. It is recommended that a 0.1µF ceramic capacitor is used on every device between VCCand VSS. This should be a high frequency type of low inherent inductance and should be placed as close as possible to the device. In addition, a 4.7µF electrolytic capacitor should be used between VCCand VSSfor every eight devices.
This capacitor should be mounted near the power supply connection point. The purpose of this ca­pacitor is to overcome the voltage drop caused by the inductive effects of PCB traces.
Programming
When delivered (and after each erasure for UV EPROM), all bits of the M27C160 are in the ’1’ state. Data is introduced by selectively program­ming ’0’s into the desired bit locations. Although only ’0’s will be programmed, both ’1’s and ’0’s can be present in the data word. The only way to change a ’0’ to a ’1’ is by die exposition to ultravio­let light (UV EPROM).The M27C160 is in the pro­gramming mode when VPPinput is at 12.5V, G is at VIHand E is pulsed to VIL. The data to be pro­grammedis applied to 16 bitsin parallel to the data output pins. The levels required for the address and data inputs are TTL. VCCis specified to be
6.25V ± 0.25V.
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