SGS Thomson Microelectronics BF3506TV Datasheet

BF3506TV
FULL 50-60Hz RECTIFICA T ION BRIDGE
MAIN PRODUCT CHARACTERISTICS
I
F(AV)
V
RRM
VF (max) 1.3V
FEATURES AND BENEFITS
35A
600V
.COMPACT ISOTOP DESIGN COMPATIB LE
.EXCELLENT THERMAL TRANSFER JUNC-
TION TI HEATSINK
.UL PENDING
DESCRIPTION
The Bridges series from SGS-THOMSON has been designed to allow a better standardization of packages on boards principally designed with ISOTOP packages. The insulated package of the bridge will be able to sit on heatsink with other components. Single phase and 3-phase high power SMPS, UPS, MOTOR DRIVES and WELDING equipment will primarily find advan­tage in these industry package products.
PRELIMINARY DATASHEET
+
-
+
-
Screw version
ISOTOP
(Plastic)
MAXIMUM RATINGS AND ELECTRICAL CHARA CTERISTICS ( per diode unless specified)
Symbol Parameter Value Unit
V
RRM
V
RSM
I
F(AV) total
I
FSM
I2.t Fusing 660 A2.s
Tstg Storage temperature range - 65 to + 150 °C
Tj Max. operating junction temperature 150 °C
Pmax total Total power dissipation 50 W
TM : ISOTOP is a trademark of SGS-THOMSON Microelectronics.
November 1995 Ed : 1
Repetitive peak reverse voltage 600 V Non repetitive peak reverse voltage 600 V Average forward current Tc=80°C
Sinus
Surge non repetitive forward current 50Hz JEDEC method
35 A
300 A
1/3
BF3506TV
THERMAL RESISTANCE
Symbol Parameter Value Unit
Rth (j-c)
total
Junction to case 0.5 °C/W
ELECTRICAL CHARACTERISTICS (Per diode)
STATIC CHARACTERISTICS
Symbol Parameter Test Conditions Min. Typ. Max. Unit
IR * Reverse leakage current VR = 0.8 V
δ < 2% tp = 5ms
V
F **
Pulse test : * tp = 5 ms, duty cycle < 2 % ** tp = 380 µs, duty cycle < 2 %
For one diode: Pcond = 1.02 x I
Forward voltage drop IF = 35 A
δ < 2% tp = 380µs
+ 0.008 x I
F(AV)
RRM
2
F(RMS)
Tj = 25°C10µA T
= 125°C 0.2 mA
j
Tj = 25°C 1.4 V Tj = 125°C 1.3 V
and Tj = Pcond x 4 x R
th(j-c)
+ Tc
2/3
Loading...
+ 1 hidden pages