RailClamps are ultra low capacitance TVS arrays
designed to protect high speed data interfaces. This
series has been specifically designed to protect sensitive components which are connected to high-speed
data and transmission lines from overvoltage caused
by ESD (electrostatic discharge), CDE (Cable Discharge
Events), and EFT (electrical fast transients).
The RClamp
0.60pF (pin 1 to 2). This means it can be used on
circuits operating in excess of 3GHz without signal
attenuation. They may be used to meet the ESD
immunity requirements of IEC 61000-4-2, Level 4
(±15kV air, ±8kV contact discharge). Each device can
be configured to protect one bidirectional line or two
unidirectional lines.
These devices are in a small SC-75 (SOT-523) package
and feature a lead-free, matte tin finish. They are compatible with both lead free and SnPb assembly techniques. They are designed for use in applications where
board space is at a premium. The combination of small
size, low capacitance, and high level of ESD protection
makes them a flexible solution for applications such as
HDMI, antenna circuits, Automatic Test Equipment,
USB 2.0, and Infiniband circuits.
TM
2402B has a typical capacitance of only
Features
Transient protection for high-speed data lines to
This device is optimized for protection of 1 line
operating in excess of 3GHz. It may also be used to
protect two lines operating in excess of 2.0GHz. The
device is connected as follows:
Protection for one line with <1pF capacitance can be
achieved by connecting one data line to either pin 1 or
pin 2 with the other pin connected to ground. Pin 3 is
not connected. The connection to ground should be
made directly to a ground plane. The path length
should also be kept as short as possible to minimize
parasitic inductance.
Protection of two lines is achieved by connecting data
lines at pins 1 & 2. Pin 3 is connected to ground. The
connection to ground should be made directly to a
ground plane. The path length should also be kept as
short as possible to minimize parasitic inductance.
RClamp2402B
Figure 1. Pin Configuration
Matte Tin Lead Finish
Matte tin has become the industry standard lead-free
replacement for SnPb lead finishes. A matte tin finish
is composed of 100% tin solder with large grains.
Since the solder volume on the leads is small compared to the solder paste volume that is placed on the
land pattern of the PCB, the reflow profile will be
determined by the requirements of the solder paste.
Therefore, these devices are compatible with both
lead-free and SnPb assembly techniques. In addition,
unlike other lead-free compositions, matte tin does not
have any added alloys that can cause degradation of
the solder joint.