Sanyo LC72P32 Specifications

Ordering number : EN4742
93098HA (OT) /93094TH (OT) B8-0763 No. 4742-1/16
LC72P32
One-Time Programmable ROM Single-Chip
PLL Plus Microcontroller
CMOS LSI
Overview
Features
• Option selection according to PROM data The LC7232N optional functions can be specified with PROM data. This allows mass-production products to be tested and evaluated.
• On-chip 8 Kbyte (4096 words × 16 bits) PROM This is a one-time programmable 8 Kbyte (4096 words × 16 bits) ROM.
• Packaging and pin assignments are identical to those of the LC7232N mask ROM version, i.e., these products are pin compatible.
Sanyo PROM Writing Service
Sanyo provides custom PROM writing, printing, screening and read-back testing (for fee) services for our one-time programmable ROM microcontroller products. Contact your Sanyo sales representative for pricing and other details.
Package Dimensions
unit: mm
3044B-QFP80A
SANYO Electric Co.,Ltd. Semiconductor Bussiness Headquarters
TOKYO OFFICE Tokyo Bldg., 1-10, 1 Chome, Ueno, Taito-ku, TOKYO, 110-8534 JAPAN
Any and all SANYO products described or contained herein do not have specifications that can handle applications that require extremely high levels of reliability, such as life-support systems, aircraft’s control systems, or other applications whose failure can be reasonably expected to result in serious physical and/or material damage. Consult with your SANYO representative nearest you before using any SANYO products described or contained herein in such applications.
SANYO assumes no responsibility for equipment failures that result from using products at values that exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or other parameters) listed in products specifications of any and all SANYO products described or contained herein.
SANYO: QIP80A
[LC72P32]
Allowable Operating Ranges at Ta = –30 to +70°C, VDD= 4.0 to 5.5 V
No. 4742-2/16
LC72P32
Parameter Symbol Conditions
Ratings
Unit
min typ max
V
DD
1 CPU and PLL operating 4.5 5.5 V
Supply voltage V
DD
2 CPU operating 4.0 5.5 V
V
DD
3 Memory hold 1.3 5.5 V
V
IH
1 G port 0.7 V
DD
8.0 V
V
IH
2 RES, INT, HOLD 0.8 V
DD
8.0 V
Input high level voltage
V
IH
3 SNS 2.5 8.0 V
V
IH
4 A port 0.6 V
DD
V
DD
V
V
IH
5 E and F ports 0.7 V
DD
V
DD
V
V
IH
6 LCTR (period measurement), VDD1 0.8 V
DD
V
DD
V
V
IL
1 G port 0 0.3 V
DD
V
V
IL
2 RES, INT 0 0.2 V
DD
V
V
IL
3 SNS 0 1.3 V
Input low level voltage V
IL
4 A port 0 0.2 V
DD
V
V
IL
5 E and F port 0 0.3 V
DD
V
V
IL
6 LCTR (period measurement), VDD1 0 0.2 V
DD
V
V
IL
7 HOLD 0 0.4 V
DD
V
f
IN
1 XIN 4.0 4.5 5.0 MHz
f
IN
2 FMIN, VIN2, VDD1 10 130 MHz
f
IN
3 FMIN, VIN3, VDD1 10 150 MHz
Input frequency
f
IN
4 AMIN (L), VIN4, VDD1 0.5 10 MHz
f
IN
5 AMIN (H), VIN5, VDD1 2.0 40 MHz
f
IN
6 HCTR, VIN6, VDD1 0.4 12 MHz
f
IN
7 LCTR (frequency measurement), VIN7 and VDD1 100 500 kHz
f
IN
8 LCTR (period), VIH6, VIL6 and VDD1 1 20 × 10
3
Hz
V
IN
1 XIN 0.50 1.5 Vrms
V
IN
2 FMIN 0.10 1.5 Vrms
Input amplitude V
IN
3 FMIN 0.15 1.5 Vrms
V
IN
4, 5 AMIN 0.10 1.5 Vrms
V
IN
6, 7 LCTR, HCTR 0.10 1.5 Vrms
Input voltage range V
IN
8 ADI 0 V
DD
V
Specifications
Absolute Maximum Ratings at Ta = 25°C, VSS= 0 V
Note: This IC has reduced resistance to damage from static discharges and therefore requires special care in handling.
Parameter Symbol Conditions Ratings Unit
Maximum supply voltage V
DD
max –0.3 to +6.5 V
Input voltage
V
IN
1 HOLD, INT, RES, ADI, SNS, and the G port –0.3 to +13 V
V
IN
2 Inputs other than VIN1 –0.3 to VDD+ 0.3 V
Output voltage
V
OUT
1 H port –0.3 to +15 V
V
OUT
2 Outputs other than V
OUT
1 –0.3 to VDD+ 0.3 V
I
OUT
1 D and H port pins 0 to 5 mA
Output current
I
OUT
2 E and F port pins 0 to 3 mA
I
OUT
3 B and C port pins 0 to 1 mA
I
OUT
4 S1 to S28 and I port pins 0 to 1 mA Allowable power dissipation Pd max Topg = –30 to +70°C 400 mW Operating temperature Topg –30 to +70 °C Storage temperature Tstg –45 to +125 °C
Electrical Characteristics for the Allowable Operating Ranges
No. 4742-3/16
LC72P32
Parameter Symbol Conditions
Ratings
Unit
min typ max
Hysteresis V
H
LCTR (period), RES, INT 0.1 V
DD
V
Reject pulse width P
REJ
SNS 50 µs
Power-down detection voltage V
DET
3.0 3.5 4.0 V
I
IH
1 HOLD, INT, RES, ADI, SNS, and the G port: VI= 5.5 V 3.0 µA
I
IH
2
A, E and F ports: E and F ports output off,
3.0 µA
Input high level current
A port with no R
PD
: VI= V
DD
IIH3 XIN: VI= VDD= 5.0 V 2.0 5.0 15 µA I
IH
4 FMIN, AMIN, HCTR, LCTR: VI= VDD= 5.0 V 4.0 10 30 µA
I
IH
5 A port: with RPD: VI= VDD= 5.0 V 50 µA
I
IL
1 INT, HOLD, RES, ADI, SNS, and the G port: VI= V
SS
3.0 µA
I
IL
2
A, E and F ports: E and F ports output off,
3.0 µA
Input low level current
A port with no R
PD
: VI= V
SS
IIL3 XIN: VIN= V
SS
2.0 5.0 15 µA
I
IL
4 FMIN, AMIN, HCTR, LCTR: VI= V
SS
4.0 10 30 µA
Input floating voltage V
IF
A port: with R
PD
0.05 V
DD
V
Pull-down resistance R
PD
A port: with RPD, VDD= 5.0 V 75 100 200 k
Output high level off
I
OFFH
1 EO1, EO2: VO= V
DD
0.01 10 nA
leakage current
I
OFFH
2 B, C, D, E, F, and I ports: VO= V
DD
3.0 µA
I
OFFH
3 H port: VO= 13 V 5.0 µA
Output low level off
I
OFFL
1 EO1, EO2: VO= V
SS
0.01 10 nA
leakage current
I
OFFL
2 B, C, D, E, F, and I ports: VO= V
SS
3.0 µA
V
OH
1 B and C ports: IO= –1 mA VDD– 2.0 VDD– 1.0 VDD– 0.5 V
V
OH
2 E and F ports: IO= –1 mA VDD– 1.0 V
V
OH
3 EO1, EO2: IO= –500 µA VDD– 1.0 V
Output high level voltage V
OH
4 XOUT: IO= –200 µA VDD– 1.0 V
V
OH
5 S1 to S28 and I port: IO= –0.1 mA VDD– 1.0 V
V
OH
6 D port: IO= –5 mA VDD– 1.0 V
V
OH
7 COM1, COM2: IO= –25 µA VDD– 0.75 VDD– 0.5 VDD– 0.3 V
V
OL
1 B and C ports: IO= 50 µA 0.5 1.0 2.0 V
V
OL
2 E and F ports: IO= 1 mA 1.0 V
V
OL
3 EO1, EO2: IO= 500 µA 1.0 V
V
OL
4 XOUT: IO= 200 µA 1.0 V
Output low level voltage
V
OL
5 S1 to S28 and I port: IO= 0.1 mA 1.0 V
V
OL
6 D port: IO= 5 mA 1.0 V
V
OL
7 COM1, COM2: IO= 25 µA 0.3 0.5 0.75 V
V
OL
8 H port: IO= 5 mA
(150 ) 0.75
(400 ) 2.0 V
Output middle level voltage V
M
1 COM1, COM2: VDD= 5.0 V, IO= 20 µA 2.0 2.5 3.0 V
A/D conversion error ADI, V
DD
1 –1/2 1/2 LSB
I
DD
1 VDD1, fIN2 = 130 MHz 15 20 mA
I
DD
2
V
DD
= 5.0 V, PLL stopped, CT = 2.67 µs
2.7 mA
(HOLD mode, Figure 1)
I
DD
3
V
DD
= 5.0 V, PLL stopped, CT = 13.33 µs
1.7 mA
(HOLD mode, Figure 1)
Current drain
I
DD
4
V
DD
= 5.0 V, PLL stopped, CT = 40.00 µs
1.5 mA
(HOLD mode, Figure 1) V
DD
= 5.5 V, oscillator stopped, Ta = 25°C
5 µA
I
DD
5
(BACKUP mode, Figure 2) V
DD
= 2.5 V, oscillator stopped, Ta = 25°C
1 µA
(BACKUP mode, Figure 2)
Test Circuits
Note: With PB to PF, PH and PI all open. Note that output mode is selected for PE and PF.
Figure 1 IDD2 to IDD4 in HOLD Mode
Note: With PA to PI, S1 to S24, COM1 and COM2 open.
Figure 2 IDD5 in BACKUP Mode
No. 4742-4/16
LC72P32
Pin Functions
No. 4742-5/16
LC72P32
Pin Pin No. Function I/O Circuit type
PROM mode function
PA0 PA1 PA2 PA3
PB0 PB1 PB2 PB3 PC0 PC1 PC2 PC3
PD0 PD1 PD2 PD3
PE0 PE1 PE2 PE3
PF0 PF1 PF2 PF3
PG0 PG1
PG2 PG3
35 34 33 32
30 29 28 27 26 25 24 23
22 21 20 19
18 17 16 15
14 13 12 11
6 5
4 3
Low threshold type dedicated input port These pins can be used, for example, for key data acquisition. Built-in pull-down resistors can be specified as an option. This
option is in 4-pin units, and cannot be specified for individual pins.
Input through these pins is disabled in BACKUP mode.
Dedicated output ports Since the output transistor impedances are unbalanced
CMOS, these pins can be effectively used for functions such as key scan timing. These pins go to the output high­impedance state in BACKUP mode.
These pins go to the low level during a reset, i.e., when the RES pin is low.
Dedicated output port These are normal CMOS outputs. These pins go to the output
high-impedance state in BACKUP mode. These pins go to the low level during a reset, i.e., when the
RES pin is low.
I/O port These pins are switched between input and output as follows.
Once an input instruction (IN, TPT, or TPF) is executed, these pins latch in the input mode. Once an output instruction (OUT, SPB, or RPB) is executed, they latch in the output mode.
These pins go to the input mode during a reset, i.e., when the RES pin is low.
In BACKUP mode these pins go to the input mode with input disabled.
I/O port These pins are switched between input and output by the
FPC instruction. The I/O states of this port can be specified for individual pins. These pins go to the input mode during a reset, i.e., when the
RES pin is low. In BACKUP mode these pins go to the input mode with input
disabled.
Dedicated input port Input through these pins is disabled in BACKUP mode.
Input
Output
I/O
Input
Data I/O PE0: D0
PE1: D1 PE2: D2 PE3: D3
PF0: D4 PF1: D5 PF2: D6 PF3: D7
PROM control signal inputs
PG0: CE PG1: OE
Continued on next page.
Continued from preceding page.
No. 4742-6/16
LC72P32
Continued on next page.
Pin Pin No. Function I/O Circuit type
PROM mode function
PH0 PH1 PH2 PH3
PI0/S25 PI1/S26 PI2/S27 PI3/S28
S1 to S14
S15 to S24
COM1 COM2
FMIN
AMIN
10
9 8 7
39 38 37 36
63 to 50
49 to 40
65 64
74
75
Dedicated output port Since these pins are high breakdown voltage n-channel
transistor open-drain outputs, they can be effectively used for functions such as band power supply switching.
Note that PH2 and PH3 also function as the DAC1 and DAC2 outputs.
These pins go to the high impedance state during a reset, i.e., when the RES pin is low, and in BACKUP mode.
Dedicated output port While these pins have a CMOS output circuit structure, they
can be switched to function as LCD drivers. Their function is switched by the SS and RS instructions. These pins cannot be switched individually.
The LCD driver function is selected and a segment off signal is output when power is first applied or when RES is low.
These pins are held at the low level in BACKUP mode. Note that when the general-purpose port use option is
specified, these pins output the contents of IPORT when LPC is 1, and the contents of the general-purpose output port LATCH when LPC is 0.
LCD driver segment outputs A frame frequency of 100 Hz and a 1/2 duty, 1/2 bias drive
type are used. A segment off signal is output when power is first applied or
when RES is low. These pins are held at the low level in BACKUP mode. The use of these pins as general-purpose output ports can be
specified as an option.
LCD driver common outputs A 1/2 duty, 1/2 bias drive type is used. The output when power is first applied or when RES is low is
identical to the normal operating mode output. These pins are held at the low level in BACKUP mode.
FM VCO (local oscillator) input The input must be capacitor-coupled. The input frequency range is from 10 to 130 MHz.
AM VCO (local oscillator) input The input should be capacitor-coupled. The band supported by this pin can be selected using the PLL
instruction. High (2 to 40 MHz) SW
Low (0.5 to 10 MHz) LW and MW
Output
Output
I/O
Output
Output
Input
Address input S: A0 to
S14: A13
Continued from preceding page.
No. 4742-7/16
LC72P32
Pin Pin No. Function I/O Circuit type
PROM mode function
HCTR
LCTR
ADI
INT
EO1 EO2
SNS
HOLD
RES
XIN
XOUT
TEST1 TEST2
V
DD
V
SS
70
71
69
66
77 78
72
67
68
1
80
79
2
31, 73
76
Universal counter input The input should be capacitor-coupled. The input frequency range is from 0.4 to 12 MHz. This input can be effectively used for FM IF or AM IF
counting.
Universal counter input The input should be capacitor-coupled for input frequencies in
the range 100 to 150 kHz. Capacitor coupling is not required for input frequencies from
1 to 20 Hz. This input can be effectively used for AM IF counting.
A/D converter input A 1.28 ms period is required for a 6-bit sequential comparison
conversion. The full scale input is ((63/96) · V
DD
) for a data
value of 3FH.
Interrupt request input An interrupt is generated when the INTEN flag is set (by an
SS instruction) and a falling edge is input.
Reference frequency and programmable divisor phase comparison error outputs
Charge pump circuits are built in. EO1 and EO2 are the same.
Input pin used to determine if a power outage has occurred in BACK UP mode
This pin can also be used as a normal input port.
Input pin used to force the LC72E32 to HOLD mode The LC72E32 goes to HOLD mode when the HOLDEN flag is
set (by an SS instruction) and the HOLD input goes low. A high breakdown voltage circuit is used so that this input can
be used in conjunction with the normal power switch.
System reset input This signal should be held low for 75 ms after power is first
applied to effect a power-up reset. The reset starts when a low level has been input for at least
six reference clock cycles.
Crystal oscillator connections (4.5 MHz) A feedback resistor is built in.
LSI test pins. These pins must be connected to V
SS
.
Power supply + connections. Both pins must be connected.
Power supply – connection.
Input
Input
Input
Output
Input
Input
Input
Input
Output
Programming voltage
Vpp
Option
Usage Notes
The LC72P32 is provided for use in early production runs of products designed for the LC7232N. Please keep the following points in mind when using this product.
1. Differences between the LC72P32 and the LC7232N
Note: * This refers to the option setup time of about 1 ms that occurs following the period of about 75 ms from power application.
2. PLA and options
The LC72P32 uses locations 2000H to 201FH as program memory for PLA pattern specification, and locations 2020H to 2033H for option specification. This option specification allows the LC72P32 to support option setups identical to those available with the LC7232N.
No. 4742-8/16
LC72P32
Parameter LC72P32 LC7232N
Operating temperature (Topr) –30 to +70 °C –40 to +85°C
After the 75 ms power-on reset period, the LSI internal Operation immediately option settings are set up during a period of about 1 ms. After the 75 ms power-on reset period, program execution following power on After that operation completes, program execution starts starts with the program counter set to location 0.
with the program counter set to location 0. Input type of the A port
No pull-down resistors
Pull-down resistors are included or not according to the
immediately following power on* option specifications. Output type of the S1 to S28 These pins function as either LCD ports or general-
outputs immediately following LCD ports purpose output ports according to the option power on* specifications.
Power-down detection voltage
Minimum: 3.0 V Minimum: 2.7 V (V
DET
)
Typical 3.5 V Typical: 3.0 V
Maximum: 4.0 V Maximum: 3.3 V
Conditions: V
DD
= 5.0 V, PLL stopped Conditions: VDD2, PLL stopped
I
DD
2 CT = 2.67 µs (HOLD mode, Figure 1) CT = 2.67 µs (HOLD mode, Figure 1)
Typical: 2.7 mA Typical: 1.5 mA
Conditions: VDD= 5.0 V, PLL stopped Conditions: VDD2, PLL stopped Current drain I
DD
3 CT = 13.33 µs (HOLD mode, Figure 1) CT = 13.33 µs (HOLD mode, Figure 1)
Typical: 1.7 mA Typical: 1.0 mA
Conditions: VDD= 5.0 V, PLL stopped Conditions: VDD2, PLL stopped
I
DD
4 CT = 40.00 µs (HOLD mode, Figure 1) CT = 40.00 µs (HOLD mode, Figure 1)
Typical: 1.5 mA Typical: 0.7 mA The TEST1 and TEST2 pins These are LSI test pins and must be connected to V
SS
.
These are LSI test pins and must be either left open or connected to V
SS
.
Supply voltage V
DD
2
Conditions: CPU operating Conditions: CPU operating
Minimum: 4.0 V Minimum: 3.5 V
No. Description Selections
1 WDT (watchdog timer) inclusion selection
WDT included
No WDT
2 Port A pull-down resistor inclusion selection
Pull-down resistors included
No pull-down resistors
2.67 µs
3 Cycle time selection 13.33 µs
40.00 µs
4 LCD port/general-purpose port selection
LCD ports
General-purpose output ports
• LC72P32 Option Types
Note that these options are not determined until the option setting period of about 1 ms, which follows a period of about 75 ms from power application, has passed.
3. Use of the mass-produced unit printed circuit board
When using the printed circuit board for the massed produced end product with the LC72P32, be sure to connect the TEST1 and TEST2 pins to VSSand be sure to connect both pins 31 and 73 (the VDDpins) to the plus side of the power supply.
4. PROM address space
5. Notes on ordering ROM when using Sanyo’s (for fee) PROM writing service
• When ordering one-time programmable and mask ROM versions at the same time The customer must provide a PROM to which the mask ROM version program and option data have been written. The customer must also provide ordering forms for both the mask ROM version and one-time programmable version products.
• When ordering only one-time programmable versions The customer must provide a PROM to which the one-time programmable version program and option data have been written. The customer must also provide ordering forms for the one-time programmable version product.
No. 4742-9/16
LC72P32
Symbol Option Type Selections
WDT WDT (watchdog timer) inclusion selection
WDT included
No WDT
APPDN A port pull-down resistor inclusion selection
Pull-down resistors included
No pull-down resistors
2.67 µs
CTIM Cycle time selection 13.33 µs
40.00 µs
LCDP LCD port/general-purpose port selection
LCD ports
General-purpose output ports
6. Conditions prior to mounting
• Use the procedure below for mounting unwritten PROM products.
• When Sanyo’s (for fee) PROM writing service is used
Note: Due to the structure of microcontrollers with built-in one-time programmable PROM (unwritten PROM products), complete testing prior to shipment is
not possible. Thus there are cases where the writing yield may be lower.
Usage Techniques
1. Writing the built-in PROM
The following two techniques can be used to write the LC72P32’s built-in PROM.
• Using a general-purpose EPROM programmer
If a general-purpose EPROM programmer is used, the built-in PROM can be written by using a dedicated writing adapter available from Sanyo (product name: LC72E32 ADAPTER FOR EPROM PROGRAMMER). Note that the 27512 (Vpp = 12.5 V) Intel fast writing method should be used, and the address range should be set to locations 0 to 2033H.
• Using the RE32 in-circuit emulator
If the RE32 in-circuit emulator is used, the built-in PROM can be written by using a dedicated writing adapter available from Sanyo (product name: LC72E32 ADAPTER FOR RE32). Use the PGOTP command to write data to the PROM.
No. 4742-10/16
LC72P32
2. Dedicated writing adapter
There are two writing adapters available for use with the LC72P32. These adapters are not interchangeable and each adapter must be used only for its intended purpose.
Note: The two writing adapters have essentially identical external appearances.
General-purpose EPROM programmer adapter:
Product name: LC72E32 Adapter for EPROM Programmer Product code: NDK-DC-001-A
RE32 in-circuit emulator adapter:
Product name: LC72E32 Adapter for RE32 Product code: NDK-DC-003-A
No. 4742-11/16
LC72P32
Pin Assignment
No. 4742-12/16
LC72P32
Block Diagram
No. 4742-13/16
LC72P32
LC72P32 Instruction Table
Abbreviations: ADDR: Program memory address [12 bits] b: Borrow B: Bank number [2 bits] C: Carry DH: Data memory address high (row address) [2 bits] DL: Data memory address low (column address) [4 bits] I: Immediate data [4 bits] M: Data memory address N: Bit position [4 bits] Pn: Port number [4 bits] r: General register (one of the locations 00 to 0FH in bank 0) Rn: Register number [4 bits] ( ): Contents of register or memory ( )n: Contents of bit N of register or memory
No. 4742-14/16
LC72P32
Mnemonic
Operand
Function Operation
Machine code
1st 2nd D15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 D0
AD r M Add M to r r (r) + (M) 0 1 0 0 0 0 DH DL Rn ADS r M
Add M to r, r (r) + (M)
0 1 0 0 0 1 DH DL Rn
then skip if carry skip if carry
AC r M Add M to r with carry r (r) + (M) + C 0 1 0 0 1 0 DH DL Rn ACS r M
Add M to r with carry, r (r) + (M) + C
0 1 0 0 1 1 DH DL Rn
then skip if carry skip if carry
AI M I Add I to M M (M) + I 0 1 0 1 0 0 DH DL I AIS M I
Add I to M, M (M) + I
0 1 0 1 0 1 DH DL I
then skip if carry skip if carry
AIC M I Add I to M with carry M (M) + I + C 0 1 0 1 1 0 DH DL I AICS M I
Add I to M with carry, M (M) + I + C
0 1 0 1 1 1 DH DL I
then skip if carry skip if carry
SU r M Subtract M from r r (r) – (M) 0 1 1 0 0 0 DH DL Rn SUS r M
Subtract M from r, r (r) – (M)
0 1 1 0 0 1 DH DL Rn
then skip if borrow skip if borrow
SB r M
Subtract M from r with
r (r) – (M) – b 0 1 1 0 1 0 DH DL Rn
borrow Subtract M from r with
r (r) – (M) – b
SBS r M borrow,
skip if borrow
0 1 1 0 1 1 DH DL Rn
then skip if borrow
SI M I Subtract I from M M (M) – I 0 1 1 1 0 0 DH DL I SIS M I
Subtract I from M, M (M) – I
0 1 1 1 0 1 DH DL I
then skip if borrow skip if borrow
SIB M I
Subtract I from M with
M (M) – I – b 0 1 1 1 1 0 DH DL I
borrow Subtract I from M with
M (M) – I – b
SIBS M I borrow,
skip if borrow
0 1 1 1 1 1 DH DL I
then skip if borrow
SEQ r M Skip if r equals M
r – M
0 0 0 0 0 1 DH DL Rn
skip if zero
Skip if r is greater
r – M
SGE r M
than or equal to M
skip if not borrow 0 0 0 0 1 1 DH DL Rn (r) (M)
SEQI M I Skip if M equal to I
M – I
0 0 1 1 0 1 DH DL I
skip if zero
Skip if M is greater
M – I
SGEI M I
than or equal to I
skip if not borrow 0 0 1 1 1 1 DH DL I (M) I
Instruction
Group
Addition instructionsSubtraction instructionsComparison instructions
Continued on next page.
Continued from preceding page.
No. 4742-15/16
LC72P32
Mnemonic
Operand
Function Operation
Machine code
1st 2nd D15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 D0
AND M I AND I with M M (M) I 0 0 1 1 0 0 DH DL I
OR M I OR I with M M (M) I 0 0 1 1 1 0 DH DL I
EXL r M Exclusive OR M with r r (r) (M) 0 0 1 0 0 0 DH DL Rn LD r M Load M to r r (M) 1 0 0 0 0 0 DH DL Rn
ST M r Store r to M M (r) 1 0 0 0 0 1 DH DL Rn
Move M to destination
MVRD r M M referring to r in [DH, Rn] (M) 1 0 0 0 1 0 DH DL Rn
the same row Move source M
MVRS M r referring to r to M in M [DH, Rn] 1 0 0 0 1 1 DH DL Rn
the same row
MVSR M1 M2
Move M to M in
[DH, DL1] [DH, DL2] 1 0 0 1 0 0 DH DL1 DL2
the same row
MVI M I Move I to M M I 1 0 0 1 0 1 DH DL I PLL M r
Load M to PLL
PLL r PLL DATA 1 0 0 1 1 0 DH DL Rn
registers Test M bits, then skip
if M (N) = all “1”,
TMT M N if all bits specified
then skip
1 0 1 0 0 1 DH DL N
are true Test M bits, then skip
if M (N) = all “0”,
TMF M N if all bits specified
then skip
1 0 1 0 1 1 DH DL N
are false
JMP ADDR Jump to the address PC ADDR 1 0 1 1 ADDR (12 bits)
PC ADDR
CAL ADDR Call subroutine
Stack (PC) + I
1 1 0 0 ADDR (12 bits)
RT Return from subroutine PC Stack 1 1 0 1 0 1 0 0 0 0 0 0 0 0 0 0 RTI Return from interrupt PC Stack 1 1 0 1 0 1 0 1 0 0 0 0 0 0 0 0
Test timer F/F
if timer F/F = “0”,
TTM N then skip if it has
then skip
1 1 0 1 0 1 1 0 0 0 0 0 N
not been set Test unlock F/F
if UL F/F = “0”,
TUL N then skip if it has
then skip
1 1 0 1 0 1 1 1 0 0 0 0 N
not been set
SS N Set status register
(Status register 1)
1 1 0 1 1 1 0 0 0 0 0 0 N
N 1
RS N Reset status register
(Status register 1)
1 1 0 1 1 1 0 1 0 0 0 0 N
N 0
TST N Test status register true
if (Status register 2) N =
1 1 0 1 1 1 1 0 0 0 0 0 N
all “1”, then skip
TSF N Test status register false
if (Status register 2) N =
1 1 0 1 1 1 1 1 0 0 0 0 N
all “0”, then skip
BANK B Select bank BANK B 1 1 0 1 0 0 B 0 0 0 0 0 0 0 0
Instruction
Group
Logical operation
instructions
Transfer instructions
Bit test
instructions
Jump and subroutine
call instructions
F/F test
instructions
Status register instructions
Bank switching
instructions
Continued on next page.
PS. No. 4742-16/16
LC72P32
Continued from preceding page.
Mnemonic
Operand
Function Operation
Machine code
1st 2nd D15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 D0
LCD M I
Output segment pattern
LCD (DIGIT) M 1 1 1 0 0 0 DH DL DIGIT
to LCD digit direct
LCP M I
Output segment pattern
LCD (DIGIT) PLA M 1 1 1 0 0 1 DH DL DIGIT
to LCD digit through PLA IN M P Input port data to M M (Port (P)) 1 1 1 0 1 0 DH DL P OUT M P Output contents of M to port (Port (P)) M 1 1 1 0 1 1 DH DL P SPB P N Set port bits (Port (P)) N 1 1 1 1 1 0 0 0 0 P N RPB P N Reset port bits (Port (P)) N 0 1 1 1 1 0 1 0 1 P N
Test port bits, if (Port (P)) N = all “1”, TPT P N then skip if all bits then skip 1 1 1 1 1 0 1 0 P N
specified are true
Test port bits, if (Port (P)) N = all “0”, TPF P N then skip if all bits then skip 1 1 1 1 1 1 1 1 P N
specified are false
UCS I Set I to UCCW1 UCCW1 I 0 0 0 0 0 0 0 1 0 0 0 0 I
UCC I Set I to UCCW2 UCCW2 I 0 0 0 0 0 0 1 1 0 0 0 0 I
FPC N F port I/O control FPC latch N 0 0 0 1 0 0 0 0 0 0 0 0 N CKSTP Clock stop Stop clock if HOLD = 0 0 0 0 1 0 0 0 1 0 0 0 0 0 0 0 0 DAC I Load M to D/A registers DAreg DAC DATA 0 0 0 0 0 0 1 0 0 0 0 0 I NOP No operation 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0
Instruction
Group
I/O instructions
Universal counter
instructions
Other
instructions
This catalog provides information as of August, 1998. Specifications and information herein are subject to change without notice.
Specifications of any and all SANYO products described or contained herein stipulate the performance, characteristics, and functions of the described products in the independent state, and are not guarantees of the performance, characteristics, and functions of the described products as mounted in the customer’s products or equipment. To verify symptoms and states that cannot be evaluated in an independent device, the customer should always evaluate and test devices mounted in the customer’s products or equipment.
SANYO Electric Co., Ltd. strives to supply high-quality high-reliability products. However, any and all semiconductor products fail with some probability. It is possible that these probabilistic failures could give rise to accidents or events that could endanger human lives, that could give rise to smoke or fire, or that could cause damage to other property. When designing equipment, adopt safety measures so that these kinds of accidents or events cannot occur. Such measures include but are not limited to protective circuits and error prevention circuits for safe design, redundant design, and structural design.
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