Sanyo LC72P32 Specifications

Ordering number : EN4742
93098HA (OT) /93094TH (OT) B8-0763 No. 4742-1/16
LC72P32
One-Time Programmable ROM Single-Chip
PLL Plus Microcontroller
CMOS LSI
Overview
Features
• Option selection according to PROM data The LC7232N optional functions can be specified with PROM data. This allows mass-production products to be tested and evaluated.
• On-chip 8 Kbyte (4096 words × 16 bits) PROM This is a one-time programmable 8 Kbyte (4096 words × 16 bits) ROM.
• Packaging and pin assignments are identical to those of the LC7232N mask ROM version, i.e., these products are pin compatible.
Sanyo PROM Writing Service
Sanyo provides custom PROM writing, printing, screening and read-back testing (for fee) services for our one-time programmable ROM microcontroller products. Contact your Sanyo sales representative for pricing and other details.
Package Dimensions
unit: mm
3044B-QFP80A
SANYO Electric Co.,Ltd. Semiconductor Bussiness Headquarters
TOKYO OFFICE Tokyo Bldg., 1-10, 1 Chome, Ueno, Taito-ku, TOKYO, 110-8534 JAPAN
Any and all SANYO products described or contained herein do not have specifications that can handle applications that require extremely high levels of reliability, such as life-support systems, aircraft’s control systems, or other applications whose failure can be reasonably expected to result in serious physical and/or material damage. Consult with your SANYO representative nearest you before using any SANYO products described or contained herein in such applications.
SANYO assumes no responsibility for equipment failures that result from using products at values that exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or other parameters) listed in products specifications of any and all SANYO products described or contained herein.
SANYO: QIP80A
[LC72P32]
Allowable Operating Ranges at Ta = –30 to +70°C, VDD= 4.0 to 5.5 V
No. 4742-2/16
LC72P32
Parameter Symbol Conditions
Ratings
Unit
min typ max
V
DD
1 CPU and PLL operating 4.5 5.5 V
Supply voltage V
DD
2 CPU operating 4.0 5.5 V
V
DD
3 Memory hold 1.3 5.5 V
V
IH
1 G port 0.7 V
DD
8.0 V
V
IH
2 RES, INT, HOLD 0.8 V
DD
8.0 V
Input high level voltage
V
IH
3 SNS 2.5 8.0 V
V
IH
4 A port 0.6 V
DD
V
DD
V
V
IH
5 E and F ports 0.7 V
DD
V
DD
V
V
IH
6 LCTR (period measurement), VDD1 0.8 V
DD
V
DD
V
V
IL
1 G port 0 0.3 V
DD
V
V
IL
2 RES, INT 0 0.2 V
DD
V
V
IL
3 SNS 0 1.3 V
Input low level voltage V
IL
4 A port 0 0.2 V
DD
V
V
IL
5 E and F port 0 0.3 V
DD
V
V
IL
6 LCTR (period measurement), VDD1 0 0.2 V
DD
V
V
IL
7 HOLD 0 0.4 V
DD
V
f
IN
1 XIN 4.0 4.5 5.0 MHz
f
IN
2 FMIN, VIN2, VDD1 10 130 MHz
f
IN
3 FMIN, VIN3, VDD1 10 150 MHz
Input frequency
f
IN
4 AMIN (L), VIN4, VDD1 0.5 10 MHz
f
IN
5 AMIN (H), VIN5, VDD1 2.0 40 MHz
f
IN
6 HCTR, VIN6, VDD1 0.4 12 MHz
f
IN
7 LCTR (frequency measurement), VIN7 and VDD1 100 500 kHz
f
IN
8 LCTR (period), VIH6, VIL6 and VDD1 1 20 × 10
3
Hz
V
IN
1 XIN 0.50 1.5 Vrms
V
IN
2 FMIN 0.10 1.5 Vrms
Input amplitude V
IN
3 FMIN 0.15 1.5 Vrms
V
IN
4, 5 AMIN 0.10 1.5 Vrms
V
IN
6, 7 LCTR, HCTR 0.10 1.5 Vrms
Input voltage range V
IN
8 ADI 0 V
DD
V
Specifications
Absolute Maximum Ratings at Ta = 25°C, VSS= 0 V
Note: This IC has reduced resistance to damage from static discharges and therefore requires special care in handling.
Parameter Symbol Conditions Ratings Unit
Maximum supply voltage V
DD
max –0.3 to +6.5 V
Input voltage
V
IN
1 HOLD, INT, RES, ADI, SNS, and the G port –0.3 to +13 V
V
IN
2 Inputs other than VIN1 –0.3 to VDD+ 0.3 V
Output voltage
V
OUT
1 H port –0.3 to +15 V
V
OUT
2 Outputs other than V
OUT
1 –0.3 to VDD+ 0.3 V
I
OUT
1 D and H port pins 0 to 5 mA
Output current
I
OUT
2 E and F port pins 0 to 3 mA
I
OUT
3 B and C port pins 0 to 1 mA
I
OUT
4 S1 to S28 and I port pins 0 to 1 mA Allowable power dissipation Pd max Topg = –30 to +70°C 400 mW Operating temperature Topg –30 to +70 °C Storage temperature Tstg –45 to +125 °C
Electrical Characteristics for the Allowable Operating Ranges
No. 4742-3/16
LC72P32
Parameter Symbol Conditions
Ratings
Unit
min typ max
Hysteresis V
H
LCTR (period), RES, INT 0.1 V
DD
V
Reject pulse width P
REJ
SNS 50 µs
Power-down detection voltage V
DET
3.0 3.5 4.0 V
I
IH
1 HOLD, INT, RES, ADI, SNS, and the G port: VI= 5.5 V 3.0 µA
I
IH
2
A, E and F ports: E and F ports output off,
3.0 µA
Input high level current
A port with no R
PD
: VI= V
DD
IIH3 XIN: VI= VDD= 5.0 V 2.0 5.0 15 µA I
IH
4 FMIN, AMIN, HCTR, LCTR: VI= VDD= 5.0 V 4.0 10 30 µA
I
IH
5 A port: with RPD: VI= VDD= 5.0 V 50 µA
I
IL
1 INT, HOLD, RES, ADI, SNS, and the G port: VI= V
SS
3.0 µA
I
IL
2
A, E and F ports: E and F ports output off,
3.0 µA
Input low level current
A port with no R
PD
: VI= V
SS
IIL3 XIN: VIN= V
SS
2.0 5.0 15 µA
I
IL
4 FMIN, AMIN, HCTR, LCTR: VI= V
SS
4.0 10 30 µA
Input floating voltage V
IF
A port: with R
PD
0.05 V
DD
V
Pull-down resistance R
PD
A port: with RPD, VDD= 5.0 V 75 100 200 k
Output high level off
I
OFFH
1 EO1, EO2: VO= V
DD
0.01 10 nA
leakage current
I
OFFH
2 B, C, D, E, F, and I ports: VO= V
DD
3.0 µA
I
OFFH
3 H port: VO= 13 V 5.0 µA
Output low level off
I
OFFL
1 EO1, EO2: VO= V
SS
0.01 10 nA
leakage current
I
OFFL
2 B, C, D, E, F, and I ports: VO= V
SS
3.0 µA
V
OH
1 B and C ports: IO= –1 mA VDD– 2.0 VDD– 1.0 VDD– 0.5 V
V
OH
2 E and F ports: IO= –1 mA VDD– 1.0 V
V
OH
3 EO1, EO2: IO= –500 µA VDD– 1.0 V
Output high level voltage V
OH
4 XOUT: IO= –200 µA VDD– 1.0 V
V
OH
5 S1 to S28 and I port: IO= –0.1 mA VDD– 1.0 V
V
OH
6 D port: IO= –5 mA VDD– 1.0 V
V
OH
7 COM1, COM2: IO= –25 µA VDD– 0.75 VDD– 0.5 VDD– 0.3 V
V
OL
1 B and C ports: IO= 50 µA 0.5 1.0 2.0 V
V
OL
2 E and F ports: IO= 1 mA 1.0 V
V
OL
3 EO1, EO2: IO= 500 µA 1.0 V
V
OL
4 XOUT: IO= 200 µA 1.0 V
Output low level voltage
V
OL
5 S1 to S28 and I port: IO= 0.1 mA 1.0 V
V
OL
6 D port: IO= 5 mA 1.0 V
V
OL
7 COM1, COM2: IO= 25 µA 0.3 0.5 0.75 V
V
OL
8 H port: IO= 5 mA
(150 ) 0.75
(400 ) 2.0 V
Output middle level voltage V
M
1 COM1, COM2: VDD= 5.0 V, IO= 20 µA 2.0 2.5 3.0 V
A/D conversion error ADI, V
DD
1 –1/2 1/2 LSB
I
DD
1 VDD1, fIN2 = 130 MHz 15 20 mA
I
DD
2
V
DD
= 5.0 V, PLL stopped, CT = 2.67 µs
2.7 mA
(HOLD mode, Figure 1)
I
DD
3
V
DD
= 5.0 V, PLL stopped, CT = 13.33 µs
1.7 mA
(HOLD mode, Figure 1)
Current drain
I
DD
4
V
DD
= 5.0 V, PLL stopped, CT = 40.00 µs
1.5 mA
(HOLD mode, Figure 1) V
DD
= 5.5 V, oscillator stopped, Ta = 25°C
5 µA
I
DD
5
(BACKUP mode, Figure 2) V
DD
= 2.5 V, oscillator stopped, Ta = 25°C
1 µA
(BACKUP mode, Figure 2)
Test Circuits
Note: With PB to PF, PH and PI all open. Note that output mode is selected for PE and PF.
Figure 1 IDD2 to IDD4 in HOLD Mode
Note: With PA to PI, S1 to S24, COM1 and COM2 open.
Figure 2 IDD5 in BACKUP Mode
No. 4742-4/16
LC72P32
Pin Functions
No. 4742-5/16
LC72P32
Pin Pin No. Function I/O Circuit type
PROM mode function
PA0 PA1 PA2 PA3
PB0 PB1 PB2 PB3 PC0 PC1 PC2 PC3
PD0 PD1 PD2 PD3
PE0 PE1 PE2 PE3
PF0 PF1 PF2 PF3
PG0 PG1
PG2 PG3
35 34 33 32
30 29 28 27 26 25 24 23
22 21 20 19
18 17 16 15
14 13 12 11
6 5
4 3
Low threshold type dedicated input port These pins can be used, for example, for key data acquisition. Built-in pull-down resistors can be specified as an option. This
option is in 4-pin units, and cannot be specified for individual pins.
Input through these pins is disabled in BACKUP mode.
Dedicated output ports Since the output transistor impedances are unbalanced
CMOS, these pins can be effectively used for functions such as key scan timing. These pins go to the output high­impedance state in BACKUP mode.
These pins go to the low level during a reset, i.e., when the RES pin is low.
Dedicated output port These are normal CMOS outputs. These pins go to the output
high-impedance state in BACKUP mode. These pins go to the low level during a reset, i.e., when the
RES pin is low.
I/O port These pins are switched between input and output as follows.
Once an input instruction (IN, TPT, or TPF) is executed, these pins latch in the input mode. Once an output instruction (OUT, SPB, or RPB) is executed, they latch in the output mode.
These pins go to the input mode during a reset, i.e., when the RES pin is low.
In BACKUP mode these pins go to the input mode with input disabled.
I/O port These pins are switched between input and output by the
FPC instruction. The I/O states of this port can be specified for individual pins. These pins go to the input mode during a reset, i.e., when the
RES pin is low. In BACKUP mode these pins go to the input mode with input
disabled.
Dedicated input port Input through these pins is disabled in BACKUP mode.
Input
Output
I/O
Input
Data I/O PE0: D0
PE1: D1 PE2: D2 PE3: D3
PF0: D4 PF1: D5 PF2: D6 PF3: D7
PROM control signal inputs
PG0: CE PG1: OE
Continued on next page.
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