Sanyo LC72720NM Specifications

Ordering number : EN5877

CMOS IC

LC72720N, 72720NM

Single-Chip RDS

Signal-Processing System LSI

Overview

The LC72720N and LC72720NM are single-chip system ICs that implement the signal processing required by the European Broadcasting Union RDS (Radio Data System) standard and by the US NRSC (National Radio System Committee) RDBS (Radio Broadcast Data System) standard. These ICs include band-pass filter, demodulator, synchronization, and error correction circuits as well as data buffer RAM on chip and perform effective error correction using a soft-decision error correction technique.

Functions

Band-pass filter: Switched capacitor filter (SCF)

Demodulator: RDS data clock regeneration and demodulated data reliability information

Synchronization: Block synchronization detection (with variable backward and forward protection conditions)

Error correction: Soft-decision/hard-decision error correction

Buffer RAM: Adequate for 24 blocks of data (about 500 ms) and flag memory

Data I/O: CCB interface (power on reset)

Features

Error correction capability improved by soft-decision error correction

The load on the microcontroller can be reduced by storing decoded data in the on-chip data buffer RAM.

Two synchronization detection circuits provide continuous and stable detection of the synchronization timing.

Data can be read out starting with the backwardprotection block data after a synchronization reset.

Fully adjustment free

Operating power-supply voltage: 4.5 to 5.5 V

Operating temperature: –40 to +85°C

Packages: DIP24S, MFP24

CCB is a trademark of SANYO ELECTRIC CO., LTD.

CCB is SANYO’s original bus format and all the bus addresses are controlled by SANYO.

Package Dimensions

unit: mm

3067-DIP24S

[LC72720N]

SANYO: DIP24S

unit: mm

3045B-MFP24

[LC72720NM]

SANYO: MFP24

SANYO Electric Co.,Ltd. Semiconductor Bussiness Headquarters

TOKYO OFFICE Tokyo Bldg., 1-10, 1 Chome, Ueno, Taito-ku, TOKYO, 110-8534 JAPAN

51398RM (OT) No. 5877-1/14

Sanyo LC72720NM Specifications

LC72720N, 72720NM

Pin Assignment

Block Diagram

T3 to T7

No. 5877-2/14

LC72720N, 72720NM

Pin Descriptions

Pin No.

Pin name

Function

I/O

Equivalent circuit

1

VREF

Reference voltage output (Vdda/2)

Output

 

2

MPXIN

Baseband (multiplexed) signal input

Input

5

FLOUT

Subcarrier output (filter output)

Output

6

CIN

Subcarrier input (comparator input)

Input

 

 

 

 

 

 

 

 

 

 

 

3

Vdda

Analog system power supply (+5 V)

 

 

 

 

 

 

 

 

 

 

4

Vssa

Analog system ground

 

 

 

 

 

 

 

 

 

 

12

XOUT

Crystal oscillator output (4.332/8.664 MHz)

Output

 

 

 

 

 

 

 

 

 

 

 

13

XIN

Crystal oscillator input (external reference signal input)

 

 

 

 

 

 

 

 

 

 

 

 

 

7

T1

Test input (This pin must always be connected to ground.)

Input

 

 

 

 

 

 

 

 

 

 

 

8

T2

Test input (standby control)

 

 

 

0: Normal operation, 1: Standby state (crystal oscillator stopped)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

9

T3 (RDCL)

Test I/O (RDS clock output)

 

 

 

 

 

 

 

 

 

 

 

 

 

10

T4 (RDDA)

Test I/O (RDS data output)

 

 

 

 

 

 

 

 

 

 

 

 

 

11

T5 (RSFT)

Test I/O (soft-decision control data output)

 

 

 

 

 

 

 

 

 

 

 

 

 

16

T6 (ERROR/57K/BE1)

Test I/O (error status output, regenerated carrier output, error block count

I/O*

 

output)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

17

T7 (CORREC/ARI-ID/BE0)

Test I/O (Error correction status output, SK detection output, error block count

 

 

 

output)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

18

SYNC

Block synchronization detection output

 

 

 

 

 

 

 

 

 

 

 

 

 

19

RDS-ID

RDS detection output

Output

 

 

 

 

 

 

 

 

 

20

DO

Data output

 

 

 

 

 

 

 

 

 

 

 

 

21

CL

Clock input

 

 

 

 

 

 

 

 

 

Serial data interface (CCB)

 

 

 

22

DI

Data input

 

Input

 

 

 

 

 

 

 

 

 

 

 

23

CE

Chip enable

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

24

SYR

Synchronization and RAM address reset (active high)

 

 

 

 

 

 

 

 

 

 

 

14

Vddd

Digital system power supply (+5 V)

 

 

 

 

 

 

 

 

15

Vssd

Digital system ground

Note: * Normally function as an output pin. Used as an I/O pin in test mode, which is not available to user applications.

No. 5877-3/14

LC72720N, 72720NM

Specifications

Absolute Maximum Ratings at Ta = 25°C, Vssd = Vssa = 0 V

Parameter

Symbol

Conditions

Ratings

Unit

 

 

 

 

 

 

Maximum supply voltage

VDD max

Vddd, Vdda (Vdda ≤ Vddd + 0.3 V)

–0.3 to +7.0

V

 

VIN1 max

CL, DI, CE, SYR, T1, T2, T3, T4, T5, T6, T7, SYNC

–0.3 to +7.0

V

Maximum input voltage

VIN2 max

XIN

–0.3 to Vddd +0.3

V

 

VIN3 max

MPXIN, CIN

–0.3 to Vdda +0.3

V

 

VO1 max

DO, SYNC, RDS-ID, T3, T4, T5, T6, T7

–0.3 to +7.0

V

Maximum output voltage

VO2 max

XOUT

–0.3 to Vddd +0.3

V

 

VO3 max

FLOUT

–0.3 to Vdda +0.3

V

 

IO1 max

DO, T3, T4, T5, T6, T7

6.0

mA

Maximum output current

IO2 max

XOUT, FLOUT

3.0

mA

 

IO3 max

SYNC, RDS-ID

20.0

mA

Allowable power dissipation

Pd max

Ta ≤ 85°C

DIP24S:

350

mW

 

 

 

MFP24:

300

mW

 

 

 

 

 

 

 

 

 

Operating temperature

Topr

 

 

–40 to +85

°C

 

 

 

 

 

 

Storage temperature

Tstg

 

 

–55 to +125

°C

 

 

 

 

 

 

Note: A capacitor of at least 1000 pF must be inserted between the power supply pins Vdd and Vss.

Allowable Operating Ranges at Ta = –40 to +85°C, Vssd = Vssa = 0 V

Parameter

Symbol

Conditions

 

Ratings

 

Unit

 

 

 

min

typ

max

 

 

 

 

 

 

 

 

 

 

 

Supply voltage

VDD1

Vddd, Vdda (Vddd = Vdda)

4.5

5.0

5.5

V

VDD2

Vddd: Serial data hold voltage

2.0

 

 

V

 

 

 

Input high-level voltage

VIH

CL, DI, CE, SYR, T1, T2

0.7 Vddd

 

6.5

V

Input low-level voltage

VIL

CL, DI, CE, SYR, T1, T2

0

 

0.3 Vddd

V

Output voltage

VO

DO, SYNC, RDS-ID, T3, T4, T5, T6, T7

 

 

6.5

V

 

VIN1

MPXIN : f = 57 ±2 kHz

 

 

50

mVrms

Input amplitude

VIN2

MPXIN : 100% modulation composite

100

 

 

mVrms

 

VXIN

XIN

400

 

1500

mVrms

Guaranteed crystal oscillator frequencies

Xtal

XIN, XOUT : CI ≤ 120 Ω (XS = 0)

 

4.332

 

MHz

 

 

 

 

 

XIN, XOUT : CI ≤ 70 Ω (XS = 1)

 

8.664

 

MHz

 

 

 

 

 

 

 

 

 

 

 

Crystal oscillator frequency deviation

TXtal

XIN, XOUT : fO = 4.322 MHz, 8.664 MHz

 

 

±100

ppm

Data setup time

tSU

DI, CL

0.75

 

 

µs

Data hold time

tHD

DI, CL

0.75

 

 

µs

Clock low-level time

tCL

CL

0.75

 

 

µs

Clock high-level time

tCH

CL

0.75

 

 

µs

CE wait time

tEL

CE, CL

0.75

 

 

µs

CE setup time

tES

CE, CL

0.75

 

 

µs

CE hold time

tEH

CE, CL

0.75

 

 

µs

CE high-level time

tCE

CE

 

 

20

ms

Data latch change time

tLC

 

 

 

1.15

µs

 

tDC

DO, CL: Differs depending on the value of the

 

 

0.46

µs

Data output time

pull-up resistor used.

 

 

tDH

DO, CE: Differs depending on the value of the

 

 

0.46

µs

 

 

 

 

pull-up resistor used.

 

 

Electrical Characteristics in the allowable operating ranges

 

 

 

 

 

 

 

 

 

 

 

Parameter

Symbol

Conditions

 

Ratings

 

Unit

 

 

 

min

typ

max

 

 

 

 

 

 

 

 

 

 

 

Input resistance

Rmpxin

MPXIN–Vssa : f = 57 kHz

 

23

 

 

 

 

 

 

 

Rcin

CIN–Vssa : f = 57 kHz

 

100

 

 

 

 

 

 

 

 

 

 

 

Internal feedback resistance

Rf

XIN

 

1.0

 

 

 

 

 

 

 

 

Center frequency

fc

FLOUT

56.5

57.0

57.5

kHz

 

 

 

 

 

 

 

–3 dB bandwidth

BW – 3 dB

FLOUT

2.5

3.0

3.5

kHz

 

 

 

 

 

 

 

Gain

Gain

MPXIN–FLOOUT : f = 57 kHz

28

31

34

dB

 

 

 

 

 

 

 

 

Att1

FLOUT : f = ±7 kHz

30

 

 

dB

 

 

 

 

 

 

 

Stop band attenuation

Att2

FLOUT : f < 45 kHz, f > 70 kHz

40

 

 

dB

 

 

 

 

 

 

 

 

Att3

FLOUT : f < 20 kHz

50

 

 

dB

 

 

 

 

 

 

 

Reference voltage output

Vref

VREF : Vdda = 5 V

 

2.5

 

V

 

 

 

 

 

 

 

Continued on next page.

No. 5877-4/14

LC72720N, 72720NM

Continued from preceding page.

Parameter

Symbol

Conditions

 

Ratings

 

Unit

 

 

 

min

typ

max

 

 

 

 

 

 

 

 

 

 

 

Hysteresis

VHIS

CL, DI, CE, SYR, T1, T2

 

0.1 Vddd

 

V

Output low-level voltage

VOL1

DO, T3, T4, T5, T6, T7 : I = 2 mA

 

 

0.4

V

VOL2

SYNC, RDS-ID : I = 8 mA

 

 

0.4

V

 

 

 

Input high-level current

IIH1

CL, DI, CE, SYR, T1, T2 : VI = 6.5 V

 

 

5.0

µA

IIH2

XIN : VI = Vddd

2.0

 

11

µA

 

 

Input low-level current

IIL1

CL, DI, CE, SYR, T1, T2 : VI = 0 V

 

 

5.0

µA

IIL2

XIN : VI = 0 V

2.0

 

11

µA

 

 

Output off leakage current

IOFF

DO, SYNC, RDS-ID, T3, T4, T5, T6, T7 :

 

 

5.0

µA

VO = 6.5 V

 

 

Current drain

Idd

Vddd + Vdda

 

12

 

mA

 

 

 

 

 

 

 

CCB Output Data Format

Each block of output data consists of 32 bits (4 bytes), of which 2 bytes are RDS data and 2 bytes are flag data.

Any number of 32-bit output data blocks can be output consecutively.

When there is no data that can be read out in the internal memory, the system outputs blocks of all-zero data consecutively.

If data readout is interrupted, the next read operation starts with the 32-bit data block whose readout was interrupted. However, if only the last bit remains to be read, it will not be possible to reread that whole block.

The check bits (10 bits) are not output.

To judge whether or not the data is valid, refer to the error information flags E0 to E2, but the offset word detection flags (OWD) should never be reffered to.

If the first four-bits are not “1010”, since the readout data is invalid, readout operation must be halted.

CCB address 6C

Output data/first bit

Last bit

(8) RDS data

(7) Error information flags

(6) Synchronization established flag

(5) ARI (SK) detection flag

(4) RAM data remaining flag

(3) Consecutive RAM read out possible flag

(2) Offset word information flag

(1) Offset word detection flag Fixed pattern (1010)

1. Offset

OWD

Offset word detection

 

 

1

Detected

 

 

0

Not detected (protection function operating)

 

 

2. Offset word information flag (3 bits): B0 to B2

B

B

B

Offset word

2

1

0

 

 

 

 

 

0

0

0

A

 

 

 

 

0

0

1

B

 

 

 

 

0

1

0

C

 

 

 

 

0

1

1

C’

 

 

 

 

1

0

0

D

 

 

 

 

1

0

1

E

 

 

 

 

1

1

0

Unused

 

 

 

 

1

1

1

Unused

 

 

 

 

No. 5877-5/14

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