SANYO LC72711LW, LC72711W Datasheet

Ordering number : ENN6167
12100RM (OT) No. 6167-1/29
Overview
The LC72711W and LC72711LW are data demodulator ICs for receiving FM multiplex broadcasts for mobile reception in the DARC format. This IC includes an on­chip bandpass filter for extracting the DARC signal from the FM baseband signal. Furthermore, since this IC supports all of the IT-R recommended FM multiplex frame structures (methods A, A', B, and C), it is optimal for worldwide market radios that provide FM multiplex reception. The LC72711W and LC72711LW support both parallel and CCB serial CPU interfaces.
Functions
• Adjustment-free 76 kHz SCF bandpass filter
• Supports all FM multiplex frame structures (methods A, A', B, and C) under CPU control.
• MSK delay detection system based on a 1T delay.
• Error correction function based on a 2T delay (in the MSK detection stage)
• Digital PLL based clock regeneration function
• Shift-register 1T and 2T delay circuits
• Block and frame synchronization detection circuits
• Functions for setting the number of allowable BIC errors and the number of synchronization protection operations.
• Error correction using (272, 190) codes
• Built-in layer 4 CRC code checking circuit
• On-chip frame memory and memory control circuit for vertical correction
• 7.2 MHz crystal oscillator circuit
• Two power saving modes: STNBY and EC_STOP
• Applications can use either a parallel CPU interface (DMA) or a CCB serial interface.
• Supply voltage: 4.5 to 5.5 V (LC72711W), 2.7 to 3.6 V (LC72711LW)
Package Dimensions
unit: mm
3190-SQFP64
10.0
12.0
1.25
0.51.25
1.25 0.5 1.250.18
12.0
116
17
32
33
48
49
64
10.0
0.5
1.7max
0.5
0.1
0.15
SANYO: SQFP64
[LC72711W, 72711LW]
LC72711W, 72711LW
SANYO Electric Co.,Ltd. Semiconductor Company
TOKYO OFFICE Tokyo Bldg., 1-10, 1 Chome, Ueno, Taito-ku, TOKYO, 110-8534 JAPAN
Mobile FM Multiplex Broadcast (DARC)
Receiver IC
CMOS IC
Any and all SANYO products described or contained herein do not have specifications that can handle applications that require extremely high levels of reliability, such as life-support systems, aircraft’s control systems, or other applications whose failure can be reasonably expected to result in serious physical and/or material damage. Consult with your SANYO representative nearest you before using any SANYO products described or contained herein in such applications.
SANYO assumes no responsibility for equipment failures that result from using products at values that exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or other parameters) listed in products specifications of any and all SANYO products described or contained herein.
• CCB is a trademark of SANYO ELECTRIC CO., LTD.
• CCB is SANYO’s original bus format and all the bus addresses are controlled by SANYO.
No. 6167-2/29
LC72711W, 72711LW
Parameter Symbol Conditions Ratings Unit
Maximum supply voltage V
DD
(–0.3 to +5.5) –0.3 to +7.0 V
Input voltage
V
IN
(1) A0/CL, A1/CE, A2/DI, RST, STNBY –0.3 to +7.0 V
V
IN
(2) Pins other than VIN(1) –0.3 to VDD+ 0.3 V
Output voltage
V
OUT
(1) DO –0.3 to +7.0 V
V
OUT
(2) Pins other than V
OUT
(1) –0.3 to VDD+ 0.3 V
Output current
I
OUT
(1) INT, RDY, DREQ, and D0 to D15 0 to 4.0 mA
I
OUT
(2) Pins other than I
OUT
(1) 0 to 2.0 mA
Allowable output current (total) I
TTL
Total for all the output pins 20 mA Allowable power dissipation Pdmax Ta +85°C 200 mW Operating temperature Topr –40 to +85 °C Storage temperature Tstg –55 to +125 °C
Specifications
Absolute Maximum Ratings at Ta = +25°C, VSS= 0 V. Items in parentheses refer to the LC72711LW.
Parameter Symbol Conditions
Ratings
Unit
min typ max
Supply voltage V
DD
4.5 5.5 V
High-level input voltage
V
IH
1 A0/CL, A1/CE, A2/DI, RST, STNBY 0.7 V
DD
5.5 V
V
IH
2 DACK, WR, RD, CS, SP, BUSWD, A3, IOCNT1, IOCNT2 0.7 V
DD
V
DD
V
Low-level input voltage
V
IL
1 Pins for which VIH1 applies V
SS
0.3 V
DD
V
V
IL
2 Pins for which VIH2 applies V
SS
0.3 V
DD
V
Oscillator frequency FOSC This IC operates with a frequency precision of ±250 ppm 7.2 MHz X
IN
input sensitivity VXI
With a sine wave input to X
IN
, capacitor coupling,
400 1500 mVrms
V
DD
= +4.5 to +5.5 V
Input amplitude VMPX
With a 100% modulated composite signal input to
150 400 mVrms
MP
XIN
, VDD= +4.5 to +5.5 V
Clock low-level period t
CL
A0/CL 0.7 µs
Clock high-level period t
CH
A0/CL 0.7 µs
Data setup time t
SU
A0/CL, A2/DI 0.7 µs
Data hold time t
HD
A0/CL, A2/DI 0.7 µs
CE wait time t
EL
A0/CL, A1/CE 0.7 µs
CE setup time t
ES
A0/CL, A1/CE 0.7 µs
CE hold time t
EH
A0/CL, A1/CE 0.7 µs
Data latch change time t
LC
A1/CE 0.7 µs
Data output time t
DDO
DO, A0/CL 277 555 ns
CRC4 change time t
CRC
CRC4, A0/CL 0.7 µs
[LC72711W] Allowable Operating Ranges at Ta = –40 to +85°C, VSS= 0 V
Serial I/O
No. 6167-3/29
LC72711W, 72711LW
[LC72711W] Allowable Operating Ranges: Parallel Interface at Ta = –40 to +85°C, VSS= 0 V
Notes: Application designs must take the RDY signal output delay into consideration if the RDY signal is used as the CPU bus wait signal.
When the RDY signal is used, the “RD low-level width” and the “Corrected output RD width” values express the basic timing (excluding the wait time) settings for the CPU bus. If the RDY signal is not used, (that is, if no wait states are inserted) the value of the RD low-level width will be 250 ns (minimum).
Parameter Symbol Conditions
Ratings
Unit
min typ max
Address to RD setup t
SARD
A0/CL, A1/CE, A2/DI, A3, RD 20 ns
RD to address hold t
HARD
A0/CL, A1/CE, A2/DI, A3, RD, t
WRDL
250 ns –20 ns
RD low-level width t
WRDL
1 RD 250 ns
RD low-level width (when RDY is used) t
WRDL
2 RD 100 250 ns
RD cycle wait t
CYRD
A0/CL, A1/CE, A2/DI, A3, RD 150 ns
RDY width (Register read) t
WRDY
RDY 60 210 ns
RD data hold t
RDH
RD, DATn 0 ns
Address to WR setup t
SAWR
A0/CL, A1/CE, A2/DI, A3, WR 20 ns
WR to address hold t
HAWR
A0/CL, A1/CE, A2/DI, A3, WR 20 ns
WR cycle wait t
CYWR
A0/CL, A1/CE, A2/DI, A3, WR 150 ns
WR low-level width t
WWRL
WR 200 ns
WR data hold t
WDH
WR, DATn 0 ns
RDY output delay t
DRDY
RD, RDY 0 30 ns
Corrected output RD width t
WDRD
1
RD (BUSWD = L 8 bits) 300 ns RD (BUSWD = H 16 bits) 540 ns
Corrected output RD width
t
WDRD
2
RD (BUSWD = L 8 bits) 100 300 ns
(when RDY is used) RD (BUSWD = H 16 bits) 300 540 ns
RDY width (corrected output read) t
WDRDY
RDY (BUSWD = L 8 bits) 60 210 ns RDY ((BUSWD = H 16 bits) 300 490 ns
DACK to DREQ delay t
DREQ
DREQ, DACK 260 ns
DMA cycle wait t
CYDM
RD, DREQ 420 ns
RD low-level width (DMA) t
WRDM
RD 300 ns
Parallel I/O
No. 6167-4/29
LC72711W, 72711LW
Parameter Symbol Conditions
Ratings
Unit
min typ max
Supply voltage V
DD
2.7 3.6 V
High-level input voltage
V
IH
1 A0/CL, A1/CE, A2/DI, RST, STNBY 0.7 V
DD
5.5 V
V
IH
2 DACK, WR, RD, CS, SP, BUSWD, A3, IOCNT1, IOCNT2 0.7 V
DD
V
DD
V
Low-level input voltage
V
IL
1 Pins for which VIH1 applies V
SS
0.3 V
DD
V
V
IL
2 Pins for which VIH2 applies V
SS
0.3 V
DD
V
Oscillator frequency FOSC This IC operates with a frequency precision of ±250 ppm 7.2 MHz X
IN
input sensitivity VXI
With a sine wave input to X
IN
, capacitor coupling.
400 900 mVrms
V
DD
= +2.7 to +3.6 V
VMPX1
With a 100% modulated composite signal input to
120 350 mVrms
Input amplitude
MP
XIN
. VDD= +3.3 V
VMPX2
With a 100% modulated composite signal input
120 180 mVrms
to MP
XIN
. VDD= +2.7 V
Clock low-level period t
CL
A0/CL 0.7 µs
Clock high-level period t
CH
A0/CL 0.7 µs
Data setup time t
SU
A0/CL, A2/DI 0.7 µs
Data hold time t
HD
A0/CL, A2/DI 0.7 µs
CE wait time t
EL
A0/CL, A1/CE 0.7 µs
CE setup time t
ES
A0/CL, A1/CE 0.7 µs
CE hold time t
EH
A0/CL, A1/CE 0.7 µs
Data latch change time t
LC
A1/CE 0.7 µs
Data output time t
DDO
DO, A0/CL 277 555 ns
CRC4 change time t
CRC
CRC4, A0/CL 0.7 µs
[LC72711LW] Allowable Operating Ranges at Ta = –40 to +85°C, VSS= 0 V
Serial I/O
No. 6167-5/29
LC72711W, 72711LW
[LC72711LW] Allowable Operating Ranges: Parallel Interface at Ta = –40 to +85°C, VSS= 0 V
Notes: Application designs must take the RDY signal output delay into consideration if the RDY signal is used as the CPU bus wait signal.
When the RDY signal is used, the “RD low-level width” and the “Corrected output RD width” values express the basic timing (excluding the wait time) settings for the CPU bus. If the RDY signal is not used, (that is, if no wait states are inserted) the value of the “RD low-level width” will be 280 ns (minimum).
Parameter Symbol Conditions
Ratings
Unit
min typ max
Address to RD setup t
SARD
A0/CL, A1/CE, A2/DI, A3, RD 20 ns
RD to address hold t
HARD
A0/CL, A1/CE, A2/DI, A3, RD, t
WRDL
250 ns –20 ns
RD low-level width t
WRDL
1 RD 280 ns
RD low-level width (when RDY is used) t
WRDL
2 RD 100 280 ns
RD cycle wait t
CYRD
A0/CL, A1/CE, A2/DI, A3, RD 150 ns
RDY width (Register read) t
WRDY
RDY 60 230 ns
RD data hold t
RDH
RD, DATn 0 ns
Address to WR setup t
SAWR
A0/CL, A1/CE, A2/DI, A3, WR 20 ns
WR to address hold t
HAWR
A0/CL, A1/CE, A2/DI, A3, WR 20 ns
WR cycle wait t
CYWR
A0/CL, A1/CE, A2/DI, A3, WR 150 ns
WR low-level width t
WWRL
WR 200 ns
WR data hold t
WDH
WR, DATn 0 ns
RDY output delay t
DRDY
RD, RDY 0 50 ns
Corrected output RD width t
WDRD
1
RD (BUSWD = L 8 bits) 300 ns RD (BUSWD = H 16 bits) 540 ns
Corrected output RD width
t
WDRD
2
RD (BUSWD = L 8 bits) 100 300 ns
(when RDY is used) RD (BUSWD = H 16 bits) 300 540 ns
RDY width (corrected output read) t
WDRDY
RDY (BUSWD = L 8 bits) 60 230 ns RDY ((BUSWD = H 16 bits) 300 490 ns
DACK to DREQ delay t
DREQ
DREQ, DACK 260 ns
DMA cycle wait t
CYDM
RD, DREQ 420 ns
RD low-level width (DMA) t
WRDM
RD 300 ns
Parallel I/O
No. 6167-6/29
LC72711W, 72711LW
[LC72711W] Electrical Characteristics at VDD= +4.5 to +5.5 V, within the allowable operating ranges
Parameter Symbol Conditions
Ratings
Unit
min typ max
V
OH
1
Io = 2 mA, BCK, FCK, BLOCK, FLOCK,
VDD– 0.4 V
High-level output voltage
CRC4, CLK16DATA
V
OH
2 Io = 4 mA, INT, RDY, DREQ, D0 to D15 VDD– 0.4 V
V
OL
1 Io = 2 mA, Pins for which VOH1 applies 0.4 V
Low-level output voltage V
OL
2 Io = 4 mA, Pins for which VOH2 applies 0.4 V
V
OL
3 Io = 2 mA, DO, INT 0.4 V
V
IH
1
V
IN
= 5.5 V, A0/CL, A1/CE, A2/DI, RST,
1.0 µA
High-level input current
STNBY
V
IH
2VIN= V
DDD
, All input pins other than IIH1 1.0 µA
Low-level input current I
IL
VIN= V
SSD
, All input pins –1.0 µA
Input resistance Rmpx MP
XIN
– Vssa f = 100 kHz 50 k Reference supply voltage output Vref Vref, Vdda = 5 V 2.5 V Bandpass filter center frequency Fc FLOUT 76.0 kHz –3 dB bandwidth Fbw FLOUT 19.0 kHz Group delay Dgd FLOUT –7.5 +7.5 µs Gain Gain FLOUT – MPXIN f = 76 kHz 20 dB
ATT1 FLOUT f = 50 kHz 25 dB
Stop band attenuation
ATT2 FLOUT f = 100 kHz 15 dB ATT3 FLOUT f = 30 kHz 50 dB ATT4 FLOUT f = 150 kHz 50 dB
Output off leakage current IOFF V0 = V
DDD
, DO 5.0 µA
Hysteresis voltage VHIS
A0/CL, A1/CE, A2/DI, A3, CS, RD, WR,
0.1 V
DDD
V
DACK, IOCNT1, IOCNT2, RST, STNBY Internal feedback resistor Rf XIN, XOUT 1.0 M Current drain I
DD
18 25 mA
No. 6167-7/29
LC72711W, 72711LW
[LC72711LW] Electrical Characteristics at VDD= +2.7 to +3.6 V, within the allowable operating ranges
Parameter Symbol Conditions
Ratings
Unit
min typ max
V
OH
1
Io = 1 mA, BCK, FCK, BLOCK, FLOCK,
VDD– 0.4 V
High-level output voltage
CRC4, CLK16DATA
V
OH
2 Io = 2 mA, INT, RDY, DREQ, D0 to D15 VDD– 0.4 V
V
OL
1 Io = 1 mA, Pins for which VOH1 applies 0.4 V
Low-level output voltage V
OL
2 Io = 2 mA, Pins for which VOH2 applies 0.4 V
V
OL
3 Io = 1 mA, DO, INT 0.4 V
I
IH
1
V
IN
= 5.5 V, A0/CL, A1/CE, A2/DI, RST,
1.0 µA
High-level input current
STNBY
I
IH
2VIN= V
DDD
, All input pins other than IIH1 1.0 µA
Low-level input current I
IL
VIN= V
SSD
, All input pins –1.0 µA
Input resistance Rmpx MP
XIN
– Vssa f = 100 kHz 50 k Reference supply voltage output Vref Vref, Vdda = 3 V 1.5 V Bandpass filter center frequency Fc FLOUT 76.0 kHz –3 dB bandwidth Fbw FLOUT 19.0 kHz Group delay Dgd FLOUT –7.5 +7.5 µs Gain Gain FLOUT – MPXIN f = 76 kHz 20 dB
ATT1 FLOUT f = 50 kHz 25 dB
Stop band attenuation
ATT2 FLOUT f = 100 kHz 15 dB ATT3 FLOUT f = 30 kHz 50 dB ATT4 FLOUT f = 150 kHz 50 dB
Output off leakage current IOFF V0 = V
DDD
, DO 1.0 µA
Hysteresis voltage VHIS
A0/CL, A1/CE, A2/DI, A3, CS, RD, WR,
0.1 V
DDD
V
DACK, IOCNT1, IOCNT2, RST, STNBY Internal feedback resistor Rf XIN, XOUT 1.0 M Current drain I
DD
12 20 mA
Block Diagram
No. 6167-8/29
LC72711W, 72711LW
PN decoding
Memory array
LPF
MPXIN
7.2 MHz
XIN
Vssa
Vdda
XOUT
RST
CLK16
DATA
BCK
FCK
FLOCK
BLOCK
Data
Address
STNBY
Vssd
Vddd
LPF
Error correction: layer 2 CRC
76 kHz
-BPF
(SCF)
Anti-aliasing
filter
Timing control
Vref
Synchronization regeneration
MSK correction circuit
Clock
regeneration
2T delay
1T delay
IOCNT1
DACK
DREQ
IOCNT2
CRC4
FLOUT
CIN
VREF
CS
RD
WR
RDY
INT
BUSWD
TIN
SP
A3
DO
A2/DI
A1/CE
A0/CL
D0 to D15
Output control (CPU interface) and layer 4 CRC detection circuit
Pin Assignment
IOCNT1
WR
RD
A0/CL
A1/CE
A2/DI
A3
CS
STNBY
BUSWD
SP
RST
D15 D14
NC
D13
TIN
Vssa
D12
Vref
MPXIN
D11 D10
Vdda
D9
FLOUT
D8
CIN
D7
NC
D6
TPC1
SQFP-64
(Top view)
LC72711W LC72711LW
64
D5
TPC2
BCK
CRC4
FCK
BLOCK
FLOCK
DATA
CLK16
IOCNT2
Vddd
XOUT
INT
Vddd
Vssd
DO
NC
TEST
TOSEL1
TOSEL2
Vssd
XIN
Vddd
RDY
Vssd
DACK
DREQ
D4 D3 D2 D1 D0
Vref
49
1
32
16
No. 6167-9/29
LC72711W, 72711LW
Pin Functions
Pin No. Pin Function I/O Pin circuit
Data bus I/O control 1 (SP = low)*
1
Data bus I/O control 2 (SP = low)*
1
DMA acknowledge (SP = low)*
1
Write control signal (SP = low)*
1
Read control signal (SP = low)*
1
Address input 0 (SP = low) CCB CL input (SP = high)
1 (SP = low) CCB CE input (SP = high) 2 (SP = low) CCB DI input (SP = high) 3 (SP = low)*
1
Chip select input (SP = L)*
1
System reset input (negative logic) Standby mode (positive logic)
3
4 13 38 39 40 41 42 43 44 46 45
IOCNT1 IOCNT2
DACK
WR
RD
A0/CL
A1/CE
A2/DI
A3
CS
RST
STNBY
SP = low: parallel, SP = high: serial BUSWD = low: 8 bits, BUSWD = high: 16 bits The test pin must be connected to the digital system ground (V
SS
).
Must be connected to the digital system power supply (V
DD
) or ground
(VSS) in normal operation. As above As above As above As above
47 48 60 58 59 61 62 49
SP
BUSWD
TEST TPC1
TPC2 TOSEL1 TOSEL2
TIN
Clock regeneration monitor Demodulated data monitor
5 6
CLK16
DATA
Frame start signal output Block start signal output Outputs a high level when in frame synchronization Outputs a high level when in block synchronization Level 4 CRC detection result output
9
10
7 8
11
FCK
BCK FLOCK BLOCK
CRC4
External CPU interrupt request output DMA request signal Read ready signal
Input
Input
Output
I/O
33 12 16
INT
DREQ
RDY
Data bus The bus width can be set to be either 8 bits or 16 bits by the BUSWD
pin (pin 48). For data input, only the lower 8 bits (D0 to D7) are valid.
17 to 24 D0 to D7
Output
Data bus (in 16-bit mode) These pins are held in the output off state when BUSWD is low.
25 to 32 D8 to D15
I/O
Connections for the system clock crystal oscillator circuit. The XIN pin can also be used as an external clock signal input.
64
1
XIN
XOUT
InputBaseband (multiplex) signal input53 MPXIN
OutputSubcarrier output (76 kHz bandpass filter output)55 FLOUT
Continued on next page.
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