SANYO LC72710W, LC72710LW Datasheet
Ordering number : ENN6166
12100RM (OT) No. 6166-1/33
Overview
The LC72710W and LC72710LW are data demodulator
ICs for receiving FM multiplex broadcasts for mobile
reception in the DARC format. This IC includes an onchip bandpass filter for extracting the DARC signal from
the FM baseband signal. It also integrates a decoder circuit
that performs the VICS data processing on the same chip
and can implement a compact, multifunction VICS
reception system. The LC72710W and LC72710LW
support both parallel and CCB serial CPU interfaces, and
integrate the circuits required for simultaneous reception
of both VICS data and dGPS service data. Note that a
contract with VICS Center is required to evaluate this
sample IC and to produce end products that support VICS.
Functions
• Adjustment-free 76 kHz SCF bandpass filter
• Built-in VICS decoder
• MSK delay detection system based on a 1T delay.
• Error correction function based on a 2T delay (in the
MSK detection stage)
• Digital PLL based clock regeneration function
• Shift-register 1T and 2T delay circuits
• Block and frame synchronization detection circuits
• Functions for setting the number of allowable BIC errors
and the number of synchronization protection
operations.
• Error correction using (272, 190) codes
• Built-in layer 4 CRC code checking circuit
• On-chip frame memory and memory control circuit for
vertical correction
• 7.2 MHz crystal oscillator circuit
• Two power saving modes: STNBY and EC_STOP
• Dedicated frame synchronization circuit for
simultaneous reception of dGPS and VICS data
• Applications can use either a parallel CPU interface
(DMA) or a CCB serial interface.
• Supply voltage: 4.5 to 5.5 V (LC72710W), 2.7 to 3.6 V
(LC72710LW)
Package Dimensions
unit: mm
3190-SQFP64
10.0
12.0
1.25
0.51.25
1.25 0.5 1.250.18
12.0
116
17
32
33
48
49
64
10.0
0.5
1.7max
0.5
0.1
0.15
SANYO: SQFP64
[LC72710W, 72710LW]
LC72710W, 72710LW
SANYO Electric Co.,Ltd. Semiconductor Company
TOKYO OFFICE Tokyo Bldg., 1-10, 1 Chome, Ueno, Taito-ku, TOKYO, 110-8534 JAPAN
Mobile FM Multiplex Broadcast (DARC) Receiver IC
with On-Chip VICS Decoder
CMOS IC
Any and all SANYO products described or contained herein do not have specifications that can handle
applications that require extremely high levels of reliability, such as life-support systems, aircraft’s
control systems, or other applications whose failure can be reasonably expected to result in serious
physical and/or material damage. Consult with your SANYO representative nearest you before using
any SANYO products described or contained herein in such applications.
SANYO assumes no responsibility for equipment failures that result from using products at values that
exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or other
parameters) listed in products specifications of any and all SANYO products described or contained
herein.
• CCB is a trademark of SANYO ELECTRIC CO., LTD.
• CCB is SANYO’s original bus format and all the bus
addresses are controlled by SANYO.
No. 6166-2/33
LC72710W, 72710LW
Parameter Symbol Conditions Ratings Unit
Maximum supply voltage V
DD
(–0.3 to +5.5) –0.3 to +7.0 V
Input voltage
V
IN
(1) A0/CL, A1/CE, A2/DI, RST, STNBY –0.3 to +7.0 V
V
IN
(2) Pins other than VIN(1) –0.3 to VDD+ 0.3 V
Output voltage
V
OUT
(1) DO –0.3 to +7.0 V
V
OUT
(2) Pins other than V
OUT
(1) –0.3 to VDD+ 0.3 V
Output current
I
OUT
(1) INT, RDY, DREQ, and D0 to D15 0 to 4.0 mA
I
OUT
(2) Pins other than I
OUT
(1) 0 to 2.0 mA
Allowable output current (total) I
TTL
Total for all the output pins 20 mA
Allowable power dissipation Pdmax Ta ≤ +85°C 200 mW
Operating temperature Topr –40 to +85 °C
Storage temperature Tstg –55 to +125 °C
Specifications
Absolute Maximum Ratings at Ta = +25°C, VSS= 0 V. Items in parentheses refer to the LC72710LW.
Parameter Symbol Conditions
Ratings
Unit
min typ max
Supply voltage V
DD
4.5 5.5 V
High-level input voltage
V
IH
1 A0/CL, A1/CE, A2/DI, RST, STNBY 0.7 V
DD
5.5 V
V
IH
2 DACK, WR, RD, CS, SP, BUSWD, A3, IOCNT1, IOCNT2 0.7 V
DD
V
DD
V
Low-level input voltage
V
IL
1 Pins for which VIH1 applies V
SS
0.3 V
DD
V
V
IL
2 Pins for which VIH2 applies V
SS
0.3 V
DD
V
Oscillator frequency FOSC This IC operates with a frequency precision of ±250 ppm 7.2 MHz
X
IN
input sensitivity VXI
With a sine wave input to X
IN
, capacitor coupling,
400 1500 mVrms
V
DD
= +4.5 to +5.5 V
Input amplitude VMPX
With a 100% modulated composite signal input to
150 400 mVrms
MP
XIN
, VDD= +4.5 to +5.5 V
Clock low-level period t
CL
A0/CL 0.7 µs
Clock high-level period t
CH
A0/CL 0.7 µs
Data setup time t
SU
A0/CL, A2/DI 0.7 µs
Data hold time t
HD
A0/CL, A2/DI 0.7 µs
CE wait time t
EL
A0/CL, A1/CE 0.7 µs
CE setup time t
ES
A0/CL, A1/CE 0.7 µs
CE hold time t
EH
A0/CL, A1/CE 0.7 µs
Data latch change time t
LC
A1/CE 0.7 µs
Data output time t
DDO
DO, A0/CL 277 555 ns
CRC4 change time t
CRC
CRC4, A0/CL 0.7 µs
[LC72710W]
Allowable Operating Ranges at Ta = –40 to +85°C, VSS= 0 V
Serial I/O
No. 6166-3/33
LC72710W, 72710LW
[LC72710W]
Allowable Operating Ranges: Parallel Interface at Ta = –40 to +85°C, VSS= 0 V
Notes: Application designs must take the RDY signal output delay into consideration if the RDY signal is used as the CPU bus wait signal.
When the RDY signal is used, the “RD low-level width” and the “Corrected output RD width” values express the basic timing (excluding the wait
time) settings for the CPU bus.
If the RDY signal is not used, (that is, if no wait states are inserted) the value of the RD low-level width will be 250 ns (minimum).
Parameter Symbol Conditions
Ratings
Unit
min typ max
Address to RD setup t
SARD
A0/CL, A1/CE, A2/DI, A3, RD 20 ns
RD to address hold t
HARD
A0/CL, A1/CE, A2/DI, A3, RD, t
WRDL
→250 ns –20 ns
RD low-level width t
WRDL
1 RD 250 ns
RD low-level width (when RDY is used) t
WRDL
2 RD 100 250 ns
RD cycle wait t
CYRD
A0/CL, A1/CE, A2/DI, A3, RD 150 ns
RDY width (Register read) t
WRDY
RDY 60 210 ns
RD data hold t
RDH
RD, DATn 0 ns
Address to WR setup t
SAWR
A0/CL, A1/CE, A2/DI, A3, WR 20 ns
WR to address hold t
HAWR
A0/CL, A1/CE, A2/DI, A3, WR 20 ns
WR cycle wait t
CYWR
A0/CL, A1/CE, A2/DI, A3, WR 150 ns
WR low-level width t
WWRL
WR 200 ns
WR data hold t
WDH
WR, DATn 0 ns
RDY output delay t
DRDY
RD, RDY 0 30 ns
Corrected output RD width t
WDRD
1
RD (BUSWD = L 8 bits) 300 ns
RD (BUSWD = H 16 bits) 540 ns
Corrected output RD width
t
WDRD
2
RD (BUSWD = L 8 bits) 100 300 ns
(when RDY is used) RD (BUSWD = H 16 bits) 300 540 ns
RDY width (corrected output read) t
WDRDY
RDY (BUSWD = L 8 bits) 60 210 ns
RDY ((BUSWD = H 16 bits) 300 490 ns
DACK to DREQ delay t
DREQ
DREQ, DACK 260 ns
DMA cycle wait t
CYDM
RD, DREQ 420 ns
RD low-level width (DMA) t
WRDM
RD 300 ns
Parallel I/O
No. 6166-4/33
LC72710W, 72710LW
Parameter Symbol Conditions
Ratings
Unit
min typ max
Supply voltage V
DD
2.7 3.6 V
High-level input voltage
V
IH
1 A0/CL, A1/CE, A2/DI, RST, STNBY 0.7 V
DD
5.5 V
V
IH
2 DACK, WR, RD, CS, SP, BUSWD, A3, IOCNT1, IOCNT2 0.7 V
DD
V
DD
V
Low-level input voltage
V
IL
1 Pins for which VIH1 applies V
SS
0.3 V
DD
V
V
IL
2 Pins for which VIH2 applies V
SS
0.3 V
DD
V
Oscillator frequency FOSC This IC operates with a frequency precision of ±250 ppm 7.2 MHz
X
IN
input sensitivity VXI
With a sine wave input to X
IN
, capacitor coupling.
400 900 mVrms
V
DD
= +2.7 to +3.6 V
VMPX1
With a 100% modulated composite signal input to
120 350 mVrms
Input amplitude
MP
XIN
. VDD= +3.3 V
VMPX2
With a 100% modulated composite signal input to
120 180 mVrms
MP
XIN
. VDD= +2.7 V
Clock low-level period t
CL
A0/CL 0.7 µs
Clock high-level period t
CH
A0/CL 0.7 µs
Data setup time t
SU
A0/CL, A2/DI 0.7 µs
Data hold time t
HD
A0/CL, A2/DI 0.7 µs
CE wait time t
EL
A0/CL, A1/CE 0.7 µs
CE setup time t
ES
A0/CL, A1/CE 0.7 µs
CE hold time t
EH
A0/CL, A1/CE 0.7 µs
Data latch change time t
LC
A1/CE 0.7 µs
Data output time t
DDO
DO, A0/CL 277 555 ns
CRC4 change time t
CRC
CRC4, A0/CL 0.7 µs
[LC72710LW]
Allowable Operating Ranges at Ta = –40 to +85°C, VSS= 0 V
Serial I/O
No. 6166-5/33
LC72710W, 72710LW
[LC72710LW]
Allowable Operating Ranges: Parallel Interface at Ta = –40 to +85°C, VSS= 0 V
Notes: Application designs must take the RDY signal output delay into consideration if the RDY signal is used as the CPU bus wait signal.
When the RDY signal is used, the “RD low-level width” and the “Corrected output RD width” values express the basic timing (excluding the wait
time) settings for the CPU bus.
If the RDY signal is not used, (that is, if no wait states are inserted) the value of the “RD low-level width“ will be 280 ns (minimum).
Parameter Symbol Conditions
Ratings
Unit
min typ max
Address to RD setup t
SARD
A0/CL, A1/CE, A2/DI, A3, RD 20 ns
RD to address hold t
HARD
A0/CL, A1/CE, A2/DI, A3, RD, t
WRDL
→250 ns –20 ns
RD low-level width t
WRDL
1 RD 280 ns
RD low-level width (when RDY is used) t
WRDL
2 RD 100 280 ns
RD cycle wait t
CYRD
A0/CL, A1/CE, A2/DI, A3, RD 150 ns
RDY width (Register read) t
WRDY
RDY 60 230 ns
RD data hold t
RDH
RD, DATn 0 ns
Address to WR setup t
SAWR
A0/CL, A1/CE, A2/DI, A3, WR 20 ns
WR to address hold t
HAWR
A0/CL, A1/CE, A2/DI, A3, WR 20 ns
WR cycle wait t
CYWR
A0/CL, A1/CE, A2/DI, A3, WR 150 ns
WR low-level width t
WWRL
WR 200 ns
WR data hold t
WDH
WR, DATn 0 ns
RDY output delay t
DRDY
RD, RDY 0 50 ns
Corrected output RD width t
WDRD
1
RD (BUSWD = L 8 bits) 300 ns
RD (BUSWD = H 16 bits) 540 ns
Corrected output RD width
t
WDRD
2
RD (BUSWD = L 8 bits) 100 300 ns
(when RDY is used) RD (BUSWD = H 16 bits) 300 540 ns
RDY width (corrected output read) t
WDRDY
RDY (BUSWD = L 8 bits) 60 230 ns
RDY ((BUSWD = H 16 bits) 300 490 ns
DACK to DREQ delay t
DREQ
DREQ, DACK 260 ns
DMA cycle wait t
CYDM
RD, DREQ 420 ns
RD low-level width (DMA) t
WRDM
RD 300 ns
Parallel I/O
No. 6166-6/33
LC72710W, 72710LW
[LC72710W]
Electrical Characteristics at VDD= +4.5 to +5.5 V, within the allowable operating ranges
Parameter Symbol Conditions
Ratings
Unit
min typ max
V
OH
1
Io = 2 mA, BCK, FCK, BLOCK, FLOCK,
VDD– 0.4 V
High-level output voltage
CRC4, CLK16DATA
V
OH
2 Io = 4 mA, INT, RDY, DREQ, D0 to D15 VDD– 0.4 V
V
OL
1 Io = 2 mA, Pins for which VOH1 applies 0.4 V
Low-level output voltage V
OL
2 Io = 4 mA, Pins for which VOH2 applies 0.4 V
V
OL
3 Io = 2 mA, DO, INT 0.4 V
I
IH
1
V
IN
= 5.5 V, A0/CL, A1/CE, A2/DI, RST,
1.0 µA
High-level input current
STNBY
I
IH
2VIN= V
DDD
, All input pins other than IIH1 1.0 µA
Low-level input current I
IL
VIN= V
SSD
, All input pins –1.0 µA
Input resistance Rmpx MP
XIN
– Vssa f = 100 kHz 50 kΩ
Reference supply voltage output Vref Vref, Vdda = 5 V 2.5 V
Bandpass filter center frequency Fc FLOUT 76.0 kHz
–3 dB bandwidth Fbw FLOUT 19.0 kHz
Group delay Dgd FLOUT –7.5 +7.5 µs
Gain Gain FLOUT – MPXIN f = 76 kHz 20 dB
ATT1 FLOUT f = 50 kHz 25 dB
Stop band attenuation
ATT2 FLOUT f = 100 kHz 15 dB
ATT3 FLOUT f = 30 kHz 50 dB
ATT4 FLOUT f = 150 kHz 50 dB
Output off leakage current IOFF V0 = V
DDD
, DO 5.0 µA
Hysteresis voltage VHIS
A0/CL, A1/CE, A2/DI, A3, CS, RD, WR,
0.1 V
DDD
V
DACK, IOCNT1, IOCNT2, RST, STNBY
Internal feedback resistor Rf XIN, XOUT 1.0 MΩ
Current drain I
DD
18 25 mA
No. 6166-7/33
LC72710W, 72710LW
[LC72710LW]
Electrical Characteristics at VDD= +2.7 to +3.6 V, within the allowable operating ranges
Parameter Symbol Conditions
Ratings
Unit
min typ max
V
OH
1
Io = 1 mA, BCK, FCK, BLOCK, FLOCK,
VDD– 0.4 V
High-level output voltage
CRC4, CLK16DATA
V
OH
2 Io = 2 mA, INT, RDY, DREQ, D0 to D15 VDD– 0.4 V
V
OL
1 Io = 1 mA, Pins for which VOH1 applies 0.4 V
Low-level output voltage V
OL
2 Io = 2 mA, Pins for which VOH2 applies 0.4 V
V
OL
3 Io = 1 mA, DO, INT 0.4 V
I
IH
1
V
IN
= 5.5 V, A0/CL, A1/CE, A2/DI, RST,
1.0 µA
High-level input current
STNBY
I
IH
2VIN= V
DDD
, All input pins other than IIH1 1.0 µA
Low-level input current I
IL
VIN= V
SSD
, All input pins –1.0 µA
Input resistance Rmpx MP
XIN
– Vssa f = 100 kHz 50 kΩ
Reference supply voltage output Vref Vref, Vdda = 3 V 1.5 V
Bandpass filter center frequency Fc FLOUT 76.0 kHz
–3 dB bandwidth Fbw FLOUT 19.0 kHz
Group delay Dgd FLOUT –7.5 +7.5 µs
Gain Gain FLOUT – MPXIN f = 76 kHz 20 dB
ATT1 FLOUT f = 50 kHz 25 dB
Stop band attenuation
ATT2 FLOUT f = 100 kHz 15 dB
ATT3 FLOUT f = 30 kHz 50 dB
ATT4 FLOUT f = 150 kHz 50 dB
Output off leakage current IOFF V0 = V
DDD
, DO 1.0 µA
Hysteresis voltage VHIS
A0/CL, A1/CE, A2/DI, A3, CS, RD, WR,
0.1 V
DDD
V
DACK, IOCNT1, IOCNT2, RST, STNBY
Internal feedback resistor Rf XIN, XOUT 1.0 MΩ
Current drain I
DD
12 20 mA
Block Diagram
No. 6166-8/33
LC72710W, 72710LW
VICS processing
PN decoding
Memory array
LPF
MPXIN
7.2 MHz
XIN
Vssa
Vdda
XOUT
RST
CLK16
DATA
BCK
FCK
FLOCK
BLOCK
Data
Address
STNBY
Vssd
Vddd
LPF
Error correction:
layer 2 CRC
76 kHz
-BPF
(SCF)
Anti-aliasing
filter
Timing
control
Vref
Synchronization
regeneration
MSK correction
circuit
Clock
regeneration
2T delay
1T delay
IOCNT1
DACK
DREQ
IOCNT2
CRC4
FLOUT
CIN
VREF
CS
RD
WR
RDY
INT
BUSWD
TIN
SP
A3
DO
A2/DI
A1/CE
A0/CL
D0 to D15
Output control (CPU interface) and
layer 4 CRC detection circuit
Pin Assignment
IOCNT1
WR
RD
A0/CL
A1/CE
A2/DI
A3
CS
STNBY
BUSWD
SP
RST
32
D15
49
D14
D13
TIN
Vssa
D12
Vref
MPXIN
D11
D10
Vdda
D9
FLOUT
D8
NC
NC
CIN
D7
D6
TPC1
SQFP-64
64
1
16
D5
TPC2
BCK
CRC4
FCK
BLOCK
FLOCK
DATA
CLK16
IOCNT2
Vddd
XOUT
INT
Vddd
Vssd
DO
NC
TEST
TOSEL1
TOSEL2
Vssd
XIN
Vddd
RDY
Vssd
DACK
DREQ
D4
D3
D2
D1
D0
(Top view)
LC72710W
LC72710LW
Vref
No. 6166-9/33
LC72710W, 72710LW
Pin Functions
Pin No. Pin Function I/O Pin circuit
Data bus I/O control 1 (SP = low)*
1
Data bus I/O control 2 (SP = low)*
1
DMA acknowledge (SP = low)*
1
Write control signal (SP = low)*
1
Read control signal (SP = low)*
1
Address input 0 (SP = low) CCB CL input (SP = high)
1 (SP = low) CCB CE input (SP = high)
2 (SP = low) CCB DI input (SP = high)
3 (SP = low)*
1
Chip select input (SP = L)*
1
System reset input (negative logic)
Standby mode (positive logic)
3
4
13
38
39
40
41
42
43
44
46
45
IOCNT1
IOCNT2
DACK
WR
RD
A0/CL
A1/CE
A2/DI
A3
CS
RST
STNBY
SP = low: parallel, SP = high: serial
BUSWD = low: 8 bits, BUSWD = high: 16 bits
The test pin must be connected to the digital system ground (V
SS
).
Must be connected to the digital system power supply (V
DD
) or ground
(VSS) in normal operation.
As above
As above
As above
As above
47
48
60
58
59
61
62
49
SP
BUSWD
TEST
TPC1
TPC2
TOSEL1
TOSEL2
TIN
Clock regeneration monitor
Demodulated data monitor
5
6
CLK16
DATA
Frame start signal output
Block start signal output
Outputs a high level during frame synchronization
Outputs a high level during block synchronization
Level 4 CRC detection result output
9
10
7
8
11
FCK
BCK
FLOCK
BLOCK
CRC4
External CPU interrupt request output
DMA request signal
Read ready signal
Input
Input
Output
I/O
33
12
16
INT
DREQ
RDY
Data bus
The bus width can be set to be either 8 bits or 16 bits by the BUSWD
pin (pin 48).
For data input, only the lower 8 bits (D0 to D7) are valid.
17 to 24 D0 to D7
Output
Data bus (in 16-bit mode)
These pins are held in the output off state when BUSWD is low.
25 to 32 D8 to D15
I/O
Connections for the system clock crystal oscillator circuit.
The XIN pin can also be used as an external clock signal input.
64
1
XIN
XOUT
InputBaseband (multiplex) signal input53 MPXIN
–
+
OutputSubcarrier output (76 kHz bandpass filter output)55 FLOUT
Continued on next page.
No. 6166-10/33
LC72710W, 72710LW
Continued from preceding page.
Pin No. Pin Function I/O Pin circuit
Subcarrier input (comparator input)56 CIN
Vref
–
+
Input
Reference voltage output (Vdda/2)52 VREF
Vssa
Vdda
Output
CCB serial interface data output36 DO
Output
—
—
—
—
This pin must be left open
37
50
57
NC
Analog system power supply
Analog system ground
Digital system power supply (+2.7 to +5.5 V)
Digital system ground
54
51
2, 15, 34
14, 35, 63
V
DDA
V
SSA
V
DDD
V
SSD
Notes: 1. This pin must be connected to V
DDD
or V
SSD
if the IC is used in serial interface mode (when SP is high).
2. A capacitor of at least 2000 pF must be inserted between V
DDD
and V
SSD
.
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