This Service Manual is a property of Samsung Electronics Co.,Ltd.
Any unauthorized use of Manual can be punished under applicable
International and/or domestic law.
ⓒ
Samsung Electronics Co.,Ltd. March. 2006
Printed in Korea.
Code No.: GH68-09641A
BASIC.
1. Specification
1-1. GSM General Specification
EGSM900DCS1800PCS1900W-CDMA
Freq.
Band[MHz]
Uplink/Downlink
ARFCN range
Tx/Rx spacing45MHz95MHz80MHz190MHz
Mod. Bit rate/
Bit Period
Time Slot
Period/Frame
Period
Modulation0.3GMSK0.3GMSK0.3GMSK
MS Power33dBm~5dBm30dBm~0dBm30dBm~0dBm24dBm ~ - 50dBm
Power Class
890~915
935~960
0~124 &
975~1023
270.833kbps
3.692us
576.9us
4.615ms
4
(max +33dBm)1(max +30dBm)1(max +30dBm)
1710~1785
1805~1880
512~885512~810
270.833kbps
3.692us
576.9us
4.615ms
1850~1910
1930~1990
270.833kbps
3.692us
576.9us
4.615ms
1920~1980
2110~2170
UL:9612~9888
DL:10562~10838
3.84Mcps
Frame length : 10ms
QPSK
HQPSK
3
(max +24dBm)
Sensitivity-102dBm-100dBm-100dBm-106.7dBm
TDMA Mux888
Cell Radius35Km2Km2Km2Km
1-1
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Specification
1-2. GSM TX power class
TX Power
control level
533±2dBm
631±2dBm
729±2dBm
827±2dBm
925±2dBm
1023±2 dBm
1121±2 dBm
GSM900
TX Power
control level
030±3dBm
128±3dBm
226±3dBm
324±3dBm
422±3dBm
520±3dBm
618±3dBm
DCS1800
TX Power
control level
030±3dBm
128±3dBm
226±3dBm
324±3dBm
422±3dBm
520±3dBm
618±3dBm
PCS1800
1219±2 dBm
1317±2 dBm
1415±2 dBm
1513±2 dBm
1611±3 dBm
179±3dBm
187±3 dBm
195±3 dBm
716±3dBm
814±3dBm
912±4dBm
1010±4 dBm
118±4dBm
126±4 dBm
134±4 dBm
142±5 dBm
716±3dBm
814±3dBm
912±4dBm
1010±4 dBm
118±4dBm
126±4 dBm
134±4 dBm
142±5 dBm
150±5 dBm
1-2
150±5 dBm
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2. Circuit Description
2-1. SGH-Z540 RF Circuit Description
1. Antenna Switch Module (U702)
The antenna switch module allows multiple operating bands and modes to share the same antenna. A common
antenna connects to one of five paths: 1) UMTS-2100 Rx/Tx, 2) EGSM-900 Rx, 3) EGSM-900 Tx, 4) DCS-1800
Rx, and 5) DCS-1800 Tx. 6) PCS-1900 Tx, 7) PCS-1900 Rx, UMTS operation requires simultaneous reception
and transmission.
2. Filter
To convert Electromagnetic Field Wave to Acoustic Wave and then pass the specific frequency band.
- GSM Rx FILTER (F702)→For filtering the frequency band between 925 ~ 960 MHz.
- DCS Rx FILTER (F701)→For filtering the frequency band 1805 and 1880 MHz.
- PCS Rx FILTER (F700)→For filtering the frequency band 1930 and 1990 MHz.
- WCDMA Rx FILTER (F800)→For filtering the frequency band 2110 and 2170 MHz.
- WCDMA Tx FILTER (F802)→For filtering the frequency band 1920 and 1980 MHz.
3. VCTCXO
To generate the 19.2MHz reference clock to drive the logic and RF.
4. Duplexer (TCX800)
A duplexer splits a single operating band into receive and transmit paths.
5. UMTS PAM (U800)
This is a key component in the transmitter chain and must complement the RTR6250 IC precisely; jointly they
dominate the UMTS transmitter performance characteristics. Parameters such as gain, output power level, ACLR,
harmonics, Rx-band noise, and power supply current are critical.
6. GSM/DCS/PCS PAM (U701)
The PAM is a key component in any transmitter chain and must complement the rest of the transmitter precisely.
For GSM,DCS,PCS operation, the closed-loop transmit power control functions add even more requirements
relative to the UMTS PA. In addition to gain control and switching requirements, the usual RF parameters such
as gain, output power level, several output spectrum requirements, and power supply current are critical.
7. GSM/DCS/PCS l Tx VCO (OSC700)
The Tx VCO outputs for EGSM, DCS, PCS drive a resistive network that splits the active signal into two signals:
1) the input to the active PAM – this is the low loss path, and 2) the OPLL feedback signal.
8. RF VCO
The single-band UHF VCO is a key component within its phase-locked loop; VCO performance directly impacts
PLL and transceiver performance. UMTS Rx LO signal is generated from this VCO's output.
2-1
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Circuit Description
9. RFR6250 (U801)
The RFR6250 provides the Zero-IF receiver signal path, from RF to analog baseband, for UMTS-2100
applications. The RFR6250 accepts its UMTS input signal from the handset RF front-end design. The UMTS input
is configured differentially to optimize second-order inter-modulation and common mode rejection performance, and
implements MSM-controlled gain adjustments to extend the receiver dynamic range.
10. RTR6250 (UCD700)
The RTR6250 supports multi-band, multi-mode phones with two receiver signal paths and three transmitter signal
paths:
1) Receiver paths
- EGSM-900
-DCS-1800
- PCS-1900
2) Transmitter paths
- EGSM-900 (using OPLL technique)
- DCS-1800 (using OPLL technique)
- PCS-1900
- UMTS-2100
Numerous secondary functions are integrated on-chip as well:
3) Phase-locked loop circuits
- PLL#1 and an on-chip VCO supports UMTS Tx
- PLL#2 and an external VCO supports EGSM Rx and Tx, DCS Rx and Tx, and UMTS Rx
4) Transceiver LO generation and distribution circuits
- EGSM-900 Rx and Tx
- DCS-1800 Rx and Tx
- UMTS-2100 Tx
2-2
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Circuit Description
2-2. SGH-Z540 Baseband Circuit description
1. PM6650-2 (PAM200)
1.1. Power Management
Ten low-dropout regulators designed specifically for GSM applications power the terminal and help ensure optimal
system performance and long battery life. It provides LDOs support for 1.375V, 1.8V, 2.6V, 2.85V, 3.3V.
IC-level interfaces include the three-line serial bus interface(SBI) used by the MSM6250 device to control
and status the PM6650-2 IC.
1.2. Keypad Backlight
The Keypad backlight driver output is at pin 23 (KEY_EL_DRV) and is designed to drive EL on KEY FPCB. Its
output current level is SBI-programmable and meets the performance specified below.
Input parameters are not specified since they are internal.
1.3. TCXO Controller and Buffers
The PM6650-2 IC includes circuits for controlling the TCXO warm-up and buffering its signal for distribution
throughout the handset. Performance specifications are presented below.
2. Connector
2-1. LCD Connector
LCD is consisted of main LCD(color 262K TFT LCD) and small LCD(color 65K TFT LCD). Chip select signals in
the HDC400, MAIN_LCD_CS can enable main LCD and SUB_EL_CS can enable small LCD. nRESET_LCD
signal initiates the reset process of the main LCD and sub LCD. 16-bit data lines(D2(0)~D(15)) transfers data and
commands to LCD.
Power signals for LCD are "VBATT_LCD". "EAR1O_P,N" and "SPK_R,K" from UCP100 are used for audio
speaker. And "VCC_MOTOR_3.3V" from U402 enables the motor.
2-2. Key
This is consisted of key interface pins among UCP100, KEYSENSE_N(0:3). These signals compose the matrix.
Result of matrix informs the key status to key interface in the UCP100. Power on/off key is seperated from the
matrix. The EL key PAD use the "VREG_MSMP_2.6V" voltage. "HALL_SW" informs the status of folder (open or
closed) to the. This uses the hall effect IC, EM-1681-FT
2-3. EMI ESD Filter
This system uses the EMI ESD filter, ECLAMP2378P to protect noise from IF CONNECTOR part.
2-3
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Circuit Description
2-4. IF connetor
It is 20-pin connector. They are designed to use VBATT, UART1_TX, UART1_RX, EARMIC_P/N, EAR_R/L,
EAR_SW, JACK_INT, ADC_BOOTSW, JIG_ON, USB_D+/-. They connected to power supply IC, microprocessor
and signal processor IC.
3. Audio
EAR1O_P and EAR1O_N from UCP100 are connected to the main speaker. AUXO_P and AUXO_N are
connected to the Digital AMP. MIC1_P and MIC1_N are connected to the main MIC. And MIC2_P and MIC2_N
are connected to the Earphone.
YMU765 has a built-in amplifier, and thus, is an ideal device for outputting sounds that are used by mobile
phones in addition to game sounds and ringing melodies that are replayed by a synthesizer.
The synthesizer section adopts "stereophonic hybrid synthesizer system" that are given advantages of both FM
synthesizers and Wave Table synthesizers to allow simultaneous generation of up to 32 FM voices and 32 Wave
Table voices. Furthermore, YMU765 has a built-in hardware sequencer that helps to realize complex play without
heavily loading the host CPU. And this device also has a built-in circuit for controlling vibrators and LEDs
synchronizing with play of music. The consumed electric current can be stopped to the minimum by power down
mode when not operating.
The hardware sequence built in this device allows playing of the complex music without giving excessive load to
the CPU of the portable telephones. Moreover, the registers of the FM synthesizer can be operated directly for
real time sound generation, allowing, for example, utilization of various sound effects when using the game
software installed in the portable telephone.
4. Memory (UME300)
The signals in the MSM6250 enable two memories. They use VREG_MSME_1.8V and VREG_MSMP_2.6V from
the PM6650. This system uses SEC's memory, KBE00S005M-D411. It is consisted of 2G bits flash NAND
memory and 512M bits SDRAM memory. It has 16 bit data line, D1[0~15] which is connected to MSM6250.
It has 22 bit address lines, A[1~22]. SDRAM_CS and NANDFLASH_CS signals is chip select.
5. Camera
The camera module consists of 1.3 Mega pixel and VGA pixel. The 1.3 Mega camera is a highly integrated
CMOS color image sensor implemented by Micron COMS sensor process realizing high sensitivity and wide
dynamic range. Total active pixel is 1280H x 1024V. The VGA camera is a highly integrated CMOS color image
sensor implemented by Micron COMS sensor process realizing high sensitivity and wide dynamic range. Total
active pixel is 656H x 488V.
2-4
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3. Exploded View and Parts List
3-1. Exploded View
QCW01
QWD01
QVO01
QFR01
QIF01
QCK01
QFU01
QKP02
QLB02
QLC01
QME06
QAR01
QMO01
QFL01
QCR12
QSC01
QCA01
QCA02
QHI01
QSC14
QCB01
QKP01
QME02
QSH01
QMP01
QME04
QBM01
QAN02
QCR12
QRE01
QCR12
QSC13
QRF01
QAN06
QCR04
QSC13
QMW04
QBA01
QBA00
3-1
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MPR-TAPE BLUE SHIELDGH74-20844A
MPR-CUSHION MP3 KEYGH74-21083A
MPR-CUSHION MOTORGH74-21084A
MPR-TAPE MIC MASKGH74-21217A
MPR-VINYL BOHO SIDE KEYGH74-21328A
MPR-SPONGE UPPERGH74-21434A
MEC-HANGER(BLK)GH75-08867E
3-3
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Exploded view and Part List
3-3. Disassembling Manual
1
1) After remove screw cap with tweezers, Unscrew.
2) Remove REAR and INTENNA COVER.
3) Unscrew from the INTENNA.
1) When you use tweezers, Be careful a damage of
component.
2
Remove B/T MODULE from th
e BT connector.
1) Remove B/T MODULE from the BT connector.
2) Remove B/T MODULE from attached to Front with
tweezers.
1) When you remove the B/T MODULE, Be careful crack
and damage of the BT MODULE.
3
1) Remove LCD Connector and INTENNA Connector from
the PBA.
2) Remove PBA from the FRONT ASS'Y.
1) Pay attention to tear of the FPCB.
2) Pay attention to damage of the wire.
4
1) Remove INTENNA WIRE Tape with tweezers.
2) Remove INTENNA and INTENNA WIRE.
1) When you remove the tape, pay attention to damage
of the INTENNA WIRE.
2) Be careful handling INTENNA. (Don't touch intenna pattern.)
3-4
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Exploded view and Part List
5
1) Remove SHIELD CAN and KEY PAD from the FOLDER ASS"Y.
Disjoint KEYPAD and SHIELD CAN together.
1)
7
6
1) Remove conduction Tape and Rubber from the FOLDER
ASS'Y with tweezers.
8
1) Using a disassemble stick, Disjoint the Folder like the Photo.
1) When you disjoint the Folder, pay attention to damage
of the LCD F-PCB.
2) When you use a disassemble stick, Be careful a damage
of component.
9
1) Disjoint the Folder of the Bottom with tweezers.
2) Using a disassemble stick, disjoint the Folder of the Side.
1) When disjointing UPPER, pay attention to damage of
the wire.
1) After remove screw cap with tweezers, Unscrew.
1) When you use a screwdriver, Be careful a damage
of component.
10
1) Romove the LCD PROTECTION TAPE with tweezers
1) Pay attention to a finger mark and dust of the LCD.
2) When you use tweezers, Be careful a damage of
component.
3-5
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Exploded view and Part List
11
1) Take off the SPK and the RECEIVER from the LOWER with
tweezers.
2) Open the ACTUATOR around the SPK ASS'Y connector.
3) After lifting BRAKET with tweezers,remove the SPK
ASS'Y.
1) W h e n y o u take off the SPK and the RECEIVER, p a y attention
to da mage o f the SPK and the RECEIVER.
2) When disjointing SPK ASS'Y, pay attention to
damage of the F-PCB.
Lift BRAKET
with tweezers
13
12
1) Take off the MOTOR from the LOWER with tweezers.
2) Open the ACTUATOR around the CAMERA connector.
1) When you take off MOTOR, pay attention to damag e of
LCD F-PCB and MOTOR WIRE.
2) pay attention to damage of CAMERA F-PCB .
1) Take off the LCD from the LOWER .
2) Take off the MEGA CAMERA from the LOWER.
1) When you remove the LCD, p ay attention to damage of LCD F-PCB,LCD component, finger mark, dust.
2) When you remove the CAMERA, pay attention to damage of CAMERA F-PCB and CAMERA.
3-6
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3-4. Assembling Manual
Exploded view and Part List
1
1) Solder the MOTOR WIRE after positioning it on the MOTOR PAD.
1) Take care of soldering correct.
2) Don't touch the LCD component and LCD DATA LINE with a
hot iron carefully.
3
2
1) Insert MEGA CAMERA F-PCB in the Connector.
2) Insert SUB CAMERA F-PCB in the Connector.
1) Insert CAMERA F-PCB in the Connector.
(By Silk Base Line)
2) Be careful F-PCB CRACK.
1) Take off SPK ASS'Y's tape, .
2) Press the SPK ASS'Y의 KEY DOME with a hand.
3) Attach the sponge on the MP3 KEY DOME correctly.
1) Attach KEY PCB on the a rising correctly.
2) Be careful the sponge of dust.
4
1) Insert SPK ASS'Y F-PCB F-PCB in the Connector.
2) Bond the solder part with receiver wire of the end.
1) Insert SPK ASS'Y F-PCB in the Connector. (By Silk Base Line)
2) Do not bond too much and control the amount of bond not to be high.
After bonding, handling the dust
direction
3-7
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Exploded view and Part List
Insert the Blue marked
5
가.Insert the top of the SHIELD CAN obliquely.( 45°)
→ When inserting, check the condition of the KEY PAD Basefilm .
나.Combine the bottom hole of the SHIELD CAN and FRONT SCREW boss.
다.After Combining, check the KEY GAP of the PAD.
1) After Combining FRONT and SHIELD CAN, open the FOLDER and check the KEY PAD of the GAP.
part of the SHIELD CAN
under the Red marked of
the FRONT HOOK.
6
1) Adhere the Mic insulation TAPE to SHIELD CAN along metallized SHIELD CAN.
2) After put the ANT on the FRONT, screw ANT.
3) Put the ANT CABLE through the passage of FRONT.
4) Don't keep being shown the Ant Cable after adhering Ant TAPE.
1) Attach tape by Guide line.
3-8
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7
1) Connect ANT cover with FRONT
2) Screw down
3) Insert Screw cap at two points
1) Take care so that ANT cover do not interfere with Ant wire.
2) On screwing down, be careful not to scratch
Exploded view and Part List
8
④F-PCB insert
1) Insert LCD and SPK ASS'Y bracket.
2) Twist twice MOTOR wire and insert MOTOR.
3) insert LCD FPCB into F/LOWER hole.
4) Insert VGA CAMERA.
5) Attach a semocircular Poron sponge on the MOTOR with a
pinset.
1) On inserting LCD, be careful for foreign substance.
2) Take care that MOTOR wire do not interfere with screw boss.
3) Notice that FPCB should not be cracked on inserting CAMERA.
⑤ CAMERA
insert
③ MOTOR insert
① LCD insert
② Bracket insert
3-9
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Exploded view and Part List
9
1) Attach a black insulation tape on LCD upper covering parts
2) Push and insert a receiver into LOWER receiver inserting
position rightly.
3) Insert SPK into LOWER SPK position.
4) Attach a black insulation tape on LCD lower covering parts.
5) Push a receiver wire for wire to avoid putting on F-PCB.
1) Attach insulation tapes covering parts perfectly at the right position.
→Check tape position with red lines.
10
1) Firstly, connect UPPER end hook with LOWER end hook.
2) Be care for foreign substance and connect Lower hooks.
3) Connect side hooks.
1) Notice that foreign substances do not go in.
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11
1) Screw down at four points.
2) Insert screw cap at four points.
Exploded view and Part List
12
1) Insert FOLDER into FRONT passing hole.
2) After inserting hinge dummy, assemble pushing hinge on the other part with wooden pinset or hand.
3) Check folder connection by repeating open and close two or three times.
Insert pushing hinge with wooden pinset
or hand
3-11
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Exploded view and Part List
13
1) Insert PBA into FRONT ASS'Y.
2) When inserting PBA, put ANT wire at PBA hole
near the screw boss hole and connect with
connector.
1) Be careful not to damage ANT wire.
2) Ensure space so that ANT Wire can not be damaged when connecting FRONT with REAR.
14
1) Connect LCD F-PCB connector.
2) Connect B/T Module.
1516
1) After aligning REAR upper hook part with FRONT upper
hook part, cover REAR and assemble.
→ Check the hook connection by pushing the upper part
of REAR
1) Screw down 4 points.
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3-5. LCD KIT assembling Manual
1
Exploded view and Part List
1) Attach the black insulation tape on the LCD upper to cover parts completely.
→ Attach tape according to red lines.
DiscriptionSEC CODESEC Designquantity
TAPE LCD MASKING 1GH74-20203A39.7 x 31.6 x 0.08T1
----
2
1) Attach the black insulation tape on the LCD
lower to cover parts completely.
→ Attach tape according to red lines.
DiscriptionSEC CODESEC Designquantity
TAPE LCD MASKING 2GH74-20204A39.7 x 11.62 x 0.08T1
----
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Exploded view and Part List
3-6. Test Jig (GH80-03308A)
3-6-1. RF Test Cable
3-6-2. Test Cable3-6-3. Serial Cable
(GH39-00397A)
3-6-4. Power Supply Cable3-6-5. DATA CABLE3-6-6. TA
3-14
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