Samsung MX-H630/ZP Schematic

MINI-Compact System

Model Name	MX-H630
Model Code	MX-H630/ZP

SERVICEMANUAL

MINI-Compact System

Contents

1. Precaution

2. Product Specification

3. Disassembly and Reassembly

4. Troubleshooting

5. PCB Diagram

6. Schematic Diagram

MX-H630

Refer to the service manual in the GSPN (see the rear cover) for more information.

Contents

1.	Precaution........................................................................................................................................			1	−	1
	1.1.	Safety Precautions ...................................................................................................................		1	−	1
	1.2.	Servicing Precautions ...............................................................................................................		1	−	3
	1.3. Precautions for Electrostatically Sensitive Devices (ESDs) ..............................................................			1	−	4
	1.4.	Installation Precautions.............................................................................................................		1	−	5
2.	Product Specification .........................................................................................................................			2	−	1
	2.1.	Product Feature .......................................................................................................................		2	−	1
	2.2.	Specifications..........................................................................................................................		2	−	2
	2.3.	Specifications Analysis .............................................................................................................		2	−	3
	2.4.	Accessories ............................................................................................................................		2	−	4
		2.4.1.	Supplied Accessories ...................................................................................................	2	−	4
3.	Disassembly and Reassembly ..............................................................................................................			3	−	1
	3.1. Main Disassembly and Reassembly.............................................................................................			3	−	1
	3.2. DECK Disassembly and Reassembly...........................................................................................			3	−	5
4.	Troubleshooting................................................................................................................................			4	−	1
	4.1. Checkpoints by Error Mode .......................................................................................................			4	−	1
		4.1.1.	No Power...................................................................................................................	4	−	2
		4.1.2.	No Output..................................................................................................................	4	−	4
	4.2. Measures to be taken when the Protection Circuit operates...............................................................			4	−	5
		4.2.1. Operation of Power Block Protection Circuit ....................................................................		4	−	5
		4.2.2. Check AMP in Power Protection ....................................................................................		4	−	6
	4.3. MICOM, MPEG Initialization & Update......................................................................................			4	−	7
	4.4. Buyer-Region Code Setting Method ............................................................................................			4	−	8
		4.4.1. The inserting method of Region Code after replacing the Main PBA .....................................		4	−	8
5.	PCB Diagram ...................................................................................................................................			5	−	1
	5.1.	Wiring Diagram.......................................................................................................................		5	−	1
	5.2.	FRONT PCB Top ....................................................................................................................		5	−	2
		5.2.1.	Pin Connection ...........................................................................................................	5	−	3
	5.3.	FRONT PCB Bottom ...............................................................................................................		5	−	4
	5.4.	MAIN PCB Top ......................................................................................................................		5	−	5
		5.4.1.	Pin Connection ...........................................................................................................	5	−	6
		5.4.2. Test Point Wave Form ..................................................................................................		5	−	7
	5.5.	MAIN PCB Bottom..................................................................................................................		5	−	8
	5.6.	SMPS PCB Top.......................................................................................................................		5	−	9
		5.6.1.	Pin Connection ...........................................................................................................	5	− 10
	5.7.	SMPS PCB Bottom..................................................................................................................		5	− 11
6.	Schematic Diagram ...........................................................................................................................			6	−	1
	6.1.	Overall Block Diagram .............................................................................................................		6	−	1

i	Copyright© 1995-2013 SAMSUNG. All rights reserved.

		Contents
6.2.	FRONT .................................................................................................................................	6 −	2
6.3.	MAIN-1.................................................................................................................................	6 −	3
6.4.	MAIN-2.................................................................................................................................	6 −	4
6.5.	MAIN-3.................................................................................................................................	6 −	5
	6.5.1. Test Point Wave Form ..................................................................................................	6 −	6
6.6.	MAIN-4.................................................................................................................................	6 −	7
6.7.	SMPS-1 .................................................................................................................................	6 −	8
6.8.	SMPS-2 .................................................................................................................................	6 −	9

1. Precaution

Follow these safety instructions while servicing the ESD to prevent damage and to protect against potential hazards such as electrical shock and X-rays.

1.1. Safety Precautions

1)When reinstalling the chassis and its assemblies, be sure to restore all of the protective devices, including the control knobs and the compartment covers.

2)Make sure that there are no cabinet openings through which people (particularly children) can make contact with dangerous internal components.

3)Design Alteration Warning:

Never alter or add to the mechanical or electrical design of the unit.

Example: Do not add auxiliary audio or video connectors. Such alterations might create a safety hazard. Also, any design changes or additions will void the manufacturer’s warranty.

4)Leakage Current Hot Check Figure 1.1 AC Leakage Test:

WARNING

Do not use an isolation transformer during this test. Use a leakage-current tester or a metering system that complies.

With the unit completely reassembled, plug the AC cord directly into a AC outlet. With the unit’s power switched from the ON to the OFF position, measure the current between a known ground and all exposed metal parts.

Known Grounds - Earth

Known Metal parts - screwheads, metal cabinets, etc.

Figure 1.1 AC Leakage Test

1-1	Copyright© 1995-2013 SAMSUNG. All rights reserved.

1. Precaution

5)Insulation Resistance Cold Check:

(1)With the unit’s AC plug disconnected from the AC source, connect an electrical jumper across the two AC prongs.

(2)Set the power switch to ON. (3) Measure the resistance between the shorted AC plug and any exposed metallic parts.

Example: screwheads, metal cabinets, antenna port, etc. If any of the exposed metallic parts has a return path to the chassis, the measured resistance should be between 1 and 5.2 megohms. If there is no return path, the measured resistance should be “infinite.” If the resistance is outside these limits, a shock hazard might exist. See Figure 1.2 Insulation Resistance Test

Figure 1.2 Insulation Resistance Test

6)Components, parts and wiring that appear to have overheated or that are otherwise damaged should be replaced with parts that meet the original specifications. Always determine the cause of damage or overheating, and correct any potential hazards.

7)Observe the original lead dress, especially near the following areas: Antenna wiring, sharp edges, and especially the AC and high voltage power supplies. Always inspect for pinched, out-of-place, or frayed wiring.

Do not change the spacing between components and the printed circuit board. Check the AC power cord for damage. Make sure that no wires or components touch thermally hot parts.

8)Product Safety Notice:

Some electrical and mechanical parts have special safety-related characteristics which might not be obvious from visual inspection. These safety features and the protection they give might be lost if the replacement component differs from the original—even if the replacement is rated for higher voltage, wattage, etc.

9)Components that are critical for safety are indicated in the circuit diagram by shading, or . Use replacement components that have the same ratings, especially for flame resistance and dielectric strength specifications. A

replacement part that does not have the same safety characteristics as the original might create shock, fire or other hazards.

1-2

1. Precaution

1.2. Servicing Precautions

1)Servicing precautions are printed on the cabinet. Follow them.

2)Always unplug the unit’s AC power cord from the AC power source before attempting to :

(a) Remove or reinstall any component or assembly, (b) Disconnect an electrical plug or connector, (c) Connect a test component in parallel with an electrolytic capacitor.

3)Some components are raised above the printed circuit board for safety. An insulation tube or tape is sometimes used. The internal wiring may be clamped to prevent contact with thermally hot components. Reinstall all such elements to their original position.

4)After servicing, always check that the screws, components and wiring have been correctly reinstalled. Make sure that the portion around the serviced part has not been damaged.

5)Check the insulation between the blades of the AC plug and accessible conductive parts (examples : metal panels, input terminals and earphone jacks).

6)Insulation Checking Procedure :

Disconnect the power cord from the AC source. Connect an insulation resistance meter (500 V) to the blades of the AC plug. The insulation resistance between each blade of the AC plug and accessible conductive parts (see above) should be greater than 1 megohm.

7)Never defeat any of the B+ voltage interlocks. Do not apply AC power to the unit (or any of its assemblies) unless all solid-state heat sinks are correctly installed.

8)Always connect a test instrument’s ground lead to the instrument chassis ground before connecting the positive lead; always remove the instrument’s ground lead last.

CAUTION

First read the “Safety Precautions” section of this manual. If some unforeseen circumstance creates a conflict between the servicing and safety precautions, always follow the safety precautions.

1-3	Copyright© 1995-2013 SAMSUNG. All rights reserved.

1. Precaution

1.3. Precautions for Electrostatically Sensitive Devices (ESDs)

Some semiconductor (“solid state”) devices are easily damaged by static electricity. Such components are called Electrostatically Sensitive Devices (ESDs).

Examples include integrated circuits and some field-effect transistors.

The following techniques will reduce the occurrence of component damage caused by static electricity :

1)Immediately before handling any semiconductor components or assemblies, drain the electrostatic charge from your body by touching a known earth ground. Alternatively, wear a discharging wrist-strap device. (Be sure to remove it prior to applying power–this is an electric shock precaution.)

2)After removing an ESD-equipped assembly, place it on a conductive surface such as aluminum foil to prevent accumulation of electrostatic charge.

3)Do not use freon-propelled chemicals. These can generate electrical charges that damage ESDs.

4)Use only a grounded-tip soldering iron when soldering or unsoldering ESDs.

5)Use only an anti-static solder removal device. Many solder removal devices are not rated as “anti-static” (these can accumulate sufficient electrical charge to damage ESDs).

6)Do not remove a replacement ESD from its protective package until you are ready to install it.

Most replacement ESDs are packaged with leads that are electrically shorted together by conductive foam, aluminum foil or other conductive materials.

7)Immediately before removing the protective material from the leads of a replacement ESD, touch the protective material to the chassis or circuit assembly into which the device will be installed.

8)Minimize body motions when handling unpackaged replacement ESDs. Motions such as brushing clothes together, or lifting a foot from a carpeted floor can generate enough static electricity to damage an ESD.

1-4

1. Precaution

1.4. Installation Precautions

1)Keep the product away from a heat source such as candle light, mosquito repellent incense, heating equipment, or direct sunlight. Otherwise, this may cause fire.

2)Do not install the product on a place that is shaking, tilted, unstable, or seriously vibrating. The product may drop to get damaged or injure a person. If using the product in a highly vibrating place, it may be broken or cause fire.

3)When moving the product, turn off the power switch and unplug all the connected cables with the product such as the power plug and antenna cable. If the power cord is damaged, this may cause electric shock or fire.

4)Secure room for ventilation. Keep at least 10 cm of distance from the rear wall, and at least 5 cm from either side wall.

5)Installing the product in a special place like below rather than normal environment may cause serious quality concerns due to its special conditions. If this is the case, make sure to contact a local Samsung service center before installing the product. (Special places: a place where a large amount of dust is accumulated; where chemical substances are used

or the ambient temperature is too high or low; a place that is full of moisture or water; in transportation vehicles such as a car; or in public places such as the airport or subway station where the product is supposed to operate uninterruptedly for a long time)

6)Keep the packaging plastic wrapper out of children's reach. If children play with it improperly, they may get suffocated.

7)If installing the product on a display cabinet, shelf, desk, etc., keep the product from protruding on its lower side. If the product falls, it may break or cause physical injury. Use only the display cabinet or shelf that fully covers the product.

8)If using lithium batteries, carefully read the following precautions:

NOTE

•Ensure the batteries are inserted in the right direction. Otherwise, they may cause an explosion. Dispose of used batteries according to the manufacturer's instructions.

•Do not expose the battery to fire.

•Do not disassemble, short - cut, or heat the battery.

•Use only the same type and size of batteries for replacement.

•Do not expose the battery to fire or excessive heat.

1-5	Copyright© 1995-2013 SAMSUNG. All rights reserved.

2. Product Specification

2.1. Product Feature

■Power

•2.0 ch : 230 W Total RMS / 2640 W PMPO

•IR Amp

■Specialized Function

•CD Ripping (Able to ripping while listening)

•New Bass Sound System (Called GIGA Sound)

•Connectivity

•USB

•MIC

■Disc

•Type : 1 Tray

•Compatible : MP3, CD / CD-R, RW, WMA

2-1

2. Product Specification

2.2. Specifications

■ Basic Specification

	Weight	2.3 Kg
General	Dimensions	203 (W) x 306 (H) x 256.5 (D) mm

	Operating Temperature Range	+5 °C ~ +35 °C
	Operating Temperature Range	+5 °C ~ +35 °C

	Operating Humidity Range	10 % to 75 %
	Signal/Noise ratio	55 dB
FM Tuner	Usable sensitivity	12 dB
	Total harmonic distortion	0.6 %
	Signal/Noise ratio	35 dB
AM Tuner	Usable sensitivity	58 dB
(optional)	Usable sensitivity	58 dB
	Total harmonic distortion	1.5 %
CD Disc	CD : 12 cm (Compact Disc)	Reading Speed : 4.8 ~ 5.6 m/sec.

		Maximum Play Time : 74 min.
		Maximum Play Time : 74 min.

		MX-H630 : 230 Watts (MAX)
	Front speaker output	110 W/CH (4 Ω/100 Hz)
		MX-H730 : 550 Watts (MAX)
Amplifier	Front speaker output	275 W/CH (4 Ω/100 Hz)

	Frequency range	20 Hz ~ 20 KHz
	Frequency range	20 Hz ~ 20 KHz

	S/N Ratio	80 dB
	Channel separation	65 dB
	Input sensitivity	(AUX) 800 mV

NOTE

•Samsung Electronics Co., Ltd reserves the right to change the specifications without notice.

•Weight and dimensions are approximate.

•Design and specifications are subject to change without prior notice.

•For the power supply and Power Consumption, refer to the label attached to the product.

2-2	Copyright© 1995-2013 SAMSUNG. All rights reserved.

2. Product Specification

2.3. Specifications Analysis

Model Name	MX H630	MX-F630 / MX-F630B / MX-F630DB
Photo

OUTPUT POWER	2.0CH 230W	2.0 CH 220 W
FRONT DISPLAY	VFD	VFD
DIMMER	O	O
CD/DVD	CD	CD
CD/DVD	CD	DVD : MX-F630DB Only
		DVD : MX-F630DB Only
Bluetooth	O	MX-F630B, MX-F630DB Only
MP3	O	O
USB HOST	O	O
CD RIPPING	O	O
TAPE	X	X
AUDIO IN	O	O
HEADPHONE	X	X
FM / RDS	FM/AM	FM/AM
REMOTE KEY	45 KEY	45 KEY
DUAL VOLTAGE	O	O
SPK IMPENDANCE	4 OHM	4 OHM

TIP
O : Feature Included
X : Not Included

2-3

2. Product Specification

2.4. Accessories

2.4.1. Supplied Accessories

Accessories	Item	Item code
	Batteries (AAA)	4301-000116

Remote Control

AH59-02613B

User’s Manual

AH68-02677J

FM/AM Antenna

AH42-00036A

(Optional)

2-4	Copyright© 1995-2013 SAMSUNG. All rights reserved.

3. Disassembly and Reassembly

3.1. Main Disassembly and Reassembly

CAUTION

•Be careful to follow the disassembly sequence described in the manual. Otherwise, the product may be damaged.

•Be sure to carefully read and understand the safety instructions before performing any work as the IC chips on the PCB are vulnerable to static electricity.

•In order to assemble reverse the order of disassembly.

Description	Description Photo

1.Unfasten 4 screws on the 2 side Cover. : BH 3*10 BLACK

CAUTION

Be careful not to make any scratches as you remove them.

3-1

3. Disassembly and Reassembly

Description	Description Photo

2.Separate the Front panel.

3-2	Copyright© 1995-2013 SAMSUNG. All rights reserved.

3. Disassembly and Reassembly

Description	Description Photo

3.Unfasten 5 screws in SMPS and detach AC-CORD & 13P shield wire.

: BH 3*10 SILVER

4.Unfasten BT screws and 2 kitting screws and detach DECK wire. : BH 3*10 BLACK

3-3

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