Samsung MX-H630/ZP Schematic

MINI-CompactSystem

ModelNameMX-H630

ModelCodeMX-H630/ZP

MANUAL

SERVICE

MINI-CompactSystem

1.Precaution

2.ProductSpecication

3.DisassemblyandReassembly

4.Troubleshooting

5.PCBDiagram

6.SchematicDiagram

MX-H630

Contents

RefertotheservicemanualintheGSPN(seetherearcover)formoreinformation.

Contents

Contents

1.Precaution........................................................................................................................................1−1

1.1.SafetyPrecautions...................................................................................................................1−1

1.2.ServicingPrecautions...............................................................................................................1−3

1.3.PrecautionsforElectrostaticallySensitiveDevices(ESDs)..............................................................1−4

1.4.InstallationPrecautions.............................................................................................................1−5

2.ProductSpecication.........................................................................................................................2−1

2.1.ProductFeature.......................................................................................................................2−1

2.2.Specications..........................................................................................................................2−2

2.3.SpecicationsAnalysis.............................................................................................................2−3

2.4.Accessories............................................................................................................................2−4

2.4.1.SuppliedAccessories...................................................................................................2−4

3.DisassemblyandReassembly..............................................................................................................3−1

3.1.MainDisassemblyandReassembly.............................................................................................3−1

3.2.DECKDisassemblyandReassembly...........................................................................................3−5

4.Troubleshooting................................................................................................................................4−1

4.1.CheckpointsbyErrorMode.......................................................................................................4−1

4.1.1.NoPower...................................................................................................................4−2

4.1.2.NoOutput..................................................................................................................4−4

4.2.MeasurestobetakenwhentheProtectionCircuitoperates...............................................................4−5

4.2.1.OperationofPowerBlockProtectionCircuit....................................................................4−5

4.2.2.CheckAMPinPowerProtection....................................................................................4−6

4.3.MICOM,MPEGInitialization&Update......................................................................................4−7

4.4.Buyer-RegionCodeSettingMethod............................................................................................4−8

4.4.1.TheinsertingmethodofRegionCodeafterreplacingtheMainPBA.....................................4−8

5.PCBDiagram...................................................................................................................................5−1

5.1.WiringDiagram.......................................................................................................................5−1

5.2.FRONTPCBTop....................................................................................................................5−2

5.2.1.PinConnection...........................................................................................................5−3

5.3.FRONTPCBBottom...............................................................................................................5−4

5.4.MAINPCBTop......................................................................................................................5−5

5.4.1.PinConnection...........................................................................................................5−6

5.4.2.TestPointWaveForm..................................................................................................5−7

5.5.MAINPCBBottom..................................................................................................................5−8

5.6.SMPSPCBTop.......................................................................................................................5−9

5.6.1.PinConnection...........................................................................................................5−10

5.7.SMPSPCBBottom..................................................................................................................5−11

6.SchematicDiagram...........................................................................................................................6−1

6.1.OverallBlockDiagram.............................................................................................................6−1

iCopyright©1995-2013SAMSUNG.Allrightsreserved.

Contents

6.2.FRONT.................................................................................................................................6−2

6.3.MAIN-1.................................................................................................................................6−3

6.4.MAIN-2.................................................................................................................................6−4

6.5.MAIN-3.................................................................................................................................6−5

6.5.1.TestPointWaveForm..................................................................................................6−6

6.6.MAIN-4.................................................................................................................................6−7

6.7.SMPS-1.................................................................................................................................6−8

6.8.SMPS-2.................................................................................................................................6−9

Copyright©1995-2013SAMSUNG.Allrightsreserved.ii

1.Precaution

DEVICE
UNDER

TES T

LEAKAGE

CUR RE NT

TES TER

TES T ALL

EXPO SED ME TAL

SU RFACES

2-WIRE CORD

ALSO TE S T WITH

PLUG REVERS ED

(US ING AC

ADAPTER P LUG

AS R EQ UIRED)

EARTH

GR OUND

(RE ADING
SH OULD NOT BE
ABOVE 0.5m A)

1.Precaution

FollowthesesafetyinstructionswhileservicingtheESDtopreventdamageandtoprotectagainstpotentialhazards
suchaselectricalshockandX-rays.

1.1.SafetyPrecautions

1)Whenreinstallingthechassisanditsassemblies,besuretorestorealloftheprotectivedevices,includingthecontrol
knobsandthecompartmentcovers.

2)Makesurethattherearenocabinetopeningsthroughwhichpeople(particularlychildren)canmakecontactwith
dangerousinternalcomponents.

3)DesignAlterationWarning:

Neveralteroraddtothemechanicalorelectricaldesignoftheunit.

Example:Donotaddauxiliaryaudioorvideoconnectors.Suchalterationsmightcreateasafetyhazard.

Also,anydesignchangesoradditionswillvoidthemanufacturer’swarranty.

4)LeakageCurrentHotCheckFigure1.1

ACLeakageTest:

WARNING

Donotuseanisolationtransformerduringthistest.Usealeakage-currenttesterorameteringsystemthatcomplies.

Withtheunitcompletelyreassembled,plugtheACcorddirectlyintoaACoutlet.Withtheunit’spowerswitchedfrom
theONtotheOFFposition,measurethecurrentbetweenaknowngroundandallexposedmetalparts.

KnownGrounds-Earth

KnownMetalparts-screwheads,metalcabinets,etc.

Figure1.1ACLeakageTest

1-1Copyright©1995-2013SAMSUNG.Allrightsreserved.

1.Precaution

Ante nna

Term inal

ohm

Expo sed

Meta l Part

Ohmmet er

5)InsulationResistanceColdCheck:

(1)Withtheunit’sACplugdisconnectedfromtheACsource,connectanelectricaljumperacrossthetwoACprongs.
(2)SetthepowerswitchtoON.(3)MeasuretheresistancebetweentheshortedACplugandanyexposedmetallicparts.

Example:screwheads,metalcabinets,antennaport,etc.Ifanyoftheexposedmetallicpartshasareturnpathtothe
chassis,themeasuredresistanceshouldbebetween1and5.2megohms.Ifthereisnoreturnpath,themeasured
resistanceshouldbe“innite.”Iftheresistanceisoutsidetheselimits,ashockhazardmightexist.SeeFigure1.2

InsulationResistanceTest

Figure1.2InsulationResistanceTest

6)Components,partsandwiringthatappeartohaveoverheatedorthatareotherwisedamagedshouldbereplacedwith
partsthatmeettheoriginalspecications.Alwaysdeterminethecauseofdamageoroverheating,andcorrectany
potentialhazards.

7)Observetheoriginalleaddress,especiallynearthefollowingareas:Antennawiring,sharpedges,andespeciallytheAC
andhighvoltagepowersupplies.Alwaysinspectforpinched,out-of-place,orfrayedwiring.

Donotchangethespacingbetweencomponentsandtheprintedcircuitboard.ChecktheACpowercordfordamage.
Makesurethatnowiresorcomponentstouchthermallyhotparts.

8)ProductSafetyNotice:

Someelectricalandmechanicalpartshavespecialsafety-relatedcharacteristicswhichmightnotbeobviousfromvisual
inspection.Thesesafetyfeaturesandtheprotectiontheygivemightbelostifthereplacementcomponentdiffersfrom
theoriginal—evenifthereplacementisratedforhighervoltage,wattage,etc.

9)Componentsthatarecriticalforsafetyareindicatedinthecircuitdiagrambyshading,

or.Usereplacement
componentsthathavethesameratings,especiallyforameresistanceanddielectricstrengthspecications.A
replacementpartthatdoesnothavethesamesafetycharacteristicsastheoriginalmightcreateshock,reorother
hazards.

Copyright©1995-2013SAMSUNG.Allrightsreserved.1-2

1.Precaution

1.2.ServicingPrecautions

1)Servicingprecautionsareprintedonthecabinet.Followthem.

2)Alwaysunplugtheunit’sACpowercordfromtheACpowersourcebeforeattemptingto:
(a)Removeorreinstallanycomponentorassembly ,(b)Disconnectanelectricalplugorconnector,(c)Connecta
testcomponentinparallelwithanelectrolyticcapacitor.

3)Somecomponentsareraisedabovetheprintedcircuitboardforsafety.Aninsulationtubeortapeissometimesused.
Theinternalwiringmaybeclampedtopreventcontactwiththermallyhotcomponents.Reinstallallsuchelements
totheiroriginalposition.

4)Afterservicing,alwayscheckthatthescrews,componentsandwiringhavebeencorrectlyreinstalled.Makesurethat
theportionaroundtheservicedparthasnotbeendamaged.

5)ChecktheinsulationbetweenthebladesoftheACplugandaccessibleconductiveparts(examples:metalpanels,
inputterminalsandearphonejacks).

6)InsulationCheckingProcedure:
DisconnectthepowercordfromtheACsource.Connectaninsulationresistancemeter(500V)tothebladesofthe
ACplug.TheinsulationresistancebetweeneachbladeoftheACplugandaccessibleconductiveparts(seeabove)
shouldbegreaterthan1megohm.

7)NeverdefeatanyoftheB+voltageinterlocks.DonotapplyACpowertotheunit(oranyofitsassemblies)unlessall
solid-stateheatsinksarecorrectlyinstalled.

8)Alwaysconnectatestinstrument’sgroundleadtotheinstrumentchassisgroundbeforeconnectingthepositivelead;
alwaysremovetheinstrument’sgroundleadlast.

CAUTION

Firstreadthe“SafetyPrecautions”sectionofthismanual.Ifsomeunforeseencircumstancecreatesaconictbetweenthe
servicingandsafetyprecautions,alwaysfollowthesafetyprecautions.

1-3Copyright©1995-2013SAMSUNG.Allrightsreserved.

1.Precaution

1.3.PrecautionsforElectrostaticallySensitiveDevices(ESDs)

Somesemiconductor(“solidstate”)devicesareeasilydamagedbystaticelectricity.
SuchcomponentsarecalledElectrostaticallySensitiveDevices(ESDs).
Examplesincludeintegratedcircuitsandsomeeld-effecttransistors.
Thefollowingtechniqueswillreducetheoccurrenceofcomponentdamagecausedbystaticelectricity:

1)Immediatelybeforehandlinganysemiconductorcomponentsorassemblies,draintheelectrostaticchargefromyour
bodybytouchingaknownearthground.Alternatively,wearadischargingwrist-strapdevice.(Besuretoremoveit
priortoapplyingpower–thisisanelectricshockprecaution.)

2)AfterremovinganESD-equippedassembly,placeitonaconductivesurfacesuchasaluminumfoiltoprevent
accumulationofelectrostaticcharge.

3)Donotusefreon-propelledchemicals.ThesecangenerateelectricalchargesthatdamageESDs.

4)Useonlyagrounded-tipsolderingironwhensolderingorunsolderingESDs.

5)Useonlyananti-staticsolderremovaldevice.Manysolderremovaldevicesarenotratedas“anti-static”(thesecan
accumulatesufcientelectricalchargetodamageESDs).

6)DonotremoveareplacementESDfromitsprotectivepackageuntilyouarereadytoinstallit.
MostreplacementESDsarepackagedwithleadsthatareelectricallyshortedtogetherbyconductivefoam,aluminum
foilorotherconductivematerials.

7)ImmediatelybeforeremovingtheprotectivematerialfromtheleadsofareplacementESD,touchtheprotectivematerial
tothechassisorcircuitassemblyintowhichthedevicewillbeinstalled.

8)MinimizebodymotionswhenhandlingunpackagedreplacementESDs.Motionssuchasbrushingclothestogether,or
liftingafootfromacarpetedoorcangenerateenoughstaticelectricitytodamageanESD.

Copyright©1995-2013SAMSUNG.Allrightsreserved.1-4

1.Precaution

1.4.InstallationPrecautions

1)Keeptheproductawayfromaheatsourcesuchascandlelight,mosquitorepellentincense,heatingequipment,ordirect
sunlight.Otherwise,thismaycausere.

2)Donotinstalltheproductonaplacethatisshaking,tilted,unstable,orseriouslyvibrating.Theproductmaydroptoget
damagedorinjureaperson.Ifusingtheproductinahighlyvibratingplace,itmaybebrokenorcausere.

3)Whenmovingtheproduct,turnoffthepowerswitchandunplugalltheconnectedcableswiththeproductsuchasthe
powerplugandantennacable.Ifthepowercordisdamaged,thismaycauseelectricshockorre.

4)Secureroomforventilation.Keepatleast10cmofdistancefromtherearwall,andatleast5cmfromeithersidewall.

5)Installingtheproductinaspecialplacelikebelowratherthannormalenvironmentmaycauseseriousqualityconcerns
duetoitsspecialconditions.Ifthisisthecase,makesuretocontactalocalSamsungservicecenterbeforeinstallingthe
product.(Specialplaces:aplacewherealargeamountofdustisaccumulated;wherechemicalsubstancesareused
ortheambienttemperatureistoohighorlow;aplacethatisfullofmoistureorwater;intransportationvehicles
suchasacar;orinpublicplacessuchastheairportorsubwaystationwheretheproductissupposedtooperate
uninterruptedlyforalongtime)

6)Keepthepackagingplasticwrapperoutofchildren'sreach.Ifchildrenplaywithitimproperly,theymaygetsuffocated.

7)Ifinstallingtheproductonadisplaycabinet,shelf,desk,etc.,keeptheproductfromprotrudingonitslowerside.Ifthe
productfalls,itmaybreakorcausephysicalinjury .Useonlythedisplaycabinetorshelfthatfullycoverstheproduct.

8)Ifusinglithiumbatteries,carefullyreadthefollowingprecautions:

NOTE

•Ensurethebatteriesareinsertedintherightdirection.Otherwise,theymaycauseanexplosion.Disposeofusedbatteries
accordingtothemanufacturer'sinstructions.

•Donotexposethebatterytore.

•Donotdisassemble,short-cut,orheatthebattery.

•Useonlythesametypeandsizeofbatteriesforreplacement.

•Donotexposethebatterytoreorexcessiveheat.

1-5Copyright©1995-2013SAMSUNG.Allrightsreserved.

2.ProductSpecication

2.1.ProductFeature

■Power

•2.0ch:230WTotalRMS/2640WPMPO

•IRAmp

■SpecializedFunction

•CDRipping(Abletorippingwhilelistening)

•NewBassSoundSystem(CalledGIGASound)

•Connectivity

•USB

2.ProductSpecication

•MIC

■Disc

•Type:1Tray

•Compatible:MP3,CD/CD-R,RW ,WMA

Copyright©1995-2013SAMSUNG.Allrightsreserved.2-1

2.ProductSpecication

2.2.Specications

■BasicSpecication

Weight2.3Kg

General

AMTuner

(optional)

CDDiscCD:12cm(CompactDisc)

Amplier

Dimensions203(W)x306(H)x256.5(D)mm

OperatingT emperatureRange+5°C~+35°C

OperatingHumidityRange10%to75%

Signal/Noiseratio55dB

Usablesensitivity12dB FMT uner

Totalharmonicdistortion0.6%

Signal/Noiseratio35dB

Usablesensitivity58dB

Totalharmonicdistortion1.5%

Frontspeakeroutput110W/CH(4Ω/100Hz)

Frontspeakeroutput275W/CH(4Ω/100Hz)

Frequencyrange20Hz~20KHz

ReadingSpeed:4.8~5.6m/sec.

MaximumPlayTime:74min.

MX-H630:230Watts(MAX)

MX-H730:550Watts(MAX)

S/NRatio80dB

Channelseparation65dB

Inputsensitivity(AUX)800mV

NOTE

•SamsungElectronicsCo.,Ltdreservestherighttochangethespecicationswithoutnotice.

•Weightanddimensionsareapproximate.

•Designandspecicationsaresubjecttochangewithoutpriornotice.

•ForthepowersupplyandPowerConsumption,refertothelabelattachedtotheproduct.

2-2Copyright©1995-2013SAMSUNG.Allrightsreserved.

2.3.SpecicationsAnalysis

ModelNameMX‐ ‐‐H630MX-F630/MX-F630B/MX-F630DB

Photo

OUTPUTPOWER2.0CH230W2.0CH220W

FRONTDISPLAYVFDVFD

DIMMEROO

2.ProductSpecication

CD/DVDCD

BluetoothOMX-F630B,MX-F630DBOnly

MP3OO

USBHOSTOO

CDRIPPINGOO

TAPEXX

AUDIOINOO

HEADPHONEXX

FM/RDSFM/AMFM/AM

REMOTEKEY45KEY45KEY

DUALVOLTAGEOO

SPKIMPENDANCE4OHM4OHM

TIP

O:FeatureIncluded

X:NotIncluded

CD

DVD:MX-F630DBOnly

Copyright©1995-2013SAMSUNG.Allrightsreserved.2-3

2.ProductSpecication

TUNER/AUX

CD/BLUETOOTH

AUTO
CHANGE

FOOTBALL

2.4.Accessories

2.4.1.SuppliedAccessories

AccessoriesItemItemcode

Batteries(AAA)4301-000116

RemoteControlAH59-02613B

User’sManualAH68-02677J

FM/AMAntenna

(Optional)

AH42-00036A

2-4Copyright©1995-2013SAMSUNG.Allrightsreserved.

3.DisassemblyandReassembly

3.DisassemblyandReassembly

3.1.MainDisassemblyandReassembly

CAUTION

•Becarefultofollowthedisassemblysequencedescribedinthemanual.Otherwise,theproductmaybedamaged.

•BesuretocarefullyreadandunderstandthesafetyinstructionsbeforeperforminganyworkastheICchipson

thePCBarevulnerabletostaticelectricity.

•Inordertoassemblereversetheorderofdisassembly .

DescriptionDescriptionPhoto

1.Unfasten4screwsonthe2sideCover.
:BH3*10BLACK

CAUTION

Becarefulnottomakeanyscratchesasyouremovethem.

Copyright©1995-2013SAMSUNG.Allrightsreserved.3-1

3.DisassemblyandReassembly

2.SeparatetheFrontpanel.

DescriptionDescriptionPhoto

3-2Copyright©1995-2013SAMSUNG.Allrightsreserved.

DescriptionDescriptionPhoto

3.Unfasten5screwsinSMPSanddetachAC-CORD&13Pshield
wire.
:BH3*10SILVER

3.DisassemblyandReassembly

4.UnfastenBTscrewsand2kittingscrewsanddetachDECKwire.
:BH3*10BLACK

Copyright©1995-2013SAMSUNG.Allrightsreserved.3-3