Samsung BD-F8900M, BD-F8900N, BD-F8909S, BD-F8500, BD-F8500A Service Manual

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Page 1

Blu-rayDiscPlayer

BD-F8500

Application Models

Application Area BAS, EN, XE, XN, XU, XY, ZF, ZG

BD-F8500 / BD-F8500A / BD-F8500M / BD-F8500N / BD-F8509S / BD-F8900 / BD-F8900A / BD-F8900M / BD-F8900N / BD-F8909S

MANUAL

SERVICE

Blu-RayDiscPlayer

1.Precautions

2.ProductSpecications

3.DisassemblyandReassembly

4.Troubleshooting

5.PCBDiagrams

6.SchematicDiagrams

Contents

RefertotheservicemanualintheGSPN(seetherearcover)formoreinformation.

Page 2

Contents

1.Precautions......................................................................................................................................1−1

1.1.SafetyPrecautions...................................................................................................................1−1

1.2.ServicingPrecautions...............................................................................................................1−3

1.2.1.GeneralServicingPrecautions.......................................................................................1−3

1.2.2.InsulationCheckingProcedure.......................................................................................1−3

1.3.ESDPrecautions......................................................................................................................1−4

1.4.Handlingtheopticalpick-up......................................................................................................1−5

2.ProductSpecications........................................................................................................................2−1

2.1.ProductSpecication................................................................................................................2−1

2.1.1.PlayerFeatures...........................................................................................................2−2

2.1.2.Blu-rayDiscFeatures...................................................................................................2−2

2.1.3.Disctypesandcontentsyourproductcanplay..................................................................2−3

2.1.4.Disctypesyourproductcannotplay................................................................................2−4

2.1.5.AvailableRecordingTimeforinternalHDD.....................................................................2−4

2.1.6.Regioncode...............................................................................................................2−5

2.1.7.LogosofDiscstheproductcanplay................................................................................2−5

2.1.8.SupportedFormats.......................................................................................................2−6

2.2.ChassisProductSpecication.....................................................................................................2−10

2.3.OptionProductSpecication......................................................................................................2−20

3.DisassemblyandReassembly..............................................................................................................3−1

3.1.CabinetandPCB.....................................................................................................................3−1

3.1.1.TopCabinetRemoval...................................................................................................3−1

3.1.2.Wi-FiModuleRemoval................................................................................................3−2

3.1.3.AssyDeckRemoval.....................................................................................................3−3

3.1.4.AssyS-HDDRemoval.................................................................................................3−4

3.1.5.S.M.P.SPCBRemoval.................................................................................................3−5

3.1.6.Fan&FrontPCBRemoval............................................................................................3−6

3.1.7.MainPCBRemoval.....................................................................................................3−7

3.2.PCBLocation.........................................................................................................................3−8

4.Troubleshooting................................................................................................................................4−1

4.1.Troubleshooting......................................................................................................................4−1

4.2.SoftwareUpdate......................................................................................................................4−13

4.2.1.UpdateNow...............................................................................................................4−13

4.2.2.AutoUpdate...............................................................................................................4−14

4.3.DeckAdjustment.....................................................................................................................4−15

5.PCBDiagrams..................................................................................................................................5−1

5.1.WiringDiagram.......................................................................................................................5−2

5.2.MainPCB..............................................................................................................................5−3

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Contents

5.3.FrontPCB..............................................................................................................................5−5

5.4.TouchPCB.............................................................................................................................5−6

6.SchematicDiagrams..........................................................................................................................6−1

6.1.AllBlockDiagram...................................................................................................................6−2

6.2.Power....................................................................................................................................6−3

6.2.1.AboutS.M.P .S(RingingChokeConverterMethod)............................................................6−3

6.2.2.Circuitdescripcotion[FL Y -BackRCC(RingingChokeConverter)]Control............................6−3

6.2.3.InternalBlockDiagram(InternalBlockDiagramofS.M.P .SCircuit)....................................6−5

6.3.S.M.P.S(S.M.P .SPCB).............................................................................................................6−6

6.4.PowerBlock(MainPCB)..........................................................................................................6−7

6.5.FrontEndSC75011(MainPCB)................................................................................................6−8

6.6.FrontEndSC75012(MainPCB)................................................................................................6−9

6.7.F_Micom(MainPCB).............................................................................................................6−10

6.8.HDMI_GPIO(MainPCB).........................................................................................................6−11

6.9.Ethernet_USB(MainPCB)........................................................................................................6−12

6.10.FOX-BMMCFlash(MainPCB)................................................................................................6−13

6.11.FOX-BDDR3(MainPCB)........................................................................................................6−14

6.12.FOX-BInterface(MainPCB)....................................................................................................6−15

6.13.SAT A_USB(MainPCB)...........................................................................................................6−16

6.14.TSD_Power(MainPCB)...........................................................................................................6−17

6.15.Tuner_LNB(MainPCB)...........................................................................................................6−18

6.16.2-CI(MainPCB).....................................................................................................................6−19

6.17.Front(FrontPCB)....................................................................................................................6−20

6.18.Touch(TouchPCB)..................................................................................................................6−21

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1.Precautions

1.1.SafetyPrecautions

1)Beforereturninganinstrumenttothecustomer,alwaysmakeasafetycheckoftheentireinstrument,including,butnot limitedto,thefollowingitems:

a)Besurethatnobuilt-inprotectivedevicesaredefectiveorhavebeendefeatedduringservicing

i)Protectiveshieldsareprovidedtoprotectboththetechnicianandthecustomer .Correctlyreplaceallmissing

protectiveshields,includinganyremovedforservicingconvenience.

ii)Whenreinstallingthechassisand/orotherassemblyinthecabinet,besuretoputbackinplaceallprotective

devices,including,butnotlimitedto,nonmetalliccontrolknobs,insulatingshpapers,adjustmentand compartmentcovers/shields,andisolationresistor/capacitornetworks.Donotoperatethisinstrumentorpermit ittobeoperatedwithoutallprotectivedevicescorrectlyinstalledandfunctioning.

b)Besurethattherearenocabinetopeningsthroughwhichadultsorchildrenmightbeabletoinserttheirngersand

contactahazardousvoltage.Suchopeningsinclude,butarenotlimitedto,excessivelywidecabinetventilation slots,andanimproperlyttedand/orincorrectlysecuredcabinetbackcover.

c)LeakageCurrentHotCheck—Withtheinstrumentcompletelyreassembled,plugtheAClinecorddirectlyintoa

230V(220V~240V)ACoutlet.(Donotuseanisolationtransformerduringthistest.)

UsealeakagecurrenttesterorameteringsystemthatcomplieswithAmericanNationalStandardInstitute(ANSI) C101.1LeakageCurrentforAppliancesandUnderwritersLaboratories(UL)1270(40.7).Withtheinstrument’s ACswitchrstintheONpositionandthenintheOFFposition,measurefromaknownearthground(metal waterpipe,conduit,etc.)toallexposedmetalpartsoftheinstrument(antennas,handlebrackets,metalcabinets, screwheads,metallicoverlays,controlshafts,etc.),especiallyanyexposedmetalpartsthatofferanelectrical returnpathtothechassis.

Anycurrentmeasuredmustnotexceed0.5mA.

Reversetheinstrumentpowercordplugintheoutletandrepeatthetest.See

Anymeasurementsnotwithinthelimitsspeciedhereinindicateapotentialshockhazardthatmustbeeliminated beforereturningtheinstrumenttothecustomer.

Figure1.1ACLeakageT est

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d)InsulationResistanceTestColdCheck—(1)Unplugthepowersupplycordandconnectajumperwirebetween

thetwoprongsoftheplug.(2)Turnonthepowerswitchoftheinstrument.(3)Measuretheresistancewith anohmmeterbetweenthejumperedACplugandallexposedmetalliccabinetpartsontheinstrument,suchas screwheads,antenna,controlshafts,handlebrackets,etc.Whenanexposedmetallicparthasareturnpathtothe chassis,thereadingshouldbebetween1and5.2megohm.Whenthereisnoreturnpathtothechassis,thereading mustbeinnite.Ifthereadingisnotwithinthelimitsspecied,thereisthepossibilityofashockhazard,andthe instrumentmustberepairedandrecheckedbeforeitisreturnedtothecustomer.See

1.Precautions

2)Readandcomplywithallcautionandsafetyrelatednotesonorinsidethecabinet,oronthechassis.

3)DesignAlterationWarning—Donotalteroraddtothemechanicalorelectricaldesignofthisinstrument.

Designalterationsandadditions,includingbutnotlimitedto,circuitmodicationsandtheadditionofitemssuchas auxiliaryaudiooutputconnections,mightalterthesafetycharacteristicsofthisinstrumentandcreateahazardtothe user.Anydesignalterationsoradditionswillmakeyou,theservicer,responsibleforpersonalinjuryorproperty damageresultingtherefrom.

4)Observeoriginalleaddress.Takeextracaretoassurecorrectleaddressinthefollowingareas:

(1)nearsharpedges,(2)nearthermallyhotparts(besurethatleadsandcomponentsdonottouchthermallyhotparts), (3)theACsupply,(4)highvoltage,and(5)antennawiring.Alwaysinspectinallareasforpinched,out-of-place,or frayedwiring,Donotchangespacingbetweenacomponentandtheprinted-circuitboard.ChecktheACpowercord fordamage.

5)Components,parts,and/orwiringthatappeartohaveoverheatedorthatareotherwisedamagedshouldbereplacedwith components,partsand/orwiringthatmeetoriginalspecications.

Additionally,determinethecauseofoverheatingand/ordamageand,ifnecessary,takecorrectiveactiontoremove anypotentialsafetyhazard.

6)ProductSafetyNotice—Someelectricalandmechanicalpartshavespecialsafety-relatedcharacteristicswhichare oftennotevidentfromvisualinspection,norcantheprotectiontheygivenecessarilybeobtainedbyreplacingthemwith componentsratedforhighervoltage,wattage,etc.Partsthathavespecialsafetycharacteristicsareidentiedbyshading, an(

)schematicsandpartslists.Useofasubstitutereplacementthatdoesnothavethesamesafetycharacteristics astherecommendedreplacementpartmightcreateshock,reand/orotherhazards.Productsafetyisunderreview continuouslyandnewinstructionsareissuedwheneverappropriate.

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1.Precautions

1.2.ServicingPrecautions

CAUTION

Beforeservicingunitscoveredbythisservicemanualanditssupplements,readandfollowtheSafetyPrecautions sectionofthismanual.

NOTE

Ifunforeseencircumstancescreateconictbetweenthefollowingservicingprecautionsandanyofthesafetyprecautions, alwaysfollowthesafetyprecautions.Remember:SafetyFirst.

1.2.1.GeneralServicingPrecautions

1)a.Alwaysunplugtheinstrument’sACpowercordfromtheACpowersourcebefore(1)removingorreinstallingany component,circuitboard,moduleoranyotherinstrumentassembly,(2)disconnectinganyinstrumentelectricalplugor otherelectricalconnection,(3)connectingatestsubstituteinparallelwithanelectrolyticcapacitorintheinstrument.

b.Donotdamageanyplug/socketB+voltageinterlockswithwhichinstrumentscoveredbythisservicemanual mightbeequipped.

c.DonotapplyACpowertothisinstrumentandoranyofitselectricalassembliesunlessallsolid-statedeviceheat sinksarecorrectlyinstalled.

d.Alwaysconnectatestinstrument’sgroundleadtotheinstrumentchassisgroundbeforeconnectingthetestinstrument positivelead.Alwaysremovethetestinstrumentgroundleadlast.

NOTE

RefertotheSafetyPrecautionssectiongroundleadlast.

2)Theserviceprecautionsareindicatedorprintedonthecabinet,chassisorcomponents.Whenservicing,followthe printedorindicatedserviceprecautionsandservicematerials.

3)Thecomponentsusedintheunithaveaspeciedameresistanceanddielectricstrength.Whenreplacingcomponents, usecomponentswhichhavethesame.Componentsidentiedbyshading,inthecircuitdiagramareimportantforsafety orforthecharacteristicsoftheunit.Alwaysreplacethemwiththeexactreplacementcomponents.

4)Aninsulationtubeortapeissometimesusedandsomecomponentsareraisedabovetheprintedwiringboardfor safety.Theinternalwiringissometimesclampedtopreventcontactwithheatingcomponents.Installsuchelements astheywere.

5)Afterservicing,alwayscheckthattheremovedscrews,components,andwiringhavebeeninstalledcorrectlyandthat theportionaroundtheservicedparthasnotbeendamagedandsoon.

Further,checktheinsulationbetweenthebladesoftheattachmentplugandaccessibleconductiveparts.

1.2.2.InsulationCheckingProcedure

DisconnecttheattachmentplugfromtheACoutletandturnthepowerON.Connecttheinsulationresistancemeter(500V) tothebladesoftheattachmentplug.Theinsulationresistancebetweeneachbladeoftheattachmentplugandaccessible conductiveparts(seenote)shouldbemorethan1Megohm.

NOTE

Accessibleconductivepartsincludemetalpanels,inputterminals,earphonejacks,etc.

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1.Precautions

1.3.ESDPrecautions

ElectrostaticallySensitiveDevices(ESD)

Somesemiconductor(solidstate)devicescanbedamagedeasilybystaticelectricity .

SuchcomponentscommonlyarecalledElectrostaticallySensitiveDevices(ESD).ExamplesoftypicalESDdevicesare integratedcircuitsandsomeeld-effecttransistorsandsemiconductorchipcomponents.Thefollowingtechniquesshould beusedtohelpreducetheincidenceofcomponentdamagecausedbystaticelectricity.

1)Immediatelybeforehandlinganysemiconductorcomponentorsemiconductor-equippedassembly,drainoffany electrostaticchargeonyourbodybytouchingaknownearthground.Alternatively,obtainandwearacommercially availabledischargingwriststrapdevice,whichshouldberemovedforpotentialshockreasonspriortoapplyingpower totheunitundertest.

2)AfterremovinganelectricalassemblyequippedwithESDdevices,placetheassemblyonaconductivesurfacesuchas aluminumfoil,topreventelectrostaticchargebuilduporexposureoftheassembly.

3)Useonlyagrounded-tipsolderingirontosolderorunsolderESDdevices.

4)Useonlyananti-staticsolderremovaldevices.Somesolderremovaldevicesnotclassiedas“anti-static”cangenerate electricalchargessufcienttodamageESDdevices.

5)Donotusefreon-propelledchemicals.ThesecangenerateelectricalchargessufcienttodamageESDdevices.

6)DonotremoveareplacementESDdevicefromitsprotectivepackageuntilimmediatelybeforeinstallingit.(Most replacementESDdevicesarepackagedwithleadselectricallyshortedtogetherbyconductivefoam,aluminumfoilor comparableconductivematerials).

7)ImmediatelybeforeremovingtheprotectivematerialsfromtheleadsofareplacementESDdevice,touchtheprotective materialtothechassisorcircuitassemblyintowhichthedevicewillbeinstalled.

CAUTION

Besurenopowerisappliedtothechassisorcircuit,andobserveallothersafetyprecautions.

8)MinimizebodymotionswhenhandlingunpackagedreplacementESDdevices.

(Otherwiseharmlessmotionssuchasthebrushingtogetherofyourclothesfabricortheliftingofyourfootfroma carpetedoorcangeneratestaticelectricitysufcienttodamageanESDdevice).

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1.Precautions

1.4.Handlingtheopticalpick-up

Thelaserdiodeintheopticalpickupmaysufferelectrostaticbreakdownbecauseofpotentialstaticelectricityfrom clothingandyourbody.

Thefollowingmethodisrecommended.

1)Placeaconductivesheetontheworkbench(Theblacksheetusedforwrappingrepairparts.)

2)Placethesetontheconductivesheetsothatthechassisisgroundedtothesheet.

3)Placeyourhandsontheconductivesheet(Thisgivesthemthesamegroundasthesheet.)

4)Removetheopticalpickupblock

5)Performworkontopoftheconductivesheet.Becarefultoletyourclothesoranyotherstaticsourcestouchtheunit.

NOTE

•Besuretoputonawriststrapgroundedtothesheet.

•Besuretolayaconductivesheet,thatisgroundedtothetable,madeofcopper.

Fig.1-3

6)ShorttheshortterminalonthePCB,whichisinsidethePick-UpASS’Y ,beforereplacingthePick-Up.(Theshort terminalisshortedwhenthePick-UpAss’yisbeingliftedormoved.)

7)AfterreplacingthePick-up,opentheshortterminalonthePCB.

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2.ProductSpecications

2.1.ProductSpecication

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2.ProductSpecications

2.1.1.PlayerFeatures

•SupportsaV arietyofDiscTypes

-Blu-ray(BD-ROM,BD-RE,BD-R),DVDVideo,DVD-RW/-R(Vmodeandnalizedonly)discsandAudioCD.

-CD-RW/CD-R,DVD-RW/-RandUSBstoragedevicecontentsuchasMP3,JPEGandDivXles.

•HDMI(HighDenitionMultimediaInterface)

HDMIreducespicturenoisebyallowingapuredigitalvideo/audiosignalpathfromtheplayertoyourTV .

2.1.2.Blu-rayDiscFeatures

Blu-rayDiscscanstore25GB(singlelayer)or50GB(duallayer)onasinglesideddisc-about5to10timesthecapacity ofaDVD.Blu-rayDiscsalsosupportthehighestqualityHDvideoavailableintheindustry(upto1920x1080at40 Mbit/sec)–Largecapacitymeansnocompromiseonvideoquality.Furthermore,aBlu-rayDischasthesamefamiliarsize andlookasDVD.

NOTE

ThefollowingBlu-rayDiscfeaturesarediscdependantandwillvary.

Appearanceandnavigationoffeatureswillalsovaryfromdisctodisc.

Notalldiscswillhavethefeaturesdescribedbelow .

•Videohighlights

TheBD-ROMformatformoviedistributionsupportsthreehighlyadvancedvideocodecs,includingA VC,VC-1, andMPEG-2.

HDvideoresolutionsarealsoavailable:

-1920x1080HD

-1280x720HD

•ForHigh-DenitionPlayback

Toviewhigh-denitioncontentsinBDdiscs,anHDTV(HighDenitionTelevision)isrequired.Somediscsmay requireusingtheplayer'sHDMIOUTtoviewhigh-Denitioncontent.Theabilitytoviewhigh-Denitioncontenton BDdiscsmaybelimiteddependingontheresolutionofyourTV.

•Graphicplanes

Twoindividual,fullHDresolution(1920x1080)videolayersareavailableontopoftheHDvideolayer.

Onelayerisassignedtovideo-relatedgraphics(likesubtitles),andtheotherlayerisassignedtointeractiveelements, suchasbuttonsormenus.V ariouswipes,fadesandscrolleffectsmaybeavailableonbothlayers.

•Menugraphics

Support256fullcolorresolutiongraphicsandanimation,therebygreatlysurpassingthecapabilitiesofDVDVideo. UnlikeDVD,Menuscanbeaccessedduringvideoplayback.

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2.ProductSpecications

•Menusounds

WhenyouhighlightorselectamenuoptiononaBlu-raydisc,soundscanbeheardsuchasbuttonclicksoravoice overexplainingthehighlightedmenuchoice.

•Multi-page/PopUpMenus

WithDVD-Video,playbackisinterruptedeachtimeanewmenuscreenisaccessed.DuetoBlu-rayDisc'sabilityto preloaddatafromthediscwithoutinterruptingplayback,amenumayconsistofseveralpages.

Youcanbrowsethroughthemenupagesorselectdifferentmenupaths,whiletheaudioandvideoremainplaying inthebackground.

•Interactivity

CertainBlu-rayDiscsmaycontainAnimatedmenusandTriviagames.

•UserBrowsableSlideshows

WithBlu-rayDiscs,youcanbrowsethroughvariousstillpictureswhiletheaudioremainsplaying.

•Subtitles

DependingonwhatiscontainedontheBlu-rayDisc,youmaybeabletoselectdifferentfontstyles,sizesandcolorsfor thesubtitles,Subtitlesmayalsobeanimated,scrolledorfadedinandout.

•BD-LIVE

YoucanuseaBlu-rayDiscsupportingBD-LIVEthroughnetworkconnectiontoenjoyvariouscontentsprovided bythediscmanufacturer.

2.1.3.Disctypesandcontentsyourproductcanplay

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2.ProductSpecications

NOTE

•TheproductmaynotplaycertainCD-RW/RandDVD-Rbecauseofthedisctypeorrecordingconditions.

•IfaDVD-RW/-RhasnotbeenrecordedproperlyinDVDvideoformat,itwillnotbeplayable.

•YourproductwillnotplaycontentthathasbeenrecordedonaDVD-Ratabit-ratethatexceeds10Mbps.

•YourproductwillnotplaycontentthathasbeenrecordedonaBD-RorUSBdeviceatabitratethatexceeds25Mbps.

2.1.4.Disctypesyourproductcannotplay

•HDDVD

•DVD-RAM

•DVD-RW(VRmode)

•3.9GBDVD-RforAuthoring.

•DVD-ROM/PD/MVDisc,etc

•SuperAudioCD(exceptCDlayer)

•CVD/CD-ROM/CDV/CD-G/CD-I/LD(CD-Gsplayaudioonly,notgraphics.)

NOTE

•TheproductmaynotplaycertainCD-RW/RandDVD±RW/±Rbecauseoftherecordingconditions.

•IfaDVD±RW/±RhasnotbeenrecordedproperlyinDVDvideoformat,itwillnotbeplayable.

•YourproductwillnotplaycontentthathasbeenrecordedonaDVD±RW/±Ratabit-ratethatexceeds10Mbps.

•YourproductwillnotplaycontentthathasbeenrecordedonaBD-RE/Ratabitratethatexceeds25Mbps.

•Playbackmaynotworkforsometypesofdiscs,orwhenyouusespecicoperations,suchasanglechangeandaspectratio adjustment.Informationaboutthediscsiswrittenindetailonthediscbox.Pleaserefertothisifnecessary.

•WhenyouplayaBD-Jtitle,loadingmaytakelongerthananormaltitleorsomefunctionsmayperformslowly .

2.1.5.AvailableRecordingTimeforinternalHDD

YoucanrecorddigitalbroadcastontheinternalHDDasbelow.Dependingontheactualbroadcast,availablerecordingtime maybedifferentwiththetableshownbelowInOnScreenDisplay,youcancheckavailablerecordingtimeasshownin "high"caseinthetableshownbelow.

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2.ProductSpecications

NOTE

•Sincetheproduct'sTimeshiftandotherimplementedfunctionsrequireacertainamountofHDDspaceallocatedinternally,

thetotalsizeshowninthe"StorageDeviceManager"ofSettingsmenumaydifferfromtheHDD'scapacityshownin themanual.

2.1.6.Regioncode

Boththeproductandthediscsarecodedbyregion.Theseregionalcodesmustmatchinordertoplaythedisc.Ifthecodes donotmatch,thediscwillnotplay.TheRegionNumberforthisproductisdescribedontherearpaneloftheproduct.

2.1.7.LogosofDiscstheproductcanplay

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2.ProductSpecications

2.1.8.SupportedFormats

VideoFileSupport

•Limitations

-Evenwhentheleisencodedbyasupportedcodeclistedabove,alemightnotbeplayedifitscontenthas

aproblem.

-Normalplaybackisnotguaranteedifthele’scontainerinformationiswrongortheleitselfiscorrupted.

-FileshavinghigherBitrate/frameratethanstandardmaystutterwhenplayedback.

-Seek(skip)functionisnotavailableifthele’sindextableisdamaged.

-Whenyouplaybackaleremotelythroughanetworkconnection,videoplaybackmaystutterdependingon

thenetworkspeed.

-SomeUSB/Digitalcameradevicesmaynotbecompatiblewiththeplayer.

•Videodecoder

-SupportsuptoH.264Level4.1

-DoesnotsupportH.264FMO/ASO/RS,VC1SP/MP/APL4.

-CODECsexceptforMVC,VP8,VP6

1)Below1280x720:60framesmax.

2)Above1280x720:30framesmax.

3)DoesnotsupportGMC2orhigher.

-SupportsSV AFTop/Bottom,SidebySide.

-SupportsBDMVCSpec.

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•Audiodecoder

-SupportsWMA10PRO(Upto5.1).

-DoesnotsupportWMAlosslessaudio.

-DoesnotsupportQCELP/AMRNB/WB.

-Supportsvorbis(Upto2ch),Supportscodeconlyinwebmcontainer.

-SupportedADPCMIMA,MS.(MULA W ,ALA Warenotsupported)

NOTE

•PlaybackofsomeMKVorMP4lemaynotbesupporteddependingontheirvideoresolutionandframerate.

SupportedSubtitleFileFormats

2.ProductSpecications

MusicFileSupport

PictureFileSupport

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2.ProductSpecications

NotesontheUSBconnection

•YourproductsupportsUSBstoragemedia,MP3products,digitalcameras,andUSBcardreaders.

•SomeUSB/digitalcameradevicesmaynotbecompatiblewiththeproduct.

•YourproductsupportstheFA T16,FA T32,andNTFSlessystems(readonly).

•ConnectUSBdevicesdirectlytotheproduct’sUSBport.ConnectingthroughaUSBcablemaycausecompatibility

problems.

•Insertingmorethanonememorydeviceintoamulti-cardreadermaycausethereadertooperateimproperly .

•TheproductsupportsthePTPprotocol.

•DonotdisconnectaUSBdeviceduringa"loading"process.

•Thebiggertheimageresolution,thelongertheimagetakestodisplay.

•ThisproductcannotplayMP3leswithDRM(DigitalRightsManagement)downloadedfromcommercialsites.

•Yourproductonlysupportsvideothatisunder30fps(framerate).

•YourproductonlysupportsUSBMassStorageClass(MSC)devicessuchasthumbdrives,ashcardreadersandUSB

HDD.(HUBisnotsupported.)

•CertainUSBHDDDevices,multi-cardreadersandthumbdrivesmaynotbecompatiblewiththisproduct.

•IfsomeUSBdevicesrequireexcessivepower,theymaybelimitedbythecircuitsafetydevice.

•IfplaybackfromaUSBHDDisunstable,provideadditionalpowerbypluggingtheHDDintoawallsocket.Ifthe

problemcontinues,contacttheUSBHDDmanufacturer.

•YoumustremovetheUSBstoragedevicesafely(byperformingthe"SafelyRemoveUSB"functiontopreventpossible

damagetotheUSBmemory).

•SAMSUNGisnotresponsibleforanydataledamageordataloss.

•Yourproductdoesnotsupportcompressionle,sparseleandencrptionleofNTFS.

-BeforedisconnectingaUSBdevice,pleaseuseUSBSafetyRemoval.

-Ifyoudon'tuseUSBSafetyRemoval,yourdataonUSBdevicecanbecorruptedorlost

-YoucanrepairorformataUSBdeviceonyourDesktopPC.(MS-WindowsOSonly)

ConnectaUSBdevicebeforeusingtheTimeshiftandRecordedTVfunctions

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2.ProductSpecications

•TousetheTimeshiftmodeortheRecordedTVfunction,aconnectedUSBdevicemustbeexecutetheDeviceFormat

functiontoproperformforrecording.

-Duringthedeviceformatting,donotdisconnectthedevicewhileformattingisinprogress.Ifyouformatthe

device,allleswillbedeleted.

-Beforeformattingyourdevicetothisproduct,pleasebackupyourlestopreventthemfromdamageorlossof

data.SAMSUNGisnotresponsibleforanydataledamageordataloss.

•RecordedvideosareDRM(digitalrightsmanagements)protectedandcannotbeplayedonaPCorotherproduct.Note

thatlessavedontheTVcannotbeusedafterthemainboardischanged.

•Atleast100MBoffreespaceisrequiredforrecording.

•Recordingwillstopifthestorage'sfreespacebecomeslessthan50MB.

•IftheUSBdevicehasfailedtheDevicePerformanceTest,theUSBdevicemustgothroughtheDeviceFormatand

DevicePerformanceTestagainbeforeyourecordwiththeGuideorChannelManager.Ifthedevicehasfailedthe PerformanceTest,Itcannotbeusedforrecording.

A VCHD(AdvancedVideoCodecHighDenition)

•ThisproductcanplaybackA VCHDformatdiscs.Thesediscsarenormallyrecordedandusedincamcorders.

•TheA VCHDformatisahighdenitiondigitalvideocameraformat.

•TheMPEG-4A VC/H.264formatcompressesimageswithgreaterefciencythantheconventionalimagecompressing

format.

•SomeA VCHDdiscsusethe"x.v.Color"format.ThisproductcanplaybackA VCHDdiscsthatuse"x.v .Color"format.

•"x.v.Color"isatrademarkofSonyCorporation.

•"A VCHD"andtheA VCHDlogoaretrademarksofMatsushitaElectronicIndustrialCo.,Ltd.andSonyCorporation.

NOTE

•SomeA VCHDformatdiscsmaynotplay,dependingontherecordingcondition.A VCHDformatdiscsneedtobenalized.

•"x.v.Colour"offersawidercolourrangethannormalDVDcamcorderdiscs.

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2.ProductSpecications

2.2.ChassisProductSpecication

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2.ProductSpecications

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2.ProductSpecications

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2.ProductSpecications

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2.ProductSpecications

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2.ProductSpecications

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2.ProductSpecications

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2.ProductSpecications

Page 26

2.ProductSpecications

Page 27

2.ProductSpecications

Page 28

2.ProductSpecications

2.3.OptionProductSpecication

Page 29

3.DisassemblyandReassembly

3.1.CabinetandPCB

NOTE

ConnectorMustberemovedwithcare

3.DisassemblyandReassembly

3.1.1.TopCabinetRemoval

Page 30

3.DisassemblyandReassembly

3.1.2.Wi-FiModuleRemoval

Page 31

3.1.3.AssyDeckRemoval

3.DisassemblyandReassembly

Page 32

3.DisassemblyandReassembly

3.1.4.AssyS-HDDRemoval

Page 33

3.1.5.S.M.P .SPCBRemoval

3.DisassemblyandReassembly

Page 34

3.DisassemblyandReassembly

3.1.6.Fan&FrontPCBRemoval

Page 35

3.1.7.MainPCBRemoval

3.DisassemblyandReassembly

Page 36

3.DisassemblyandReassembly

3.2.PCBLocation

Page 37

4.Troubleshooting

4.1.Troubleshooting

Page 38

4.Troubleshooting

Page 39

4.Troubleshooting

Page 40

4.Troubleshooting

Page 41

4.Troubleshooting

Page 42

4.Troubleshooting

Page 43

4.Troubleshooting

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4.Troubleshooting

Page 45

4.Troubleshooting

Page 46

4.Troubleshooting

Page 47

4.Troubleshooting

Page 48

4.Troubleshooting

Page 49

4.2.SoftwareUpdate

TheSoftwareUpdatemenuallowsyoutoupgradetheplayer'ssoftwareforperformanceimprovementsoradditional services.theupdateprocess.

4.Troubleshooting

1)IntheHomescreen,selecttheSettings,andthenpressthe

2)SelectSupport,andthenpressthebutton.

3)SelectSoftwareUpdate,andthenpressthe

4)T odownloadupdatesoftwareandupdatenow,selectUpdateNow,andthenpressthe onthispagefordetails.

5)T olettheproductdownloadupdatesoftwareautomaticallywhenavailable,selectAutoUpdate,andthenpressthe button.

NOTE

•Theupgradeiscompletewhentheplayerturnsoff,andthenturnsonagainbyitself.

•SamsungElectronicsshalltakesnolegalresponsibilityforplayermalfunctioncausedbyanunstableInternetconnectionor consumernegligenceduringasoftwareUpdate.

•Whenasystemupgradeisinprogress,"UPDA TE"isdisplayedonthefrontpanel.

button.

button.SeeUpdateNow

4.2.1.UpdateNow

YoucanuseUpdateNowtoupdatethesoftwarethroughyournetworkconnectionorbyusingaUSBashdrive.The networkinstructionsarebelow.TheUSBashdriveinstructionsareonthenextpage.

1)SelectUpdateNow ,andthenpressthe

2)Theproductsearchesonlineforthelatestsoftwareversion.

3)Ifitdoesnotndanupdate,the"Nonewupdates"pop-upappears.Pressthe

4)Ifitndsanewversion,theUpdateRequestpop-upappears.

5)SelectOK.Theproductupgradesthesoftware,turnsoff,andthenturnsonautomatically.

6)IfyoudonotselectOKorCancelinoneminute,theproductstoresthenewupgradesoftware.Y oucanupgradethe softwarelaterusingAutoUpdate.

7)IfyouselectCancel,theproductcancelstheupgrade.

NOTE

•Whenthesystemupgradeisdone,checkthesoftwaredetailsintheProductInformationsectionoftheContactSamsung screen.

•DonotturnofftheplayerduringtheSoftwareUpdate.Itmaycausetheplayertomalfunction..

button.TheUpdatenowpop-upappears.

buttontoexit.

Page 50

4.Troubleshooting

4.2.2.AutoUpdate

YoucansettheAutoUpdatefunctionsothattheplayerdownloadsnewupgradesoftwarewhenitisinAutoUpdate mode.InAutoUpdatemode,theplayerisoff,butitsInternetconnectionisactive.Thisallowstheplayertodownload upgradesoftwareautomatically ,whenyouarenotusingit.

1)Pressthe

buttonstoselectAutoUpdateMode,andthenpressthebutton.

2)SelectOnorOff.IfyouselectOn,theplayerwillautomaticallydownloadnewupgradesoftwarewhenitisinAuto Updatemodewiththepoweroff.Ifitdownloadsnewupgradesoftware,theplayerwillaskyouifyouwanttoinstall itwhenyouturntheplayeron.

NOTE

•TousetheAutoUpdateModeUpgradefunction,yourplayermustbeconnectedtotheInternet.

•ByUSB

1)V isitwww.samsung.com.

2)ClickSUPPORTonthetoprightofthepage.

3)Entertheproduct'smodelnumberintothesearcheld.Asyouenterthemodelnumber,adropdownwilldisplay productsthatmatchthemodelnumber.

4)Leftclickyourproduct'smodelnumberinthedropdownlist.

5)Onthepagethatappears,scrolldowntoandthenclickFirmwareManuals&Downloads.

6)ClickFirmwareinthecentreofthepage.

7)ClicktheZIPbuttonintheFilecolumnontherightsideofthepage.

8)ClickSendintherstpop-upthatappears.ClickOKinthesecondpop-uptodownloadandsavethermwarele toyourPC.

9)Unziptheziparchivetoyourcomputer.Youshouldhaveasinglefolderwiththesamenameastheziple.

10)CopythefoldertoaUSBashdrive.

11)Makesurenodiscisinsertedintheproduct,andtheninserttheUSBashdriveintotheUSBportoftheproduct.

12)Intheproduct'smenu,gotoSettings>Support>SoftwareUpdate.

13)SelectUpdateNow.

14)TheproductsearchesforthesoftwareontheUSBdrive.Whenitndsthesoftware,theUpdateRequestpop-upappears.

15)SelectOK.Theproduct

NOTE

•ThereshouldbenodiscintheplayerwhenyouupgradethesoftwareusingtheUSBjack.

•Whenthesystemupgradeisdone,checkthesoftwaredetailsintheProductInformationsectionoftheContactSamsung screen.

•DonotturnofftheplayerduringthesoftwareUpdate.Itmaycausetheplayertomalfunction.

•SoftwareUpdatesusingtheUSBjackmustbeperformedwithaUSBashmemorystickonly.

Page 51

4.3.DeckAdjustment

•DeckAdjustment

-YouhavetocompleteaDeckAdjustmentafteryoureplacetheMainPCBAss'yorDeckAss'y

•DeckReplacement

-WewillnotprovidetheP/Uass'yfor2013Blu-rayrepair,wewillinsteadsupplythefullDeckass'yforallLoader issues.

•LatestFirmware

-Itisrecommendedthatyouupdatethelatestrmwaretokeepupwiththemostrecentdisccompatibility .

DeckAdjustment

•When

-YouhavetocompleteaDeckAdjustmentwheneverafteryoureplacetheMainPCBAss'yorDeckAss'y

•Method

-Step1:Puttheplayerin'NoDisc'status.

-Step2:PuttheHOMEkey.CalltheHOMEmenu

-Step3:Press'2','3','5','8','7','8'ontheremotecontroller

-Step4:V erifythepictureonthescreen.

-Step5:InsertaBlu-rayDisc

->TrayTypePlayer(F8500,F6900):traywillbeopenedautomatically.

->YoucanuseoneofeithersinglelayeredBlu-rayDiscorduallayeredBlu-rayDisc.

->Youdon'tneedtoplayDVD.

-Step6:Ejectthediscafteryouverifyplayback.

-Step7:Press'2','3','5','8','7','9'ontheremotecontroller.

-Step8:MakesuretheresultsareOK,ifnotthenrepeattheprocess.

4.Troubleshooting

Step1

Step3

Page 52

4.Troubleshooting

Step4

Step7

HDDReplacement(onlyforBD-F8500)

•When

-WhenyouchangeHDDdevice,youhavetoformatHDD.

•Method

-Step1:Copy'HDD_FORMA T_FLAG','musicMetaDB.db'letoUSB.

-Step2:ConnecttheUSBtoplayer .

-Step3:IntheMenuscreen,put“54831”inorderonremocon.

-Step4:Inscreen“HDDFormat”characterwillbeappeared,andthenplayerwillberebooted.

-Step5:AfterSetreboots,intheMenuscreenput“54832”inorderonremoconmaintainingaconnectionwithUSB.

-Step6:OntheVFD“DBCOPY”characterwillbeappeared,andthenplayerwillbeoff.

Factoryreset

Page 53

•When

-Whenyouwantresetdevice.

•Method

-Step1:EjectBDorDVDdisc.

-Step2:Callthehomemenu.

-Step3:Press'Stop'buttononthetouchpanelduring5seconds.-Step4:HoldofftheStopbutton.Devicewill beturnedoff.

4.Troubleshooting

Page 54

5.PCBDiagrams

Page 55

5.1.WiringDiagram

5.PCBDiagrams

Page 56

5.PCBDiagrams

5.2.MainPCB

Page 57

5.PCBDiagrams

Page 58

5.PCBDiagrams

5.3.FrontPCB

Page 59

5.4.TouchPCB

5.PCBDiagrams

Page 60

6.SchematicDiagrams

NOTE

•ForschematicDiagram

-Resistorsareinohms,1/8Wunlessotherwisenoted.

NOTE

Donotusethepartnumbershownonthisdrawingforordering.Thecorrectpartnumberisshowninthepartslist(maybeslightlydifferentoramendedsincethisdrawingwasprepared).

CAUTION

Mostsemiconductordevicesareelectrostaticallysensitiveandthereforerequirethespecialhandlingtechniquesdescribedunderthe“electrostaticallysensitive(ES)devices”sectionofthisservicemanual.

WARNING

Componentsidentiedwiththemarkhavethespecialcharacteristicsforsafety.Whenreplacinganyofthesecomponents.Useonlythesametype.

Page 61

6.1.AllBlockDiagram

6.SchematicDiagrams

Page 62

6.SchematicDiagrams

6.2.Power

6.2.1.AboutS.M.P .S(RingingChokeConverterMethod)

Terms

1)1st:Commonpowerinputto1stwinding.

2)2nd:Circuitfollowingsoutputwindingoftransformer.

3)f(Frequency):Switchingfrequency(T:Switchingcycle)

4)Duty:(Ton/T)x100

6.2.2.Circuitdescripcotion[FL Y-BackRCC(RingingChokeConverter)]Control

1)ACPowerRectication/SmoothingT erminal

a)BD01~04:ConvertACpowertoDC(W averectication).

b)C1S05B:SmooththevoltageconvertedtoDC.

c)L1S01,C1S03,C1S04:Noiseremovalatpowerinput/output.

d)R1S02:Rushcurrentlimitresistanceatthemomentofpowercordinsertion.

WithoutP1S02,thebridgediodemightbedamagedastherushcurrentincreases.

2)SNUBBERCircuit:D1S10,C1S10,R1S10

a)Preventresidualhighvoltageattheterminalsofswitchduringswitchoff/Suppressnoise.Highinvertedpoweroccursatswitchoff,becauseofthe1stwindingoftransformer:(V=-L1xdi/dt.L1:LeakageInduction)Averyhighresidualvoltageexistonboth

terminalsofIC1becausedtisaveryshort.

b)SNUBBERcircuitprotectsIC1fromdamagethroughleakagevoltagesuppressionbyRC,(ChargestheleakagevoltagetoDIS10andCIS10anddischargestoR1S10).

Page 63

3)IC1S01Vcccircuit

a)ICIS01,RIS05,RIS07,RIS08:ICIS01drivingresistance(ICIS01worksthroughdrivingresistanceatpowercordin)

b)ICIS01Vcc:RIS05,RIS07,RIS08

i)UsetheoutputoftransformerasVcc,becausethecurrentstartstoowintotransformerwhileICIS01isactive

ii)RectifytoDIS07andsmoothtoCIS09.

iii)UsetheoutputoftransformerasICIS01Vcc:TheloadsaredifferentbeforeandafterICIS01driving.(VccofICIS01decreasesbelowOFFvoltage,usingonlytheresistanceduttolodeincreaseafterICIS01driving.)

6.SchematicDiagrams

4)FeedbackControlCircuit

a)F/BTerminalofIC1determinesoutputdutycycle.

b)C-E(Collector-Emitter)ofandF/BpotentialofPQIZ1aresame.

Page 64

6.SchematicDiagrams

6.2.3.InternalBlockDiagram(InternalBlockDiagramofS.M.P .SCircuit)

Page 65

6.3.S.M.P .S(S.M.P .SPCB)

6.SchematicDiagrams

Page 66

6.SchematicDiagrams

6.4.PowerBlock(MainPCB)

Page 67

6.5.FrontEndSC75011(MainPCB)

6.SchematicDiagrams

Page 68

6.SchematicDiagrams

6.6.FrontEndSC75012(MainPCB)

Page 69

6.7.F_Micom(MainPCB)

6.SchematicDiagrams

Page 70

6.SchematicDiagrams

6.8.HDMI_GPIO(MainPCB)

Page 71

6.9.Ethernet_USB(MainPCB)

6.SchematicDiagrams

Page 72

6.SchematicDiagrams

6.10.FOX-BMMCFlash(MainPCB)

Page 73

6.11.FOX-BDDR3(MainPCB)

6.SchematicDiagrams

Page 74

6.SchematicDiagrams

6.12.FOX-BInterface(MainPCB)

Page 75

6.13.SATA_USB(MainPCB)

6.SchematicDiagrams

Page 76

6.SchematicDiagrams

6.14.TSD_Power(MainPCB)

Page 77

6.15.Tuner_LNB(MainPCB)

6.SchematicDiagrams

Page 78

6.SchematicDiagrams

6.16.2-CI(MainPCB)

Page 79

6.17.Front(FrontPCB)

6.SchematicDiagrams

Page 80

6.SchematicDiagrams

6.18.Touch(TouchPCB)

Page 81

GSPN(GLOBALSERVICEPARTNERNETWORK)

Area

Europe,MENA, CIS,Africa

E.Asia,W.Asia, China,Japan

N.America,S.Americahttps://gspn3.samsungcsportal.com

ThisServiceManualisapropertyofSamsungElectronics Co.,Ltd. AnyunauthorizeduseofManualcanbepunishedunder applicableInternationaland/ordomesticlaw.

WebSite

https://gspn1.samsungcsportal.com

https://gspn2.samsungcsportal.com

Samsung BD-F8900M, BD-F8900N, BD-F8909S, BD-F8500, BD-F8500A Service Manual

Specifications and Main Features

Frequently Asked Questions

User Manual

Blu-rayDiscPlayer

1.Precautions

1.1.SafetyPrecautions

1.2.ServicingPrecautions

1.2.1.GeneralServicingPrecautions

1.2.2.InsulationCheckingProcedure

1.3.ESDPrecautions

1.4.Handlingtheopticalpick-up

2.1.1.PlayerFeatures

2.1.2.Blu-rayDiscFeatures

2.1.3.Disctypesandcontentsyourproductcanplay

2.1.4.Disctypesyourproductcannotplay

2.1.5.AvailableRecordingTimeforinternalHDD

2.1.6.Regioncode

2.1.7.LogosofDiscstheproductcanplay

2.1.8.SupportedFormats

3.DisassemblyandReassembly

3.1.CabinetandPCB

3.1.1.TopCabinetRemoval

3.1.2.Wi-FiModuleRemoval

3.1.3.AssyDeckRemoval

3.1.4.AssyS-HDDRemoval

3.1.5.S.M.P .SPCBRemoval

3.1.6.Fan&FrontPCBRemoval

3.1.7.MainPCBRemoval

3.2.PCBLocation

4.Troubleshooting

4.1.Troubleshooting

4.2.SoftwareUpdate

4.2.1.UpdateNow

4.2.2.AutoUpdate

4.3.DeckAdjustment

5.PCBDiagrams

5.1.WiringDiagram

5.2.MainPCB

5.3.FrontPCB

5.4.TouchPCB

6.SchematicDiagrams

6.1.AllBlockDiagram

6.2.Power

6.2.1.AboutS.M.P .S(RingingChokeConverterMethod)

6.3.S.M.P .S(S.M.P .SPCB)

6.4.PowerBlock(MainPCB)

6.5.FrontEndSC75011(MainPCB)

6.6.FrontEndSC75012(MainPCB)

6.7.F_Micom(MainPCB)

6.8.HDMI_GPIO(MainPCB)

6.9.Ethernet_USB(MainPCB)

6.10.FOX-BMMCFlash(MainPCB)

6.11.FOX-BDDR3(MainPCB)

6.12.FOX-BInterface(MainPCB)

6.13.SATA_USB(MainPCB)

6.14.TSD_Power(MainPCB)

6.15.Tuner_LNB(MainPCB)

6.16.2-CI(MainPCB)

6.17.Front(FrontPCB)

6.18.Touch(TouchPCB)