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MO300QBM
Users Manual
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SAGEMCOM BROANDS MO300QBM Users Manual

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Direction des Recherches et des Développements Etablissement de VELIZY
VELIZY R&D Center
TITRE / TITLE :
MO300 series module Application Note
RESUME / SUMMARY
This document is the application note for the MO300 series modules.
Note d’étude / Technical document : URD1 – 5625.1 – 006 / 69796 Edition 03
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Direction des Recherches et des Développements Etablissement de VELIZY
VELIZY R&D Center
FICHE RECAPITULATIVE / SUMMARY SHEET
Ed Date
Date
1 24/08/2007 Création du document
2 24/10/2007 Mise à jour / Major
3 13/10/2008 FCC Updates 4 5 6
Observations
Comments
/ Document creation
update
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Direction des Recherches et des Développements Etablissement de VELIZY
VELIZY R&D Center
MO300 M2M MODULE
APPLICATION NOTE
Note d’étude / Technical document : URD1 – 5625.1 – 006 / 69796 Edition 03
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Direction des Recherches et des Développements Etablissement de VELIZY
VELIZY R&D Center
SOMMAIRE / CONTENTS
OVERVIEW ...................................................................................................................................................................6
1
1.1 OBJECT OF THE DOCUMENT .......................................................................................................................................6
1.2 REFERENCE DOCUMENTS ...........................................................................................................................................6
1.3 MODIFICATION OF THIS DOCUMENT...........................................................................................................................6
1.4 FCC COMPLIANCE.....................................................................................................................................................6
2 BLOCK DIAGRAM.......................................................................................................................................................7
3 FUNCTIONAL INTEGRATION .................................................................................................................................8
3.1 HOW TO CONNECT A SIM CARD ?: .............................................................................................................................8
3.1.1 SIM on the Board to Board Connector............................................................................................................. 9
3.1.1.1 Without SIM card detection ......................................................................................................................................... 10
3.1.1.2 With SIM card detection .............................................................................................................................................. 11
3.1.2 SIM holder soldered on the back of the MO300.............................................................................................12
3.1.2.1 Schematics.................................................................................................................................................................... 12
3.1.2.2 Placing.......................................................................................................................................................................... 13
3.2 HOW TO CONNECT THE AUDIOS? .........................................................................................................................14
3.2.1 Using a differential Handset mode on the main audio path...........................................................................14
3.2.1.1 Notes for microphone ................................................................................................................................................... 15
3.2.1.2 Notes for speaker.......................................................................................................................................................... 15
3.2.2 Non differential audio handset .......................................................................................................................16
3.2.3 Using a mono Headset mode on the secondary audio path............................................................................17
3.2.4 Audio interface selection ................................................................................................................................17
3.2.5 Multi Channel Serial Interface ....................................................................................................................... 17
3.2.6 Characteristics of the microphone and speaker recommended by SAGEM ...................................................18
3.2.6.1 Characteristics of the microphone recommended by SAGEM ..................................................................................... 18
3.2.6.2 Characteristics of the dual mode speaker recommended by SAGEM .......................................................................... 18
3.3 NETWORK LEDS .....................................................................................................................................................18
3.3.1 Network LEDs connection. .............................................................................................................................19
3.3.2 Network LEDs behaviour. ..............................................................................................................................19
3.4 POWER SUPPLY ........................................................................................................................................................20
3.5 V24 UART .............................................................................................................................................................20
3.5.1 Complete V24 – connection MO300 - host..................................................................................................... 20
3.5.2 Complete V24 interface with PC ....................................................................................................................20
3.5.3 Partial V24 ( RX-TX-RTS-CTS) – connection MO300 - host .........................................................................21
3.5.4 Partial V24 ( RX-TX) – connection MO300 - host .........................................................................................22
3.6 UART 2 ..................................................................................................................................................................22
3.7 USB 2.0 OTG .........................................................................................................................................................22
3.8 BACKUP BATTERY ...................................................................................................................................................23
3.8.1 Backup battery function feature......................................................................................................................23
3.8.2 Current consumption on the backup battery ..................................................................................................24
3.8.2.1 Charge by internal MO300 charging function .............................................................................................................. 24
3.8.3 Backup Battery technology recommended......................................................................................................25
3.8.3.1 Manganese Silicon Lithium-Ion rechargeable Battery .................................................................................................25
3.8.3.2 Capacitor Battery.......................................................................................................................................................... 25
3.9 GENERAL PURPOSE INPUT OUTPUT .........................................................................................................................25
3.10 TEMPERATURE SENSOR............................................................................................................................................25
3.11 ADC........................................................................................................................................................................26
3.12 MICRO-WIRE BUS ....................................................................................................................................................26
3.13 ANTENNA DETECTION..............................................................................................................................................26
3.14 HARDWARE POWER MANAGEMENT AND MULTIPLEXING INTERFACES .....................................................................27
3.15 RESETTING THE MODULE .........................................................................................................................................27
3.16 STARTING THE MODULE...........................................................................................................................................27
3.16.1 Use of PWON*................................................................................................................................................27
3.16.2 Case of USB Plugged .....................................................................................................................................28
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3.17 STOPPING THE MODULE ...........................................................................................................................................28
3.17.1 Case of UART Interface..................................................................................................................................28
3.17.2 Case of USB Interface ....................................................................................................................................29
3.18 SLEEP MODE MANAGEMENT.....................................................................................................................................29
3.18.1 First mode....................................................................................................................................................... 29
3.18.2 Second mode...................................................................................................................................................29
3.18.3 Third mode......................................................................................................................................................29
3.18.4 USB connectivity impact on sleep mode.........................................................................................................29
4 MANDATORY POINTS FOR THE FINAL TESTS AND TUNING .....................................................................30
5 ESD & EMC RECOMMENDATIONS......................................................................................................................31
5.1 STANDARD REQUIREMENTS FOR ESD......................................................................................................................31
5.1.1 ESD Analysis ..................................................................................................................................................31
5.1.2 Recommendations to avoid ESD issues .......................................................................................................... 31
5.2 ESD FEATURES........................................................................................................................................................ 32
5.3 EMC RECOMMENDATIONS ...................................................................................................................................... 32
6 RECOMMENDED COMPONENTS .........................................................................................................................33
7 RADIO INTEGRATION.............................................................................................................................................34
7.1 ANTENNA CONNECTION...........................................................................................................................................35
7.1.1 Mini Coaxial connector .................................................................................................................................. 35
7.1.2 Spring contacts ...............................................................................................................................................35
7.2 GROUND LINK AREA ................................................................................................................................................35
7.3 LAYOUT .................................................................................................................................................................. 36
7.4 MECHANICAL SURROUNDING ..................................................................................................................................36
7.5 OTHER RECOMMENDATIONS – TESTS FOR PRODUCTION/DESIGN.............................................................................. 36
7.6 FCC RF COMPLIANCE ............................................................................................................................................. 36
8 AUDIO INTEGRATION.............................................................................................................................................37
8.1 MECHANICAL INTEGRATION AND ACOUSTICS .........................................................................................................37
8.2 ELECTRONICS AND LAYOUT..................................................................................................................................... 37
9 RECOMMENDATIONS ON LAYOUT OF THE MAIN BOARD.........................................................................38
9.1 GENERAL RECOMMENDATIONS ON LAYOUT.............................................................................................................38
9.1.1 Ground............................................................................................................................................................38
9.1.2 Power supplies................................................................................................................................................38
9.1.3 Clocks .............................................................................................................................................................38
9.1.4 Data bus and other signals.............................................................................................................................38
9.1.5 Radio...............................................................................................................................................................38
9.1.6 Audio...............................................................................................................................................................38
9.2 EXAMPLE OF LAYOUT FOR MAIN BOARD ..................................................................................................................39
10 MECHANICAL INTEGRATION .......................................................................................................................... 40
10.1 EXTERNAL CONNECTIONS PRESENTATION ...............................................................................................................40
10.2 CONNECTION CONSTRAINTS ....................................................................................................................................40
10.2.1 Board to board connection.............................................................................................................................40
10.2.2 Antenna connection ........................................................................................................................................41
10.3 WARNING RELATED TO THE USE OF METALLIC HOUSINGS........................................................................................ 41
11 SUMMARY OF INTEGRATION ..........................................................................................................................42
11.1 ANNEXE: MOLEX BOARD TO BOARD CONNECTOR...................................................................................................42
11.2 ANNEXE: HIROSE COAXIAL CONNECTOR .................................................................................................................44
11.3 ANNEXE: SPRING CONTACT FOR ANTENNA ..............................................................................................................45
12 LABEL.......................................................................................................................................................................46
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1 Overview
1.1 Object of the document
The aim of this document is to describe some examples of hardware solutions for developing some products around the SAGEM MO300 M2M Module. Most part of these solutions are not mandatory. Use them as suggestions of what should be done to have a working product and what should be avoided thanks to our experiences. This document suggests how to integrate the MO300 M2M module in wireless communicating devices such as GSM Gateway, POS, EDGE/GPS Tracking system, Wireless modem : connection with external devices, layout advises, external components (decoupling capacitors…).
1.2 Reference documents
[ 1 ] URD1 – 5625.1 – 004 69772 - MO300 series modules specification [ 2 ] URD1 - 5625.1 - 014 69979 - AT Command Set for SAGEM Modules
1.3 Modification of this document
The information presented in this document is supposed to be accurate and reliable. SAGEM assumes no responsibility for its use, nor any infringement of patents or other rights of third parties which may result from its use. This document is subject to change without notice.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment.
1.4 FCC Compliance
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
1. this device may not cause harmful interference, and
2. this device must accept any interference received; including interference that may cause undesired operation.
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2 Block diagram
t
(
y
)
p
GSM850 / GSM900 / DCS1800 / PCS1900
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MO300
EDGE QUAD-BANDS
PWON* signal
Hardware
Power
Managemen
U.S.B. 2.0 O.T.G.
DEVICE
External Analog Input
1.8/2.8V Power Supply
Digital Audio
4
PWON*
Power ON & Reset
Mod_on_state Mod_uart_state Mod_flow_state Mod_reset_state Dte_uart_state*
H.P.M.
USB_ID USB_DM USB_DP VBUS
Full U.S.B. 2.0
O.T.G. BUS
ADC
VREXTH
MCSI_SYNC MCSI_BCLK MCSI_DIN MCSI_DOUT
M.S.C.I. BUS
Analog
1
1
1
1
1
1
4
1
1
VBAT_CNT
Power supplies
RXD2* TXD2
MicroWire BUS
Backup
*
U.A.R.T.2
TXD*, RXD*,
*, RTS*,
CTS
*, DSR*,
DCD
*, RI*
DTR
U.A.R.T
MWDSI
MWSDO
MWSCLK
MWCS0*
LED1
LED2
L.P.G.
(P.W.M. out)
6
1
2
Debug UART
8
4
1
47µF - 10V
VBAT
Backup battery
Main battery
V24 Full UART
Interface with
Transceiver
if necessar
µ Wire Devices: LCD,
EEPROM, CENSORS …
VBAT
VBAT
10
available
G.P.I.O.s
SIM plus interface 3V & 1.8V
* Low level active signal.
1
1
8
GPIO1 GPIO2 GPIO3 GPIO4 GPIO5
GPIO6
G.P.I.O.s
GPIO7 GPIO8 GPIO9 GPIO10
SIM Plus BUS
SIMCLK SIMRST SIMVCC SIMIO SIMPLUS_CMD SIMPLUS_DATA SIMPLUS_CLK SIMCD*
6
GND
SDA_I²C
SCL_I²C
I²C BUS
MICP
MICN
MICBIAS_OUT
HSMICBIAS_OUT
SPKP
SPKN
HSOR
Analog Audio
HSOL
BUSES
HSMICP
HSMICN
5
GND ANA
2
2
2
2
Devices: LCD,
EEPROM, CENSORS…
+
2
2
Accessory Microphone
2V or 2.5V power
supply for
Micro
Receiver
Accessory earphone
+
Accessory Microphone
hones
Figure 1
MO300 bloc diagram
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3 Functional integration
The MO300 series modules target the M2M applications market. Following the improvement of Silicon technologies includes functionality improvement, less power consumption, low voltage and higher working frequencies clock, the MO300 module meets all these requirement and uses last high end technology. All digital I/Os at the 80 pins connector are on 1.8V domain and 1.4 V for its core. Except VREXTH (1.8V or 2.8V) and VCCSIM (and the SIM I/Os at 1.8V or 2.8V) and obviously VBAT. Thus, all chip used to communicate with the MO300 must be compatible with this voltage requirement. Otherwise you will be simply required to use level shifters to adapt the voltage of the signals to meet the requirement of MO300 Module. As example here is the validated chip on our design to shift I/Os voltage from 2.8V to 1.8V:
Figure 2
Example of Level Shifter
3.1 How to connect a SIM card ?:
Figure 3
Sim plus card
Preliminary notes:
Regarding the Sim cards: Some improvements and new features are supported by new generation of Sim cards. The main features are the support for 1.8 power supply for USIM used in EDGE, HSDPA and UMTS applications. The second one is the add-on, the flash memory included in Simplus card to mix and simplify the design of two Card holder in some applications. If necessary, with only one mechanical card holder it is possible to have access to Sim card features and at the same time to also have access to an external Flash memory module like MMC.
Regarding the card holders: The Sim card holder can have 6 or 8 pins depending if it feature a mechanical card presence detector or not. The Simplus card holder can have 8 or 10 pins depending if it feature a card presence detector or not. There are two ways to connect a Sim card holder to the MO300 module.
• External Sim card holder uses 10 pins if Simplus compliant or 8 pins if normal Sim compliant from Pin 5 to pin 12 of the board to board (BtB)connector.
• Internal Sim card holder by soldering the card holder( and it's protective components) on the back side of the MO300 module.
Note: These two ways are exclusives, never use both solutions at the same time. This is mandatory.
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3.1.1 SIM on the Board to Board Connector.
The SIM card connection could be done in two ways:
• Connector with 6 pins without SIM card detection.
• Connector with 8 pins with SIM card detection.
In both cases, decoupling capacitors of 10pF have to be added on SIMCLK, SIMRST, SIMVCC and SIMIO signals as close as possible to the SIM card connector to avoid EMC issues. Moreover, use ESD protection components to protect Sim card and module I/Os against Electro Static Discharges. The following schematic show how to protect the Sim access for 8 pins connector. Apply the same method for a 6 pins connector.
Figure 4
Protections : EMC and ESD components close to the Sim
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_
3.1.1.1 Without SIM card detection
Normal SIM card case: 6 pins are used.
GND
MO300
SIMVCC
SIMRST
SIMCLK
SIMIO
SIMCD*
SIM connector
GND
RST
CLK
VPP
I/O
Figure 5
6 pins SIM card connection without presence detection
SIM Plus card case: 8 pins are used.
GND
MO300
GND
SIMVCC
SIMRST
SP CLK
SIMPLUS
SIMCLK
DATA
RST
SIMPLUS_CMD
SIMIO
I/O
SIMPLUS_CLK
SP DATA SP CMD
SIMCD*
Figure 6
8 pins SIM plus card connection without presence detection
In these configurations, the SIMCD* signal is always Low. There is no hardware SIM card detection, so the SIM card is considered as always present. (A software detection is always performed). For filtering, EMC and ESD values refer to schematics figure 4.
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_
3.1.1.2 With SIM card detection
Normal SIM card case: 6 pins are used.
GND
MO300
SIMVCC
SIMRST
SIM connector
GND
RST
VPP
SIMCLK
CLK
SIMIO
CNT1
I/O
CNT2
SIMCD*
Figure 7
SIM card connection with presence detection
SIM Plus card case: 8 pins are used.
SIMPLUS
SIMPLUS_CMD
SIMPLUS_CLK
GND
SIMVCC
SIMRST
SIMCLK
DATA
SIMIO
SIMCD*
SIM connector
GND
RST
CLK
SP_DATA
SP_CLK
I/O
SP_CMD
CNT2
Figure 8
8 pins SIM plus card connection with presence detection
These configurations allows the module to detect if a SIM card is present in the connector or not. When present, the SIMCD signal is connected to GND signal through a mechanical switch integrated in the SIM connector (the type of switch depends of the SIM connector) thus a hardware interruption is generated. When the switch is opened, the internal MO300 pull up raise the signal to high level (1.8V)
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3.1.2 SIM holder soldered on the back of the MO300.
The MO300 module feature a soldering area on its back to mount a Sim card holder with all necessary components to protect it from EMC and ESD. For your design, if the Sim connection through the BtB connector is not required, use the following recommended schematic. As already warned: Never use both SIM card connection solutions at the same time. This is mandatory.
Figure 9 SIM holder
The behaviour is as described in the previous chapter.
3.1.2.1 Schematics
Figure 10
Components for backside Sim holder
Note: SIM card presence detector cannot be used with the SIM holder on the back of the MO300. The
SIMCD signal is therefore not used in that case.
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3.1.2.2 Placing
All these components should be soldered at the following positions.
Figure 11
Components for backside SIM holder
Close view of the components area:
Figure 12
Zoom on components area
SAGEM can provide a suppliers component codes list on request
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3.2 HOW to connect the AUDIOS?
The MO300 module feature 2 differential audio paths. A main audio path to connect a microphone and a speaker, and a second one to connect an auxiliary audio through a Jack (for example). In this following chapter examples of design will be given including protections against EMC and ESD and some notes about the routing rules to follow to avoid the TDMA noise usually present in this sensitive area of design. It will also give the way to use the hook function and the audio-jack presence detector.
3.2.1 Using a differential Handset mode on the main audio path
The MO300 can manage an external microphone (MICP/MICN) and external speaker (32 ohms SPKP/SPKN) in differential mode. Thus, one receiver and one microphone can be connected to the module with the following characteristics (see SAGEM references):
- Receiver 32 ohms up to 120 ohms
- Microphone accepting the polarisation described below (FET Buffer + Open Drain).
- The microphone can be supplied using the internal MO300 bias supply (recommended but not mandatory)
or any other external bias system compliant with selected microphone within the MO300 inputs limits.
MO300
SPKP
SPKN
MICP MICN
2.0V / 2.5V MICBIAS
Protective components
22pF
22pF
47nH
47nH
See
Application
schematic
15pF
15pF
Figure 13
Differential audio handset mode
speaker
+
Microphone
Figure 14
Microphone on board components
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