SAGEMCOM BROANDS HILONC Users Manual
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NOTE D'ETUDE / TECHNICAL DOCUMENT
REFERENCE
URD1 – OTL 5665.1– 002 /
70 884
Code
C
TITRE / TITLE :
Edition
N°
Nom
03
Name
Signature
Date
Rédacteur(s)
Author(s)
J.DUMONT T. Fu M. Boutboul E. Sillère
27/06/08
TA1
HiloNC Application note
Chef de projet
Project design
manager
NOM DE L’ETUDE
Approbations /Approvals
Responsable
d’entité /
Product design
manager
ETUDE / PROJECT
HiloNC Module
Chef Unité
R&D unit
manager
Assurance
Qualité /
R&D quality
assurance
RESUME / SUMMARY
This document is HiloNC module application note.
Mots clés / Keywords : Cellular, module, GSM, GPRS, application, M2M
DIFFUSION INTERNE / INTERNAL DISTRIBUTION
√
REDACTEUR(S) / AUTHOR (S) + F.FREULON, F.GOUERE .
Distribution externe pour les prestataires de services : renseigner dans la rubrique ci-dessous sous la forme
« SOCIETE (P. Nom) »
DIFFUSION EXTERNE sous convention de confidentialité :
EXTERNAL DISTRIBUTION with confidentiality agreement :
………….
Enregistrement relatif à la qualité (ERQ) / Quality record
A déposer en enveloppe soleau / Put in a soleau envelope
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Direction des Recherches et des Développements Etablissement de VELIZY
VELIZY R&D Center
NOTE D'ETUDE / TECHNICAL DOCUMENT
FICHE RECAPITULATIVE / SUMMARY SHEET
Ed
1
2
3 10/11/2008 URD1– OTL 5665.1–
Date
Date
27/06/2008
07/10/2008
Référence
Reference
URD1– OTL 5665.1–
002 / 70 884
URD1– OTL 5665.1–
002 / 70 884
002 / 70 884
Rédacteur(s)
Author(s)
Steven Long
Bingming Chen
AMMARI. M. DUMONT J. §3.6 and §3.10;
AMMARI M. Dumont J. §3.1, §3.9, §3.12 Clarification on Vbackup
Relecteur(s)
Reviser(s)
Tiejun Fu / M.
Boutboul
Pages modifiées
/ Changed pages
Création du document /
P25
Observations
Comments
Document creation
UART Update
connection. Reset
duration 10ms. Sim card
connection figure 3.
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HiloNC Application Note
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Direction des Recherches et des Développements Etablissement de VELIZY
VELIZY R&D Center
SOMMAIRE / CONTENTS
Direction des Recherches et des Développements Etablissement de VELIZY...........................................................1
NOTE D'ETUDE / TECHNICAL DOCUMENT ..........................................................................................................1
Direction des Recherches et des Développements Etablissement de VELIZY...........................................................2
NOTE D'ETUDE / TECHNICAL DOCUMENT ..........................................................................................................2
FICHE RECAPITULATIVE / SUMMARY SHEET....................................................................................................2
SOMMAIRE / CONTENTS..........................................................................................................................................4
FIGURES LIST ............................................................................................................................................................6
1. OVERVIEW...........................................................................................................................................................7
1.1 OBJECT OF THE DOCUMENT..................................................................................................................7
1.1 REFERENCE DOCUMENTS.......................................................................................................................7
1.2 MODIFICATION OF THIS DOCUMENT....................................................................................................7
1.3 CONVENTIONS............................................................................................................................................7
2. BLOCK DIAGRAM................................................................................................................................................8
3. FUNCTIONAL INTEGRATION............................................................................................................................9
3.1 HOW TO CONNECT TO A SIM CARD....................................................................................................10
3.2 HOW TO CONNECT THE AUDIOS?.......................................................................................................11
3.2.1 Connecting microphone and speaker................................................................................................11
3.2.2 Recommended characteristics for the microphone and speaker....................................................12
3.3 PWM............................................................................................................................................................13
3.3.1 PWM outputs...........................................................................................................................................13
3.3.2 PWM for Buzzer connection..................................................................................................................14
3.4 POWER SUPPLY.......................................................................................................................................14
3.5 EXAMPLE OF POWER SUPPLY .............................................................................................................15
3.5.1 Example 1............................................................................................................................................15
3.5.2 Example 2............................................................................................................................................15
3.5.3 Example 3............................................................................................................................................16
3.6 V24...............................................................................................................................................................16
3.6.1 Complete V24 – connection HiloNC - host........................................................................................16
3.6.2 Complete V24 interface with PC........................................................................................................17
3.6.3 Partial V24 (RX-TX-RTS-CTS) – connection HiloNC - host............................................................18
3.6.4 Partial V24 (RX-TX) – connection HiloNC - host..............................................................................19
3.6.5 Design impact on DTR usage ............................................................................................................19
3.7 SPI ...............................................................................................................................................................19
3.8 GPIO............................................................................................................................................................20
3.9 BACKUP BATTERY...................................................................................................................................20
3.9.1 Backup battery function feature.........................................................................................................20
3.9.2 Current consumption on the backup battery.....................................................................................20
3.9.3 Charge by internal HiloNC charging function....................................................................................20
3.9.4 Backup Battery technology recommended .......................................................................................21
3.10 HARDWARE POWER MANAGEMENT AND MULTIPLEXING INTERFACES....................................22
3.11 STARTING THE MODULE........................................................................................................................22
3.12 MODULE RESET........................................................................................................................................22
3.13 MODULE SWITCH OFF............................................................................................................................22
3.14 SLEEP MODE MANAGEMENT................................................................................................................23
4. MANDATORY POINTS FOR THE FINAL TESTS AND TUNING.....................................................................24
5. ESD & EMC RECOMMENDATIONS.................................................................................................................24
5.1 HILONC ALONE.........................................................................................................................................24
5.2 CUSTOMER’S PRODUCT WITH HILONC..............................................................................................24
5.2.1 Analysis ................................................................................................................................................24
5.2.2 Recommendations to avoid ESD issues...........................................................................................24
6. RADIO INTEGRATION.......................................................................................................................................25
6.1 ANTENNA ...................................................................................................................................................25
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6.2 GROUND LINK AREA................................................................................................................................25
6.3 LAYOUT......................................................................................................................................................25
6.4 MECHANICAL SURROUNDING...............................................................................................................26
6.5 OTHER RECOMMENDATIONS – TESTS FOR PRODUCTION/DESIGN...........................................26
7. AUDIO INTEGRATION......................................................................................................................................26
7.1 MECHANICAL INTEGRATION AND ACOUSTICS.................................................................................26
7.2 ELECTRONICS AND LAYOUT.................................................................................................................27
8. RECOMMENDATIONS ON LAYOUT OF CUSTOMER’S BOARD...................................................................28
8.1 GENERAL RECOMMENDATIONS ON LAYOUT....................................................................................28
8.1.1 Ground .................................................................................................................................................28
8.1.2 Power supplies.....................................................................................................................................28
8.1.3 Clocks...................................................................................................................................................28
8.1.4 Data bus and other signals.................................................................................................................28
8.1.5 Radio....................................................................................................................................................28
8.1.6 Audio (see also § 10.2).......................................................................................................................28
8.2 EXAMPLE OF LAYOUT FOR CUSTOMER’S BOARD...........................................................................29
9. RECOMMANDATIONS FOR CUSTOMER INDUSTRIALIZATION..................................................................29
9.1 MOISTURE LEVEL.....................................................................................................................................30
9.2 PACKAGE...................................................................................................................................................30
9.3 SOLDER MASK..........................................................................................................................................32
9.4 SOLDER PASTE........................................................................................................................................32
9.5 PROFILE FOR REFLOW SOLDERING...................................................................................................32
9.6 SMT MACHINE...........................................................................................................................................34
9.7 UNDERFILL.................................................................................................................................................34
9.8 SECOND REFLOW SOLDERING............................................................................................................35
9.9 HAND SOLDERING...................................................................................................................................35
9.10 REWORK....................................................................................................................................................35
10. LABEL.............................................................................................................................................................35
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FIGURES LIST
Figure 1: Block diagram of HiloNC module......................................................................................................................8
Figure 2: SIM Card signals.............................................................................................................................................10
Figure 3: Protections: EMC and ESD components close to the SIM................................................................................10
Figure 4: Audio connection.............................................................................................................................................11
Figure 5 : Filter and ESD protection of microphone........................................................................................................12
Figure 6: Filter and ESD protection of 32 ohms speaker.................................................................................................12
Figure 7: Buzzer connection...........................................................................................................................................14
Figure 8: GSM/GPRS Burst............................................................................................................................................14
Figure 9: Example of power supply based on a DC/DC step down converter...................................................................15
Figure 10: Example of power supply based on regulator..................................................................................................15
Figure 11: Example with Linear LT1913........................................................................................................................16
Figure 12: Complete V24 connection between HiloNC and host......................................................................................17
Figure 13: connection to a data cable..............................................................................................................................18
Figure 14: Partial V24 connection (4 wires) between HiloNC and host...........................................................................18
Figure 15: Partial V24 connection (2 wires) between HiloNC and host...........................................................................19
Figure 16: Backup battery internally charged..................................................................................................................21
Figure 17: Charging curve of backup battery...................................................................................................................21
Figure 18: Hardware interface between HiloNC and host................................................................................................22
Figure 19: Antenna connection.......................................................................................................................................25
Figure 20: Forbidden area for via....................................................................................................................................26
Figure 21: Layout of audio differential signals on a layer n.............................................................................................29
Figure 22: Adjacent layers of audio differential signals...................................................................................................29
Figure 23: layer allocation for a 6 layers circuit..............................................................................................................29
Figure 24 : Solder mask design.......................................................................................................................................32
Figure 25 : Typical thermal profile.................................................................................................................................33
Figure 26 : CMS fiducials positions................................................................................................................................34
Figure 27 : Underfill holes..............................................................................................................................................35
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1. OVERVIEW
1.1 OBJECT OF THE DOCUMENT
The aim of this document is to describe some examples of hardware solutions for developing some products
around the Sagem Communications HiloNC GPRS Module. Most part of these solutions is not mandatory. Use
them as suggestions of what should be done to have a working product and what should be avoided thanks to
our experiences.
This document suggests how to integrate the HiloNC GPRS module in machine devices such as automotive,
AMM (Automatic Metering Management), tracking system: connection with external devices, layout advises,
external components (decoupling capacitors…).
1.1 REFERENCE DOCUMENTS
URD1 OTL 5665.1 001 70883 - HiloNC technical specification
URD1 OTL 5635.1 008 70248 - AT Command Set for SAGEM Hilo Modules
1.2 MODIFICATION OF THIS DOCUMENT
The information presented in this document is supposed to be accurate and reliable. Sagem Communications
assumes no responsibility for its use, nor any infringement of patents or other rights of third parties which may
result from its use.
This document is subject to change without notice.
Changes or modifications not expressly approved by the party responsible for compliance could void the user’s
authority to operate the equipment.
1.3 CONVENTIONS
SIGNAL NAME : All signal name available on the pads of the HiloNC module is written in italic.
Specific attention must be granted to the information given here.
F
1.4 DECLARATION
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
1. This device may not cause harmful interference, and
2. This device must accept any interference received; including interference that may cause undesired
operation.
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2. BLOCK DIAGRAM
3 +2
Pads
3
Pads
1Pad
1Pad
1Pad
1Pad
1Pad
5 Pads
5
Pads
4Pads
3Pads
8Pads
3 Pads
SPI_CLK /SPI_IRQ/SPI_OUT/SPI_IN/
SIM_DATA/SIM_CLK/SIM_RST/VSIM
RXD/RTS/CTS/TXD/DCD/DTR/DSR/RI
RESET
VBACKUP
VGPIO
POK_IN
AUX_ADC0
SPI_SEL
GPIO[1:5]
PWM[0:2]
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Dual Saw Filter (850/900)
Band 1
(850MHz)
(900MHz)
Band 2
Dual Saw Filter (1800/1900)
Band1
(1800MHz)
(1900MHz)
Band2
26MHz
32.768KHz
850/900/1800/1900
External Memory
9 Pads
INTMIC_BIAS
INTMIC_P
HSET_OUT_P
HSET_OUT_N
VBATT
V
G
PIO
In Out
PowerSupplySystem
RESET
VBACK
UP
CONTROL
POWER
ADC SPI
PERIPHERALS
GPIO SIM PWM
UART
Subsystem
GROUND
RFSubsystem
FE_CTRL
Ramp_DAC
ADDR
[22:1]
DATA [15:0]
NCS_RAM
NCS_Flash
NUB
EMC Subsystem
NLB
NOE
NWE
RFIL
RFIH
RFOL
RFOH
DCXO
Audio
RTC
TMS/RTCK/TCK/NTRST /TDI/TDO/ TEST / TEST1 / TEST2
JTAG
Figure 1: Block diagram of HiloNC module
PA+Switch
Antenna
pad
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3. FUNCTIONAL INTEGRATION
The improvement of Silicon technologies heads toward functionality improvement, less power consumption.
The HiloNC module meets all these requirement and use last high end technology.
All digital I/Os among the 51 pads are in 2.8V domain which is suitable for most systems except :
F
- VSIM (the SIM I/Os at 1.8V or 2.9V)
- VBAT (from 3.2V to 4.5V).
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3.1 HOW TO CONNECT TO A SIM CARD
Figure 2: SIM Card signals
HiloNC module provides the SIM signals on the 51 pads. A SIM card holder with 6 pads needs to be adopted to
use the SIM function.
Decoupling capacitors have to be added on SIM_CLK, SIM_RST, VSIM and SIM_DATA signals as close
F
as possible to the SIM card connector to avoid EMC issues.
Use ESD protection components to protect SIM card and module I/Os against Electro Static Discharges.
F
The following schematic show how to protect the SIM access for 6 pads connector.
Figure 3: Protections: EMC and ESD components close to the SIM
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3.2 HOW TO CONNECT THE AUDIOS?
The HiloNC module features one input audio path and one output audio path. The input path is single-end while
the output path is differential. In this following chapter examples of design will be given including protections
against EMC and ESD and some notes about the routing rules to follow to avoid the TDMA noise usually
present in this sensitive area of design.
Please note that acoustic competences are mandatory to get accurate audio performance on customer’s
F
product.
3.2.1 Connecting microphone and speaker
The HiloNC module can manage an external microphone (INTMIC_P) in single-end mode and an external
speaker (HSET_OUT_P / HSET_OUT_N) in differential mode. Thus, one speaker and one microphone can be
connected to the module. The bias supply to microphone is implemented in the module.
The speaker connected to the module should be 32 ohms.
F
HiloNC
If the design is ESD or EMC sensitive we strongly recommend to read the notes below.
The weakness can either come from the PCB routing and placement or from the chosen components (or both).
3.2.1.1 Notes for microphone
Pay attention to the microphone device, it must not be sensitive to RF disturbances.
F
Some microphones include two spatial microphones inside the same shell and allow to make an electrical
F
difference between the environment noise (received by one of the two mic.) and the active signal
(received by the other mic. + noise) resulting in a very high SNR.
HSET_OUT_P
HSET_OUT_N
INTMIC_P
Filter and
ESD
protection
Figure 4: Audio connection
32ohms speaker
MIC
If you need to have deported microphone out of the board with long wires, you should pay attention to the
F
EMC and ESD effect. It is also the case when your design is ESD sensitive. In those cases, add the
following protections to improve your design.
F
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To ensure proper operation of such sensitive signals, they have to be isolated from the others by
analogue ground on customer’s board layout. (Refer to Layout design chapter)
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