SAGEMCOM BROANDS HILOC Users Manual
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NOTE D'ETUDE / TECHNICAL DOCUMENT
REFERENCE
ETUDE / PROJECT
URDx – OTL 5635.1– 007 /
70 230
Code
C
TITRE / TITLE :
Edition
N°
#
Nom
03
Name
Date
Signature
Rédacteur(s)
Author(s)
M. Ammari T. Fu M. Boutboul E. Sillère
jj/mm/aaaa
TA1
HiLo Application note
Chef de projet
Project design
manager
NOM DE L’ETUDE
Approbations /Approvals
Responsable
d’entité /
Product design
manager
HiLo Module
Chef Unité
R&D unit
manager
Assurance
Qualité /
R&D quality
assurance
RESUME / SUMMARY
This document is HiLo module application note.
Mots clés / Keywords : Cellular, module, GSM, GPRS, application, M2M
DIFFUSION INTERNE / INTERNAL DISTRIBUTION
√
R
EDACTEUR(S) / AUTHOR (S) + F.FREULON, F.GOUERE .
Distribution externe pour les prestataires de services : renseigner dans la rubrique ci-dessous sous la forme
« SOCIETE (P. Nom) »
DIFFUSION EXTERNE sous convention de confidentialité :
EXTERNAL DISTRIBUTION with confidentiality agreement :
………….
Enregistrement relatif à la qualité (ERQ) / Quality record
A déposer en enveloppe soleau / Put in a soleau envelope
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Direction des Recherches et des Développements Etablissement de VELIZY
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NOTE D'ETUDE / TECHNICAL DOCUMENT
FICHE RECAPITULATIVE / SUMMARY SHEET
Ed Date
Date
05/12/2007
1
08/02/2008
2
3 18/03/2008 URDx– OTL 5635.1–
4 16/05/2008 URDx– OTL 5635.1–
5 24/06/2008 URDx– OTL 5635.1–
6
7
Référence
Reference
URDx– OTL 5635.1–
70 230
007 /
URDx– 2– 007 / 70
230
007 / 70 230
007 / 70 230
007 / 70 230
Rédacteur(s)
Author(s)
Steven Long
Bingming Chen
AMMARI M. Tiejun Fu / M.
AMMARI M. F.GOUERE
M. Boutboul F. Gouere all Presentation change
Steven Long Tiejun Fu 5, 20, 23, 24 For FCC requirement
Relecteur(s)
Reviser(s)
Tiejun Fu / M.
Boutboul
Boutboul
Pages
modifiées /
Changed pages
Création du document /
13
Observations
Comments
Document creation
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Direction des Recherches et des Développements Etablissement de VELIZY
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SOMMAIRE / CONTENTS
Direction des Recherches et des Développements Etablissement de VELIZY...............................................................1
NOTE D'ETUDE / TECHNICAL DOCUMENT................................................................................................................1
Direction des Recherches et des Développements Etablissement de VELIZY...............................................................2
NOTE D'ETUDE / TECHNICAL DOCUMENT................................................................................................................2
FICHE RECAPITULATIVE / SUMMARY SHEET .........................................................................................................2
SOMMAIRE / CONTENTS.................................................................................................................................................3
1. OVERVIEW...................................................................................................................................................................5
1.1 OBJECT OF THE DOCUMENT.........................................................................................................................5
1.1 REFERENCE DOCUMENTS.............................................................................................................................5
1.2 MODIFICATION OF THIS DOCUMENT ..........................................................................................................5
2. BLOCK DIAGRAM ......................................................................................................................................................6
3. FUNCTIONAL INTEGRATION ..................................................................................................................................6
3.1 HOW TO CONNECT TO A SIM CARD ............................................................................................................7
3.2 HOW TO CONNECT THE AUDIOS? ...............................................................................................................7
3.2.1 Connecting microphone and speaker .......................................................................................................7
3.2.2 Characteristics of the microphone and speaker recommended by Sagem communications ..........9
3.3 PWM ....................................................................................................................................................................10
3.3.1 PWM for LED..................................................................................................................................................10
3.3.2 PWM for Buzzer connection.........................................................................................................................10
3.4 POWER SUPPLY ..............................................................................................................................................10
3.5 EXAMPLE OF POWER SUPPLY....................................................................................................................12
3.5.1 Example 1 ...................................................................................................................................................12
3.5.2 Example 2 ...................................................................................................................................................12
3.6 V24.......................................................................................................................................................................13
3.6.1 Complete V24 – connection HiLo - host.................................................................................................13
3.6.2 Complete V24 interface with PC..............................................................................................................13
3.6.3 Partial V24 (RX-TX-RTS-CTS) – connection HiLo - host ....................................................................14
3.6.4 Partial V24 (RX-TX) – connection HiLo - host.......................................................................................14
3.7 SPI........................................................................................................................................................................15
3.8 GPIO ....................................................................................................................................................................15
3.9 BACKUP BATTERY ..........................................................................................................................................15
3.9.1 Backup battery function feature ...............................................................................................................15
3.9.2 Current consumption on the backup battery..........................................................................................16
3.9.3 Charge by internal HiLo charging function.............................................................................................16
3.9.4 Backup Battery technology recommended ............................................................................................16
3.10 HARDWARE POWER MANAGEMENT AND MULTIPLEXING INTERFACES.......................................17
3.11 STARTING THE MODULE...............................................................................................................................17
3.12 MODULE SWITCH OFF...................................................................................................................................17
3.13 SLEEP MODE MANAGEMENT.......................................................................................................................18
4. MANDATORY POINTS FOR THE FINAL TESTS AND TUNING........................................................................19
5. ESD & EMC RECOMMENDATIONS.......................................................................................................................19
5.1 STANDARD REQUIREMENTS.......................................................................................................................19
5.1.1 Analysis .......................................................................................................................................................19
5.1.2 Recommendations to avoid ESD issues ................................................................................................19
5.2 ESD FEATURES................................................................................................................................................20
6. RADIO INTEGRATION .............................................................................................................................................20
6.1 ANTENNA...........................................................................................................................................................20
6.2 GROUND LINK AREA ......................................................................................................................................21
6.3 LAYOUT ..............................................................................................................................................................21
6.4 MECHANICAL SURROUNDING.....................................................................................................................21
6.5 OTHER RECOMMENDATIONS – TESTS FOR PRODUCTION/DESIGN...............................................21
7. AUDIO INTEGRATION.............................................................................................................................................22
7.1 MECHANICAL INTEGRATION AND ACOUSTICS......................................................................................22
7.2 ELECTRONICS AND LAYOUT .......................................................................................................................22
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8. RECOMMENDATIONS ON LAYOUT OF MMI BOARD.......................................................................................22
8.1 GENERAL RECOMMENDATIONS ON LAYOUT......................................................................................... 22
8.2 EXAMPLE OF LAYOUT FOR MMI BOARD ..................................................................................................23
9. LABEL.........................................................................................................................................................................23
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1. OVERVIEW
1.1 OBJECT OF THE DOCUMENT
The aim of this document is to describe some examples of hardware solutions for developing some products
around the SAGEM HiLo GPRS Module. Most part of these solutions is not mandatory. Use them as
suggestions of what should be done to have a working product and what should be avoided thanks to our
experiences.
This document suggests how to integrate the HiLo GPRS module in machine devices such as automotive, AMM
(Automatic Metering Management), tracking system: connection with external devices, layout advises, external
components (decoupling capacitors…).
1.1 REFERENCE DOCUMENTS
URD1 OTL 5635.1 005 70086 - HiLo technical specification
URD1 OTL 5635.1 008 70248 - AT Command Set for SAGEM HiLo Modules
1.2 MODIFICATION OF THIS DOCUMENT
The information presented in this document is supposed to be accurate and reliable. Sagem communications
assumes no responsibility for its use, nor any infringement of patents or other rights of third parties which may
result from its use.
This document is subject to change without notice.
Changes or modifications not expressly approved by the party responsible for compliance could void the user’s
authority to operate the equipment.
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2. BLOCK DIAGRAM
POWER ON
TRACE PORT
5 GPIOs
EXTERNAL
ANALOG INPUT
SIM 3V & 1.8V
Antenna Port:
RF_IN
POWER CONTROL:
POK_IN
TRACE:
SPI_CLK
SPI_IRQ
SPI_OUT
SPI_IN
SPI_SEL
GENERAL IO:
GPIO1
GPIO2
GPIO3
GPIO4
GPIO5
ADC:
AUX_ADC0
SIM:
SIM_CLK
SIM_RST
VSIM
SIM_DATA
POWER SUPPLY:
VBATT (4)
VBACKUP
VGPIO
GND (4)
UART: TXD
RXD
CTS
RTS
DCD
DSR
DTR
PWM:
PWM0 (LED1)
PWM1 (LED2)
PWM2 (Buzzer)
AUDIO:
INTMIC_P
HSET_OUT_P
HSET_OUT_N
DC
2.8V
FULL UART PORT
VBAT
RI
VBAT
VBAT
Figure 1: Block diagram of HiLo module
3. FUNCTIONAL INTEGRATION
The improvement of Silicon technologies heads toward functionality improvement, less power consumption. The
HiLo Module meets all these requirement and use last high end technology. All digital I/Os at the 40 pins
connector are in 2.8V domain which are suitable for most systems except VSIM (the SIM I/Os at 1.8V or 2.9V)
and VBAT which ranges from 3.2V to 4.5V.
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3.1 HOW TO CONNECT TO A SIM CARD
Preliminary notes:
Figure 2: SIM Card signals
HiLo module provides the SIM signals on the board to board connector. A SIM card holder with 6 pins needs to
be adopted to use the SIM function. In this case, decoupling capacitors have to be added on SIM_CLK,
SIM_RST, VSIM and SIM_DATA signals as close as possible to the SIM card connector to avoid EMC issues.
Moreover, use ESD protection components to protect SIM card and module I/Os against Electro Static
Discharges. The following schematic show how to protect the SIM access for 6 pins connector.
SIM connect or
SIM_CLK
SIM_RST
VSIM
33pF
SIM_RST
4
4
3
3
2
2
1
1
10pF 22pF 10pF10nF
1
1
2
2
3
3
5
5
4
4
8
7
6
5
8
7
6
5
VSIMSIM_CLK
SIM_DATA
SIM_DATA
CM1218
Figure 3: Protections: EMC and ESD components closed to the SIM
3.2 HOW TO CONNECT THE AUDIOS?
The HiLo module features one input audio path and one output audio path. The input path is single-end while
the output path is differential. In this following chapter examples of design will be given including protections
against EMC and ESD and some notes about the routing rules to follow to avoid the TDMA noise usually
present in this sensitive area of design.
3.2.1 Connecting microphone and speaker
The HiLo module can manage an external microphone (INTMIC_P) in single-end mode and an external speaker
(HSET_OUT_P / HSET_OUT_N) in differential mode. Thus, one speaker and one microphone can be
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connected to the module. The bias supply to microphone is implemented in the module. The speaker connected
to the module should be 32 ohms.
HiLo
HSET_OUT_P
HSET_OUT_N
INTMIC_P
Filter and
ESD
protection
32ohms speaker
MIC
Figure 4: Audio connection
If the design is ESD or EMC sensitive we strongly recommend to read the notes below.
The weakness can either come from the PCB routing and placement or from the chosen components (or both).
3.2.1.1 Notes for microphone:
• Pay attention to the microphone device, It must not be sensitive to RF disturbances.
• Some microphone includes two spatial microphones inside the same shell and allow to make an
electrical difference between the environment noise (received by one of the two mic.) and the active
signal (received by the other mic. + noise) resulting in a very high SNR.
• If you need to have deported microphone out of the board with long wires, you should pay attention to
the EMC and ESD effect. It also the case when your design is ESD sensitive. In those cases, add the
following protections to improve your design.
• To ensure proper operation of such sensitive signals, they have to be isolated from the others by
analogue ground on mother board layout. (Refer to Layout design chapter)
HiLo
INTMIC_P
Ferrite Bead
MIC
18pF
ESD protection
Figure 5 : Filter and ESD protection of microphone
3.2.1.2 Notes for speaker:
• As explained for the microphone, if the speaker is deported out of the board or is sensitive to ESD, use
the schematic here after to improve the audio.
• HSET_OUT_P, HSET_OUT_N, and tracks must be larger than other tracks: 0.1 mm.
• As described in the layout chapter, differential signals have to be routed in parallel: it is the case for
HSET_OUT_P and HSET_OUT_N.
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