SAGEMCOM BROANDS HILO3G Users Manual
Note d‘étude / Technical document :
URD1– OTL 5696.1– 003 / 72361 Edition 02
HILO 3G Application Note
17 January 2011 - Page 1 / 38
REFERENCE
URD1 – OTL 5696.1– 003 /
ETUDE / PROJECT
NOM DE L’ETUDE
72361
Code
C
TA1
HiLo3G
TITRE / TITLE :
HILO 3G Application Note
Edition
Approbations /Approvals
N°
#
Rédacteur(s)
Author(s)
Chef de projet
Project design
manager
Responsable
d’entité /
Product design
manager
Chef Unité
R&D unit
manager
Assurance Qualité
/
R&D quality
assurance
02
Nom
Name
CC Hsieh
CC Hsieh
CW Sheu
P. NOM
Harry Lin
Date
17 January 2011
10/24/2010
10/24/2010
10/24/2010
Signature
CC Hsieh
CC Hsieh
CW Sheu
Harry Lin
RESUME / SUMMARY
This document is the application notes of the HiLo 3G module.
Mots clés / Keywords : : HiLo3G, Application Notes
DIFFUSION INTERNE / INTERNAL DISTRIBUTION
RÉDACTEUR(S) / AUTHOR (S) +………….
DIFFUSION EXTERNE sous convention de confidentialité :
EXTERNAL DISTRIBUTION with confidentiality agreement :
………….
Enregistrement relatif à la qualité (ERQ) / Quality record
A déposer en enveloppe soleau / Put in a soleau envelope
Direction des Recherches et des Développements Etablissement de RUEIL-MALMAISON
RUEIL-MALMAISON R&D Center
NOTE D'ETUDE / TECHNICAL DOCUMENT
Note d‘étude / Technical document :
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HILO 3G Application Note
17 January 2011 - Page 2 / 38
Ed
Date
Date
Référence
Reference
Rédacteur(s)
Author(s)
Relecteur(s)
Reviser(s)
Pages
modifiées /
Changed
pages
Observations
Comments
1
15/12/2010
URD1– OTL 5696.1–
003 / 72361
CC Hsieh
AMMARI M.
All
Document creation
2
17/01/2011
URD1– OTL 5696.1–
003 / 72361
CC Hsieh
AMMARI M.
All
Document number
changed.
3 4
5 6
7
NOTE D'ETUDE / TECHNICAL DOCUMENT
FICHE RECAPITULATIVE / SUMMARY SHEET
Note d‘étude / Technical document :
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HILO 3G Application Note
17 January 2011 - Page 3 / 38
SOMMAIRE / CONTENTS
1. OVERVIEW ................................................................................................................................................................... 6
1.1. Document Objectives .............................................................................................................................................. 6
1.2. Reference Documents ............................................................................................................................................. 6
1.3. Document Modifications ........................................................................................................................................ 6
1.4. Conventions ............................................................................................................................................................ 6
2. Block Diagram ................................................................................................................................................................ 7
3. Functional Integration ..................................................................................................................................................... 8
3.1. How to connect a SIM card .................................................................................................................................... 9
3.2. Connect Audio ...................................................................................................................................................... 10
3.2.1 PCM Digital Audio ........................................................................................................................................... 10
3.2.2 Analog Audio ................................................................................................................................................... 13
3.2.2.1 Microphone Note .............................................................................................................................................. 13
3.2.2.2 Note for Speaker ............................................................................................................................................... 13
3.2.2.3 Recommended Microphone Characteristics ..................................................................................................... 14
3.2.2.4 Recommended Speaker Characteristics ............................................................................................................ 16
3.3 PWM ..................................................................................................................................................................... 16
3.3.1 PWM for Buzzer connection ............................................................................................................................ 16
3.3.2 Network LED ................................................................................................................................................... 16
3.4 Power Requirements ............................................................................................................................................. 17
3.5 UART ................................................................................................................................................................... 17
3.5.1 Complete V24—Connection HiLo3G -host ..................................................................................................... 18
3.5.2 Complete V24 Interface with PC ...................................................................................................................... 19
3.5.3 Partial V24 (RX-TX-RTS-CTS)—Connection HiLo3G -host ......................................................................... 20
3.5.4 Partial V24 (RX-TX)—Connection HiLo3G -host ........................................................................................... 21
3.6 GPIO ................................ ................................................................ ................................ ..................................... 22
3.7 ADC ...................................................................................................................................................................... 22
3.8 Backup Battery ..................................................................................................................................................... 23
3.8.1 Backup Battery Function Feature ..................................................................................................................... 23
3.8.2 Charge by Internal HiLo3G Charging Function ............................................................................................... 23
3.8.3 Backup Battery Technology ............................................................................................................................. 23
3.8.3.1 Capacitor Battery .............................................................................................................................................. 23
3.9 USB ...................................................................................................................................................................... 24
4. Power Management ...................................................................................................................................................... 24
4.1 Power Modes ........................................................................................................................................................ 24
4.2 Module Power up .................................................................................................................................................. 24
4.2.1 PWON Power up .............................................................................................................................................. 24
4.2.1.1 IO DC Presence before Power on ....................................................................................................................... 25
4.3 Power on and Sleep Diagrams .............................................................................................................................. 26
4.4 Module Power off ................................................................................................................................................. 28
4.4.1 UART Interface ................................................................................................................................................ 28
4.4.2 USB Interface ................................................................................................................................................... 28
4.5 Sleep Mode ........................................................................................................................................................... 28
5. ESD & EMC Recommendation .................................................................................................................................... 29
5.1 Handling HiLo3G ................................................................................................................................................. 29
5.2 ESD Recommendations ........................................................................................................................................ 29
5.2.1 Avoid ESD ........................................................................................................................................................ 29
5.3 EMC recommendations ........................................................................................................................................ 29
6. Radio Integration .......................................................................................................................................................... 30
6.1 Antenna Connection ............................................................................................................................................. 30
6.1.1 Antenna Connector ........................................................................................................................................... 30
6.1.2 Spring Contact .................................................................................................................................................. 30
6.1.3 Antenna Notice ................................................................................................................................................. 31
6.2 Ground Link Area ................................................................................................................................................. 31
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6.3 Layout ................................................................................................................................ ................................... 32
6.4 Mechanical Surrounding ....................................................................................................................................... 32
6.5 Other Recommendation—test for production/design ........................................................................................... 32
7. Audio Integration .......................................................................................................................................................... 32
7.1 Mechanical integration and acoustics ................................................................................................................... 32
7.2 Electronics and layout ........................................................................................................................................... 33
8. Recommendations on layout of customer‘s board ........................................................................................................ 33
8.1 General recommendations on layout .................................................................................................................... 33
8.1.1. Ground .......................................................................................................................................................... 33
8.1.1.1 Ground layout guidelines .................................................................................................................................. 33
8.1.1.2 Digital ground ................................................................................................................................................... 33
8.1.1.3 Analog/RF ground ............................................................................................................................................ 33
8.1.2 Power supplies .............................................................................................................................................. 34
8.1.3 Clocks ........................................................................................................................................................... 34
8.1.4 Data bus and other signals ............................................................................................................................ 34
8.1.5 Radio ............................................................................................................................................................. 34
8.1.6 Audio ............................................................................................................................................................ 34
8.1.7 Shielding ....................................................................................................................................................... 35
8.2 Example of layout for customer‘s board ............................................................................................................... 35
9. Label ............................................................................................................................................................................. 36
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Figures List
Figure 1: HiLo3G module Block diagram ................................................................................................................ 7
Figure 2: HiLo3G module connector side ................................................................................................................ 8
Figure 3: HiLo3G module back side ......................................................................................................................... 8
Figure 4: SIM Card signals ....................................................................................................................................... 9
Figure 5: EMC and ESD protection components close to SIM ................................................................................ 9
Figure 6: Serial resistors for protection of long SIM bus lines ............................................................................... 10
Figure 7: Primary PCM mode timing parameter .................................................................................................... 11
Figure 8: Auxiliary PCM mode timing parameter .................................................................................................. 12
Figure 9: Analog audio connections ....................................................................................................................... 13
Figure 10: Filter and ESD protection for microphone ............................................................................................ 13
Figure 11: Filter and ESD protection for 32 ohms speaker .................................................................................... 14
Figure 12: Example of D class TPA2010D1 1Watt audio amplifier connections .................................................. 14
Figure 13: Microphone performance requirements ................................................................................................ 15
Figure 14: Speaker performance requirements ....................................................................................................... 16
Figure 15: Buzzer connection ................................................................................................................................. 16
Figure 16: Network LED connection ...................................................................................................................... 17
Figure 17: Complete V24 connection between the HiLo3G and the host............................................................... 18
Figure 18: C ........................................................ 19
Figure 19: Connection to a data cable................................................................................................ ..................... 19
Figure 20: Partial V24 connection (4 wires) between HiLo3G and host ................................................................ 20
Figure 21: Partial V24 connection (2 wires) between HiLo3G and host ................................................................ 21
Figure 22: Programmable GPIO configurations ..................................................................................................... 22
Figure 23: Backup battery or 10μF capacitor internally charged ............................................................................ 23
Figure 24: Power on sequence ................................................................................................................................ 25
Figure 25: Power off sequence ............................................................................................................................... 25
Figure 26: Diagram for the power on ..................................................................................................................... 26
Figure 27: Diagram for the sleep mode .................................................................................................................. 27
Figure 28: Power off sequence for PWON, VGPIO and CTS ................................................................................ 28
Figure 29: Antenna connection reference ............................................................................................................... 30
Figure 30: Spring contact reference ........................................................................................................................ 30
Figure 31: Ground HiLo3G to customer board ....................................................................................................... 31
Figure 32: Layout of audio differential signals on a layer n ................................................................................... 34
Figure 33: Adjacent layers of audio differential signals ......................................................................................... 34
Figure 34: Reference 6 layers PCB stack ............................................................................................................... 35
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HILO 3G Application Note
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1. OVERVIEW
1.1. Document Objectives
The aim of this document is to describe some examples of hardware solutions for developing some products around the
SagemCom HiLo3G Module. Most parts of these solutions are not mandatory. Use them as suggestions of what should be
done to have a working product and what should be avoided thanks to our experience.
This document suggests how to integrate the HiLo3G module into machine devices such as automotive, AMM (Automatic
Metering Management), tracking system: connection with external devices, layout advises, external components
(decoupling capacitors…), etc.
1.2. Reference Documents
[1] URD1 OTL 5696.1 004 72362 Ed 04 - HiLo 3G technical specifications
[2] URD1 OTL 5696.1 006 72370 Ed 01- AT Command Set for SAGEM HiLo3G Modules
1.3. Document Modifications
The information presented in this document is supposed to be accurate and reliable. SAGEMCOM assumes no
responsibility for its use, nor any infringement of patents or other rights of third parties which may result from its use.
This document is subject to change without notice.
Changes or modifications not expressly approved by the party responsible for compliance could void the user‘s authority to
operate the equipment.
1.4. Conventions
SIGNAL NAME: All signal names available on the pins of the HiLo3G module are written in italic.
Specific attention must be granted to the information given here.
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Antenna Port
Power Control
Antenna
Power on
Signal
Reset
USB Slave
USB
Master
GPIO
Three
GPIO
ADC
External
Analog
input
USB Slave
SIM 3V &
1.8V
Power Supply
47uF
DC
3.7V
Battery
2.85V
UART
Full UART
PWM
Audio
HiLo 3G
Vibrating
device
Microphone
Speaker
PCM
2. Block Diagram
Figure 1: HiLo3G module Block diagram
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3. Functional Integration
Advancements in Silicon technologies head toward functionality improvement with less power consumption. The HiLo3G
module with its industrial 40 pins connector meets all these requirements, using the latest high end technology in a very
compact design of only 27 x 27 x 4.8 mm and weighs less than 7 grams.
All digital I/Os among the 40 pins are in the 2.9V domain suitable for most systems except SIM I/O's, which can also
be in the 1.8V domain depending on SIM-card use and PWON in the 1.8V domain.
Analogical I/O are in the following power domains:
• VSIM SIM I/Os in the 1.8V or 2.9V domain
• VBACKUP 3V domain
•VGPIO 2.9V domain
•VBAT from the 3.2V to the 4.4V domain. 3.7V is normal.
•VUSB 5V domain
•ADC 2.1V domain
•MIC_N/P 1.8V domain
•HSET_N/P VBAT domain
•Antenna RF power Amplifier is on VBAT domain
•Operation temperature from the -40℃ to the +85℃
Do not power on the module I/O with a voltage over the specified limits. This could damage the module.
Acoustic engineering competencies are mandatory to obtain accurate audio performance from customer products.
Radio engineering competencies are mandatory to obtain accurate radio performance from customer products.
Figure 2: HiLo3G module connector side
Figure 3: HiLo3G module back side
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HILO 3G Application Note
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PIN No.
Name
C1
VCC
C2
RST
C3
CLK
C4
NA
C5
GND
C6
VPP
C7
I/O
C8
N/A
VSIM
3.1. How to connect a SIM card
Figure 4: SIM Card signals
The HiLo3G module provides SIM signals to the 40 pins. A SIM card holder with 6 pins must be adopted to use the SIM
function.
Decoupling capacitors must be added on VSIM,SIM_DATA,SIM_RST,and SIM_CLK signals as close
as possible to the SIM card connector to avoid EMC issues and pass SIM card approval tests.
Use ESD protection components to protect SIM card and module I/Os against Electro Static Discharges.
The following schematic shows how to protect SIM access of a 6 pins connector. This must be performed every time a SIM
card holder is accessed by the end user customer.
Figure 5: EMC and ESD protection components close to SIM
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1
6
5
4 8
7
3
2
9
10
SIM_RST_CARD
SIM_CLK_CARD
VSIM_CARD
SIM_DATA_CARD
VSIM_CARD
SIM_GPIO
C601
10nF
C602
33pF
C60322pF
R601
R602
56
10
10
R601
NC
NC
2.2k
R616
GND
In cases of long SIM bus lines over 100mm, using serial resistors to avoid electrical overshoots on SIM bus signals is
recommended. Use 56 Ω for the clock line and 10Ω for the reset and data lines.
Figure 6: Serial resistors for protection of long SIM bus lines
The schematic here above includes the hardware SIM card presence detector. It can be connected to any GPIO and
managed with an AT command.
The SIM card must not be removed from its holder while it is still powered. First switch the module off properly with
the AT command, then remove the SIM card from its holder.
3.2. Connect Audio
The HiLo3G module features two input audio paths and two output audio paths. The two input paths, one is differential
analog microphone and the other is PCM digital input. The two output paths, one is a differential analog 32Ω speaker and
the other is PCM digital output.
In this following chapter design examples will be given including protections against EMC and ESD and some notes about
the routing rules to follow to avoid TDMA noise sometimes present in this sensitive area of design.
3.2.1 PCM Digital Audio
HiLo3G can be used for connections to an external codec through the integrated PCM interface. The interface supports an 8
kHz short sync mode at 2048 kHz and an 8 kHz long sync mode at 128 kHz. In the short-sync (primary PCM) mode, the
HiLo3G can be a master or a slave. In the long-sync (auxiliary PCM) mode, the HiLo3G is always a master; there is no
slave support.
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Figure 7: Primary PCM mode timing parameter
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Figure 8: Auxiliary PCM mode timing parameter
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