SAGEMCOM BROANDS HIALLNC User Manual
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User Manual
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User Manual 2012/06/28
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SOMMAIRE / CONTENTS
1 OVERVIEW...................................................................................................................................................................5
1.1 OBJECT OF THE DOCUMENT.........................................................................................................................5
1.2 REFERENCE DOCUMENTS.............................................................................................................................5
1.3 DOCUMENT MODIFICATIONS ........................................................................................................................5
1.4 CONVENTIONS...................................................................................................................................................5
1.5 TERMS AND ABBREVIATION ..........................................................................................................................5
2. BLOCK DIAGRAM.......................................................................................................................................................7
3. FUNCTIONAL INTEGRATION...................................................................................................................................8
3.1 POWER DOMAIN................................................................................................................................................8
3.2 SIM CARD...........................................................................................................................................................12
3.2.1 Internal SIM card........................................................................................................................................12
3.2.2 External SIM card connection ..................................................................................................................12
3.2.3 SIM CARD priority......................................................................................................................................13
3.3 AUDIOS...............................................................................................................................................................14
3.3.1 Analogue audio connection ......................................................................................................................14
3.3.1.1 Connecting microphone and speaker........................................................................................................14
3.3.1.1.1 Notes for microphone ...........................................................................................................................14
3.3.1.1.2 Notes for speaker ..................................................................................................................................15
3.3.1.2 Recommended characteristics for the microphone and speaker ...............................................................16
3.3.1.2.1 Recommended characteristics for the microphone...............................................................................16
3.3.1.2.2 Recommended characteristics for the speaker ......................................................................................16
3.3.1.3 DTMF OVER GSM network....................................................................................................................17
3.3.2 Digital PCM Audio......................................................................................................................................17
3.4 POWER SUPPLY ..............................................................................................................................................18
3.4.1 Burst conditions..........................................................................................................................................18
3.4.2 Ripples and drops......................................................................................................................................19
3.4.3 EXAMPLE OF POWER SUPPLIES........................................................................................................19
3.4.3.1 DC/DC Power supply from a USB or PCMCIA port..........................................................................19
3.4.3.2 Simple high current low dropout voltage regulator............................................................................20
3.4.3.3 Simple 4V boost converter....................................................................................................................20
3.4.4 Avoid side effects of a retro supply (current re-injection)............................................................................21
3.5 UARTS.................................................................................................................................................................22
3.5.1 Complete V24 connection of HiAllNC to host..........................................................................................23
3.5.2 Complete V24 interface with PC..............................................................................................................24
3.5.3 Partial V24 (RX-TX-RTS-CTS) connection of HiAllNC to host............................................................25
3.5.4 Partial V24 (RX-TX) – connection HiAllNC - host ...................................................................................26
3.6 SPI ........................................................................................................................................................................27
3.7 GPIOS .................................................................................................................................................................27
3.8 ADCS...................................................................................................................................................................28
3.9 BACKUP BATTERY ..........................................................................................................................................28
3.9.1 Backup battery function features .............................................................................................................28
3.9.2 Current consumption on the backup battery..........................................................................................28
3.9.3 Internal HiAllNC charging function.............................................................................................................28
3.9.4 Capacitor backup battery technology......................................................................................................29
4. UNUSED PINS POLICY.............................................................................................................................................30
5. SCALABILITY WITH HILONC-3GPS........................................................................................................................32
6. POWER MANAGEMENT ..........................................................................................................................................35
6.1 POWER MODES ...............................................................................................................................................35
6.2 MODULE POWER-UP......................................................................................................................................35
6.2.1 Power-up with POK_IN signal..................................................................................................................35
6.2.2 IO DC Presence before Power on...........................................................................................................36
6.2.3 MODULE RESET.......................................................................................................................................36
6.3 POWER ON AND SLEEP DIAGRAMS..........................................................................................................37
6.4 MODULE POWER OFF....................................................................................................................................40
6.5 MODULE SLEEP MODE ..................................................................................................................................41
7. ESD & EMC RECOMMENDATIONS .......................................................................................................................42
7.1 HiAllNC MODULE................................................................................................................................................42
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7.2 Module handling.................................................................................................................................................42
7.3 Customer’s product with HiAllNC......................................................................................................................42
7.4 Analysis...............................................................................................................................................................42
7.5 Recommendations to avoid ESD issues........................................................................................................42
8. RADIO INTEGRATION..............................................................................................................................................43
8.1 GSM antenna connection......................................................................................................................................43
8.2 GNSS antenna connection...................................................................................................................................43
8.2.1 Reference schematics...............................................................................................................................43
8.2.2 Antenna detection......................................................................................................................................44
8.3 RADIO LAYOUT DESIGN ................................................................................................................................44
9. AUDIO INTEGRATION .............................................................................................................................................45
9.1 MECHANICAL INTEGRATION AND ACOUSTICS......................................................................................45
9.2 ELECTRONICS AND LAYOUT.......................................................................................................................45
10. LAYOUT RECOMMENDATIONS ON CUSTOMER BOARD ............................................................................47
10.1
GENERAL RECOMMENDATIONS ON LAYOUT.....................................................................................47
10.1.1 Ground.........................................................................................................................................................47
10.1.2 Power supplies...........................................................................................................................................47
10.1.3 Clocks..........................................................................................................................................................48
10.1.4 Data bus and other signals.......................................................................................................................48
10.1.5 Radio............................................................................................................................................................48
10.1.6 Audio............................................................................................................................................................48
10.2
EXAMPLE OF LAYOUT FOR CUSTOMER’S BOARD............................................................................49
11. LABEL .....................................................................................................................................................................49
12. FCC LEGAL INFORMATION................................................................................................................................49
12.1
FCC REGULATIONS ....................................................................................................................................49
12.2
RF EXPOSURE INFORMATION.................................................................................................................50
12.3
IC REGULATIONS.........................................................................................................................................50
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FIGURES LIST
Figure 1: HiAllNC Block diagram .............................................................................................................................................7
Figure 2: Typical SIM schematic ...........................................................................................................................................12
Figure 3: SIM card signals......................................................................................................................................................12
Figure 4: SIM schematic with protection serial resistors & EXT_SIM_DET signal..............................................................13
Figure 5: Analogue audio connection.....................................................................................................................................14
Figure 6: Filter and ESD protection of microphone ...............................................................................................................15
Figure 7: Filter and ESD protection of 32 ohms speaker........................................................................................................15
Figure 8: Example of D class TPA2010D1 1Watt audio amplifier connections ....................................................................16
Figure 9: PCM interface timing..............................................................................................................................................18
Figure 10: GSM/GPRS Burst Current rush ............................................................................................................................18
Figure 11: GSM/GPRS Burst Current rush and VBAT drops and ripples...............................................................................19
Figure 12: DC/DC power supply schematic example.............................................................................................................20
Figure 13: Example of power supply based on regulator MIC29302WU ..............................................................................20
Figure 14: Example with Linear LT1913...............................................................................................................................21
Figure 15: Complete V24 connection of HiAllNC to host processor.....................................................................................23
Figure 16: UART1_CTS versus POK_IN signal during the power on sequence. ..................................................................23
Figure 17: Connection to a data cable ....................................................................................................................................24
Figure 18: Example of a connection to a data cable with a MAX3238E................................................................................25
Figure 19: Partial V24 connection (4 wires) of HiAllNC to host processor.............................................................................25
Figure 20: Partial V24 connection (2 wires) of HiAllNC to host processor.............................................................................26
Figure 21: SPI HE10 pin – TOP VIEW..................................................................................................................................27
Figure 22: internal charging of backup battery or 10uF capacitor..........................................................................................29
Figure 23: Reset command of the HiAllNC by an external GPIO............................................................................................36
Figure 24: Diagram for the power on .....................................................................................................................................38
Figure 25: Diagram for the sleep mode ..................................................................................................................................39
Figure 26: Power supply command by a GPIO......................................................................................................................40
Figure 27: Power OFF sequence for POK_IN, VGPIO and CTS...........................................................................................40
Figure 28: GSM antenna connection schematic .....................................................................................................................43
Figure 29: GNSS active antenna connection schematic .........................................................................................................44
Figure 30: Layout of audio differential signals on a layer n...................................................................................................48
Figure 31: Adjacent layers of audio differential signals.........................................................................................................48
Figure 32: 6 layers PCB stack-up ...........................................................................................................................................49
HiAll
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1 OVERVIEW
1.1 OBJECT OF THE DOCUMENT
The aim of this document is to provide technical guidelines to help the customer to design solutions based on
HiAllNC module.
1.2 REFERENCE DOCUMENTS
[1] URD1 5717.1 004 72589 - HiAllNC Technical Specification
[2] URD1 5635.1 008 70248 - AT Command Set for SAGEMCOM Modules
[3] URD1 5635.1 118 72618 – Radio Application Note for Hilo Modules
[4] URD1 5696 3 001 72497 - HiLoNC-3GPS Technical Specification
1.3 DOCUMENT MODIFICATIONS
The information presented in this document should be accurate and reliable. However Sagemcom assumes no
responsibility for its use, nor any infringement of patents or other third party rights which may result from its use.
This document is subject to change without notice.
1.4 CONVENTIONS
SIGNAL NAME: All signal names written on the pins of the HiAllNC module are in italics.
Specific attention must be granted to the information given here.
1.5 TERMS AND ABBREVIATION
ADC Analog to Digital Converter
CODEC Coder-Decoder
CLIP Calling Line Identification Presentation
COLP Connected Line Identification Presentation
CLIR Calling Line Identification Restriction
COLR Connected Line Identification Restriction
CTS Clear To Send
CSD Circuit Switched Data
CS Codec Scheme
DCS Digital Communications System
DSR Data Set Ready
DTR Data Terminal Ready
EDGE Enhanced Data Rate for GSM Evolution
EGSM Extended GSM
ENS Enhanced network selection
EONS Enhanced operator name string
ESD Electrostatic Discharge
ETS European Telecommunication Standard
FTA Full Type Approval
GLONASS GLObal NAvigation Satellite System
GNSS Global aeronautical Navigation Satellite System
GSM Global System for Mobile communication
GPRS General Packet Radio Services
GPS Global Positioning System
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HBM Human Body Model
HDOP Horizontal Dilution Of Precision
HSCSD High Speed Circuit Switched Data
HSDPA High Speed Downlink Packet Access
HSUPA High Speed Uplink Packet Access
HSPA+ Evolved High-Speed Packet Access
IC Integrated Circuit
IEEE Institute of Electrical and Electronics Engineers
I/O Input / Output
ISO International Standards Organization
ITU International Telecommunication Union
IVS In-Vehicle System
JTAG Joint Test Action Group
Kbps kilobit per second
LCD Liquid Crystal Display
LED Light Emitting Diode
LTO Long Term Orbits
Mbps Megabit per second
MSD Minimum Set of Data
NAD Network Access Device
PBCCH Packet Broadcast Channel
PCB Printed Circuit Board
PCM Pulse Code Modulation
PCS Personal Communication System
PSAP Public Safety Answering Point
PWM Pulse Width Modulation
RAM Random Access Memory
RF Radio Frequency
RI Ring Indication
RMS Root Mean Square
RTS Ready To Send
RX Reception
SIM Subscriber Identification Module
SMS Short Message Service
SV Satellite Vehicle
TBC To Be Clarified
TTFF Time To First Fix
TX Transmission
UART Universal Asynchronous Receiver and Transmitter
UMTS Universal Mobile Telecommunications System
USB Universal Serial Bus
USSD Unstructured Supplementary Service Data
VAD Vehicle Access Device
VM Virtual Machine
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2. BLOCK DIAGRAM
VBAT
GND
VGPIO
VBACKUP
GPIO x6
ADC x2
UART1 8pins
UART0 4pins
SPI
JTAG
PCM
MIC_IN
HSET_OUT
IC SIM
EXT SIM
Memory
(Flash + RAM)
HiAllNC Baseband
JAVA apps
VM
eCall library
GSM Baseband
26MHz 32.768KHz
Figure 1: HiAllNC Block diagram
GNSS
library
DAT
TRL
C
D
ATA
A
SAW
Filters
GNSS
16.369MHz
HiAll
850
GSM
900
1800
1900
LNA
PA
&
Switch
R
F
EXT_LNA_EN
SAW
Filter
NC
PPS
RF
2G_TX_
IND
R
F
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3. FUNCTIONAL INTEGRATION
3.1 POWER DOMAIN
HiAllNC module has several power domains as defined below.
• SIM I/Os 1.8V or 2.9V
• VBACKUP 3V
• Digital IOs 2.8V
• VBAT 3.3V to 4.5V
• MIC_IN 2.85V
• HSET_OUT same as VBAT
• ADC 2.85V
The table below summarizes the power domain for each I/O:
Supply
HiAll
Pad
number
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
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Pad name Pad type Description
GND GND GND 0V
GND GND GND 0V
GND GND GND 0V
RF_GSM RF GSM RF IN/OUT
GND GND GND 0V
GND GND GND 0V
GND GND GND 0V
GND GND GND 0V
RESERVED
(3G
compatibility)
RESERVED
(3G compatibility)
RESERVED
(3G compatibility)
GND GND GND 0V
RF_GPS GPS RF IN GPS RF input
GND GND GND 0V
PPS Digital output buffer
GPS synchro
Pulse Per Second
UART1_DTR Digital output buffer UART data terminal ready 2.8V
UART1_DSR Digital input buffer UART1 data set ready 2.8V
UART1_CTS Digital input buffer UART1 clear to send 2.85V
UART1_RX Digital input buffer UART1 receive 2.85V
UART0_TX Digital output buffer UART0 transmit 2.85V
UART0_RTS Digital output buffer UART0 ready to send 2.8V
RESERVED
(3G
compatibility)
RESERVED
(3G compatibility)
RESERVED
(3G compatibility)
PCM_CLK Digital bi-directional buffer Digital audio clock 2.85V
PCM_SYNC Digital bi-directional buffer Digital audio sync 2.85V
HSET_N Analog output
HSET_P Analog output
Differential output to
earphone 32 ohms
Differential output to
earphone 32 ohms
MIC_P Analog input Differential input from 2.85V
voltage
domain
Note 1
2.8V
-
3.7V
3.7V
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microphone
26
27
28
29
30
31
32
33
34
35
36
MIC_N Analog input
RESET Digital input Module Reset 2.8V
VBACKUP Power supply input/output
VBAT Power supply input
ADC1 Analog input
ADC0 Analog input
POK_IN Digital input Module power on signal 3V
SIM_VCC Power supply output SIM power supply 1.8V/2.9V
SIM_DATA Digital bi-directional buffer SIM data 1.8V/2.9V
SIM_CLK Digital output buffer SIM clock 1.8V/2.9V
GPIO1 Digital bi-directional buffer
Differential input from
microphone
Backup battery power
supply
+3.7V power supply
(nominal)
Analog input to digital
converter
Analog input to digital
converter
General purpose
input/output 1
2.85V
3V
3.7V
2.85V
2.85V
2.8V
Serial peripheral interface.
37
SPI_IRQ Digital input buffer
To be connected for debug
2.8V
purpose.
HiAll
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
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RESERVED
(futur use)
GPS_EXT_LN
A_EN
GPIO2 Digital bi-directional buffer
GPIO3 Digital bi-directional buffer
TRST Digital bi-directional buffer JTAG reset 2.8V
VBAT_PA Power supply input for PA
VBAT_PA Power supply input for PA
GND GND GND 0V
GND GND GND 0V
GND GND GND 0V
GND GND GND 0V
GND GND GND 0V
GND GND GND 0V
GND GND GND 0V
GND GND GND 0V
GND GND GND 0V
GND GND GND 0V
GND GND GND 0V
GND GND GND 0V
VBAT Power supply input
UART1_DCD Digital output buffer UART data carrier detect 2.8V
UART1_RTS Digital output buffer UART1 ready to send 2.85V
UART1_TX Digital output buffer UART1 transmit 2.85V
UART1_RI Digital output buffer UART1 ring indicator 2.8V
UART0_RX Digital input buffer UART0 receive 2.85V
UART0_CTS Digital input buffer UART0 clear to send 2.8V
RESERVED RESERVED RESERVED -
RESERVED
(futur use)
RESERVED
(futur use)
Digital output buffer GPS LNA Enable 2.8V
General purpose
input/output 2
General purpose
input/output 3
+3.7V power supply
(nominal)
+3.7V power supply
(nominal)
+3.7V power supply
(nominal)
2.8V
2.8V
3.7V
3.7V
3.7V
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(3G
(3G compatibility) (3G compatibility)
compatibility)
65
66
67
68
69
70
71
PCM_OUT Digital output buffer Digital audio out 2.85V
PCM_IN Digital input buffer Digital audio in 2.85V
RESERVED
(3G
compatibility)
RESERVED
(3G
compatibility)
RESERVED
(3G
compatibility)
RESERVED
(3G
compatibility)
VGPIO Power supply
RESERVED
(3G compatibility)
RESERVED
(3G compatibility)
RESERVED
(3G compatibility)
RESERVED
(3G compatibility)
RESERVED
(3G compatibility)
RESERVED
(3G compatibility)
RESERVED
(3G compatibility)
RESERVED
(3G compatibility)
Power supply for external
components
-
-
-
-
2.8V
Serial peripheral interface.
72
SPI_IN Digital input buffer
To be connected for debug
2.8V
purpose.
Serial peripheral interface.
73
SPI_OUT Digital output buffer
To be connected for debug
2.8V
purpose.
Serial peripheral interface.
74
SPI_SEL Digital bi-directional buffer
To be connected for debug
2.8V
purpose.
Serial peripheral interface.
75
SPI_CLK Digital bi-directional buffer
To be connected for debug
2.8V
purpose.
HiAll
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
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TMS Digital input buffer JTAG mode select input 2.8V
TDI Digital input buffer JTAG data input 2.8V
TDO Digital output buffer JTAG data output 2.8V
SIM_RST Digital output buffer SIM reset 1.8V/2.9V
JTAG_TEST Digital input buffer JTAG TEST input 2.8V
RESERVED
(Factory use)
RESERVED
(Factory use)
Factory use. Do not
connect.
TCK Digital input buffer JTAG clock input 2.8V
GPIO4 Digital bi-directional buffer
GPIO5 Digital bi-directional buffer
GPIO6 Digital bi-directional buffer
General purpose
input/output 4
General purpose
input/output 5
General purpose
input/output 6
2.8V
2.8V
2.8V
VIO_SEL Digital input buffer VGPIO voltage selection
2G_RF_IND Digital output buffer 2G Transmit indicator 2.85V
RTCK Digital output buffer JTAG return clock 2.8V
GND GND GND 0V
GND GND GND 0V
GND GND GND 0V
GND GND GND 0V
GND GND GND 0V
GND GND GND 0V
GND GND GND 0V
GND GND GND 0V
GND GND GND 0V
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98
99
100
101
102
103
104
105
106
107
108
109
110
111
112
113
114
115
116
Note 1: VIO_SEL (Pad86) left unconnected
GND GND GND 0V
GND GND GND 0V
GND GND GND 0V
GND GND GND 0V
GND GND GND 0V
GND GND GND 0V
GND GND GND 0V
GND GND GND 0V
GND GND GND 0V
GND GND GND 0V
GND GND GND 0V
GND GND GND 0V
GND GND GND 0V
GND GND GND 0V
GND GND GND 0V
GND GND GND 0V
GND GND GND 0V
GND GND GND 0V
GND GND GND 0V
.
Do not power the module I/O with a voltage over the specified limits, this could damage the module.
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3.2 SIM CARD
3.2.1 Internal SIM card
HiAllNC module embeds an IC SIM Card as an optional hardware feature (MFF2 format according to ETSI
standard).
To get information about internal IC SIM Card option, please contact SAGEMCOM.
3.2.2 External SIM card connection
HiAllNC module provides also external SIM interface.
Figure 2: Typical SIM schematic
Figure 3: SIM card signals
HiAll
Decoupling capacitors must be added on SIM_CLK, SIM_RST, SIM_VCC and SIM_DATA signals as
close as possible to the SIM card connector to avoid EMC issues and in order to pass the SIM card
approval tests.
SIM_VCC must be used only for the SIM card.
Use ESD protection components to protect SIM card and module I/Os against Electrostatic Discharges.
ESD components must be placed as close as possible to the SIM. The following schematic shows how to
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protect SIM access of the 6 pin connector. This must be performed every time when the SIM card holder
is accessed by the end user.
If it is necessary to use long SIM bus lines of over 100mm, it is recommended to adopt serial resistors to
avoid electrical overshoot on SIM bus signals. Use 56 Ω for the clock line and 10Ω for the reset and data
lines.
To use external SIM detection function, a GPIO pad must be connected to SIM holder.
Figure 4: SIM schematic with protection serial resistors & EXT_SIM_DET signal
The schematic above includes a hardware SIM card presence detector. When SIM card is not inserted into SIM
holder, Pin9 and Pin10 of SIM holder are disconnected. A GPIO detects a high level during boot. Then there is
no initialization to SIM card. When SIM card is inserted, Pin9 is short to Pin10 by mechanic contact, and a GPIO
detects a low level during boot.
A
22pF capacitor is recommended on EXT_SIM_DET.
SIM card must not be removed from its holder while it is still powered. Switch the module off properly with
the AT command, then remove the SIM card from its holder.
3.2.3 SIM CARD priority
The SIM card selection is performed thanks to KSIMSEL parameter.
HiAllNC shall be configured to support to one of the following configuration:
- KSIMSEL=0 external SIM only
- KSIMSEL=1 internal SIM only
- KSIMSEL=2 priority to external SIM if both SIM cards are presents
Change of KSIMSEL value is taken into account only after reboot
Use of EXT_SIM_DET is mandatory to support KSIMSEL=2 feature (see KSIMSEL description in
reference [2])
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3.3 AUDIOS
The HiAllNC module provides both analogue and digital audio interfaces.
3.3.1 Analogue audio connection
HiAllNC module features one input path and one output path for analogue audio. Both the input path and the
output path are differential. The design examples in the following chapter will take into account the EMC, ESD
protections, and reducing the possible TDMA noise in sensitive area by performing the given routing rules.
customer’s product.
3.3.1.1 Connecting microphone and speaker
HiAllNC module can manage an external microphone (MIC_P/MIC_N) in differential mode and an external
speaker (HSET_OUT_P / HSET_OUT_N) in differential mode. Thus, one speaker and one microphone can be
connected to the module. The 1.4V voltage to bias the microphone is implemented in the module.
ESD protection
If the design is ESD or EMC sensitive, we strongly recommend reading the notes below.
A poor audio quality could either come from the PCB routing and placement or from the chosen components (or
even both).
Note that acoustic engineering competences are mandatory to get accurate audio performance on
The speaker connected to the module should be 32 ohms.
HiAllNC
Figure 5: Analogue audio connection
Speaker
MIC
3.3.1.1.1 Notes for microphone
Pay attention to the microphone device, it must not be sensitive to RF disturbances.
As described in the layout chapter, differential pairs must be routed in parallel and same length (MIC_P
and MIC_N signals)
If you need to have deported microphone out of the board with long wires, you should pay attention to the
EMC and ESD effect. In those cases, add the following protections to improve your design.
HiAll
To ensure proper operation of such sensitive signals, they have to be isolated from the others by
analogue ground on customer’s board layout. (Refer to Layout design chapter)
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+
33pF
Ferrite Bead
HiAllNC
3.3.1.1.2 Notes for speaker
As explained for the microphone, if the speaker is deported out of the board or is sensitive to ESD, use the
schematic here to improve the audio.
Ferrite Bead
33pF
Figure 6: Filter and ESD protection of microphone
ESD protection
ESD protection
18pF
MIC
ESD protection
HiAllNC
HSET_OUT_P, HSET_OUT_N tracks must be larger than other tracks: 0.1mm.
As described in the layout chapter, differential pairs must be routed in parallel and same length
(HSET_OUT_P and HSET_OUT_N signals)
The impedance of audio chain (filter + speaker) must be lower than 32Ω.
To use an external audio amplifier connected to a loud-speaker, use serial capacitors of 10nF on HiAllNC
audio outputs to connect the audio amplifier.
HSET_OUT_P
HSET_OUT_N
Figure 7: Filter and ESD protection of 32 ohms speaker
Ferrite Bead
Ferrite Bead
speaker
18pF
ESD protection
HiAll
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Figure 8: Example of D class TPA2010D1 1Watt audio amplifier connections
3.3.1.2 Recommended characteristics for the microphone and speaker
3.3.1.2.1 Recommended characteristics for the microphone
Item to be inspected Acceptance criterion
Sensitivity - 40 dB SPL +/-3 dB (0 dB = 1 V/Pa @ 1kHz)
Frequency response Limits (relatives values)
Freq. (Hz) Lower limit Upper limit
100 -1 1
200 -1 1
300 -1 1
1000 0 0
2000 -1 1
3000 -1.5 1.5
3400 -2 2
4000 -2 2
Current consumption 1 mA (maximum)
Operating voltage DC 1 to 3 V (minimum)
S / N ratio 55 dB minimum (A-Curve at 1 kHz, 1 Pa)
Directivity Omni-directional
Maximum input sound pressure level 100 dB SPL (1 kHz)
Maximum distortion 1%
Radio frequency protection Over 800 -1200 MHz and 1700 -2000 MHz, S/N ratio 50
dB minimum (signal 1 kHz, 1 Pa)
3.3.1.2.2 Recommended characteristics for the speaker
Item to be inspected Acceptance criterion
Input power: rated / max 0.1W (Rate)
Audio chain impedance 32 ohm +/- 10% at 1V 1KHz
Frequency Range
300 Hz ~ 4.0 KHz
Sensitivity (S.P.L) >105 dB at 1KHz with IEC318 coupler,
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