Because of the variety of uses for the products described in this publication,
those responsible for the application and use of this control equipment must
satisfy themselves that all necessary steps have been taken to assure that
each application and use meets all performance and safety requirements,
including any applicable laws, regulations, codes and standards.
The illustrations, charts, sample programs and layout examples shown in
this guide are intended solely for purposes of example. Since there are
many variables and requirements associated with any particular installation,
Allen-Bradley does not assume responsibility or liability (to include
intellectual property liability) for actual use based upon the examples shown
in this publication.
Allen-Bradley publication SGI-1.1, Safety Guidelines for the Application,Installation, and Maintenance of Solid State Control (available from your
local Allen-Bradley office), describes some important differences between
solid-state equipment and electromechanical devices that should be taken
into consideration when applying products such as those described in this
publication.
Reproduction of the contents of this copyrighted publication, in whole or in
part,
without written permission of Allen-Bradley Company, Inc. is prohibited.
Throughout this manual we use ATTENTION and Important to alert you
to the following:
ATTENTION: Tells readers where people may be hurt,
machinery may be damaged, or economic loss may occur, if
procedures are not followed properly.
ATTENTION helps you:
- identify a hazard
- avoid the hazard
- recognize the consequences
Important: Identifies information that is especially important for successful
application and understanding of the product.
Important: We recommend that you frequently back up your application
programs on an appropriate storage medium to avoid possible data loss.
PLC is a registered trademark of Allen-Bradley Company, Inc.
PanelView, and PanelBuider are trademarks of Allen-Bradley Company, Inc
Summary of Changes
Summary of Changes
Summary of Changes
We revised this publication to include changes due to upgrading the
1771-QDC/B module to a 1771-QDC/C.
For These ChangesRefer to Page(s)
Lossofsensor detection
input range changed back to 0.00 to 10V dc
Added the section, Record I/O Ranges.
Added the title Ground and Shield Your I/O Devices to
better describe the task.
Reversed the order of chapters 3 and 4 to present the
download procedure for the MCC block before the
download procedure for the other data blocks.
Revised the download procedure for the MCC block
(chapter 3) and for other command blocks (chapter 4).
Added data codes to Profile Block worksheets.Chapter 8 and Appendix A
Placed 2page worksheets on facing pagesChapters 7 and 8
Minor correctionsas found
35, 310
A3, A4
21
29
Chapters 3 and 4
To Help You Find Changes
To help you find these changes, we added change bars as shown to the left.
Chapter
Record
Set Module Jumper Plugs 22
Key Your I/O Chassis 25
Install
Wire
Ground and Shield Your I/O Devices 29
Plan for EStops and Machine Interlocks 211
Configure the QDC Module'
Chapter
Use Worksheets to Select Module Parameters and I/O Ranges 31
Determine Initial Sensorconfiguration Values 34
Download
Use SetOutput Operation to Move the Ram (Screw) 38
Complete Your Sensor Configuration 39
Select
Chapter
Configuration Concepts 41
Special Command and Status Blocks 42
Overview of Remaining Configuration Procedures 43
Enter Data Table Values and Download Command Blocks 44
Chapter
About Jogging 51
Use These Worksheets 51
Determine
Write Ladder Logic 55
Jog Your Ram (Screw) 57
Configure Jogs for the Clamp and Ejector 57
Write Ladder Logic to Assist with Clamp & Eject Jogs 59
Jog Your Clamp and Ejector 510
Chapter
Use These Worksheets 72
Procedure
Determine
Select the T
Set Values for Expert Response CompensationE (ERC) 715
Determine Unselected Valve Setoutput Values 715
Set Your Acceleration/Deceleration Ramp Rates 717
Determine Setoutput Values for End of Profiles 718
Set Pressure Control Limits 719
Set V
Set
Set
Chapter
Use These Worksheets 81
Determine and Record Setpoints for the Injection Profile (IPC) 82
Determine Bit Selections for Worksheet 8A 84
Determine Word Values for Worksheet 8A 85
Enter and Download your Worksheet Values 89
Determine and Record Setpoints for the Pack/Hold Profile (HPC) 89
Determine Bit Selections for Worksheet 8B 812
Enter and Download your Worksheet Values 815
Determine and Record Setpoints for Plastication Profile (PPC) 816
Determine Bit Selections for Worksheet 8C 818
Determine Word Values for Worksheet 8C 819
Enter and Download your Worksheet Values 822
. . . . . . . . . . . . . . . .
. . . .
. . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . .
Span Your V
Chapter
Referenced Worksheets 91
Span Your Injection Pressure Valve 92
Span Your Injection V
Span Your Pack and Hold Pressure Valves 913
Span Your Plastication Pressure Valve 920
Span Y
Tune Your Machine for Producing Parts 101. . . . . . . . . . . . . . .
Chapter
Closedloop Control 102
Tune Closedloop Pressure Control 102
Tune Closedloop V
Tuning Considerations for Production Parts 108
Profile Requirements 108
Cushion, Shot Size, and T
Unselected Valve Setoutput Values 1013
Logical Bridges and Endofprofile Setoutput Values 1015
Decompression Pullback 1016
Acceleration and Deceleration Ramp Rates 1016
Watchdog T
Pressure
Pressurelimited
Expert Response Compensation 1021
Use this preface to familiarize yourself with this manual so you can use it
effectively. This manual shows you how to apply the QDC module to your
molding machine in the minimum length of time.
Since this manual is task oriented, we recommend that you perform these
tasks in the following order:
Perform this task:As discussed in this
Browse through the entire manual to become familiar with its
contents.
Overview the inject process. This presents an overview on
how the QDC module controls the inject phase of your injection
molding system.
Install the QDC module. This includes such tasks as wiring
and setting jumpers.
Configure the QDC module mode to match your specific
application, and to communicate with inputs and outputs.
Overview of remaining configuration procedures that you will
perform throughout the remainder of this manual.
Jog the ram (screw). This task requires jog setpoints to be
configured along with jog pressure alarm setpoints.
Set up communications between your PLC5 processor and
the QDC module. Select command and status bits that you will
use when writing your ladder logic.
Load your initial configuration values to the QDC module. This
task requires you to determine and enter values into
configuration blocks in preparation for chapter 9.
Load your initial machine profile setpoints to the QDC module.
This is performed in preparation for chapter 9.
Span your machine's valves for inject mode. This is done
using setoutput and openloop control.
Tune your machine for producing parts.Chapter 10
Troubleshoot problems that may occur with the QDC module.Chapter 11
Refer to this appendix for a blank copy of each worksheet
contained in this manual.
chapter:
All chapters
Chapter 1
Chapter 2
Chapter 3
Chapter 4
Chapter 5
Chapter 6
Chapter 7
Chapter 8
Chapter 9
Appendix A
P-1
Preface
Audience
Use
of T
erms
In order to apply the QDC module to a molding machine, we assume that
you are an:
injection molding professional
experienced programmer with Allen-Bradley PLC-5 processors
hydraulics designer or technician
We use these abbreviations:
Abbreviated Name:Item
QDC module1771QDC Plastic Molding Module
PLC processor
T45 or T47
T50 or T53 terminal
ProSet 600 Software
PanelView Terminal
PLC5 Processor
1784T45 or T47
1784T50 or T53 Industrial Terminal
The next table presents other terms we commonly use in this manual:
Term:Definition:
Selected ValveIn multivalve systems, depending on the configured profile, the QDC
module controls one valve and presets the setting of the remaining
valves to produce moldingmachine profiles. We call the valve being
controlled by the QDC module's algorithms the selected valve.
Unselected ValvesIn multivalve systems, depending on the configured profile, the QDC
module controls one valve and presets the remaining valves to
produce moldingmachine profiles. We call the valves that are preset
with an open loop percentage setpoint the unselected valves.
ProfileA group of mold/part setpoints which define a given machine operation
to the QDC module.
Command Blocks
Status BlocksData blocks used by the QDC module to relay information to the
Direct Acting ValveAn analog control valve that delivers increasing velocity or pressure
Reverse Acting ValveAn analog control valve that delivers increasing velocity or pressure
Data blocks downloaded from the PLC5 data table to the QDC
module to make configuration changes or to initiate machine actions.
PLC5 processor about the QDC module's current operating status.
with increasing signal input.
with decreasing signal input.
P-2
Preface
Command Blocks
Command blocks provide the parameters that control machine operation.
They are transferred from the PLC processor to the QDC module by means
of block transfer write (BTW) instructions in software ladder logic. Their
abbreviations are:
Acronym:Description:
MCCModule Configuration Block
JGCJog Configuration Block
INCInjection Configuration Block
IPCInjection Profile Block
PKCPack Configuration Block
HDCHold Configuration Block
HPCPack/Hold Profile Block
PRCPredecompression Configuration Block
PLCPlastication Configuration Block
PPCPlastication Profile Block
PSCPostdecompression Configuration Block
DYCDynamic Command Block
RLC
Inject ERC Values Command Block
Status Blocks
Status blocks report current status of molding-machine operation. They
are returned from the QDC module to the PLC processor by means of
block transfer read (BTR) instructions in software ladder logic. Their
abbreviations are:
Acronym:Description:
SYSSystem Status Block
IPSInjection Profile Status Block
HPSPack/Hold Profile Status Block
PPSPlastication Profile Status Block
RLS
Inject ERC Values Status Block
P-3
Preface
Word and bit Numbering
The QDC module stores data in command and status blocks. Each word
location in a command or status block is identified by an alphanumeric
code containing the block acronym and word number. For example, word
09 of the Module Configuration Command Block (MCC) is identified as
MCC09.
Identify bits in a word location by adding bit numbering to the abbreviated
word location. For example:
Specific: MCC09-B15General: MCCxx-Byy
where:
MCC = Module Configuration Command Block
xx=word number (01-64)
B = bit identifier
yy = bit number (00-15)
Related
Publications
The following table lists documentation necessary for the successful
application of the QDC module:
Publication
17856.6.1PLC5 Family Programmable
6200N8.0016200 PLC5 Programming
17714.10Application guideSelect QDC module's mode of operation and
17716.5.86
17716.5.87
17716.5.93
17716.5.88Plastic Molding Module
#:
Use this documentation:To:
Controller Installation Manual
Software Documentation Set
Plastic Molding Module,
1771QDC, User Manuals
1771QDC, Reference
Manual
Install the PLC processor and I/O modules.
Select instructions and organize memory
when writing ladder logic to run your machine
match it to your machine's hydraulics
Configure, program, install, and operate your
QDC module in other QDC modes of
operation
Program block transfers between PLC
processor and QDC. Also, information on
PLC5 data transfer logic.
P-4
Preface
Take time now to familiarize yourself with the Reference Manual,
publication 1771-6.5.88. The five sections, in brief, include:
summary of each data block used by the QDC module
(abbreviated command and status blocks)
programming error codes returned by the QDC module for each data
block, and recommended procedures to correct these errors
detailed listing and explanation of each command word and bit used by,
and each status word and bit returned from, the QDC module
operational, mechanical, electrical, and environmental specifications
about your module
instructions to help you calibrate your QDC module
If you purchased Pro-Set 600 software, you also need the following:
Publication
65006.5.11ProSet 600 Software
65006.5.12ProSet 600 Software
65006.5.13ProSet 600 Software
65006.5.14ProSet 600 Software
65006.5.15ProSet 600 Software
#:
Use this documentation:To:
Designer's Guide
Assembly Manual
Overlay Installation Manual
Customization Manual
Reference Manual
Select the ProSet 600 software that matches
the requirements of your molding machine.
Transfer your ProSet 600 software from a
floppy to your hard drive. Add overlays into
your PLC5 and PanelView application files.
Install ProSet 600 overlays into your
application files to obtain desired features.
Customize your ProSet 600 application to
your machinecontrol requirements.
Support customizing your software control
system.
P-5
Chapter
Overview of Inject Mode
1
Chapter
Objectives
Inject Mode Operation
Inject PhaseDescription
InjectionThe ram (screw) injects plastic into the mold. You can vary the velocity of the ram (screw), or the pressure
This chapter presents an overview of the 1771-QDC Plastic Molding
Module in the Inject mode. We present a summary of Inject features
followed by sample applications.
Important: This manual assumes you have already read your Plastic
Molding Module Application Guide, publication 1771-4.10, and have
chosen Inject as your QDC module’s mode of operation.
The Inject mode controls the following actions of your molding machine:
Shoots hot plastic into the mold
Packs and holds the plastic until cured
Reloads for the next shot
When you select the Inject mode, you can use the following phases:
Table 1.A
of Inject Mode
Phases
driving it, to fill areas of the mold cavity at different rates to achieve uniform quality of the molded part.
This phase can be critical to part quality. The pattern of velocity or pressure variation during injection is
called the injection profile.
TransitionDetects when injection is complete.
Pack
(optional)
HoldHolding lets the plastic cool and shrink slightly from the mold cavity in preparation for ejection. The affect
Pre-decompression
(optional)
PlasticationThe machine reloads by drawing plastic beads into the barrel containing the ram (screw). The mechanical
Post-decompression
(optional)
Packing pressurizes the plastic to a specified density which determines the flexibility of the molded part.
To achieve uniform density, you can release or increase pressure in steps according to cooling gradients
across the mold. Thus, as the plastic cools unevenly, the pack profile can compress the plastic uniformly.
is similar to packing. You can hold at predetermined pressures for predetermined lengths of time
throughout the hold phase.
This single, backward movement of the ram (screw) separates plastic solidifying in the mold from molten
cushion remaining in the barrel prior to plastication. This phase is also referred to as sprue break.
action of the rotating ram (screw) grinds and melts the beads. The longer it grinds, the hotter it melts. You
can vary the screw RPM or backpressure on the ram (screw) causing it to remain longer in an area. Thus,
you can induce any desired temperature gradient along the length of the shot.
This single, backward movement of the ram (screw) guards against drooling molten plastic into the open
mold during ejection prior to the next injection. This phase is also called melt pullback or suckback.
1-1
Chapter 1
Overview of Inject Mode
Figure 1.1
Operation of a T
Inject
ypical Machine Cycle
Clamp
& Eject
Operation
InjectionPackHold
Post-PreDecompressionDecompression
Transition to
Pack or Hold
Plastication
(Reload)
Injection Phase
You can vary the velocity of the ram (screw), or the pressure driving it, so
the leading edge of the melt moves through the mold cavity at the desired
speed. The pattern of velocity or pressure variation during injection is
called the injection profile. The QDC module lets you chose from four
different injection profiles:
velocity vs. position
pressure-limited velocity vs. position
pressure vs. position
pressure vs. time
1-2
11109
Figure 1.2
Example
Injection Profile
87654321
Position or T
ime
Velocity
or
Pressure
You enter setpoints to create a profile. You can select from 1 to 11
segments of position or time. Segment numbers represent the order of
operation. By convention the ram (screw) injects plastic by moving from
right to left.
Chapter 1
Overview of Inject Mode
With this Profile
Velocity vs. PositionSpeedLength of the shot
Pressure-limited [1]
Velocity vs. Position
Pressure vs. PositionPressureLength of the shot
Pressure vs. TimePressureTime for a shot
You Control InjectionWith up to 11 Segments
Speed, with a maximum
pressure
Distributed over the
Length of the shot
[1] Pressure-limited velocity vs. position profile differs from the velocity
vs. position profile as follows: During any segment of a pressure-limited
profile if the pressure exceeds a preset limit, the module switches to PID
pressure control with the pressure limit as the setpoint. Then if velocity
exceeds the velocity setpoint, the module returns to velocity control.
Example Benefits of Profiling an Injection Phase
The injection phase should force the melt through the mold as fast as
possible without flashing or burning the melt at a mold gate. Here are two
examples of how you can achieve this by profiling the injection phase.
5
43
Velocity Example – As the leading edge of melt enters mold cavities, the
flow of plastic through the gate should increase or decrease accordingly to
keep the melt front at maximum desired speed without flashing the mold.
This reduces injection time and minimizes surface stress due to surface
cooling. You achieve this by shaping the injection profile to suit the mold
cavity (figure 1.3).
Figure 1.3
Velocity
Mold Cavity
Flow into mold
Example
1
2
Gate
Mold
End
Injection
5
Sequence of execution
Profile
4
Position
Velocity
23
1
Back
Point
1-3
Chapter 1
Overview of Inject Mode
Flash Prevention Example -
With a velocity profile (figure 1.4 part 1),
the pressure may reach a peak and flash the mold at ram (screw) position
segments (part 2) that correspond to events such as:
the initial surge (2.a)
when the melt front enters a constriction in the mold cavity (2.b)
You can remedy this (part 3) by decreasing the ram (screw) velocity at
segments (3.a) and (3.b) that correspond to flash points. Conversely, you
can boost velocity at segment (3.c) where the resulting pressure is well
below the flash point. Segment pressures in part 4 are optimum for the
velocity vs. position profile in part 3.
Figure 1.4
Prevention Example
Flash
1. Initial Velocity Profile
Velocity
2. Resulting Pressure Profile
Flash
Point
Pressure
PositionPosition
3. Final Velocity Profile
Velocity
b ca
Position
ba
4. Resulting Pressure Profile
ba
Position
cbca
Flash
Point
Pressure
c
As an option, you may select pressure-limited velocity vs. position
injection control. With your pressure-limit setpoint below the flash point,
the module switches to pressure control prior to flashing the mold.
1-4
Chapter 1
Overview of Inject Mode
Injectiontopack Transition
The QDC module ends the injection phase and automatically starts the
pack or hold phase when it detects the first of up to four events occurred:
Ram (screw) position exceeds a preset limit
Ram (screw) pressure exceeds a preset limit
Cavity pressure exceeds a preset limit
Injection phase elapsed time exceeds a preset limit
You select which of these events you want monitored for transition by
entering the appropriate setpoint, or zero for ignoring the event. You also
may specify the zone of ram (screw) travel over which pressure transitions
may or may not occur.
Pack Phase
The QDC module controls the pack phase with a pressure vs. time profile.
You create the profile based on controlling hydraulic pressure against the
ram (screw), or by controlling pressure within the mold cavity resulting
from hydraulic pressure against the ram (screw). You can control either
pressure with up to five time segments. By convention, events occur from
right to left on the time axis (figure 1.5). You determine the pressure
setpoints and time durations for the pack profile based on molding
requirements. The pack phase is optional.
Figure 1.5
Phase Example
Pack
Pressure
4
5
Time
123
1-5
Chapter 1
Overview of Inject Mode
Lower density
(last zone filled)
Example Benefits of Profiling the Pack Phase
Molten plastic may cool unevenly in the mold causing variations in density
with the end result of warpage and distortion as shown in Figure 1.6.
Figure 1.6
Uneven
Density in Mold Cavity
Cooling in Pack Phase
Higher density
(gate zone,
greater pressure)
Pack Profile
Pressure
Gate
You can remedy this by decreasing the pack pressure with time so plastic
can back out of the mold as shown in Figure 1.7. This is to alleviate
gradations in density as the plastic cools from the low-density end of the
mold (last zone filled) to the high-density end of the mold cavity (gate
zone where pressure is greater).
Figure 1.7
Cooling in Pack Phase
Even
Constant Pressure over entire Mold Cavity
Density in Mold Cavity
Gate
5
Time
Pack Profile
5
234
Time
1
Pressure
234
1
1-6
After completing the last segment of the pack phase, the QDC module
automatically starts the hold phase.
Chapter 1
Overview of Inject Mode
Hold Phase
The QDC module controls the hold phase with a pressure vs. time profile.
You create the profile based on controlling hydraulic pressure against the
ram (screw), or by controlling pressure within the mold cavity resulting
from hydraulic pressure against the ram (screw). You can control either
pressure with up to five time segments. You determine the pressure
setpoints and time durations for the hold profile based on your molding
requirements.
After completing the last segment of the hold phase, the QDC module
either immediately starts the optional Pre-decompression movement, skips
the pre-decompression movement if none is required and immediately
starts the plastication phase, or waits for a command from your PLC
program to continue.
Predecompression Movement
You select a length of pullback for the ram (screw) prior to the plastication
phase to separate plastic solidifying in the sprue from molten cushion
remaining in the barrel.
After completing the pre-decompression movement, the QDC module
either immediately starts the plastication phase or waits for a command
from your PLC program to continue.
Plastication Phase
The plastication phase lets you achieve a melt temperature gradient in the
barrel containing the ram (screw). To do this, you can create the
plastication profile with up to 11 segments of position or time (figure 1.8).
You chose from four plastication profiles:
Backpressure vs. position
Backpressure vs. time
Screw RPM vs. position
Screw RPM vs. time
1-7
Chapter 1
Overview of Inject Mode
Figure 1.8
Plastication
Backpressure or Screw RPM
12 345
Mold End
Phase Example
hotter
6
Position or Time
Temperature Gradient
Barrel Containing the Melt
7891011
cooler
Back Point
Affects of Profiling a Plastication Phase
Backpressure and/or screw RPM have these affects on plastication:
The higher the backpressure (or screw RPM) during plastication, the
higher the resultant temperature of the melt.
You can accelerate the backup rate by reducing backpressure
(or increasing screw RPM).
You can increase resultant melt temperature by increasing backpressure
(or increasing screw RPM).
After completing the last segment of the Plastication phase, the QDC
module either immediately starts the Post-decompression movement or
waits for a command from your PLC-5 program to continue.
Postdecompression Movement
You select a length of Post-decompression pull-back of the ram (screw)
after the Plastication phase to guard against drooling molten plastic into the
open mold during ejection. The QDC module notifies your PLC-5
program when the Post-decompression movement is complete.
Screw Speed
Beginning with the 1771-QDC/C revision of the module, you can control
and monitor screw RPM only when you have configured the QDC module
for the singular Inject mode. None of the other mode combinations allow
for connecting a screw RPM sensor to the QDC module.
1-8
Chapter
Install the QDC Module
2
Chapter
Objectives
Record I/O Ranges
This chapter guides you through the following installation procedures:
record I/O ranges
set module jumpers
key your I/O chassis
install your QDC module
wire I/O devices to your QDC module
ground your system
plan for E-Stops and Machine Interlocks
To match your QDC module to your I/O devices, record the I/O ranges of
your I/O devices on Worksheet 2-A. You will use this information in this
chapter for hardware configuration (setting jumper plugs) and in chapter 4
to configure the module’s inputs and outputs with software.
Circle or check the I/O ranges on Worksheet 2-A. Cross off I/O not used.
Worksheet 2A
I/O Ranges
Record
I/O Connection:Voltage 1:Voltage 2:Current:
Input 1 (Screw position)0 to 10 Vdc1 to 5 Vdc4 to 20 mA
Input 2 (Screw pressure)0 to 10 Vdc1 to 5 Vdc4 to 20 mA
Input 3 (Screw RPM)0 to 10 Vdc1 to 5 Vdc4 to 20 mA
Input 4 (Cavity pressure)0 to 10 Vdc1 to 5 Vdc4 to 20 mA
Output 110 to 10 Vdc0 to 10 Vdc4 to 20 mA
Output 210 to 10 Vdc0 to 10 Vdc4 to 20 mA
Output 310 to 10 Vdc0 to 10 Vdc4 to 20 mA
Output 410 to 10 Vdc0 to 10 Vdc4 to 20 mA
2-1
Chapter 2
Install the QDC Module
Set Module Jumper Plugs
Before installing the QDC module, you must select with jumper plugs the
I/O ranges that you recorded on Worksheet 2-A.
Access and Position the Jumpers
Access the jumpers and set them as follows:
ATTENTION: To avoid damage to internal circuits, observe
handling precautions and rid yourself of any electrostatic
charge. Use an anti-static work station when setting jumper
plugs.
1. Remove the label-side cover plate by removing the four screws.
2. Remove the circuit board from the module housing by removing the
two screws located center-front at the swingarm catch.
3. Carefully turn over the circuit board so it is oriented as in figure 2.1.
Handle it by the edges to avoid touching conductors or components.
4. Use figure 2.1 to locate the jumper plugs.
5. Set the jumper plugs (Table 2.A) using a small needle-nose pliers.
6. After setting the jumper plugs, re-assemble the module.
2-2
Chapter 2
Install the QDC Module
Figure 2.1
Jumper
LEFT
Locations on the QDC Module'
TOP
E5
s Circuit Board
E1
E6
RIGHT
E7
E8
E9
E10
E11
E12
E15
E16
E14
E13
E17
BOTTOM
10908I
Important: We define jumper plug positions as left, right, top, and bottom.
This represents the position of the jumper plug on the 3-pin connector as
relative to the sides of the circuit board shown above.
-10 to +10VDC = top
0 to +10VDC or
4 to 20mA = bottom [1]
Important: If you select current output with jumper plugs E10, E14, E13,
and/or E17, then you must select the 4 to 20mA jumper position with E11,
E12, E15, and/or E16.
ATTENTION: If an output is unconnected, set the jumper
(E11, E12, E15, and/or E16) that corresponds to that output to 0
to 10 Vdc (bottom position). Setting the jumpers for –10 to +10
Vdc and later configuring the output as “unconnected” causes
the QDC module to output –10 Vdc on that channel when
stopped or when a system reset occurs and all outputs are forced
to 0% (i.e. 0% output equals –10Vdc).
Important: Selecting –10 to +10 VDC with jumper E11, E12, E15, and/or
E16 sets the QDC module for bi-directional valve operation. The
relationship to percentage output is as follows:
10
0
Output Voltage (Vdc)
-10
0 102030405060708090100
%Output Requested
2-4
Chapter 2
Install the QDC Module
Key Your I/O Chassis
Use the plastic keying bands, shipped with each I/O chassis, for keying I/O
slots to accept only one type of module. This is done to prevent the
inadvertent installation of the wrong module into the wrong slot.
The QDC module is slotted in two places on the rear edge of the circuit
board. The position of the keying bands on the backplane connector must
correspond to these slots to allow insertion of the module.
Place keying bands between the following terminal numbers labeled on the
backplane connector of your I/O chassis (see Figure 2.2):
between 20 and 22
between 26 and 28
Figure 2.2
Positions
Keying
2
4
6
8
10
12
14
16
18
20
Keying
Bands
22
24
26
28
30
32
34
36
Install the QDC Module
1771QDC
12676
Install your QDC module in an I/O chassis with these steps:
1.First, turn off power to the I/O chassis.
ATTENTION: Remove power from the 1771 I/O chassis
backplane and wiring arm before removing or installing a QDC
module.
Failure to remove power from the backplane could cause injury
or equipment damage due to possible unexpected operation.
2-5
Chapter 2
Install the QDC Module
Failure to remove power from the backplane or wiring arm
could cause module damage, degradation of performance, or
injury.
2. Place the module in the plastic tracks on the top and bottom of the
slot that guides the module into position.
Important: Be aware that Pro-Set 600 expects your QDC module to be
placed in slot 0 of I/O rack 0 when operating in inject mode. If you choose
to install your QDC module in some other slot, some modifications to your
PLC-5 application program will be necessary (refer to your Pro-Set 600
documentation for details).
3. Do not force the module into its backplane connector. Apply a firm
and even pressure on the module to seat it properly.
Wire the QDC Module
4. Snap the chassis latch over the top of the module to secure it.
5. Connect the wiring arm to the module.
Use the wiring arm (1771-WF) supplied with the QDC module to wire I/O
devices (Figure 2.3). The wiring arm lets you install or remove the QDC
module from the I/O chassis without rewiring. Wiring arm terminals are
numbered in descending order from the top down, starting with terminal 18
(Figure 2.3 and Table 2.B).
2-6
Figure 2.3
W
iring and Grounding
I/O
Chapter 2
Install the QDC Module
+
Customer
PS
–
+
Screw
Position
Sensor
–
+
Screw
Pressure
Sensor
–
+
Screw
RPM
Sensor
–
+
Cavity
Pressure
Sensor
–
Input 3
Input 4
Input 1
Input 2
–
Customer
PS
18
+
–
+
Amplifier
Valve 1
+
–
+
–
To Valve 1
+
–
Amplifier
Valve 2
Amplifier
Valve 3
+
–
To Valve 2
+
–
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
Output 1
Output 2
Output 3
Earth Ground
Wiring Arm
1771WF
Output 4
+
–
Amplifier
Valve 4
To Valve 3
+
–
To Valve 4
10909I
2-7
Chapter 2
Install the QDC Module
Table 2.B
T
erminal Designations
I/O
TransducerI/O DesignationTerminal
Screw positionInput 1 (+)
(-)
Screw pressureInput 2 (+)
(-)
Input common14
Screw RPMInput 3 (+)
(-)
Cavity pressureInput 4 (+)
(-)
Valve 1Output 1 (+)
Output common
Valve 2Output 2 (+)
Output common
Valve 3Output 3 (+)
Output common
Valve 4Output 4 (+)
Output common
Not used01
18
17
16
15
13
12
11
10
09
08
07
06
05
04
03
02
ATTENTION: The QDC module has ESD protection to 20KV,
but you can damage the module by accidental application of the
wrong voltage to the I/O terminals. Do not exceed:
This voltageOn these terminalsWhen in
+12vdcinput (18 thru 10)any mode
+12vdcoutput (09 thru 02)voltage mode
+24vdcoutput (09 thru 02)current mode
2-8
Chapter 2
Install the QDC Module
Ground and Shield
our I/O Devices
Y
Input Sensor
Analog inputs and outputs are sensitive to electrical noise interference.
Take care to shield them properly.
Guidelines:
Use 22-gage (or larger) twisted-pair cable, 100% shielded with drain
wire, such as Belden 8761 (or equivalent). For cable distances over
50 ft, use 18-gage cable such as Belden 8760 (or equivalent)
Ground the cable shield at one end only; generally at the sensor or
amplifier end, not at the I/O chassis (see Figure 2.4 and Figure 2.5)
Figure 2.4
Shielding
Differential Inputs
QDC Module Input
18
17
18v
18v
+15V
22M
+
10G
–
22M
Connect the cable shield
and case ground to earth
ground at the Input Sensor
14
Do not connect.
Test purposes,
only.
-15V
109103
2-9
Chapter 2
Install the QDC Module
Figure 2.5
Shielding
QDC Module Output
Singleended Outputs
Customer Valve Amplifier
+
–
9
8
Connect the cable shield to earth ground
at the valve amplifier
Input
Ground
Chassis Ground
17182
ground the cable shields to a low-impedance earth ground of less than
1/8 ohm
do not connect any ground to input common (terminal 14) except as
specified below under Grounding Exceptions
place high-voltage Class A wiring and low-voltage class B wiring in
separate grounded conduits
in parallel runs, separate the Class A and B conduit by at least 1 foot
where conduit runs must cross, cross them at right angles
For additional grounding recommendations, refer to the Allen-Bradley
Programmable Controller Wiring and Grounding Guidelines, publication
1770-4.1.
Exceptions
If you experience unacceptable electrical noise interference, then try one or
both of the following alternative grounding connections:
connect the input cable shield to input common (terminal 14) after
disconnecting the shield from the transducer
connect the output cable shield to output common (terminals 8, 6, 4,
and/or 2) after disconnecting it from the valve amplifier
2-10
Chapter 2
Install the QDC Module
Plan for EStops and
Machine Interlocks
You must consider the installation of Emergency Stop (E-STOP) switches
and machine interlocks when you:
design your system
assemble mechanical/hydraulic components
wire system components
develop system ladder logic
ATTENTION: The Electrical Standard for Industrial
Machinery (NFPA 79-1987) requires an emergency stop that
when actuated, shall de-energize all electrical power circuits
which provide electrical energy to sustain machine motion.
Maintained contact “Emergency Stop” push buttons are
recommended.
ATTENTION: The American National Standard for Plastics
Machinery -- Horizontal Injection Molding Machines -- for
Construction, Care, and Use (ANSI B151.1-1984) requires
hydraulic, mechanical, and electrical interlocks to prevent
inadvertent clamp closing with a safety gate in an open position.
In addition, we strongly recommend that the electrical
interlocks consist of redundant devices and that the control
circuit be so arranged that malfunction or improper sequencing
of either redundant device prevents further operation of the
machine.
ATTENTION: NEMA Standards Publication ICS1.1, Safety
guidelines for the Application, Installation, and Maintenance of
Solid State Control recommends that the emergency stop and
safety gate electrical interlocks should directly control their
appropriate functions through an electromechanical device
independent of the solid state logic.
The next page shows an illustration of a typical grounded PLC power
distribution circuit. For ungrounded systems or for more information on
grounding and wiring guidelines, refer to Allen-Bradley publication
1770-4.1, Programmable Controller Wiring and Grounding Guidelines.
2-11
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