Rockwell Automation CS300 User Manual

Trusted
TM
PD-8162
TM
Trusted
CS300 Bridge Module
Introduction
Combining the two products will enable CS300 users to benefit from features such as 3-3-2-0 Processor fault tolerance, IEC 1131 programming suite, Ethernet networks, OPC, Ethernet peer to peer and remote diagnostics. The CS300 Bridge Module replaces the CS300 ICCB in the CS300 Primary chassis.
Any system using the CS300 Bridge Module and Trusted Expanders and I/O modules forming a Hybrid system. To the Trusted and CS300 chassis appear in the same system map. All systems using Trusted can be seamlessly integrated together.
TM
.
TM
TMR Processor can also include TrustedTM
TM
TMR Processor, the TrustedTM
TM
TMR Processors
Upgrade Features
Triple Modular Redundant (TMR), fault tolerant (3-3-2-0) operation
Dedicated hardware and software test regimes which provide very fast fault
recognition and response times
Automatic fault handling without nuisance alarming
Hot replacement, self-configuration.
TM
Interfaces to Trusted
Front panel indicators that show module health data transmission status
TÜV certification and IEC61508 SIL3
TMR Expander Bus
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Issue Record
Issue
umber Date Revised by Technical CheckAuthorised by Modification
N
1 Apr 08 A Holgate Nick Owens Pete Stock Initial Issue
2 Feb 10 A Holgate Nick Owens Pete Stock TC-322 details
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TrustedTM CS300 Bridge Module
Table of Contents
1. Description ...................................................................................................................................7
1.1. Overview......................................................................................................................................7
1.2. Power Distribution........................................................................................................................8
1.3. Communication Busses...............................................................................................................8
1.3.1. The TrustedTM to CS300 Primary Chassis...................................................................................8
1.3.2. Inter-Module Link (IML)................................................................................................................8
1.4. Function .......................................................................................................................................8
2. Installation....................................................................................................................................9
2.1. Module .........................................................................................................................................9
2.2. TC-322-02 Interface Cable assembly........................................................................................10
2.3. Module Configuration.................................................................................................................11
3. Application .................................................................................................................................13
3.1. System Configuration.................................................................................................................13
3.2. Board definitions........................................................................................................................17
3.3. Module – 8162 (Bridge Module).................................................................................................18
3.4. Module – bic (bus interface controller).......................................................................................19
3.5. Module – pi632 / pi732 (analogue input module).......................................................................20
3.6. Module – pi641 / pi741 (analogue output module).....................................................................21
3.7. Module – pi616_5 / pi616_9 / pi716 / pi717 (digital input module).............................................23
3.8. Module – pi626 / pi726 (digital output module)..........................................................................24
3.9. Module – pi627 / pi727 / pi627_fs / pi727_fs (digital output module).........................................26
3.10. Module – dmx_m (de-multiplexed display driver) ......................................................................28
3.11. Module – dmx_o (de-multiplexed display driver card) ...............................................................29
4. Operation ...................................................................................................................................30
4.1. Front Panel Indicators and Controls ..........................................................................................31
4.1.1. Tx & Rx Indicators .....................................................................................................................31
4.1.2. Health Indicator..........................................................................................................................31
4.1.3. On-Line Indicator and Switch.....................................................................................................31
5. Fault Finding and Maintenance..................................................................................................32
6. Specifications.............................................................................................................................33
Figures
Figure 1 Block Diagram showing interface between TrustedTM system and CS300 I/O ..........................7
Figure 2 8162 Bridge Module ...................................................................................................................9
Figure 3 TC-322-02 Interface Cable assembly.......................................................................................10
Figure 4 CS300 main chassis rear view .................................................................................................10
Figure 5 TrustedTM controller chassis rear view .....................................................................................11
Figure 6 CS300 Chassis Backplane.......................................................................................................11
Figure 7 TrustedTM Processor Chassis with Expander Interface ............................................................13
Figure 8 Insert New Chassis...................................................................................................................13
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Figure 9 CS300 Main Chassis................................................................................................................14
Figure 10 Chassis Connection................................................................................................................14
Figure 11 Connected Chassis ................................................................................................................14
Figure 12 Jumper Setting .......................................................................................................................15
Figure 13 BIC Chassis Addressing.........................................................................................................15
Figure 14 CS300 Modules......................................................................................................................16
Figure 15 Module Options ......................................................................................................................16
Figure 16 Front Panel Layout .................................................................................................................30
Tab le s
Table 1 Bridge Module Associated Equipment.........................................................................................6
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Precautionary Information
WARNING
Warning notices call attention to the use of materials, processes, methods, procedures or limits which
ust be followed precisely to avoid personal injury or death.
m
CAUTION
Caution notices call attention to methods and procedures which must be followed to avoid damage to the equipment.
Notes: Notes highlight procedures and contain information to assist the user in the understanding of the
information contained in this document
Warning
RADIO FREQUENCY INTERFERENCE
Most electronic equipment is influenced by Radio Frequency Interference (RFI). Caution should be exercised with regard to the use of portable communications equipment around such equipment. Signs should be posted in the vicinity of the equipment cautioning against the use of portable communications equipment.
MAINTENANCE
Maintenance must be performed only by qualified personnel, otherwise personal injury, death, or damage to the system may be caused.
Caution
HANDLING
Under no circumstances should the module housing be removed.
Associated Documents
Product Descriptions (PD) provide product specific information. The Safety Manual contains the recommended safety requirements for the safety system design. The PD-T8082 – Toolset Suite provides specific guidance on system configuration and application
generation. The Operator and Maintenance Manual contains general guidelines on maintenance and diagnostic
procedures.
For technical support email: support@icstriplex.com
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TrustedTM CS300 Bridge Module
Associated Equipment

Part Number Product Name Description

Adds equipment definitions for CS300 modules
T8043 CS300 Toolset Library
CS300/SC300E Interface Cable
TC-322-02
TC-324-02
Assembly CS300 Interface Cable
Connector Card
Table 1 Bridge Module Associated Equipment
to the Trusted To connect between Trusted
Interface Adaptor and CS300 Controller Chassis To attach TC-322-02 cable to CS300 Controller
Chassis
TM
Toolset
TM
Expander
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Module
Bridge Module (A)
Backplane
1. Description
1.1. Overview
The CS300 Bridge Module enables connection between a CS300 I/O sub system and the TrustedTM TMR Processor. Three CS300 Bridge modules replace the three ICCB modules in a CS300 primary chassis.
The Bridge module has a fast serial ("Hotlink") interface that transfers command and response packets between the two product families via the Trusted Programmable Gate Array (FPGA) for decoding instructions from the Trusted accessing the specified CS300 I/O module and returning any data requested.
Command data received by the three Bridge modules and responses to the Trusted are synchronised in accordance with the Lock Step operational characteristics of the Trusted Expander Bus. For this reason, the three bridge modules share their data and arrange their response packets in the same order for simultaneous transmission. The clock signal received from the Expander Bus is used to ensure that data from all three Bridge modules is transmitted on the same clock edge.
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The Trusted
TMR processor stores and executes the application program, scans and updates the CS300 I/O modules and detects system faults. Each of the three slices of the TMR Processor executes the application program independently, but in lock-step synchronisation with the other two.
All CS300 I/O actions are executed by polling only. This means that all CS300 I/O modules are supported, with the exception of Serial I/O modules (which generate interrupts). All communications to workstations and DCS systems are enabled through the Trusted
(C)
Expansion Bus (TC-322-02 Cable)
TM
Expander Bus. The module uses a Field
TM
Communications Interfaces.
(TC-324-02 Board)
Bridge Module (C)
TM
TMR processor,
TM
TMR Processor
Inter Module
Link
TM
(B)
(A)
FCR A
Trusted
Expander
Interface
Trusted™
Main Chassis
FCR A
Bridge Module (B)
hotlin k
receiver
hotlin k
transmitter
CS30 0
Main Chassis
FPGA
Figure 1 Block Diagram showing interface between TrustedTM system and CS300 I/O
CS300
to CS300 I/O Modules
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1.2. Power Distribution
1.3. Communication Busses
1.3.1. The TrustedTM to CS300 Primary Chassis
Communication between the TrustedTM Expander Interface Module and the CS300 Primary Chassis is via one of a possible four or seven triplicated two-way interface cables. A single backplane connector card routes the individual links in the cable to the three Bridge modules. Data voting is provided at the Expander Module Interface to ensure that cable faults are detected.
The link handles the following triplicated signals: Data - Serial bi-directional bus. Control - Bus clocks, module-enables and bus direction control. Slot - Indicating the CS300 I/O slot position to the Bridge.
M
T
Expander Chassis ID - 4 bit Trusted
chassis address code.
1.3.2. Inter-Module Link (IML)
When returning data for TrustedTM Read requests, I/O Module data received by each Bridge module is shared with the other two using the serial IML via the backplane. The three sets of data are then arranged sequentially into the response packet for Trusted requests.
M
T
. The IML is not used during Write
1.4. Function
When an I/O access is to be performed, the TrustedTM TMR Processor issues a command packet to an Expander Interface Module. The Expander Interface decodes the chassis address and transmits the packet through an Expander bus to receivers in the 8162 Bridge modules.
For short distances of a few metres, a twisted-pair copper cable is used, whilst on longer runs the copper cable is connected to three T8312 fibre optic units at each end of three pairs (Tx and Rx) of fibre optic cable. The Bridge modules, receiving the command signals, decode the packet.
The Bridge modules then implement the read or write access on the CS300 I/O module selected and return a response packet via the serial expander bus. The packet will contain both data and diagnostic information.
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2. Installation
2.1. Module
Each of the three Bridge modules replaces one of the CS300 ICCB modules. Figure 2 shows the module. The replacement must be carried out with the system offline.
The modules consist of a single PCB assembly.
Figure 2 8162 Bridge Module
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2.2. TC-322-02 Interface Cable assembly
The interface cable connects from the TrustedTM Interface Adaptor T8312 to an identical 12 way socket on the interface cable connector card.
Figure 3 TC-322-02 Interface Cable assembly
Figure 4 CS300 main chassis rear view
Figure 4 shows the interface cable connector card (top left) fitted to the rear of the CS300 controller chassis which is connected to the Trusted
TM
Expander Interface adaptor via the TC322-02 interface
cable (braided cable at top left). Connectors J1-3 on the TC-324-02 card plug into the three 26-way headers on the CS300 backplane.
The expander cable TC-322-02 from the Trusted
TM
Expander Interface plugs into 12-way socket J4.
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Figure 5 TrustedTM controller chassis rear view
Figure 5 shows a four socket version of the T8312 Expander Interface Adaptor with a TC-301-01 cable attached, which connects to a Trusted or seven connections available to individual Trusted
TM
expander chassis. The Expander Interface Adapter has four
TM
Expander chassis or to the CS300 controller
chassis using the TC-322-02 Interface Cable Assembly.
2.3. Module Configuration
The Bridge module requires minimum configuration, namely the setting of three sets of jumpers 0 to 3 to define the chassis address to Trusted shown here.
TM
. These are situated on the CS300 chassis backplane as
Figure 6 CS300 Chassis Backplane
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The four backplane jumpers 0,1,2,3 (A,B,C) represent the binary address bits 1,2,4 & 8 respectively. A
itted jumper signals a binary digit ‘1’. The address is set to between 2 and 8. On the first CS300
f chassis (containing the CS300 Bridge Modules), fit jumper 1 (A,B,C) to represent Trusted '2'. The jumpers on all three sets must be set to the same address. Leave the jumpers as they were on the other CS300 chassis. It is usual to attach the chassis with address 2 to the first Expander Interface Adapter socket, for both Trusted
TM
chassis and CS300 chassis. This makes the software configuration
easier.
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address
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3. Application
M
All CS300 I/O modules are configured using the IEC1131 application Toolset provided with Trusted
his configuration requires entries in the System Configuration (System.INI) for the chassis and
T modules and their hardware operational parameters, and also in the workbench I/O connection table, for software settings and data connection.
3.1. System Configuration
T
.
All TrustedTM systems need a system configuration file, specifying the chassis and modules in the system. For Trusted Trusted
TM
controller chassis, as for TrustedTM -only systems. An example with Expander Interfaces in
M
T
/CS300 hybrid systems, a T8311 Expander Interface is required in the
slots 1 and 2 (companion slots) and communications interfaces in slots 7 and 8 is shown below. For details of the System Configuration Tool please refer to product description PD-T8082.
TM
Figure 7 Trusted
The CS300 chassis are attached to the Expander Interface as if they were Trusted
Processor Chassis with Expander Interface
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expander chassis, but the various chassis options for Triguard and CS300 are provided on the ‘Insert New Chassis’ dialog. Right-click on the background of the configurator window to insert a new chassis.
Figure 8 Insert New Chassis
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The first chassis to be created is a CS300 8162. This includes the bridge modules in place of the CS300 processors. Choose typeCS300 8162 and select a logical chassis number. This chassis number will define the switch configuration described in section 2.3.
Figure 9 CS300 Main Chassis
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The chassis should then be allocated to the Trusted or right end of the CS300 8162 chassis to open the Chassis Connection dialog. Select the slot number of the left-hand Expander Interface module.
Expander Interface module. Left-click on the left
Figure 10 Chassis Connection
On closing this dialog, the CS300 8162 chassis should have a blue flash symbol on the left. The right hand side shows the chassis address as:
TM
< Trusted
expander Interface slot> - <Expander socket number> - <CS300 chassis number>
Figure 11 Connected Chassis
Left-click on the left or right end of the CS300 8162 chassis to open the Chassis Connection dialog again. The ‘Jumper Config’ button now demonstrates how to set the backplane jumpers.
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Figure 12 Jumper Setting
This chassis then links into the extension chassis BIC, which is linked to the main CS300 8162 chassis by ribbon cables.
To add a BIC chassis, right click again on the background and select CS300 BIC. The switch settings on these chassis should not be changed from their old configuration in the CS300 system. Select the 8162 chassis to connect the new chassis to (Parent 8162 Chassis Number), and enter the chassis number as configured on the chassis address switches on the BIC chassis (Triguard Chassis Number). Closing this window and left-clicking on the chassis ends will show the Jumper Config button, which will confirm the switch settings that have been selected.
Figure 13 BIC Chassis Addressing
The chassis will now show its address on the right end as:
TM
< Trusted
expander Interface slot> - <Expander socket number> - <CS300 chassis number>
e.g. 1-2-2 in the above example.
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Having added all the chassis in the system, the next step is to insert modules. For each module, right­click on the appropriate chassis slot. Select the module from the list.
Figure 14 CS300 Modules
On left-clicking the module, the module options are displayed.
Figure 15 Module Options
If the module has been allocated a Hot Repair partner slot, so that the partner module can take over on failure, then check the Hot Repair Module option. The configurator will automatically allocate the next appropriate slot, but this may be edited. There is no need to insert a module for the hot repair slot; the configurator will add this automatically There is also no need to edit the options for the hot repair module. The hot repair partnership is set up using the interlinking ribbon cable between the modules.
The ‘Mode’ is included for PI727 modules which can be set to 3-2-1 or 3-2-0 operation.. For output modules, an input module may be configured to monitor the outputs as a diagnostic
feedback. Where this is required, check the Enable Monitor option and select the chassis and slot of the input module. For analogue output modules, also select the monitor channel.
With monitoring enabled, it is possible to add LFD testing. Complete testing is only possible with two online output cards (in a hot repair configuration).
To allow the system to run with a module absent, check ‘Simulate’. Ensure that the options selected are as configured in the original application.
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3.2. Board definitions
There are no restrictions in the order of the boards set out in the connection table except in cases where TM117-DMX (64-Channel De-Multiplexed Driver) termination cards are configured in the system. These have to be defined before any CS300I/O modules are specified. The DMX cards are driven from the Trusted
It is also general convention to specify the Trusted table.
In a true hybrid system including Trusted definitions have to be referred to in the associated Product Description.
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processor module’s serial ports.
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TM
I/O modules, conventions for entering the various board
main processor at the head of the connection
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3.3. Module – 8162 (Bridge Module)
DESCRIPTION
This definition provides module status for a 8162 primary chassis expansion interface module that provides an expansion bridge from Trusted
The logical module accounts for the 3 physical modules FCR-A, FCR-B and FCR-C.
OEM PARAMETERS: OEM parameter Valid numbers Description CHASSIS 2-29 Logical chassis number allocated to the primary CS300 chassis in
which the 8162 modules are placed.
SLOT 16 Logical slot within the Primary CS300 chassis by which the Trusted
system identifies the 8162 module. This cannot be configured. PHYSICAL MODULE: RACK 1: [STATUS] - 6 BOOL Inputs Variable 1: TRUE = Logical module responding Variable 2: TRUE = FCR-A faulted or not responding Variable 3: TRUE = FCR-B faulted or not responding Variable 4: TRUE = FCR-C faulted or not responding RACK 2: [INFO] - 12 ANALOGUE Inputs Word 1: FCR-A fault code (see note 1) Word 2: FCR-B fault code (see note 1) Word 3: FCR-C fault code (see note 1) Word 4: FCR-A hot-link error count Word 5: FCR-B hot-link error count Word 6: FCR-C hot-link error count Word 7: FCR-A IML own-link error count Word 8: FCR-A IML down-link error count Word 9: FCR-A IML up-link error count Word 10: FCR-B IML own-link error count Word 11: FCR-B IML down-link error count Word 12: FCR-B IML up-link error count Word 13: FCR-C IML own-link error count Word 14: FCR-C IML down-link error count Word 15: FCR-C IML up-link error count
[Note 1 - Fault Codes] 0 : No fault 1 : Local backplane fault 2 : Local expansion bus fault 3 : Common fault (applies to both local backplane and expansion busses)
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to CS300 systems.
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3.4. Module – bic (bus interface controller)
DESCRIPTION
This definition provides module status for a PI 651/751 Bus Interface Controller that provides expansion interface for secondary chassis in the CS300 system.
The logical module accounts for the 3 physical modules FCR-A, FCR-B and FCR-C.
OEM PARAMETERS: OEM parameter Valid numbers Description CHASSIS 2-29 Logical chassis number allocated to the local secondary CS300
chassis in which the BIC modules are placed. SLOT 16 Logical slot within the local secondary CS300 chassis by which the
Trusted
configured.
PHYSICAL MODULE: RACK 1: [STATUS] - 10 BOOL Inputs Variable 1: FALSE (Not used) Variable 2: TRUE = FCR-A faulted Variable 3: TRUE = FCR-B faulted Variable 4: TRUE = FCR-C faulted
Note: The status of BIC FCR's can only be determined by the discrepancy status of accesses performed to I/O modules within the chassis of the BIC. If no such modules exist or if no BIC FCR's are fitted then no faults can be reported.
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system identifies the BIC module. This cannot be
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3.5. Module – pi632 / pi732 (analogue input module)
DESCRIPTION This definition will open a single PI632 or PI732.
OEM PARAMETERS OEM parameter Valid numbers Description CHASSIS 2-29 Logical chassis and slot number where the CIO_AI is located. SLOT 1-15
PHYSICAL MODULE: RACK 1: (AI) 16 INTEGER inputs RACK 2: (DIAG) 2 INTEGER inputs Word 1 Diagnostic bits bit 0 Slice A =1 slice is not responding or there is an error =0 slice is responding bit 1 Slice B =1 slice is not responding or there is an error =0 slice is responding bit 2 Slice C =1 slice is not responding or there is an error =0 slice is responding bit 3 Module offline or missing =1 offline or missing =0 online bit 4 Single slot hot repair =1 in progress =0 not in progress bit 5 Discrepancy errors =1 faults detected =0 no faults detected Word 2 Slot number of active module RACK 3: (FAULTS) 1 INTEGER inputs Word 1 Discrepancy errors, channels 1-16 (bit 0 = channel 1)
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3.6. Module – pi641 / pi741 (analogue output module)
DESCRIPTION This definition will open a single PI641 or PI741.
OEM PARAMETERS OEM parameter Valid numbers Description CHASSIS 2-29 Logical chassis and slot number where the CIO_AO is located. SLOT 1-15
PHYSICAL MODULE: RACK 1: (AO) 4 INTEGER outputs RACK 2: (DIAG) 2 INTEGER inputs Word 1 Diagnostic bits bit 0 Slice A =1 slice is not responding or there is an error =0 slice is responding bit 1 Slice B =1 slice is not responding or there is an error =0 slice is responding bit 2 Slice C =1 slice is not responding or there is an error =0 slice is responding bit 3 Module offline or missing =1 offline or missing =0 online bit 4 Single slot hot repair =1 in progress =0 not in progress bit 5 Discrepancy errors =1 faults detected =0 no faults detected Word 2 Slot number of active module RACK 3: (FAULTS) 2 INTEGER inputs Word 1 Discrepancy errors, channels 1-4 (bit 0 = channel 1) Word 2 LFD errors, channels 1-4 (bit 0 = channel 1)
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RACK 4: (CALIB) 4 BOOLEAN outputs (one per channel) which determine if the AO output data is taken from
RACK 1 (AO) or from RACKs 5-7 (CALIB_x). =0, output data taken from RACK 1 (AO) =1, output data taken from RACKs 5-7 (CALIB_x) RACK 5: (CALIB_A) 4 INTEGER outputs Output data used for Slice A on the AO module. Only used if the corresponding Boolean output
in RACK 4 (CALIB) is TRUE. RACK 6: (CALIB_B) 4 INTEGER outputs Output data used for Slice B on the AO module. Only used if the corresponding boolean output
in RACK 4 (CALIB) is TRUE. RACK 7: (CALIB_C) 4 INTEGER outputs Output data used for Slice C on the AO module. Only used if the corresponding boolean output
in RACK 4 (CALIB) is TRUE.
NOTES: Discrepancy errors will only be checked if the AO module has a configured AI monitor module.
Discrepancy errors indicate a difference between the output value on an AO and the voted input value on the AI monitor.
LFD errors will only be checked if the AO module has a configured AI monitor module and LFD testing is enabled on that AO module.
The calibration racks (4-7) can be used to aid calibration of the D/A converters on the AO modules. They allow different values to be sent to each slice's D/A converter, allowing each to be calibrated individually.
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3.7. Module – pi616_5 / pi616_9 / pi716 / pi717 (digital input module)
DESCRIPTION This definition will open a single PI616 type 5 or PI616 type 9 or PI716 or PI717.
OEM PARAMETERS OEM parameter Valid numbers Description CHASSIS 2-29 Logical chassis and slot number where the module is located. SLOT 1-15
PHYSICAL MODULE: RACK 1: (DI)
32 BOOLEAN inputs RACK 2: (DIAG) 2 INTEGER inputs Word 1 Diagnostic bits bit 0 Slice A =1 slice is not responding or there is an error =0 slice is responding bit 1 Slice B =1 slice is not responding or there is an error =0 slice is responding bit 2 Slice C =1 slice is not responding or there is an error =0 slice is responding bit 3 Module offline or missing =1 offline or missing =0 online bit 4 Single slot hot repair =1 in progress =0 not in progress bit 5 Discrepancy errors =1 faults detected =0 no faults detected Word 2 Slot number of active module RACK 3: (FAULTS) 2 INTEGER inputs Word 1 Discrepancy errors, channels 1-16 (bit 0 = channel 1) Word 2 Discrepancy errors, channels 17-32 (bit 0 = channel 17)
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3.8. Module – pi626 / pi726 (digital output module)
DESCRIPTION This definition will open a single PI626 or PI726.
OEM PARAMETERS OEM parameter Valid numbers Description CHASSIS 2-29 Logical chassis and slot number where the CIO_DO is located. SLOT 1-15 PHYSICAL MODULE: RACK 1: (DO) 32 BOOLEAN outputs RACK 2: (DIAG) 2 INTEGER inputs Word 1 Diagnostic bits bit 0 Slice A =1 slice is not responding or there is an error =0 slice is responding bit 1 Slice B =1 slice is not responding or there is an error =0 slice is responding bit 2 Slice C =1 slice is not responding or there is an error =0 slice is responding bit 3 Module offline or missing =1 offline or missing =0 online bit 4 Single slot hot repair =1 in progress =0 not in progress bit 5 Discrepancy errors =1 faults detected =0 no faults detected
bit 6 LFD faults =1 faults detected =0 no faults detected Word 2 Slot number of active module
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RACK 3: (FAULTS) 4 INTEGER inputs Word 1 Discrepancy errors, channels 1-16 (bit 0 = channel 1) Word 2 Discrepancy errors, channels 17-32 (bit 0 = channel 17) Word 3 LFD errors, channels 1-16 (bit 0 = channel 1) Word 4 LFD errors, channels 17-32 (bit 0 = channel 17)
NOTES: Discrepancy errors will only be checked if the DO module has a configured DI monitor module. Discrepancy errors indicate a difference between the output value on a DO and the voted input value
on the DI monitor.
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3.9. Module – pi627 / pi727 / pi627_fs / pi727_fs (digital output module)
DESCRIPTION This definition will open a single PI627 or PI727. If the module is configured as 3-2-1 then the ‘_fs’
version is required and the option must also be marked in the system configuration for this module.
OEM PARAMETERS OEM parameter Valid numbers Description CHASSIS 2-29 Logical chassis and slot number where the CIO_DO is located. SLOT 1-15
PHYSICAL MODULE: RACK 1: (DO) 32 BOOLEAN outputs RACK 2: (DIAG) 2 INTEGER inputs Word 1 Diagnostic bits bit 0 Slice A =1 slice is not responding or there is an error =0 slice is responding bit 1 Slice B =1 slice is not responding or there is an error =0 slice is responding bit 2 Slice C =1 slice is not responding or there is an error =0 slice is responding bit 3 Module offline or missing =1 offline or missing =0 online bit 4 Single slot hot repair =1 in progress =0 not in progress bit 5 Discrepancy errors =1 faults detected =0 no faults detected
bit 6 LFD faults =1 faults detected =0 no faults detected Word 2 Slot number of active module
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RACK 3: (FAULTS) 4 INTEGER inputs Word 1 Discrepancy errors, channels 1-16 (bit 0 = channel 1) Word 2 Discrepancy errors, channels 17-32 (bit 0 = channel 17) Word 3 LFD errors, channels 1-16 (bit 0 = channel 1) Word 4 LFD errors, channels 17-32 (bit 0 = channel 17)
NOTES:
Discrepancy errors will only be checked if the DO module has a configured DI monitor module. Discrepancy errors indicate a difference between the output value on a DO and the voted input value
on the DI monitor.
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3.10. Module – dmx_m (de-multiplexed display driver)
DESCRIPTION This definition will open a single TM117-DMX Master.
OEM PARAMETERS OEM parameter Valid numbers Description PORT_A 1-3 MP serial port number for the DMX chain primary link PORT_B 0 or 2/3 MP serial port number for the DMX chain secondary link (=0 disables
the secondary link)
PHYSICAL MODULE: RACK 1: (DMX) 1 BOOLEAN output not used
NOTES: The dmx_m module must be defined before the dmx_o modules.
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3.11. Module – dmx_o (de-multiplexed display driver card)
DESCRIPTION This definition will open a single TM117-DMX output card.
OEM PARAMETERS OEM parameter Valid numbers Description DMX_BOARD_ID 1-64 DMX board ID
PHYSICAL MODULE: RACK 1: (DMX) 64 INTEGER outputs Valid values: 0 = Off 1 = Slow flash on/off 2 = Fast flash on/off 3 = On (steady) 4+ = Invalid (will result in output being off)
NOTES: The dmx_m module must be defined before the dmx_o modules.
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4. Operation
Figure 16 Front Panel Layout
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4.1. Front Panel Indicators and Controls

4.1.1. Tx & Rx Indicators

Flashing amber LEDs indicate active transmit and receive communications on the Expander Bus.
4.1.2. Health Indicator
A steady green LED indicates a fault-free Bridge module; an extinguished LED indicates a fault.

4.1.3. On-Line Indicator and Switch

Raising and releasing the on/off-line switch momentarily takes the module off-line, which is mirrored by the steady On/Off state of the amber On-Line LED. Repeating the action brings the module back on­line.
Prior to hot-swapping the module for repair, it should be taken off-line using this feature to ensure a clean exit from the system. The replacement module is then placed on-line using the switch.
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TrustedTM CS300 Bridge Module
5. Fault Finding and Maintenance
The TrustedTM TMR Processor provides fault monitoring, self test and diagnostics functions.
M
T
Fault Detection within a Trusted
M
Trusted
T
TMR Processor and Expander Hardware CS300 Bridge Hardware CS300 I/O Hardware User Application
TM
Using current Trusted
methods for detection of faults, the TMR Processor can monitor for failures up to the Expander section. The MP is also able to separate Bridge hardware faults from CS300 I/O module faults. The CS300 I/O modules carry out on-board diagnostic tests which are relayed back to the TMR Processor via the Bridge module.
The user application can also be programmed to read error flags in the I/O module fault registers to annunciate the detection of module faults. Second faults that leave the system unable to confirm healthy operation will result in the TMR Processor stopping all communication with the 8162 bridge modules, ensuring that critical outputs go to a safe state when the internal watchdogs time out.
/ CS300 system can be categorised into four regions –
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TrustedTM CS300 Bridge Module
6. Specifications
Supply Voltage 5.4Vdc ± 5% Heat Dissipation 3W max Operating Temperature (convection cooling) 0°C to 60ºC (32°F to 140°F) Storage Temperature -40°C to 100ºC (-40°F to 212°F) Operating Humidity 5 to 95% RH, non-condensing Vibration 10 to 500 Hz peak to peak 1g Shock Operating:11ms, ½ sine wave 15g Electromagnetic Interference: IEC 801 Part 2 Electrostatic Discharges Contact discharge to 6kV
IEC 801 Part 3 – Radiated Electromagnetic Fields 10V/m, 27MHz to 500Mh
IEC 801 Part 4 - Transients and Bursts 2kV, 2.5kHz for t=60 seconds Height: 290 mm (11.4 ins) Width: 37 mm (1.5 ins) Depth: 370 mm (14.6 in) Weight (approx) 760g (1.7 lbs.)
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Trusted
TM
PD-8162
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