Renesas BP-272, HS7058ECB61H, SH7058, PMCL400 User Manual

SH7058 Group BP-272
User System Interface Board
HS7058ECB61H User’s Manual
Renesas Microcomputer Development Environment System
SuperHTM Family/SH7050 Series
Rev.3.00
2004.3.1

Cautions

Keep safety first in your circuit designs!
1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of sub stitu tiv e, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap.
Notes regarding these materials
1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party.
2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials.
3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor home page (http://www.renesas.com).
4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from the information contained herein.
5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use.
6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials.
7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited.
8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein.

IMPORTANT INFORMATION

READ FIRST
• READ this user's manual before using this user system interface board.
• KEEP the user's manual handy for future reference. Do not attempt to use the user system interface board until you fully understand its
mechanism.
User System Interface Board:
Throughout this document, the term " user system i nt erface b oard" shall be defined as the following product produced only by Renesas Technology Corp. excluding all subsidiary products.
User system interface board (HS7058ECB61H) The user system or a host computer is not included in this definition.
Purpose of the User System Interface Board:
This user system interface board is for connecting the evaluation chip board and user system. This user system interface board must only be used for the above purpose.
Improvement Policy:
Renesas Technology Corp. (including its subsidiaries, hereafter collectively referred to as Renesas) pursues a policy of continuing improvement in design, performance, functions, and safety of the user system interface board. Renesas reserves the right to change, wholly or partially, the specifications, design, user's manual, and other documentation at any time without notice.
Target User of the User System Interface Board:
This user system interface board should only be used by those who have carefully read and thoroughly understood the information and restrictions contained in the user's manual. Do not attempt to use the user system interface board until you fully understand its mechanism.
It is highly recommended that first-time users be instructed by users that are well versed in the operation of the user system interface board.
I
LIMITED WARRANTY
Renesas warrants its user system interface boards to be manufactured in accordance with published specifications and free from defects in material and/or workmanship. Renesas will repair or replace any user system interface boards determined to be defective in material and/or workmanship. User system interface boards are wearing parts which Renesas will not repair or replace if damaged and/or worn through use. The foregoing shall constitute the sole remedy for any breach of Renesas’ warranty. This warranty extends only to you, the original Purchaser. It is not transferable to anyone who subsequently purchases the user system interface board from you. Renesas is not liable for any claim made by a third party or made by you for a third party.
DISCLAIMER
RENESAS MAKES NO WARRANTIES, EITHER EXPRESS OR IMPLIED, ORAL OR WRITTEN, EXCEPT AS PROVIDED HEREIN, INCLUDING WITHOUT LIMITATION THEREOF, WARRANTIES AS TO MARKETABILITY, MERCHANTABILITY, FITNESS FOR ANY PARTICULAR PURPOSE OR USE, OR AGAINST INFRINGEMENT OF ANY PATENT. IN NO EVENT SHALL RENESAS BE LIABLE FOR ANY DIRECT, INCIDENTAL OR CONSEQUENTIAL DAMAGES OF ANY NATURE, OR LOSSES OR EXPENSES RESULTING FROM ANY DEFECTIVE USER SYSTEM INTERFACE BOARD, THE USE OF ANY USER SYSTEM INTERFACE BOARD, OR ITS DOCUMENTATION, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. EXCEPT AS EXPRESSLY STATED OTHERWISE IN THIS WARRANTY, THIS USER SYSTEM INTERFACE BOARD IS SOLD "AS IS ", AND YOU MUST ASSUME ALL RISK FOR THE USE AND RESULTS OBTAINED FROM THE USER SYSTEM INTERFACE BOARD.
II
State Law:
Some states do not allow the exclusion or limitation of implied warranties or liability for incidental or consequential damages, so the above limitation or exclusio n may not apply to you. This warrant y gi ves yo u spec i fic le gal rig hts, and you ma y ha ve ot her rig hts which may vary fro m state to state.
The Warranty is Void in the Following Cases:
Renesas shall have no liability or legal responsibility for any problems caused by misuse, abuse, misapplication, neglect, improper handling, installation, repair or modifications of the user system interface board without Renesas’ prior written consent or any problems caused by the user system.
All Rights Reserved:
This user's manual and user system interface board are copyrighted and all rights are reserved by Renesas. No part of this user's manual, all or part, may be reproduced or duplicated in any form, in hard-copy or machine-readable form, by any means available without Renesas’ prior written consent.
Other Important Things to Keep in Mind:
1. Circuitry and other examples described herein are meant merely to indicate the characteristics and perfor mance of Renesas’ semiconductor products. Renesas assumes no responsibilit y for any intellectual property claims or other problems that may result from applications based on the examples described herein.
2. No license is granted by implication or otherwise under any patents or other rights of any third party or Renesas.
Figures:
Some figures i n this user's manual may show items different from your actual system.
Limited Anticipation of Danger:
Renesas cannot anticipate every possible circumstance that might involve a potential hazard. The warnings in this user's manual and on the user system interface board are therefore not all inclusive. Therefore, you must use the user system interface board safely at your own risk.
III

SAFETY PAGE

READ FIRST
• READ this user's manual before using this user system interface board.
• KEEP the user's manual handy for future reference. Do not attempt to use the user system interface board until you fully understand its
mechanism.
DEFINITION OF SIGNAL WORDS
This is the safety alert symbol. It is used to alert you to potential personal
injury hazards. Obey all safety messages that follow this symbol to avoid possible injury or death.
DANGER
avoided, will result in death or serious injury.
WARNING
avoided, could result in death or serious injury.
CAUTION
avoided, may result in minor or moderate injury.
CAUTION
potentially hazardous situation which, if not avoided, may result in property damage.
DANGER indicates an imminently hazardous situatio n whic h, if not
WARNING indicates a potentially hazardous situation which, if not
CAUTION indic a tes a potentia lly hazar do us situat io n which, if not
CAUTION used without the safety alert symbol indicates a
NOTE
IV
emphasizes essential information.
WARNING
Observe the precautions listed below. Failure to do so will result in a FIRE HAZARD and will damage the user system and the emulator product or will result in PERSONAL INJURY. The USER PROGRAM will be LOST.
1. Do not repair or remodel the emulator product by yourself for electric shock prevention and quality assurance.
2. Always switch OFF the E6000H emulator and user system before connecting or disconnecting any CABLES or PARTS.
3. Always before connecting any BOARDS, make sure that pin 1 on both sides are correctly aligned.
V

Preface

The HS7058ECB61H is a user system interface board that connects a user system for the SH7058 BP-272 package to the SH7058 E6000H emulator (HS7058EPH60H).
i

Contents

Section 1 Configuration.....................................................................................1
Section 2 Connection Procedures......................................................................3
2.1 Connecting User System Interface Board to User System................................................3
2.1.1 Installing IC Socket..............................................................................................3
2.1.2 Fastening IC Socket Connector............................................................................6
2.2 Exchanging the Spacer of the EV-Chip Board..................................................................7
2.3 Connecting User System Interface Board to EV-Chip Board...........................................8
2.4 Recommended Dimensions for User System Mount Pad (Footprint) ...............................10
2.5 Dimensions for EV-Chip Board and User System Interface Board...................................11
2.6 Resulting Dimensions after Connecting User System Interface Board.............................12
Section 3 Verifying Operation...........................................................................13
Section 4 Notice.................................................................................................15
ii

Section 1 Configuration

Figure 1 and table 1 show the configuration and components of the user system interface board for the BP-272 package. Please make sure you have all of these components when unpacking.
EV-chip board
Spacer
User system
Screws (M2 x 8 mm)
Board
Pin 1
IC socket
Figure 1 User System Interface Board for the SH7058 BP-272 Package
1
CAUTION
Use a TQPACK256RD socket and CSPACK256Z202H01 (manufactured by Tokyo Eletech Corporation) for the BP-272 package IC socket and IC socket connector on the user system.
Table 1 HS7058ECB61H Components
No. Component Quantity Remarks
1 Board 1 2 IC socket 1 For the BP-272 package (installed on the user
system): CSPACK256Z2021H01 3 Spacer 1 For installing a BP-272 packaged MCU 4 Cover 1 For installing a BP-272 packaged MCU 5 Screws (M2 x 8 mm) 4 For installing a BP-272 packaged MCU 6 Driver 1 Dedicated screwdriver to fasten the screws. 7 Guide pins 4 8 Spacers (2.6MP x 25 mm) 2 9 User’s manual 1 User’s manual for HS7058ECB61H (this manual)
2

Section 2 Connection Procedures

2.1 Connecting User System Interface Board to User System

WARNING
Always switch OFF the user system and the emulator product before the USER SYSTEM INTERFACE CABLE is connected to or removed from any part. Before connecting, make sure that pin 1 on both sides are correctly aligned. Failure to do so will result in a FIRE HAZARD and will damage the user system and the emulator product or will result in PERSONAL INJURY. The USER PROGRAM will be LOST.
To connect the cable head to the user system, follow the instructions below.

2.1.1 Installing IC Socket

Install the socket for BP-272 packaged ICs on the user system.
(1) Gently apply solder to the BGA pads of the user system. Be careful to keep the thickness of
the solder within 100 to 150 µm. Too much solder will cause short-circuiting of the pin s.
(2) The IC socket is vacuum-packed to avoid oxidization of the surfaces of the solder balls. It
is thus recommended that the IC socket be installed on the user system immediately after the package is opened. After the package’s seal has been broken, store the socket in a desiccator. Do not touch the solder balls. If they are touched, solder may not adhere to the solder surface. The IC socket is covered by a protective cover. Socket and cover are fastened together by four screws before the whole is vacuum packed to prevent bending of the IC socket’s pins. To avoid the scattering (dispersal) of flux from other components to the IC socket, keep the protective cover on the IC socket u ntil solder reflow has been completed .
(3) Install the provided guide pins into the holes for the guide pins on the user system. Check
that the pads are correctly aligned with the IC socket.
3
(4) Notes on soldering the IC socket
a) The IC socket is larger than the actual IC package; therefore, refer to figure 4 for the
installation of other components.
b) Do not install components that occupy large volume close to the IC socket. Such
components will prevent the convective flow of heat during reflow.
c) Since the IC socket has a greater volume than the IC package, it is recommended that
the temperature profile under the conditions used in installation be measured by attaching a temperature sensor to the back side of the IC socket.
d) Actual heating of the reflow conditions for the IC socket must be more than 210°C for
30 to 60 seconds.
Recommended Reflow Conditions
Surface temperature of IC-socket connector Preheating: 150 to 180°C for 180 seconds Actual heating: To more than 210°C, for 30 to 60 seconds
4
CAUTION
1. Never dip the IC socket in flux or use wash to clean the IC socket. This is because flux may remain inside the IC socket due to the IC socket’s structure. When using the IC socket with other DIP products, never clean the other DIP products with flux because the flux may enter the connector through the guide pins of the IC socket.
2. When an IC socket with guide pins is soldered to the user system, about 1.3 mm of the guide pins will stick out (when the user-system board is 1.6 mm thick). When a load is applied to the guide pins from the back of the user-system board, stress will be applied to the soldered part of the IC socket, and this may destroy the connectors. Do not apply any load to the guide pins after the IC socket has been soldered on the user system.
3. When an IC socket with no guide pins is soldered to the user system, the soldered part will crack if stress is applied to the IC socket. Therefore, always apply adhesive to the connector and the user system so that there is a firm connection between them.
4. When the IC socket has guide pins, it is recommended that epoxy resin adhesive or solder be applied to the guide pins at the back of the user system to make sure that no stress is applied to the soldered part.
5

2.1.2 Fastening IC Socket Connector

CAUTION
1. Check the location of pin 1 before inserting.
2. Use a provided screwdriver.
3. Stop tightening when the force required to turn the screw becomes significantly greater than that needed when first tightening. If a screw is tightened too much, the screw head may break or an IC socket contact error may be caused by a crack in the IC socket solder.
4. If the emulator does not operate correctly, cracks might have occurred in the solder. Check conduction with a tester and re-solder the IC socket if necessary.
Fasten the user system interface board to the IC socket and the IC socket connector on the user system with four screws (M2 Take special care, such as manually securing the IC socket soldered area, to prevent the soldered IC socket from being damaged by twisting the components.
8 mm) provided.
x
Screws (M2 x 8 mm)
Board
Pin 1
Guide pin
Guide hole
User system
IC socket (Tokyo Eletech Corporation CSPACK256Z2021H01)
Figure 2 Connecting User System Interface Board to User System
6

2.2 Exchanging the Spacer of the EV-Chip Board

While the user system interface board is connected to the user system, force must not applied to the user system.
Exchange the spacer (2.6MP x 10 mm) of the EV-chip board with another spacer (2.6MP x 25 mm) provided for the user system interface board.
EV-chip board
Spacer (2.6MP x 25 mm)
Figure 3 Exchanging the Spacer
7

2.3 Connecting User System Interface Board to EV-Chip Board

WARNING
Observe the precautions listed below. Failure to do so will result in a FIRE HAZARD and will damage the user system and the emulator product or will result in PERSONAL INJURY. The USER PROGRAM will be LOST.
1. Always switch OFF the user system and the emulator product before the USER SYSTEM INTERFACE BOARD is connected to or removed from any part. Before connecting, make sure that pin 1 on both sides are correctly aligned.
2. The user system interface board dedicated to the emulator must be used.
1. Make sure the user system and emulator are turned off.
2. Align the connectors on the board with those on the EV-chip board according to their numbers
(figure 4).
3. Adjust the height of the spacer of the EV-chip board with the user system.
8
EV-chip board
Connector No.
EV-Chip Board Connector No.
UCN1 UCN1 UCN2 UCN2
Board
Board Connector No.
Figure 4 Connecting User System Interface Board to EV-Chip Board
9

2.4 Recommended Dimensions for User System Mount Pad (Footprint)

Figure 5 shows the recommended dimensions for the mount pad (footprint) for the user system with an IC socket for an BP-272 package (CSPACK256Z2021H01: manufactured by Tokyo Eletech Corporation). Note that the dimensions in figure 6 are somewhat different from those of the actual chip's mount pad.
23.0 ± 0.03
21.3
1.0 x 19 = 19.0
1.0
10
4-Ø1.3 Through hole
Ø0.5
Unit: mm
Figure 5 Recommended Dimensions for Mount Pad

2.5 Dimensions for EV-Chip Board and User System Interface Board

The dimensions for the EV-chip board and the user system interface board are shown in figure 6.
Spacer
5.0
65.0
70.0
50.0
120.0
EV-chip board
100.0
84.0
8.0
5.0
100.0
16.0
8.0
5.0
84.5
69.0
34.5
Top view
Unit: mm Tolerance: ±0.5 mm
Figure 6 Dimensions for EV-Chip Board and User System Interface Board
11

2.6 Resulting Dimensions after Connecting User System Interface Board

The resulting dimensions, after connecting the user system interface board to the user system, are shown in figure 7.
EV-chip board
53.7
28.4
8.7
Spacer (φ6.0)
65.0
User system
65.0
45.0
45.0
IC socket (Tokyo Eletech Corporation CSPACK256Z2021H01)
Unit: mm Tolerance: ±1.0 mm
Figure 7 Resulting Dimensions after Connecting User System Interface Board
12

Section 3 Verifying Operation

1. Turn on the emulator according to the procedures described in the SH7058 E6000H Emulator User's Manual (HS7058EPH60HE).
2. Verify the user system interface cable connections by checking the pin states with the extended monitor and checking the bus states with the FILL command (emulator command). If an error is detected, recheck the soldered IC socket and the location of pin 1.
3. The emulator connected to this user system interface board supports three kinds of clock sources as the MCU clock. For details, refer to the SH7058 E6000H Emulator User's Manual (HS7058EPH60HE).
To use the emulator internal clock
Select the clock in the emulator by the CLOCK command (emulator command).
To use the external clock on the user system
Supply the external clock from the user system to the emulator by inputting the EXTAL pin (pin A14) on the user system interface board or connecting the crystal oscillator to the XTAL (pin A15) and EXTAL pins. For details, refer to section 5, Clock Pulse Generator (CPG), in the SH7058 Hardware Manual. Figure 8 shows the clock oscillator on th e user system interface board.
1 M
HCU04
EXTAL XTAL
System clock
HCU04
270
HCU04
Figure 8 Clock Oscillator
HCU04
HCU04
HCU04
0
To E6000H emulator
13
To use the crystal oscillator mounted on the EV-chip board
Install a crystal oscillator into the crystal oscillator terminals on the EV-chip board.
Enlarged view
Crystal oscillator
X1 X2
Crystal oscillator terminals
EV-chip board
14
Figure 9 Installing the Clock Oscillator

Section 4 Notice

1. The MCU cannot be installed directly into the IC socket provided for connecting this user
system interface board.
2. Before connecting any parts or cables, make sure that pin 1 on the both sides are correctly
aligned.
3. Do not apply excessive force to the user system interface board while it is connected to the
user system.
4. The dimensions of the recommended mount pad for the IC socket for this user system
interface board are different from those of the MCU.
5. This user system interface board is specifically designed for the HS7058EPH60H emulator.
Do not use this board with any other emulator.
6. When power is not supplied to the Vcc pin on the user system interface board, the emulator displays ** VCC DOWN. The emulator will not operate correctly.
15
SH7058 Group BP-272 User System Interface board HS7058ECB61H User's Manual
Publication Date: Rev.2.00, November 20, 2003 Rev.3.00, March 1, 2004 Published by: Sales Strategic Planning Div. Renesas Technology Corp. Edited by: Technical Documentation & Information Department Renesas Kodaira Semiconductor Co., Ltd.
2003, 2004 Renesas Technology Corp. All rights reserved. Printed in Japan.
SH7058
User System Interface Board
Group BP-272
HS7058ECB61H User’ s Manu al
REJ10B0088-0300H
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