The W24512A is a high speed, low power CMOS static RAM organized as 65536 × 8 bits that
operates on a single 5-volt power supply. This device is manufactured using Winbond's high
performance CMOS technology.
Supply Voltage to VSS Potential-0.5 to +7.0V
Input/Output to VSS Potential-0.5 to VDD +0.5V
Allowable Power Dissipation1.0W
Storage Temperature-65 to +150
Operating Temperature0 to +70
Note: Exposure to conditions beyond those listed under Absolute Maximum Ratings may adversely affect the life and reliability of the
device.
Operating Characteristics
(VDD = 5V ±10%, VSS = 0V, TA = 0 to 70° C)
°C
°C
PARAMETERSYM.TEST CONDITIONSMIN.TYP.MAX.UNIT
Input Low VoltageVIL--0.5-+0.8V
Input High VoltageVIH-+2.2-VDD +0.5V
Input Leakage CurrentILIVIN = VSS to VDD-10-+10
Output Leakage
* These parameters are sampled but not 100% tested.
Write Cycle
PARAMETERSYM.
Write Cycle TimeTWC15-20-25-35-nS
Chip Selection to End of Write
Address Valid to End of WriteTAW13-17-18-20-nS
Address Setup TimeTAS0-0-0-0-nS
Write Pulse WidthTWP10-12-15-18-nS
Write Recovery Time
Data Valid to End of WriteTDW9-10-12-15-nS
Data Hold from End of WriteTDH0-0-0-0-nS
Write to Output in High ZTWHZ*-8-10-12-15nS
Output Disable to Output in High ZTOHZ*-8-10-12-15nS
Output Active from End of WriteTOW0-0-0-0-nS
CS1
CS2TCW213-17-18-20-nS
, WE
CS1
CS2TWR20-0-0-0-nS
TCW113-17-18-20-nS
TWR10-0-0-0-nS
* These parameters are sampled but not 100% tested.
W24512A-15W24512A-25W24512A-25W24512A-35
MIN. MAX.MIN. MAX.MIN. MAX.MIN. MAX.
UNIT
- 4 -
Page 5
TIMING WAVEFORMS
Read Cycle 1
(Address Controlled)
Address
D
OUT
Read Cycle 2
(Chip Select Controlled)
CS1
W24512A
T
RC
T
AA
T
OH
OH
T
CS2
D
OUT
Read Cycle 3
(Output Enable Controlled)
Address
OE
CS1
CS2
D
OUT
T
T
CLZ1
CLZ2
T
T
T
T
CLZ1
CLZ2
ACS1
ACS2
T
T
ACS1
ACS2
T
CHZ1
T
CHZ2
T
RC
T
AA
T
AOE
T
OLZ
T
CHZ2
T
CHZ1
T
OH
T
OHZ
Publication Release Date: March 1999
- 5 -Revision A7
Page 6
Timing Waveforms, continued
D
IN
Write Cycle 1
(OE Clock)
Address
OE
CS1
W24512A
T
WC
TWR1
T
CW1
CS2
WE
D
OUT
Write Cycle 2
(OE = VIL Fixed)
Address
CS1
CS2
WE
D
OUT
D
IN
T
CW2
T
AW
T
T
AS
T
OHZ
(1, 4)
T
AW
T
AS
WP
T
WC
CW1
T
T
CW2
WP
T
T
WHZ (1, 4)
WR2
T
T
T
DW
DH
T
WR1
T
WR2
T
OH
T
OW
T
T
DW
DH
(2)(3)
Notes:
1. During this period, I/O pins are in the output state, so input signals of opposite phase to the outputs should not be applied.
2. The data output from DOUT are the same as the data written to DIN during the write cycle.
3. DOUT provides the read data for the next address.
4. Transition is measured ±500 mV from steady state with CL = 5 pF. This parameter is guaranteed but not 100% tested.
- 6 -
Page 7
ORDERING INFORMATION
W24512A
PART NO.ACCESS
TIME (nS)
OPERATING
CURRENT
MAX. (mA)
STANDBY
CURRENT
MAX. (mA)
PACKAGE
W24512AK-151520010300 mil skinny DIP
W24512AK-202016010300 mil skinny DIP
W24512AK-252516010300 mil skinny DIP
W24512AK-353514010300 mil skinny DIP
W24512AJ-151520010300 mil SOJ
W24512AJ-202016010300 mil SOJ
W24512AJ-252516010300 mil SOJ
W24512AJ-353514010300 mil SOJ
W24512AS-151520010450 mil SOP
W24512AS-202016010450 mil SOP
W24512AS-252516010450 mil SOP
W24512AS-353514010450 mil SOP
W24512AT-151520010
W24512AT-202016010
W24512AT-252516010
W24512AT-353514010
Notes:
1. Winbond reserves the right to make changes to its products without prior notice.
2. Purchasers are responsible for performing appropriate quality assurance testing on products intended for use in applications
where personal injury might occur as a consequence of product failure.
standard type one TSOP
standard type one TSOP
standard type one TSOP
standard type one TSOP
Publication Release Date: March 1999
- 7 -Revision A7
Page 8
PACKAGE DIMENSIONS
______________________
__
__
__
__
__
32-pin SOJ
W24512A
32
1
S
Seating Plane
32-pin SO Wide Body
32
1
S
Seating Plane
17
E
H
e
16
D
A
2
A
B
b
e
A
1
Symbol
Min. Nom.
A
A
1
A
2
B
b
c
D
E
e
e
1
H
e
L
S
Y
θ
L
θ
____
0.020
0.095 0.100 0.105
0.008
0.815
0.3000.295
0.080
__
010
e
1
Max.
0.140
__
0.0320.0280.026
0.0220.0180.016
0.0140.010
0.8350.825
0.305
0.0560.0500.044
0.2870.2670.247
0.3450.3350.325
0.045
0.004
Dimension in mmDimension in Inches
Min. Nom.
0.508
2.413
20.701
8.255
2.032
°
0
c
Max.
3.556
__
2.540 2.667
0.8130.7110.660
0.4570.406
0.559
0.2540.203
0.356
21.20920.955
7.7477.6207.493
1.4221.2701.118
7.2906.7826.274
8.7638.509
1.143
0.102
__
°
10
Y
Dimension in Inches
Symbol
17
E
E
H
e
1
L
16
b
D
2
A
A
e
y
1
A
See Detail F
Detail F
e
1
c
L
E
A
A
A
b
c
D
E
e
HE
L
L
S
y
θ
Notes:
1. Dimension D Max. & S include mold flash
or tie bar burrs.
2. Dimension b does not include dambar
protrusion/intrusion.
3. Dimension D & E include mold mismatch
and are determined at the mold parting line.
4. Controlling dimension: Inches.
5. General appearance spec should be based
on final visual inspection spec.
1
2
E
Nom.
Min.
0.004
0.106
0.101
0.014
0.016
0.0080.006
0.805
0.5560.54614.3814.1213.87
0.023
0.031
0.047
0.055
0
Dimension in mm
Nom.
Max.Max.
Min.
0.118
0.10
0.111
2.57
2.69
0.36
0.004
10
0.41
0.200.15
20.45
11.18
11.30
1.12 1.27 1.420.044 0.050
0.58 0.79 0.99
1.40
0
0.020
0.0120.31
0.817
0.4500.4450.440
0.056
0.556
0.039
0.063 1.19
0.036
.
11.43
20.75
3.00
2.82
0.51
1.60
0.91
0.10
10
- 8 -
Page 9
Package Dimensions, continued
6. General appearance spec. should be based on
32-pin TSOP
M
e
0.10(0.004)
b
θ
L
L1
W24512A
H
D
D
c
E
A
A
2
1
A
Y
Dimension in Inches
Symbol
Min. Nom. Max.
__
__
A
0.002
A
1
2
0.037
A
b
0.007 0.008
c
0.005 0.006
0.720 0.724
D
0.311 0.315
E
0.780 0.787
H
D
__
e
0.016 0.020
L
__
1
L
0.0000.004
Y
1
θ
__
0.039
0.020
0.031
35
0.047
0.006
0.041
0.009
0.007
0.728
0.319
0.795
__
0.024
__
Note:
Controlling dimension: Millimeter
Dimension in mm
Min.
Nom.
__
__
__
0.05
0.95
0.17
0.20 0.23
0.12
0.15 0.17
18.30
18.40 18.50
7.90
8.00 8.10
19.80
20.00 20.20
__
0.50
0.40
0.50 0.60
__
0.80
____
0.00
1
35
Max.
1.20
0.15
1.051.00
__
__
0.10
32-pin P-DIP Skinny (300 mil)
32
1
E
1
S
A
A
2
L
D
e
B
1
B
0.200
0.155
0.022
0.0640.058
0.014
0.335
0.294
0.110
0.140
0.470
0.065
15
Dimension in mm
0.38
3.68
3.81
0.41
0.46
0.20
0.25
7.49
8.00
7.26
7.36
2.29 2.54 2.790.090 0.100
3.05
3.30
°
0
11.43
5.08
3.94
0.56
1.631.47
0.36
3.56
11.94
1.65
8.50
7.46
°
15
Dimension in Inches
Symbol
Min. Nom. Max.Max.Nom.Min.
A
0.015
A
1
0.150
0.145
A
2
0.016
B
17
16
E
Base Plane
1
A
1
Mounting Plane
e
a
c
A
B
c
D
E
E 1
e
L
a
e
S
Notes:
1. Dimension D Max. & S include mold flash or
tie bar burrs.
2. Dimension E1 does not include interlead flash.
3. Dimension D & E1 include mold mismatch and
are determined at the mold parting line.
4. Dimension B1 does not include dambar
protrusion/intrusion.
5. Controlling dimension: Inches.
0.018
0.0601.52
1
0.010
0.008
1.60 1.6240.64 41.15
0.295
0.315
0.286
0.290
1
0.120
0.130
0
0.43010.92
0.450
A
final visual inspection spec.
Publication Release Date: March 1999
- 9 -Revision A7
Page 10
VERSION HISTORY
VERSIONDATEPAGEDESCRIPTION
A7Mar. 1999-Arrange acceee time for 15/20/25/35 nS
W24512A
Headquarters
No. 4, Creation Rd. III,
Science-Based Industrial Park,
Hsinchu, Taiwan
TEL: 886-3-5770066
FAX: 886-3-5792647
http://www.winbond.com.tw/
Voice & Fax-on-demand: 886-2-7197006
Winbond Electronics (H.K.) Ltd.
Rm. 803, World Trade Square, Tower II,
123 Hoi Bun Rd., Kwun Tong,
Kowloon, Hong Kong
TEL: 852-27513100
FAX: 852-27552064
Taipei Office
11F, No. 115, Sec. 3, Min-Sheng East Rd.,
Taipei, Taiwan
TEL: 886-2-7190505
FAX: 886-2-7197502
Note: All data and specifications are subject to change without notice.
- 10 -
Winbond Electronics North America Corp.
Winbond Memory Lab.
Winbond Microelectronics Corp.
Winbond Systems Lab.
2730 Orchard Parkway, San Jose,
CA 95134, U.S.A.
TEL: 1-408-9436666
FAX: 1-408-9436668
Loading...
+ hidden pages
You need points to download manuals.
1 point = 1 manual.
You can buy points or you can get point for every manual you upload.