Rainbow Electronics W24257 User Manual

W24257

CS

WE

OE

32K × 8 CMOS STATIC RAM

8GENERAL DESCRIPTION

The W24257 is a slow speed, low power CMOS static RAM organized as 32768 × 8 bits that operates
on a single 5-volt power supply. This device is manufactured using Winbond's high performance
CMOS technology.

FEATURES

• Low power consumption:

− Active: 400 mW (max.)

− Standby: 250 µW (max.) (LL-version)

500 µW (max.) (L-version)

• Access time: 70/100 nS (max.)

• Single +5V power supply

• Fully static operation

PIN CONFIGURATION

A14

A12

1

2

3

A7

4

A6

5

A5

A4

6

7

A3

8

A2

28

27

26

25

24

23

22

21

V

WE

A13

A8

A9

A11

OE

A10

• All inputs and outputs directly TTL compatible

• Three-state outputs

• Battery back-up operation capability

• Data retention voltage: 2V (min.)

• Available packages: 28-pin 600 mil DIP, 330

mil SOP, 300 mil skinny DIP and SOJ

BLOCK DIAGRAM

V

DD
SS

V

DD

A14

CS
OE
WE

A0

.

DECODER

.

CONTROL

CORE

ARRAY

DATA I/O

I/O1

I/O8

.
.

I/O1

I/O2

I/O3

A1

9

A0

10

11

12

13

V

14

SS

20

CS

19

I/O8

I/O7

18

I/O6

17

16

I/O5

I/O4

15

PIN DESCRIPTION

SYMBOL DESCRIPTION

A0−A14

I/O1−I/O8

Address Inputs
Data Inputs/Outputs
Chip Select Input
Write Enable Input
Output Enable Input

VDD Power Supply
VSS Ground

Publication Release Date: April 1997

- 1 - Revision A11

TRUTH TABLE

CSOEWE

WE

Operating Power

CS

Supply Current

CS

CS

W24257

MODE

H X X Not Selected High Z ISB, ISB1

L H H Output Disable High Z IDD
L L H Read Data Out IDD
L X L Write Data In IDD

I/O1−I/O8

VDD CURRENT

DC CHARACTERISTICS

Absolute Maximum Ratings

PARAMETER RATING UNIT

Supply Voltage to VSS Potential -0.5 to +7.0 V
Input/Output to VSS Potential -0.5 to VDD +0.5 V
Allowable Power Dissipation 1.0 W
Storage Temperature -65 to +150
Operating Temperature 0 to +70

Note: Exposure to conditions beyond those listed under Absolute Maximum Ratings may adversely affect the life and reliability of the
device.

Operating Characteristics

(VDD = 5V ±10%, VSS = 0V, TA = 0 to 70° C)

PARAMETER SYM. TEST CONDITIONS MIN. TYP. MAX. UNIT

Input Low Voltage VIL - -0.5 - +0.8 V
Input High Voltage VIH - +2.2 - VDD +0.5 V
Input Leakage Current ILI VIN = VSS to VDD -2 - +2
Output Leakage

Current

Output Low Voltage VOL IOL = +4.0 mA - - 0.4 V
Output High Voltage VOH IOH = -1.0 mA 2.4 - - V

Standby Power
Supply Current

Note: Typical characteristics are at VDD = 5V, TA = 25° C.

ILO

IDD

ISB

ISB1

VI/O = VSS to VDD, CS = VIH
(min.) or OE = VIH (min.) or

= VIL (max.)

= VIL (min.),

I/O = 0 mA
Cycle = min.,

Duty = 100%

= VIH (min.)

Cycle = min., Duty = 100%

≥ VDD -0.2V

-2 - + 2

70 - - 80 mA

100 - - 70 mA

- - 3 mA

LL - - 50
L - - 100

°C
°C

µA
µA

µA
µA

- 2 -

W24257

CAPACITANCE

(VDD = 5V, TA = 25° C, f = 1 MHz)

PARAMETER SYM. CONDITIONS MAX. UNIT

Input Capacitance CIN VIN = 0V 6 pF
Input/Output Capacitance CI/O VOUT = 0V 8 pF

Note: These parameters are sampled but not 100% tested.

AC CHARACTERISTICS

AC Test Conditions

PARAMETER CONDITIONS

Input Pulse Levels 0.6V to 2.4V
Input Rise and Fall Times 5 nS
Input and Output Timing Reference Level 1.5V
Output Load CL = 100 pF, IOH/IOL = -1 mA/4 mA

AC Test Loads and Waveform

R1 1000 ohm

5V

OUTPUT

100 pF

Including
Jig and
Scope

R2
660 ohm

3.0V

0V

5 nS

90% 90%

10%

10%

OUTPUT

(For T

5 nS

5V

CLZ

OLZ TCHZ T

, ,

T

,

R1 1000 ohm

5 pF

Including
Jig and
Scope

OHZ

,

T

WHZ

R2
660 ohm

,

)

OW

T

Publication Release Date: April 1997

- 3 - Revision A11

W24257

CS, WE

AC Characteristics, continued
(VDD = 5V ±10%, VSS = 0V, TA = 0 to 70° C)

Read Cycle

PARAMETER SYM. W24257-70 W24257-10 UNIT

MIN. MAX. MIN. MAX.

Read Cycle Time TRC 70 - 100 - nS
Address Access Time TAA - 70 - 100 nS
Chip Select Access Time TACS - 70 - 100 nS
Output Enable to Output Valid TAOE - 35 - 50 nS
Chip Selection to Output in Low Z TCLZ* 10 - 10 - nS
Output Enable to Output in Low Z TOLZ* 5 - 5 - nS
Chip Deselection to Output in High Z TCHZ* - 30 - 35 nS
Output Disable to Output in High Z TOHZ* - 30 - 35 nS
Output Hold from Address Change TOH 10 - 10 - nS

∗ These parameters are sampled but not 100% tested

Write Cycle

PARAMETER SYM. W24257-70 W24257-10 UNIT

MIN. MAX. MIN. MAX.

Write Cycle Time TWC 70 - 100 - nS
Chip Selection to End of Write TCW 60 - 80 - nS
Address Valid to End of Write TAW 60 - 80 - nS
Address Setup Time TAS 0 - 0 - nS
Write Pulse Width TWP 45 - 60 - nS
Write Recovery Time

Data Valid to End of Write TDW 30 - 40 - nS
Data Hold from End of Write TDH 0 - 0 - nS
Write to Output in High Z TWHZ* - 30 - 30 nS
Output Disable to Output in High Z TOHZ* - 30 - 30 nS
Output Active from End of Write TOW 0 - 0 - nS

∗ These parameters are sampled but not 100% tested

TWR 0 - 0 - nS

- 4 -

TIMING WAVEFORMS

AA

Read Cycle 1

(Address Controlled)

Address

DOUT

Read Cycle 2

(Chip Select Controlled)

W24257

T

RC

T

T

OH

T

OH

CS

D

OUT

Read Cycle 3

(Output Enable Controlled)

Address

OE

CS

D

OUT

T

ACS

T

CLZ

RC

T

T

AA

AOE

T

TOLZ

TACS

CLZT

T

CHZ

TOH

TOHZ

CHZ

T

Publication Release Date: April 1997

- 5 - Revision A11

Timing Waveforms, continued

Write Cycle 1

Address

OE

CS

WE

DOUT

DIN

W24257

T

WC

T

WR

T

CW

T

AW

T

T

AS

T

OHZ

(1, 4)

WP

T

DW

T

DH

Write Cycle 2

(OE = VIL Fixed)

T

WC

Address

T

T

CW

CS

AWT

WE

D

OUT

DIN

T

AS

T

WP

T

WHZ

(1, 4)

Notes:

1. During this period, I/O pins are in the output state, so input signals of opposite phase to the outputs should not be applied.

2. The data output from DOUT are the same as the data written to DIN during the write cycle.

3. DOUT provides the read data for the next address.

4. Transition is measured ±500 mV from steady state with CL = 5 pF. This parameter is guaranteed but not 100% tested.

WR

T

OH

T

OW

DW

TDH

T

(2) (3)

- 6 -

W24257

CS

CS

DATA RETENTION CHARACTERISTICS

(TA = 0 to 70° C)

PARAMETER SYM. TEST CONDITIONS MIN. TYP. MAX. UNIT

VDD for Data Retention VDR
Data Retention Current IDDDR

≥ VDD -0.2V
≥ VDD -0.2V

VDD = 3V L - - 50
Chip Deselect to Data Retention Time TCDR See data retention 0 - - nS
Operation Recovery Time TR waveform TRC* - - nS

TRC* = Read Cycle Time

DATA RETENTION WAVEFORM

DATA RETENTION MODE

V

CS

DD

4.5V

T

CDR

VIH V

CS1

>

V

DR

2V

=

>

V

DD

=

-0.2V

4.5V
T

R

IH

2.0 - - V

LL - - 20

µA
µA

ORDERING INFORMATION

PART NO. ACCESS

TIME (nS)

W24257-70LL 70 80 50 600 mil DIP
W24257-70L 70 80 100 600 mil DIP
W24257-10L 100 70 100 600 mil DIP
W24257S-70LL 70 80 50 330 mil SOP
W24257S-70L 70 80 100 330 mil SOP
W24257S-10L 100 70 100 330 mil SOP
W24257K-70LL 70 80 50 300 mil Skinny
W24257K-70L 70 80 100 300 mil Skinny
W24257K-10L 100 70 100 300 mil Skinny
W24257J-70LL 70 80 50 300 mil SOJ
W24257J-70L 70 80 100 300 mil SOJ
W24257J-10L 100 70 100 300 mil SOJ

Notes:

1. Winbond reserves the right to make changes to its products without prior notice.

2. Purchasers are responsible for performing appropriate quality assurance testing on products intended for use in
applications where personal injury might occur as a consequence of product failure.

OPERATING

CURRENT

MAX. (mA)

STANDBY
CURRENT
MAX. (mA)

PACKAGE

Publication Release Date: April 1997

- 7 - Revision A11

BONDING PAD DIAGRAM

W24257

4

6

A4 A13

7

A3

8

9A110

A2

3

5

A5

A6

Y

11

12 13

A0 I/O1 I/O2 I/O3

12

28
S-228S-1

DD

A14A12A7

DDV

X

14

S-2

14

S-1

SS

V

I/O4

SS

V

27

15 16

I/O5

I/O6

23

242526

A11

A8WEV

A9

22

OE

PAD NO. X Y

1 -127.08 2785.05
2 -377.73 2785.05
3 -628.38 2785.05
4 -879.03 2785.05
5 -1129.68 2785.05
6 -1380.33 2785.05
7 -1686.51 2640.06
8 -1682.01 -2645.91

9 -1448.10 -2802.51
10 -1090.80 -2802.51
11 -877.32 -2807.28
12 -627.84 -2807.28
13 -349.56 -2807.28

14S-1 -155.52 -2781.00
14S-2 -7.02 -2771.64

21

A10

20

18

19

17

CS

I/O8

I/O7

15 249.21 -2807.28
16 498.69 -2807.28
17 776.97 -2807.28
18 1026.45 -2807.28
19 1304.73 -2807.28
20 1689.30 -2802.51
21 1686.51 -2520.90
22 1686.51 2644.74
23 1459.17 2785.05
24 1208.52 2785.05
25 957.87 2785.05
26 707.22 2785.05
27 456.57 2785.05

28S-1 205.92 2771.55
28S-2 21.42 2780.91

Note: For bare chip form (C.O.B.) applications, the substrate must be connected to VDD or left floating in the PCB layout.

- 8 -

PACKAGE DIMENSIONS

28-pin P-DIP

W24257

28

E

1

1

S

2

A

A

L

28-pin P-DIP Skinny

28

1E

1 14

S

A

A

2

L

Dimension in Inches

Symbol

Min. Nom. Max. Max.Nom.Min.

A

0.010

1

A

0.150

2

1

1

1

A

0.016

0.008

0.540 0.5500.545

0.090

0.120
0 15

0.155

0.018

0.060 1.52

0.010

1.460 1.470

0.6000.590

0.100

0.130

0.6500.630 16.00 16.51

A
B
B
c

D

15

D
E
E

e
L

a

e
S

14

E

A

1

Base Plane

15

Seating Plane

Base Plane

1A

Mounting Plane

e

a

A

E

e

A

a

c

B

e

1

B

1

D

B

B

e

1

1

Notes:

1. Dimension D Max. & S include mold flash or
tie bar burrs.

c

2. Dimension E1 does not include interlead flash.

3. Dimension D & E1 include mold mismatch and
are determined at the mold parting line.

4. Dimension B1 does not include dambar
protrusion/intrusion.

5. Controlling dimension: Inches.

6. General appearance spec. should be based on
final visual inspection spec.

Dimension in Inches Dimension in mm

Symbol

Min. Nom. Max. Max.Nom.Min.

A

0.010

A

1

0.130

0.125

A

2

0.016

B
B1
c
D
E
E
e

L

a

e
S

Notes:

1. Dimension D Max. & S include mold flash or
tie bar burrs.

2. Dimension E1 does not include interlead flash.

3. Dimension D & E1 include mold mismatch and
are determined at the mold parting line.

4. Dimension B1 does not include dambar
protrusion/intrusion.

5. Controlling dimension: Inches.

6. General appearance spec. should be based on
final visual inspection spec.

0.018

0.060 1.52

0.010

0.008

1.388 1.400

0.3100.300 0.320

0.2880.283

1

1

0.120

0.130

°

0

0.330 8.38

0.350

A

Dimension in mm

0.210

0.160

0.022

0.0640.058

0.014

0.610

14.99

13.72 13.9713.84

0.110

0.140

0.670

0.090 2.29

5.33

0.25

3.81

3.94

4.06

0.41

0.46

0.56

0.20

0.25

37.34

37.08

15.49

15.24

2.29

2.54 2.79

3.05

3.30

17.02

.

0.175

0.25

0.135

3.18

3.30

0.41

0.022

0.0640.058

0.014

0.293

0.110

0.140

0.370

0.055

15

0.46

0.20

0.25

35.26 35.56

7.87

7.62

7.19

2.29 2.54 2.790.090 0.100

3.05

3.30

°

°

0

8.89

1.631.47

0.36

3.56
150

4.45

3.43

0.56

1.631.47

0.36

8.13

7.447.32

3.56

°

15

9.40

1.40

Publication Release Date: April 1997

- 9 - Revision A11

Package Dimensions, continued

28-pin SO Wide Body

W24257

28 15

1

S

Seating Plane

e

b

D

y

28-pin Small Outline J Band

1

D

s

Seating Plane

b

1b

e

Dimension in Inches

Symbol

A
A

e

1

E H

E

L

e

1

See Detail F

Detail F

c

L

E

14

A

A

2

A

1

A
b

c
D
E

e
HE
L
LE
S

y

θ

Notes:

1. Dimension D Max. & S include mold flash
or tie bar burrs.

2. Dimension b does not include dambar
protrusion/intrusion.

3. Dimension D & E include mold mismatch
and determined at the mold parting line.

4. Controlling dimension: Inches.

5. General appearance spec should be based
on final visual inspection spec.

Symbol

1528

EHE

14

Notes:

2

A

A

L

£c

1

A

y

1e

c

Nom.

Min.

0.004

1

0.098

0.093

2

0.014

0.016

0.0100.008

0.713

0.028

0.036

0.059

0.067

0

Dimension in Inches

Min. Nom. Max. Max.Nom.Min.

A

0.027

1

A

0.095

A

2

0.026

b1

0.016

b

0.008

c
D

0.295

E

0.044

e

0.245

1

e

0.327

H

E

0.077

L
S

y

θ

0

1. Dimension D Max. & S include mold flash
or tie bar burrs.

2. Dimension b does not include dambar
protrusion/intrusion.

3. Dimension D & E include mold mismatch
and are determined at the mold parting line.

4. Controlling dimension: Inches.

5. General appearance spec. should be based
on final visual inspection spec.

Dimension in mm

Nom.

Max. Max.

Min.

0.112

0.10

0.103

2.36

2.49

0.36

0.020

0.014 0.36

0.733

0.3360.3310.326

0.4770.4650.453 12.1211.8111.51

0.044

0.075 1.50

0.047

0.004

0.41

0.250.20

18.11

8.28

8.41

1.12 1.27 1.420.044 0.050 0.056

0.91 1.12

0.71

1.70

10

0

.

Dimension in mm

0.140

0.105

0.0320.028

0.022

0.014

0.730

0.3050.300

0.285

0.347

0.097 1.96

0.045

0.004
10

0.69

2.41

0.41

7.49

1.12

6.22

8.31

0

18.03

7.62

1.27

8.56 8.81

2.21

0.100

0.018

0.010 0.25

0.710

0.050 0.056

0.265

0.337

0.087

2.85

2.62

0.51

18.62

8.53

1.91

1.19

0.10
10

3.56

2.54

2.67

0.810.710.66

0.46

0.56

0.360.20

18.54

7.75

1.42

7.246.73

2.46

1.14

0.10
10

- 10 -

W24257

Headquarters

No. 4, Creation Rd. III,

Science-Based Industrial Park,

Hsinchu, Taiwan

TEL: [phone]

FAX: [phone]

http://www.winbond.com.tw/

Voice & Fax-on-demand: 886-2-7197006

Taipei Office

11F, No. 115, Sec. 3, Min-Sheng East Rd.,

Taipei, Taiwan

TEL: [phone]

FAX: [phone]

Winbond Electronics (H.K.) Ltd.

Rm. 803, World Trade Square, Tower II,

123 Hoi Bun Rd., Kwun Tong,

Kowloon, Hong Kong

TEL: [phone]

FAX: [phone]

Winbond Electronics North America Corp.

Winbond Memory Lab.

Winbond Microelectronics Corp.

Winbond Systems Lab.

2727 N. First Street, San Jose,

CA 95134, U.S.A.

TEL: [phone]

FAX: [phone]

Note: All data and specifications are subject to change without notice.

Publication Release Date: January 1997

- 11 - Revision A11