Rainbow Electronics TSM20N50 User Manual

ITO-220
PRODUCT SUMMARY
Pin Definition:
TSM20N50
500V N-Channel Power MOSFET
1. Gate
2. Drain
3. Source
General Description
The TSM20N50 N-Channel enhancement mode Power MOSFET is produced by planar stripe DMOS technology. This advanced technology has been especially tailored to minimize on-state resistance, provide superior switching performance, and withstand high energy pulse in the avalanche and commutation mode. These devices are well suited for high efficiency switch mode power supply, electronic lamp ballast based on half bridge.
VDS (V) R
500 0.3 @ V
() ID (A)
DS(on)
=10V 18
GS
Features
Low R
Low gate charge typical @ 54nC (Typ.)
Improve dv/dt capability
DS(ON)
0.3 (Max.)
Block Diagram
Ordering Information
Part No. Package Packing
TSM20N50CZ C0 TO-220 50pcs / Tube TSM20N50CI C0 ITO-220 50pcs / Tube
N-Channel MOSFET
Absolute Maximum Rating
(Ta = 25oC unless otherwise noted)
Parameter Symbol Limit Unit
Drain-Source Voltage VDS 500 V Gate-Source Voltage VGS ±30 V Continuous Drain Current(TC=25 ) ID 18 A Pulsed Drain Current * IDM 72 A Peak Diode Recovery dv/dt (Note 3) dv/dt 4.5 V/ns Single Pulse Avalanche Energy (Note 2) EAS 954 mJ Avalanche Current (Repetitive) (Note 1) IAR 18 A Repetitive Avalanche Energy (Note 1) EAR 29 mJ Operating Junction Temperature TJ 150 ºC Storage Temperature Range T
* Limited by maximum junction temperature
1/10
-55 to +150
STG
o
C
Version: A12
c
TSM20N50
500V N-Channel Power MOSFET
Thermal Performance
Parameter Symbol TO-220 ITO-220 Unit
Thermal Resistance - Junction to Case RӨJC 0.43 2.6
o
C/W
Thermal Resistance - Junction to Ambient RӨJA 62.5
Notes: Surface mounted on FR4 board t 10sec
Electrical Specifications
(Tc = 25oC unless otherwise noted)
Parameter Conditions Symbol Min Typ Max Unit
Static
Drain-Source Breakdown Voltage V Drain-Source On-State Resistance V Gate Threshold Voltage V Zero Gate Voltage Drain Current V Gate Body Leakage VGS = ±30V, VDS = 0V I Forward Transconductance V Diode Forward Voltage IS = 18A, VGS = 0V VSD -- -- 1.5 V
Dynamic b
Total Gate Charge Gate-Source Charge Qgs -- 15 -­Gate-Drain Charge Qgd -- 12.5 -­Input Capacitance Output Capacitance C Reverse Transfer Capacitance C
Switching
Turn-On Delay Time Turn-On Rise Time tr -- 72 -­Turn-Off Delay Time t Turn-Off Fall Time tf -- 68 -­Reverse Recovery Time Reverse Recovery Charge Qfr -- 6 -- uC
Notes:
1. Repetitive Rating: Pulse Width Limited by Maximum Junction Temperature
2. VDD = 50V, IAS=18A, L=5.3mH, RG=25, Starting TJ=25
3. I
18A, di/dt 200A/uS, VDD BVDS, Starting TJ=25
SD
4. Pulse test: pulse width 300uS, duty cycle 2%
5. b For design reference only, not subject to production testing.
6. c Switching time is essentially independent of operating temperature.
= 0V, ID = 250uA BV
GS
= 10V, ID = 9.0A R
GS
= VGS, ID = 250uA V
DS
= 500V, VGS = 0V I
DS
= 30V, ID = 9.0A gfs -- 11 -- S
DS
500 -- -- V
DSS
-- 0.25 0.3
DS(ON)
2.0 -- 4.0 V
GS(TH)
-- -- 1 uA
DSS
-- -- ±100
GSS
Qg -- 54 --
V
= 400V, ID = 18A,
DS
V
= 10V
GS
C
V
= 25V, VGS = 0V,
DS
f = 1.0MHz
V
= 250V, ID = 18A,
DD
RG = 25
V
= 0V, IS = 18A,
GS
-- 3094
iss
-- 296 --
oss
-- 9.2 --
rss
t
-- 78 --
d(on)
-- 184 --
d(off)
tfr -- 426 -- nS
--
dIF/dt = 100A/us
nA
nC
pF
nS
2/10
Version: A12
500V N-Channel Power MOSFET
TSM20N50
Electrical Characteristics Curve
Output Characteristics
On-Resistance vs. Drain Current
(Tc = 25oC, unless otherwise noted)
Transfer Characteristics
Gate Charge
On-Resistance vs. Junction Temperature
Source-Drain Diode Forward Voltage
3/10
Version: A12
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