Rainbow Electronics TSM1N45 User Manual

TO-92 SOT
-
223
A
R
A
R
STG
Pin
Definition
:
TSM1N45
450V N-Channel Power MOSFET
1. Gate
2. Drain
3. Source
General Description
The TSM1N45 is N-Channel enhancement mode power field effect transistors are produced using planar DMOS technology process. This advanced technology has been especially tailored to minimize on-state resistance, provide superior switching performance, and withstand higher energy pulse in the avalanche and commutation mode. There devices are well suited for electronic ballasts base and half bridge configuration.
PRODUCT SUMMARY
VDS (V) R
450 4.25 @ V
DS(on)
GS
() ID (A)
=10V 0.25
Features
Low gate charge @ typical 6.5nC
Low Crss @ typical 6.5pF
Avalanche energy specified
Improved dv/dt capability
Gate-Source Voltage ±30V guaranteed
Block Diagram
Ordering Information
Part No. Package Packing
TSM1N45CT B0 TO-92 1Kpcs / Bulk TSM1N45CT A3 TO-92 2Kpcs / Ammo TSM1N45CW RP SOT-223 2.5Kpcs / 13” Reel
Absolute Maximum Rating
(Ta=25oC unless otherwise noted)
Parameter Symbol Limit Unit
Drain-Source Voltage Gate-Source Voltage Continuous Drain Current Pulsed Drain Current (Note 1) Single Pulse Drain to Source Avalanche Energy (Note 2) EAS 108 mJ Avalanche Current (Note 1) Repetitive Avalanche Energy (Note 1) Peak Diode Recovery dv/dt (Note 3)
Total Power Dissipation @TC =25ºC Operating Junction and Storage Temperature Range
*Surface Mounted on 1”x1” FR4 board
TO-92 SOT-223
N-Channel MOSFET
VDS 450 V VGS ±30 V
ID 0.5 A
IDM 4 A
I
0.5 A
E
0.25 mJ
dv/dt 5.5 V/ns
P
DTOT
TJ, T
-55 to +150
2
15
W
o
C
Thermal Performance
Parameter Symbol Limit Unit
Thermal Resistance - Junction to Lead TO-92 RӨJL 50 Thermal Resistance - Junction to Case SOT-223 RӨJC 8.5
Thermal Resistance - Junction to Ambient *
*When mounted on the minimum pad size recommended (PCB mount)
1/9
TO-92 SOT-223 60
RӨJA
140
o
C/W
o
C/W
GS
DSS
GS
DS(ON)
DS
DS
DS
DSS
GSS
DS
iss
oss
rss
d(on)
d(off)
S
M
GS
S
TSM1N45
450V N-Channel Power MOSFET
Electrical Specifications
Parameter Conditions Symbol
Static
Drain-Source Breakdown Voltage V Drain-Source On-State Resistance V
Gate Threshold Voltage Zero Gate Voltage Drain Current V
Gate Body Leakage VGS = ±30V, VDS = 0V I Forward Transconductance V
Dynamic
Total Gate Charge Gate-Source Charge Qgs -- 1.3 -­Gate-Drain Charge Qgd -- 3.2 -­Input Capacitance Output Capacitance C Reverse Transfer Capacitance C
Switching
Turn-On Delay Time Turn-On Rise Time tr -- 32.8 -­Turn-Off Delay Time t Turn-Off Fall Time tf -- 23.7 --
Drain-Source Diode Characteristics and Maximum Ratings
Maximum Continuous Drain-Source Diode Forward Current IS -- -- 0.5 A Maximum Pulsed Drain-Source Diode Forward Current I Drain-Source Diode Forward Voltage V
Reverse Recovery Time Reverse Recovery Charge Qrr -- 0.35 -- µC
Notes:
1. Repetitive Rating: Pulse width limited by maximum junction temperature
2. L=75mH, IAS=1.6A, VDD=50V, RG=25, Starting TJ=25ºC
3. ISD 0.5A, di/dt 300A/µS, VDD BV
4. Pulse test: pulse width 300uS.
5. Essentially independent of operating temperature
6. a) Reference point of the is the drain RӨ b) When mounted on 3”x4.5” FR-4 PCB without any pad copper in a still air environment
(RӨJA is the sum of the junction-to-case and case-to-ambient thermal resistance. RӨ
user’s board design)
(Ta=25oC, unless otherwise noted)
= 0V, ID = 250uA BV = 10V, ID = 0.25A R
V
= VGS, ID = 250uA
V
= VGS, ID = 250mA 3.2 4.0 4.8 = 450V, VGS = 0V I
= 50V, ID = 0.25A gfs -- 0.7 -- S
V
= 360V, ID = 0.5A,
DS
V
= 10V
GS
(Note 4,5) V
= 25V, VGS = 0V,
DS
f = 1.0MHz
V
= 25V, ID = 0.5A,
GS
V
= 225V, RG = 25
DS
(Note 4,5)
= 0V, I
V
= 0V, IS = 1A
GS
= 0.5A VSD -- -- 1.4 V
dIF/dt = 100A/µS (Note 4)
, Starting TJ=25ºC
DSS
lead
JL
Min Typ Max Unit
450 -- -- V
-- 3.7 4.25
V
GS(TH)
-- -- 10 uA
-- -- ±100 nA
Qg -- 6.5 10
C
-- 235 --
-- 29 --
-- 6.5 --
t
-- 14.7 --
-- 25.2 --
-- -- 4.0 A
trr -- 110 -- nS
2.3 3.0 3.7
CA
is determined by the
V
nC
pF
nS
2/9
Electrical Characteristics Curve
450V N-Channel Power MOSFET
(Ta = 25oC, unless otherwise noted)
TSM1N45
Output Characteristics
On-Resistance vs. Drain Current
Transfer Characteristics
Gate Charge
On-Resistance vs. Junction Temperature
3/9
Source-Drain Diode Forward Voltage
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