Most Standard Speeds up to 230K bits/ s at 7. 36 MHz
– Output Enable Input
– Multiple Logic Level Shifters Options (1.8V to V
– Automatic Level Shifter Option
• Multi-protocol Smart Card Interface
– Certified with Dedicated Firmware Acc ording to ISO 7816, EMV2000, GIE-CB, GSM
11.12V and WHQL Standards
– Asynchronous Protocol s T = 0 and T = 1 with Direct and Inver se Modes
– Baud Rate Generator Supporting All ISO7816 Speeds up to D = 32/F = 372
– Parity Error Det ection and Indication
– Automatic Character Repetition on Parity Errors
– Programmable Tim eout Detection
– Card Clock Stop High or Low for Card Power-down Mode
– Support Synchronous Card with C4 and C8 Programmabl e Outputs
– Card Detection and Automatic De- activation Sequence
– Step-up/down Conve rte r wit h Programmable V oltage Output: 5V, 3V (± 8% at
60 mA) and 1.8V (±8% at 20 mA)
– Direct Connection to Smart Car d Terminals:
Short Circuit Current Limitation
Logic Level Shif ter s
4 kV ESD Protection (MIL/STD 833 Class 3)
• Alternate Card Support with CLK, I/O and RST According to GSM 1 1.12V Standard
• 2x I/O Ports: 6 I/O Port1 and 8 I/O Port3
• 2x LED Outputs with Programmable Current Sources: 2, 4, or 10 mA
• 4-level Priority Interrupt System with 7 Sources
• 7.36 to 16 MHz On-chip Oscill ator with Clock Prescaler
• Absolute CPU Maxi mal Frequen c y: 16 MHz in X1 mode, 8MHz in X2 mode
• Idle and Power-down Modes
• Voltage Operation: 2.85V to 5.4V
• Low Power Consumption
– 8 mA Operating Current (at 5.4V and 3. 68 MHz )
– 150 mA Maximum Current with Smart Card Power-on (at 16 MHz X1 Mode)
–30 μA Maximum Power-down Current at 3.0V (without Smart Card)
–100 μA Maximum Power-down Current at 5.4V (without Smart Card)
• T em p erature Range
– Commercial: 0 to +70°C Operating Temperature
– Industrial: -4 0 to +85°C Operati ng Temperature
• Packages
– SSOP24
–QFN32
– PLCC52
CC
)
8-bit
Microcontroller
with Multiprotocol Smart
Card Interface
DescriptionT8xC5121 is a high performance CMOS ROM/CRAM derivative of the 80C51 CMOS
single chip 8-bit microcontrollers.
T8xC5121 retains the features of the Atmel 80C51 with extended ROM capacity (16
Kbytes), 512 bytes of internal RAM, a 4-level interrupt system, two 16-bit timer/counters
(T0/T1), a full duplex enhanced UART (EUART) with baud rate generator (BRG) and an
on-chip oscillator.
In addition, the T8xC5 121 have, a Multi protocol Smart Card Interface, a dual data
pointer, 2 programmable LED current sources (2-4-10 mA) and a hardware Watchdog.
T89C5121 Flash RAM vers ion and T85C5121 Cod e RAM version can be loaded by InSystem Programming (ISP) software residing in the on-chip ROM from a low-cost external serial EEPROM or from R232 interface.
T8xC5121 have 2 software-selectable modes of reduced activity for further reduction in
power consumption.
Block Diagram
Figure 1. Block Diagram
CC
CC
CC
V
DV
EV
VSS
LI
CVSS
(2) (2)
RxD
TxD
XTAL1
XTAL2
EA
PSEN
ALE
Xtal
Osc
:1-16
Clock
Prescaler
X2
(4)
P0
P2
CPU
EUART
BRG
Timer 0
Timer 1
(2)(2)(2)(2)
RAM
256 x8
C51
CORE
INT
Ctrl
T0
T1
INT1
INT0
Notes: 1. Alternate function of Port 1
2. Alternate function of Port 3
3. Only for the Code RAM version
4. Only for PLCC52
ROM
16K x8
IB-bus
Watchdog
POR
PFD
RST
(3)
CRAM
16K x8
6 I/Os
XRAM
256
x8
8 I/Os
Parallel I/O Ports
P1
P3
Voltage
Direct
Output
(2)
Reg.
Drive
LED
(2)
LED0
LED1
DC/DC
Converter
SCIB
Alternate
Card
Level
Shifters
(1)
(1)
(1)
(1)
(1)
(1)
CPRES
(2)
(2)
CRST1
(2)
CCLK1
CV
CC4
CC8
CIO
CRST
CCLK
CIO1
CC
2
4164G–SCR–07/06
Pin DescriptionFigure 2. 24-pin SSOP Pinout
A/T8xC5121
P1.5/CRST
P1.4/CCLK
P1.2/CPRES
Figure 3. QFN32 Pinout
CVcc
P1.5/CRST
P1.4/CCLK
P1.3/CC4
P1.2/CPRES
P1.1/CC8
P1.0/CIO
CVSS
V
C
P1.3/CC4
P1.1/CC8
P1.0/CIO
RST
XTAL2
XTAL1
RST
1
LI
2
3
CC
4
5
6
7
8
9
10
11
12
N/C
CVss
LI
N/C
28 27 26
1
2
3
4
5
QFN32
6
7
8
1211109131415
24
V
CC
23
EVCC
22
D
V
CC
21
VSS
P3.0/RxD
20
P3.1/TxD
19
P3.3/INT1/OE
18
P3.4/T0
17
P3.2/INT0
16
P3.5/CIO1/T1
15
14
P3.6/CCLK1/LED0
P3.7/CRST1/LED1
13
Vcc
EVcc
N/C
DVcc
2529303132
Vss
24
Vss
23
P3.0/RxD
22
P3.1/TxD
21
P3.3/INT1/OE
20
P3.4/T0
19
P3.2/INT0
18
P3.5/CIO1/T1
17
16
N/C
N/C
N/C
XTAL2
XTAL1
P3.7/CRST1/LED1
N/C
P3.6/CCLK1/LED0
4164G–SCR–07/06
3
A/T8xC5121
Figure 4. PLCC52 Pinout
P1.4/CCLK
P1.3/CC4
EA
PSEN
ALE
P2.7/A15
P2.6/A14
P2.5/A13
P1.2/CPRES
P1.1/CC8
P1.0/CIO
P2.4/A12
RST
10
11
12
16
17
18
19
20
8
9
13
14
15
CC
V
NC
NC
C
P1.5/CRST
5 4 3 2 1 6
7
CVSS
LI
CC
NC
V
52 51 50 49 48
21222625242329282730 31
CC
VSS
V
XTAL1
XTAL2
P0.5/AD5
P2.1/A9
P2.3/A11
P2.2/A10
CC
V
E
P2.0/A8
NCNCNC
32 33
P0.7/AD7
P3.7/CRST1/LED1
NC
47
46
D
V
45
44
43
42
41
40
39
38
37
36
35
34
P0.4/AD4
P3.6/CCLK1/LED0
CC
VSS
P3.0/RxD
P3.1/TxD
P0.0/AD0
P0.1/AD1
P0.2/AD2
P0.3/AD3
P0.6/AD6
P3.3/INT1/OE
P3.4/T0
P3.2/INT0
P3.5/CIO1/T1
4
4164G–SCR–07/06
SignalsAll the T8xC5121 signals are detailed in Table 1.
The port structure is described in Section “Port Structure Description”.
Table 1. Ports Description
Internal
Power
SupplyESDTypeDescription
Port
Signal
NameAlternate
A/T8xC5121
P1.0CIOCV
P1.1CC8CV
P1.2CPRESV
P1.3CC4CV
CC
CC
CC
CC
4 kVI/O
I/O
4 kVO
O
4 kVI
I/O
4 kVO
Smart ca rd interf ace function
Card I/O.
Input/Out p ut func tion
P1.0 is a bi-directional I/O port .
Reset co nfiguration
I
Input .
Smart ca rd interf ace function
Card contact 8
Output function
P1.1 is a Push-pull port.
Reset co nfiguration
I
Input
Smart ca rd interf ace function
Card presence
Input/Out p ut func tion
P1.2 is a bi-directional I/O port with internal pull-ups- ( External Pull-up
configuration can be selected).
Reset co nfiguration
I
Input (high leve l due to internal pu ll-up)
Smart ca rd interf ace function
Card contact 4
P1.4CCLKCV
P1.5CRSTCV
4164G–SCR–07/06
CC
CC
4 kVO
I/O
4 kVO
I/O
Output function
O
P1.3 is a Push-pull port.
Reset co nfiguration
I
Input (high leve l due to internal pu ll-up)
Smart ca rd interf ace function
Card clock
Input/Out p ut func tion
P1.4 is a a Push-pull port.
Reset co nfiguration
O
Output at low level
Smart ca rd interf ace function
Card reset
Input/Out p ut func tion
P1.5 is a a Push-pull port.
Reset co nfiguration
O
Output at low level
5
A/T8xC5121
Table 1. Ports Description (Continued)
Internal
Power
SupplyESDTypeDescription
Port
Signal
NameAlternate
P3.0RxDEV
P3.1TxDEV
P3.2INT0DV
CC
CC
CC
UART function
I
Receive data input
Input/Out p ut func tion
I/O
P3.0 is a bi-directional I/O port with internal pull-ups.
Reset co nfiguration
I
Input ( high level)
UART function
O
Transmit data output
OE active at low or high level depending of PMSO EN bits in SIOCON Reg.
Input/Out p ut func tion
I/O
P3.1 is a bi-directional I/O port with internal pull-ups.
Reset co nfiguration
Z
High impedance due to PMOS switched OFF
External interrupt 0
input set IE0 in the TCON register. If bit IT0 in this register is set, bits IE0
INT0
I
are set by a falling edge on INT
level on INT0
Input/Out p ut func tion
I/O
P3.2 is a bi-directional I/O port with internal pull-ups.
Timer 0: Gate input
I
INT0 serves as external run control for Timer 0 when
select ed in TCON register.
.
0. If bit IT0 is cleared, bits IE0 is set by a low
P3.3INT1OEEV
P3.4T0EV
Reset co nfiguration
I
Input ( high level)
External Interrupt 1
INT1
CC
CC
I
I
I/O
I
I
O
input set OEIT in ISEL Register, IE1 in the TCON register.
If bit IT1 in this register is set, bits OEIT and IE1 are set by a falling edge on
. If bit IT1 is cleared, bits OEIT and IE1 is set by a low level on INT1
INT1
UART function
Output enable. A low or high level (depending OELEV bit in
ISEL Register) on this pin disables the PMOS transistors of TxD
(P3.1) and T0 (P3.4). This function can be disabled by sof tware
Input/Out p ut func tion
P3.3 is a bi-directional I/O port with internal pull-ups.
Timer 1 function: Gate input
INT1 serves as external run control for Timer 1 when
select ed in TCON register.
Reset co nfiguration
Input ( high level)
UART function
OE active at low or high level depending of PMSOEN
bits in SIOCON Reg.
6
4164G–SCR–07/06
Table 1. Ports Description (Continued)
Internal
Signal
Port
P3.5CIO1DV
NameAlternate
Power
SupplyESDTypeDescription
CC
Input/Out p ut func tion
I/O
P3.4 is a bi-directional I/O port with internal pull-ups.
Timer 0 function: External clock input
I
When Timer 0 operates as a counter, a falling edge on the T0 pin
increments the count.
Reset co nfiguration
Z
High impedance due to PMOS switched OFF
Alternate card function
I/O
Card I/O
Input/Out p ut func tion
I/O
P3.5 is a bi-directional I/O port with internal pull-ups.
Timer 1 function: External clock input
I
When Timer 1 operates as a counter, a falling edge on the T1 pin
increments the count.
A/T8xC5121
P3.6CCLK1LED0DV
P3.7CRST1DV
P3.7CRST1LED1DV
CC
CC
CC
Reset co nfiguration
I
Input (high leve l due to internal pu ll-up)
Alternate card function
O
Card clock
LED function
Thes e pin s ca n be directly connecte d to t h e cat hode of standa r d
O
LED without external current limitin g resistor s. The typical current
of each output can be programmed by software to 2, 4 or 10 mA
(LEDCON register).
Input/Out p ut func tion
I/O
P3.6 is a LED port.
Reset co nfiguration
I
Input at high level
Alternate card function
O
Card reset
OLED function
Thes e pin s ca n be directly connecte d to t h e cat hode of standa r d
LED without external current limitin g resistor s. The typical current
of each output can be programmed by software to 2, 4 or 10 mA
(LEDCON register).
I/OInput/Out p ut func tion
P3.7 is a a LED port.
4164G–SCR–07/06
IReset configuration
Input at high level
7
A/T8xC5121
Table 1. Ports Description (Continued)
Internal
Power
SupplyESDTypeDescription
Port
Signal
NameAlternate
RSTV
CC
I/OReset input
Holding this pin low for 64 oscillator periods while the oscillator
is running reset s the device. The Po rt pins are driven to their reset
cond iti on s w he n a vo ltag e lower than V
not the os cillator is running.
This pin has an internal pull-up resistor which allows the device to be reset by
connecting a capacitor between this pin and VSS.This capacitor is optional
thanks to the internal POR which output a Reset as long as Vcc has not
reached the POR threshold level
Asserting RST
return s the chip to normal op eration.
The output is active for at least 12 oscillator periods when an internal
reset occurs.
XTAL1V
CC
IInput to the on-chip inverting oscillator amplifier
T o use the internal oscillator, a crystal/resonator circuit is connected
to this pin.
If an external oscillator is used, its output is connec ted to this pin.
XTAL2V
CC
OOutput of the on-chip inverting oscillator amplifier
T o use the internal oscillator, a crystal/resonator circuit is connected
to this pin.
If an external oscillator is used, XTAL2 may be lef t unconnected.
V
CC
PWR Supply voltage
is used to power the internal voltage regulators and internal I/O’s.
V
CC
LIPWR DC/DC input
LI must be tied to V
the curr ent for the pump charge of the DC/DC converter.
is applied, whether or
IL
when the chip is in Idle mode or Power-down mode
through an external coil (typically 4, 7 μH) and provi de
CC
CV
CC
PWR Card Sup ply voltage
is the programmable voltage output for the Card interface.
CV
CC
It must be connected to an external decoupling capacitor.
DV
CC
PWR Digital Sup ply voltage
is used to supply the digital core and internal I/Os. It is
DV
CC
interna ll y co nnect e d to the ou tp ut of a 3V re gul a tor and must be co nn ec ted t o
an exte rn a l de co upling capa ci t o r.
EV
CC
V
CC
PWR Extra supply voltage
is used to supply the level shifters of UART interface I/O
EV
CC
pins. It must be connected to an external decoupling capacitor.
This reference voltage is generated internally (automatically or not),
or it can be connected to an external voltage reference.
CVSSGND DC/DC ground
CVSS is used to sink high shunt currents from the external coil.
VSSGND Ground
8
4164G–SCR–07/06
Table 1. Ports Description (Continued)
Internal
Signal
Port
NameAlternate
ONLY FOR PLCC52 version
Power
SupplyESDTypeDescription
A/T8xC5121
P0[7:0]AD[7:0]V
P2[7:0]A[15:8]V
P3.6WRDV
P3.7RDDV
ALEV
PSENPSENV
EAEAV
CC
CC
CC
CC
CC
CC
CC
I/OInput/Output function Port 0
P0 is an 8-bit open-drain bi-directional I/O port. Port 0 pins that
have 1s written to them float and can be used as high impedance
inputs. T o avoid any parasitic current consumption, Floating P0
inputs must be pulled to V
CC
or VSS.
I/OAddress/Data low
Mutiplexed Address/Data LSB for external access
I/OInput/Output function Port 2
P2 is an 8-bit open-drain bi-directional I/O port with internal pull-ups
OAddress high
Address Bus MSB for external access
OWrite signal
Write signal asserted during external data memory write operation
IRead signal
Read signal asserted during external data memory read operation
OAddress latch enable output
The falling edge of ALE strobes the address into e x ternal latch
OProgram strobe en ab le
IExternal access enable
This pin must be held low to force the device to fetch code from
external progra m memory starting at address 0000h. It is la tched
during reset and cannot be dynamicall y changed during operation.
4164G–SCR–07/06
9
A/T8xC5121
Port Structure
The different ports structures are described as follows.
Description
Quasi Bi-directional Output
Configuration
Figure 5. Quasi Bi-directional Output Configuration
The default port output configuration for standard I/O ports is the quasi bi-directional output that is comm on on the 80 C5 1 an d mo st o f its de rivati ve s. Thi s o utput ty pe ca n b e
used as both an input and output without the need t o reconfigure the port. This is possible because whe n t he port out puts a l ogic h igh, it i s weak ly driven, al lowing an external
device to p ull th e pi n low . Wh en the po rt o utput s a lo gic l ow s tate , it is driv en s trongl y
and able to sink a fai rly large current . These fe atures are so mewhat sim ilar to an ope n
drain output except that there are three pull-up transistors in the quasi bi-directional output that serve different purposes. One of these pull-ups, called the weak pull-up, is
turned o n wheneve r the po rt latch for the pin contains a logic 1. The weak pull-up
sources a very sm all current th at will pull the pin high if it is left floating . A secon d pullup, called the medium pull-up, is turned on when the port latch for the pin contains a
logic 1 and the pin itself is also at a logic 1 level. This pull-u p provides the primary
source current for a quasi bi-directional pin that is outputting a 1. If a pin that has a logic
1 on it is pull ed low by a n ex ternal d evice , the m edi um pul l-up tu rns off, and only the
weak pull-up remains on. In order to pull the pin low under these conditions, the external
device has to sink enough current to overpower the medium pull-up and take the voltage
on the port pin below its input threshold.
2 CPU
CLOCK DELAY
PMOS
P
Strong
P
Weak
P
Medium
Port latch
Data
Push-pull Out p ut
Configuration
Pin
N
NMOS
Input
Data
The Push-pull output configuration has the same pull-down structure as the quasi bidirection al outp ut mod es, bu t prov ide s a cont inuou s strong pull- up w hen the p ort la tch
contains a l ogic 1. The P ush-pull mod e may be use d when more source curre nt is
needed from a port output. The Push-pull port configuration is shown in Figure 5.
10
4164G–SCR–07/06
Figure 6. Push-pull Output Configuration
PMOS
A/T8xC5121
P
Strong
Port latch
Data
N
NMOS
Input
Data
LED Output C on f ig urat i onThe input only configuration is shown in Figure 7.
Figure 7. LED Source Current Configuration
2 CPU
CLOCK DELAY
PMOS
NMOS
P
Strong
N
P
Weak
Pin
P
Medium
Pin
LEDx.0
Port Latch
Data
LEDx.1
Input
Data
Note:The port can be configured in quasi bi-directional mode and the level of current can be programmed by means of LEDCON0
and LEDCON1 registe rs before switching the led on by writing a logical 0 in Port latch.
LED1CTRL
LED2CTRL
N
N
11
4164G–SCR–07/06
A/T8xC5121
SFR MappingThe Special Function Registers (SFR) of the T8xC5121 belongs to the following
PowerMonitorThe Powe rMonito r functi on superv ises t he evol ution of the vo ltages f eedin g the mi cro-
controller, and if needed, suspends its activity when the detected value is out of
specification.
It is guaranteed to start up pr operly whe n T8xC512 1 is po wered up and prevents cod e
execution errors when the power supply becomes lower than the functional threshold.
This section describes the functions of the PowerMonitor.
DescriptionIn order to start up and to properly maintain the microcontroller operation, V
stabilized in the V
nal amplitude compatible with logic threshold.
This control is carried out during three phases which are the power-up, normal operation
and stop. It complies with the following requirements:
•It guarantees an operational Reset when the microcontroller is powered
•and a protection if the power supply goes out from the functional range of the
Figure 8. PowerMonitor Block Diagram
External
Power Supply
V
DD
microcontroller.
operating range and the oscillator has to be stabilised with a nom i-
DD
DC to DC
3V Regulator
C
V
CC
D
V
CC
has to be
DD
Power-up
Detector
Power-fail
Detector
Internal RESET
PowerMonitor DiagramThe target of the PowerMonitor is to survey the power supply in order to detect any volt-
age drops which are not in the target specification. This PowerMonitor block checks two
kind of situations that occur:
•During the power-up condition, when V
•During a steady-state condition, when V
undesirable voltage drops.
Figure 9 shows some configurations that can be met by the PowerMonitor.
14
is reaching the product specification
DD
is stable but disturbed by any
DD
4164G–SCR–07/06
Figure 9. Power-Up and Steady-state Conditions Monitored
DV
CC
VPFDP
VPFDM
A/T8xC5121
Reset
V
CC
t
G
Power-up
t
riset
Steady-state Condition
Power-down
Such device when it is integrated in a microcontroller, forces the CPU in reset mode
when V
reaches a voltage condition which is out of the specification.
DD
The thresholds and their functions are:
•V
: the output voltage of the regulator has reached a minimum functional value
PFDP
at the power-up . The circuit leaves the RESET mode.
•V
: the output voltage of the regulator has reached a low threshold functional
PFDM
value for the microcontroller. An internal RESET is set.
fall
4164G–SCR–07/06
Glitch fi lt e r ing prevents th e system from R ESET w hen short duration glitches are carried
on V
The ele ctri cal pa ram eter s V
power supply.
DD
PFDP
, V
PFDM
, t
, t
, tG are speci fied i n th e DC para mete rs
rise
fall
section.
15
A/T8xC5121
Power Moni toring
and Clock
Management
For applications where power consumption is a critical factor, three power modes are
provided:
•Idle mode
•Power-down mode
•Clock Management (X2 feature and Clock Prescaler)
•3V Regulator Modes (pulsed or not pulsed)
Idle ModeAn instruction that sets PCON. 0 causes t he last inst ruction to be exec uted bef ore goi ng
into the Idle mode. In the Idle mode, the internal clock signal is gated off to the CPU, but
not to the interrup t, Time r 0, and Serial Port f unction s. The CPU status is prese rved in
its entirety: the Stack Pointer, Program Counter, Program Status Word, Accumulator
and all other registers maintain their data during Idle. The port pins hold the logical
states they had at the time Idle was activated. ALE and PSEN hold at logic high levels.
There are two ways to terminate th e Idle. Activation of any enabl ed interru pt will cause
PCON.0 to be cleared by hardware, terminating the Idle mode. The interrupt will be s erviced, and following RETI the next instruction to be executed will be the one following
the instruction that put the device into idle.
The flag bit GF0 can be used to give an indication if an interrupt occurred during normal
operation or during a n Idle. For exam ple, an i nstructio n that act ivate s Idle can al so set
one or both fl ag bit s. Whe n Idle is term inated by an interrupt, the interrup t serv ice routine can examine the flag bits.
The other way of terminating the Idle mode is with a hardware reset. Since the clock
oscillator is still running, the hardware reset needs to be held active for only two
machine cycles (24 oscillator p er iods) to co mplete the reset.
Power-down Mode
Entering Power-down Mod eTo save maximum power, a Power-down mode can be invoked by software (refer to
Table 3, PCON register).
In Power-down mode, the os cillator is stopped a nd the instructi on tha t invoked P ower-
down mode is the last instruction executed. The internal RAM and SFRs retain their
V
value until the Power-down mode is terminated.
power. Eith er a ha rdwa re reset o r an exte rnal interru pt ca n ca use an e xit fro m Powe rdown. To pr operly terminat e Pow er-down, t he reset or ext ernal interr upt sho uld no t be
exec uted befo re
long enough for the oscillator to resta rt and stabi liz e.
Only external interrupts INT0
interrupt must be enabled and configured as level or edge sensitive interrupt input.
Holding the pin low restarts the oscillator but bringing the pi n high com pl etes the exit as
detailed in F igure 10. W hen both interrupt s are ena bled, the oscilla tor restart s as soon
as one of the two inputs is held low and Power-Down exit will be completed when the
first input will be released. In this case the higher priority interrupt service routine is
executed.
Once the in ter rupt is serv iced, the nex t instr uctio n to be e xec uted after RE TI will b e the
one following the instruction that put it into Power-down mode.
Exit from Power-down ModeExiting from Power-down by external interrupt does not affect the SFRs and the internal
RAM content.
V
is restored to its normal operating level and must be held active
CC
and INT1 are useful to exit from Power-down. For that,
can be lowered to save further
CC
16
4164G–SCR–07/06
The ports status under Power-down is the status which was valid before entering this
mode.
The IN T1 int errup t is a m ul tiple xed i nput (s ee Inte rrupt para grap h) w ith CP RES (Car d
detection) and Rxd (U ART Rx) . So these t hree input s can be us ed to exi t from Pow erdown mode. The configurations which must be set are detailed below:
•Rxd input:
•CPRES input:
Figure 10. Power-down Exit Waveform
INT0
A/T8xC5121
–RXEN (ISEL.0) must be set
–EX1 (IE0.2) mu st b e set
–A low level detected during more than 100 microseconds exit from Power-
down
–PRSEN (ISEL.1) must be set
–EX1 (IEO.2) must be set
–EA (IE0.7) mu st b e set
–In the INT1 interrupt vector, the CPLEV Bit (ISEL.7) must be inverted
and PRESIT Bit (ISEL.5) must be reset.
INT1
XTAL1
Power-down phase
Oscillator restart phase
Active phaseActive phase
Exiting from Pow er-down by rese t rede fines al l the SF Rs, ex iting from Pow er-down by
external interrupt does no affect the SFRs.
Exiting from Power-down by either reset or external interrupt does not affect the internal
RAM content.
Note:If idle mode is activated wi th Power -down mode (IDL and PD bits set), the exit sequence
is unchanged, when execution is vectored to interrupt, PD and IDL bits are cleared and
idle mode is not entered.
SCI Control Prior to entering Power-down mode, a de-activation of the Smart Card system must be
performed.
LED ControlPrior to entering Power-down mode, if the LED mode output is used, the medium pull-up
must be disconnected by setting the LEDPD bit in the PCON Register (PCON 3).
Low Power Mod eOnly in Power-down mode, in order to reduce the power consumption, the user can
choose to select this low-power mode.
The activation reference is the following.
•First select the Low-power mode by setting the LP bit in the AUXR Register (AUXR.
6)
•The activation of Power-down can then be done.
4164G–SCR–07/06
17
A/T8xC5121
Reduced EMI ModeThe ALE signal is used to demultiplex address and data buses on port 0 when used with
external program or data memory. Nevertheless, during internal code execution, ALE
signal is still gene r ated .
Only in case of PLCC52 version, in order to redu ce EMI , ALE s ignal can be disabled by
setting AO bit.
The AO bit is located in AUXR register at b it location 0 (See Table 4). As soon as A O is
set, ALE is no longer output but remains active during MOVX and MOVC instructions
and external fetches. During ALE disabling, ALE pin is weakly pulled high.
Power Modes Control
Registers
Table 3. PCON Register
PCON (S:87h)
Power Configuration Register
76543210
SMOD1SMOD0-- LEDPDGF0PD IDL
Bit
Number
7SMOD1
6SMOD0
5Reserved
4Reserved
3LEDPD
2GF0
Bit
Mnemonic Description
Double Baud Rate bit
Set to d ou ble t he Bau d Rat e when Timer 1 i s u sed and mo de 1, 2 o r 3 i s se le cted in
SCON register.
SCON Select bit
When cleared, read/write accesses to SCON.7 are to SM0 bit and rea d/write
accesses to SCON.6 are to SM1 bit.
When set, read/write accesses to SCON.7 are to FE bit and read/write accesses to
SCON.6 are to OVR bit. SCON is Serial Port Control register.
LED Control Power-Down Mode bits
When cleaned the I/O pull-up is the standard C51 pull-up control. When set the
medium pull-up is disconnected.
General-pu r pos e fla g 0
One use is to indi cate wether an interrupt occ urred during normal operation or
during I dl e mo de .
18
Power-down Mode bit
1PD
0IDL
Cleared by hardware when an interrupt or reset occurs.
Set to activate the Power-down mode.
If IDL and PD are both set, PD takes precedence.
Idle Mode bit
Cleared by hardware when an interrupt or reset occurs.
Set to activate the Idle mode.
If IDL and PD are both set, PD takes precedence.
Reset Valu e = X0XX XX 0 0b
4164G–SCR–07/06
A/T8xC5121
Table 4. AUXR Register
AUXR (S:8Eh)
Auxiliary Registe r
76543210
-LP----EXTRAMAO
Bit
Number
7-
6LP
5-
4-
3-
2-
1EXTRAM
0AO
Bit
MnemonicDescription
Reserved
The value read from this bit is indeterminate. Do not set this bit.
Low Power mode selection
Clear to select standard mode
Set to select low consumption mode
Reserved
The value read from this bit is indeterminate. Do not set this bit.
Reserved
The value read from this bit is indeterminate. Do not set this bit.
Reserved
The value read from this bit is indeterminate. Do not set this bit.
Reserved
The value read from this bit is indeterminate. Do not set this bit.
EXTRAM select
(ONLY for PLCC52 version)
Clear to map XRAM datas in internal XRAM memory.
Set to map XRAM datas in exter nal XRAM memo ry.
ALE Output bit
(ONLY for PLCC52 version)
Clear to restore ALE operation during internal fetches.
Set to disable ALE operation during internal fetches.
4164G–SCR–07/06
Reset Value = 00XX XX00b
19
A/T8xC5121
Table 5. IE0 Register
IE0
Interrupt Enable Register (A8h)
76543210
EA--ESET1EX1ET0EX0
Bit
Number
7EA
6-
5-
4ES
3ET1
2EX1
1ET0
Bit
MnemonicDescription
Enable All interrupt bit
Clear to disable all inter rupts.
Set to enab le all in terr u p ts.
If EA = 1, each interrupt source is individually enabled or disabled by setting or
clearing its interrupt enable bit.
Reserved
The value read from this bit is indeterminate. Do not set this bit.
Reserved
The value read from this bit is indeterminate. Do not set this bit.
Serial port Enable bit
Clear to disable serial port interrupt.
Set to enable serial por t int er ru pt.
Timer 1 overflow interrupt Enable bit
Clear to disable Timer 1 overflow interrupt.
Set to enable Timer 1 overflow interrupt.
External interrupt 1 Enable bit
Clear to disable external interrupt 1.
Set to enable external interrupt 1.
Timer 0 overflow interrupt Enable bit
Clear to disable Timer 0 overflow interrupt.
Set to enable Timer 0 overflow interrupt.
20
External interrupt 0 Enable bit
0EX0
Clear to disable external interrupt 0.
Set to enable external interrupt 0.
Reset Value = 0XX0 0000b
4164G–SCR–07/06
A/T8xC5121
Table 6. ISEL Register
ISEL (S:BAh)
Interrupt Enable Register
76543210
CPLEV-RXITPRESITOELEVOEENRXEN PRESEN
Bit
Number
7CPLEV
6-
5PRESIT
4RXIT
3OELEV
2OEEN
Bit
MnemonicDescription
Card presence detection level
This bit indicates which CPRES level will bring about an interrupt
Set this bit to indicate that Card Presence IT will appear if CPRES is at high
level.
Clear this bit to indicate that Card Presence IT will appear if CPRES is at low
level.
Reserved
The value read from this bit is indeterminate. Do not set this bit.
Card presence detection interrupt flag
Set by hardware
Must be cleared by software
Received data interrupt flag
Set by hardware
Must be cleared by software
OE/INT1 signal active level
Set this bit to indicate that high level is active.
Clear this bit to indicate that low level is active.
OE/INT1 inte rru pt dis ab le bit
Clear to disable INT1 interrupt
Set to enable INT 1 interr u pt
4164G–SCR–07/06
Card pr es en ce detecti on i nterrupt en able bit
1PRESEN
0RXEN
Clear to disable the card presence detect ion interrupt comi ng from SCIB.
Set to enable the card pre se nc e detect io n int erru pt com in g from SC IB.
Received data Interrupt enable bit
Clear to disable the RxD interrupt.
Set to enable the RxD in ter r up t
Reset Value = 0X00 0000b
21
A/T8xC5121
Clock Management In order to optimize the power consumption and the execution time needed for a specific
task, an internal prescaler feature and a X2 feature have been implemented between
the oscillator and the CPU.
Funct ional Bl ock
Diagram
Figure 11 . Clock Generation Diagram
XTAL1
XTAL2
Osc.
F
OSC
1
2
0
1
X2
CKCON0
If CKRL<>7 then:
F
–
CLK CPU
OSC
----- ----------- x2()
2
1
----- ----------- ----------- ------- -=
x
2 7 CKRL
–
()
F
If CKRL = 7 then:
F
–
CLK CPU
Fosc
--------------=
x2
2
2(7-CKRL)
F
OSC
x2
2
1
F
0
1
CKRL = 7
CKRL
CLK_CPU
F
CLK_Periph
22
CKRLPrescalor Factor
71
62
54
46
38
210
112
014
4164G–SCR–07/06
A/T8xC5121
X2 Feature The T8xC5121 core needs only 6 clock periods per mach ine cycle. This feature called
”X2” provides the following advantages:
•Divides frequency crystals by 2 (cheaper crystals) while keeping same CPU power.
•Saves power consumption while keeping same CPU power (oscillator power
saving).
•Saves power consumption by dynamical ly dividing the operating frequenc y by 2 in
operating and idle modes.
•Increases CPU power by 2 while keeping same crystal frequency.
In order to keep the original C51 compatibility, a divider by 2 is inserted between the
XTAL1 signal and the main clock input of the core (phase generator). This divider m ay
be disabled by software.
DescriptionThe clock for the who le circuit and peripheral s is first divided by tw o before being used
by the CPU core and the peripherals.
This allows any cyclic ratio to be accepted on XTAL1 input. In X2 mode, as this divider is
bypassed, the signals on XTAL1 must have a cyclic ratio from 40 to 60%.
As shown in Figure 11, X2 bit is validated on the rising edge of the XTAL1÷2 to avoid
glitches when switching from X2 to standard mode. Figure 12 shows the switching mode
waveforms.
Figure 12. Mode Switching Waveforms
XTAL1
XTAL1:2
X2 bit
CPU clock
The X2 bit in t he CKCON 0 reg ister (se e Table 9) al lows to s witch (if CK RL=7) from 12
clock periods per instruction to 6 clock periods and vice versa.
The T0X2, T1X2, UartX2, and WdX2 bits in the CKCON0 register (see Table 9) and
SCX2 bit in the CK CON1 registe r (see Tab le 10) allow to s witch f rom standa rd perip heral speed (12 clock periods per peripheral clock cycle) to fast peripheral speed (6 clock
periods per peripheral clock cycle). These bits are active only in X2 mode.
More information about the X2 mod e can be f ound in the application note "How to Take
Advantage of the X2 Features in TS80C51 Microcontroller?".
F
OSC
X2 ModeSTD ModeSTD Mode
4164G–SCR–07/06
23
A/T8xC5121
Clock PrescalerBefore supplying the CPU and the peripherals, the main clock is divided by a factor 2 to
30 to reduce the CPU power consumption. This factor is controlled with the CKRL
register.
Clock Prescaler RegisterThis register is used to reload the clock prescaler of the CPU and peripheral clock.
CLK_CPU, FCLK_Periph
(MHz)
Table 8. CKRL Register
CKRL - Clock Reload Register (97h)
76543210
----CKRLCKRLCKRL-
Bit
Number
7 - 4-
3 - 1CKRL
0-
Bit
MnemonicDescription
Reserved
The value read from this bit is indeterminate. Do not set this bit.
Clock Reload Register
Prescaler value
XXXX 000Xb: CKRL=7 and Division factor equals 14
XXXX 110Xb: CKRL=6 and factor equals 2
XXXX 111Xb: CKRL=7 and division fa ctor equal s 1
Reserved
The value read from this bit is indeterminate. Do not set this bit.
Reset Value = XXXX 111Xb
24
4164G–SCR–07/06
A/T8xC5121
Table 9. CKCON0 Register
CKCON0 - Clock Control Register (8Fh)
76543210
-WDX2- SIX2 - T1X2T0X2X2
Bit
Number
7-Reserved
6WDX2
5-Reserved
4SIX2
3-Reserved
2T1X2
1T0X2
Bit
Mnemonic Description
Watchdog clock
(This control bit is validated when the CPU clock X2 is set; when X2 is low, this
bit has no effect)
Cleared to select 6 clock periods per per ipheral clock cycle.
Set to select 12 clock periods per peripheral clock cycle.
Enhanced UART clock (Mode 0 and 2)
(This control bit is validated when the CPU clock X2 is set; when X2 is low, this
bit has no effect)
Clear to select 6 clock periods per peripheral clock cycle.
Set to select 12 clock periods per peripheral clock cycle.
Timer 1 clock
(This control bit is validated when the CPU clock X2 is set; when X2 is low, this
bit has no effect)
Clear to select 6 clock periods per peripheral clock cycle.
Set to select 12 clock periods per peripheral clock cycle
Timer 0 clock
(This control bit is validated when the CPU clock X2 is set; when X2 is low, this
bit has no effect)
Clear to select 6 clock periods per peripheral clock cycle.
Set to select 12 clock periods per peripheral clock cycle
4164G–SCR–07/06
CPU clock
Clear to select 12 clock periods per machine cycle (Standard mode) for CPU
0X2
and all the peripherals.
Set to select 6 clock periods per machine cycle (X2 mode) and to enable the
indivi dual peripherals "X2" bits.
Reset Value = X0X0 X000b
25
A/T8xC5121
Table 10. CKCON1 Register
CKCON1 - Clock Control Register (AFh)
76543210
----SCX2---
Bit
Number
7-Reserved
6-Reserved
5-Reserved
4-Reserved
3SCX2
2-Reserved
1-Reserved
0-Reserved
Bit
MnemonicDescription
SCIB clock
Clear to select 6 clock periods per peripheral clock cycle.
Set to select 12 clock periods per perip heral clock cycle.
Reset Value = XXXX 0XXXb
26
4164G–SCR–07/06
A/T8xC5121
DC/DC ClockThe DC/DC block needs a clock with a 50% duty cycle. The frequency must also respect
a value between 3.68 MHz and 4 MHz. The first requirement imposes a divider in the
clock path and the second constraint is solved with the use of a prescaler.
Figure 13. Functional Block Diagram
F
OSC
1
(2 to 5)
DCCKPS
Address BFh
F
OSC
2 to 5
F
CLK_DC/DC
Clock Control RegisterThis register is used to reload the clock prescaler of the DC/DC converter clock.
Table 11. DCCKPS Register
DCCKPS - DC/DC converter Reload Register (BFh)
76543210
------DCCKPSDCCKPS
Bit
Number
7:2-
1:0DCCKPS
Bit
MnemonicDescription
Reserved
Do not use write those bits
Clock Reload Register
Pres caler value
00b: Divi sion factor equals 2
01b: division factor equals 3
10b: division factor equals 4
1 1b: division factor equals 5 (reset value which minimize the consumption)
Reset Value = XXXX XX11b
Clock PrescalerBefore supplying the DC/DC block, the oscillator clock is divided by a factor 2 to 5 to
adapt th e cloc k needed by the DC/DC co nverte r. This factor i s contro lled with t he
DCCKPS register.
The prescaler factor must be chosen to match the requirement range which is 4MHz.
Table 12. Examples of Factors
Prescaler
XTAL (MHz)DCCKPS Value
800h24
1201h34
14.75602h43.689
1602h44
2003h54
4164G–SCR–07/06
FactorDC/DC Converter CLK (MHz)
27
A/T8xC5121
28
4164G–SCR–07/06
A/T8xC5121
Smart Card Interface Block (SCIB)
IntroductionThe SCIB provides all signals to directly interface a smart card. Compliance with the
ISO7816, EMV’2000, GSM and WHQL standards has been certified.
Both synchronous (e.g. memory card) and asynchronous smart cards (e.g. micropro-
cessor card) are supported. The component supplies the different voltages requested by
the smart card. The power-off sequence is directly managed by the SCIB.
The card presence switch of the smart card connector is used to detect card insertion or
card removal. In case of card removal, the SCIB de-activates the smart card using the
de-activation sequence. An interrupt can be generated when a card is inserted or
removed.
Any malfunction is reported to the microcontroller (interrupt + control register).
The different operating modes are configured by internal registers.
Main Features•Su pport of ISO/IEC781 6
•Character mode
•1 transmit buffer + 1 receive buffer
•11 bits ETU counter
•9 bits guard time counter
•24 bits waiting time counter
•Auto-character repetition on error signal detection in transmit mode
•Auto-error signal generation on parity error detection in receive mode
•Power-on and power-off sequence generation
•Manual mode to directly drive the card I/O
4164G–SCR–07/06
29
A/T8xC5121
Block DiagramThe Smart Card Interface Block diagram is shown in Figure 14.
Figure 14. SCIB Block Diagram
Clk_iso
Clk_cpu
INT
Ba r r e l s h if ter
Etu counter
Guard time
Wa iting t im e
SCI Registers
Interrupt generator
Scart
fsm
I/O
mux
Power on
Power off
fsm
IO (in)
IO (ou t)
CLK
RST
C4 (out)
C8 (out)
CLK1
C4 (in)
C8 (in)
VCARD
Functional DescriptionThe architecture of the Smart Card Interface Block is detailed below.
Barrel ShifterIt allows the translation between 1 bit serial data and 8 bits parallel data.
The barrel function is useful for character repetition since the character is still present in
the shifter at the end of the character transmission.
This shifter is able to shift the data in both directions and to invert the input or output
value in order to manage both direct and inverse ISO7816-3 convention.
Coupled with the barrel shifter there is a parity checker and generator.
There are 2 regist ers conn ected to this barre l shifter, one for the trans mission and on e
for the reception.
They act as buffers to relieve the CPU of timing constraints.
SCART FSM(Smart Card Asynchronous Receiver Transmitter Finite State Machine)
This is th e c ore of the de sign. I ts pu rpo se is to co ntro l the barre l s hifter. To sequ enc e
correctly the barrel shifter for a reception or a transmission, it uses the signals issued by
30
4164G–SCR–07/06
Loading...
+ 85 hidden pages
You need points to download manuals.
1 point = 1 manual.
You can buy points or you can get point for every manual you upload.